CN209824272U - Heat dissipation shell and electric motor car - Google Patents
Heat dissipation shell and electric motor car Download PDFInfo
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- CN209824272U CN209824272U CN201822069246.0U CN201822069246U CN209824272U CN 209824272 U CN209824272 U CN 209824272U CN 201822069246 U CN201822069246 U CN 201822069246U CN 209824272 U CN209824272 U CN 209824272U
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Abstract
The utility model provides a heat dissipation shell and electric motor car relates to electronic equipment technical field. A heat dissipation case mainly includes a heat dissipation body and a mounting plate connected to each other. The electronic device that can generate heat in the use is fixed on the heat dissipation main part, and the heat dissipation main part gives off the heat that produces in the electronic device working process. Along the thickness direction of heat dissipation main part, the both ends of mounting panel extend and all bulge in heat dissipation main part along opposite direction. After the heat dissipation shell is fixed, the heat dissipation main body is in a suspended state, so that the contact area between the heat dissipation main body and the surrounding air is increased, the convection effect of the air is better, the heat dissipation effect of an electronic device is greatly improved, and the service life of the electrical device is prolonged. The utility model provides an electric vehicle, it mainly includes interconnect's controller and above-mentioned arbitrary heat dissipation shell. The controller comprises a control board and a plurality of MOS tubes which are arranged at intervals. The control panel and MOS pipe electric connection, control panel and MOS pipe are all installed in the panel mounting portion.
Description
Technical Field
The utility model relates to an electronic equipment technical field particularly, relates to a heat dissipation shell and electric motor car.
Background
The MOS transistor is a metal-oxide-semiconductor (semiconductor) field effect transistor or a metal-insulator-semiconductor (insulator). The MOS transistor belongs to a power device, and particularly is applied to products such as an inverter power supply, a solar controller, a discharge instrument, a UPS power supply and an electric vehicle controller, the temperature is very high during normal work, and if the MOS transistor is poor in heat dissipation, the service life of the MOS transistor can be seriously influenced.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a heat dissipation shell, it can improve the radiating efficiency of electron heating device (for example MOS pipe), prolongs electron device's life.
Another object of the present invention is to provide an electric vehicle, which can prolong the service life of the MOS transistor in the electric vehicle.
The embodiment of the utility model is realized like this:
a heat dissipation case includes a heat dissipation body and a mounting plate connected to each other. Along the thickness direction of heat dissipation main part, the both ends of mounting panel extend and all bulge in heat dissipation main part along opposite direction.
In some embodiments of the present invention, the heat dissipating body is provided with a first heat dissipating tooth and a panel mounting portion. The first heat dissipation teeth and the panel mounting portion are arranged on two sides of the heat dissipation main body in the thickness direction relatively. The plurality of first heat dissipation teeth are arranged on the heat dissipation main body at intervals. The mounting plate protrudes out of the first heat dissipation teeth, namely along the direction of free extension of the height of the first heat dissipation teeth, the mounting plate protrudes out of the first heat dissipation teeth, so that the first heat dissipation teeth can still be in a suspended state after the heat dissipation shell is integrally fixed.
In some embodiments of the present invention, the heat dissipation case further includes a fixing member for compressing the heat generating device. The heat dissipation main part is also provided with a fixing groove matched with the fixing piece.
In some embodiments of the present invention, the heat dissipation housing includes two mounting plates, and the two mounting plates are disposed at two ends of the heat dissipation main body relatively.
In some embodiments of the present invention, the heat dissipation casing further includes a heat dissipation sub-body. At least one of two sides of the heat dissipation main body is connected with a heat dissipation auxiliary body along the width direction of the heat dissipation main body.
The utility model discloses an in some embodiments, the vice body interval of heat dissipation is provided with a plurality of second heat dissipation teeth, and the free end of a plurality of second heat dissipation teeth all extends towards the one end of keeping away from the heat dissipation main part.
In some embodiments of the present invention, the second heat dissipation teeth are bar-shaped. Of course, the specific shape of the first heat dissipation teeth and the second heat dissipation teeth may not be limited, and both may also take other shapes besides the strip shape, such as a ring shape, a wave shape, and the like.
In some embodiments of the present invention, the second heat dissipation tooth surface is provided with a plurality of protrusions.
In some embodiments of the present invention, the heat dissipating sub-body and the heat dissipating main body are integrally formed.
An electric vehicle comprises a controller and any one of the heat dissipation shells, which are connected with each other. The controller comprises a control board and a plurality of MOS tubes which are arranged at intervals. The control panel and MOS pipe electric connection, control panel and MOS pipe are all installed in the panel mounting portion.
The embodiment of the utility model provides an at least, have following advantage or beneficial effect:
an embodiment of the utility model provides a heat dissipation shell, its heat dissipation main part and mounting panel that mainly includes interconnect. Generally, an electronic device which can generate heat in the using process is fixed on a heat dissipation main body, and heat generated in the working process of the electronic device is dissipated through the heat dissipation main body, so that the electronic device is prevented from being damaged quickly due to overlarge heat productivity and overhigh temperature. Along the thickness direction of heat dissipation main part, the both ends of mounting panel extend and all bulge in heat dissipation main part along opposite direction. During the use, thereby the user is through the fixed heat dissipation main part of the installation to the mounting panel, because the mounting panel is protruding in the heat dissipation main part on the thickness direction of heat dissipation main part, when the fixed back of heat dissipation shell, the heat dissipation main part will be at unsettled state with the fixed plane interval certain distance of mounting panel, the main part that dispels the heat promptly. Under the state, the contact area between the heat dissipation main body and the ambient air is increased, the convection effect of the air is better, the heat dissipation effect of the electronic device is greatly improved, and the service life of the electric device is prolonged.
An embodiment of the utility model provides an electric motor car, its mainly includes interconnect's controller and above-mentioned arbitrary heat dissipation shell. The controller comprises a control board and a plurality of MOS tubes which are arranged at intervals. The control panel and MOS pipe electric connection, control panel and MOS pipe are all installed in the panel mounting portion. The MOS pipe is in the course of the work, and calorific capacity is great, and the heat dissipation shell has great heat radiating area, more air convection heat dissipation passageway. Therefore, the heat dissipation shell can improve the heat dissipation rate of the MOS tube in the working process, avoid heat accumulation, guarantee the normal work of the MOS tube, prolong the service life of the MOS tube, further prolong the service life of a controller in an electric vehicle, and reduce the maintenance cost of the electric vehicle.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic structural view of a heat dissipation housing according to an embodiment of the present invention;
fig. 2 is a schematic structural view of a front surface of a heat dissipation housing according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of the MOS tube and the control board provided in the embodiment of the present invention after being mounted on the heat dissipation case;
FIG. 4 is an enlarged view of the area IV in FIG. 3;
FIG. 5 is a view taken along line A of FIG. 2;
fig. 6 is a schematic structural diagram of a mounting plate according to an embodiment of the present invention.
Icon: 100-a heat dissipation shell; 110-a heat dissipating body; 112-first heat dissipation teeth; 114-a panel mounting portion; 116-a bonding portion; 118-a first snap-in portion; 120-a second clamping part; 122-a fixing member; 124-fixed groove; 130-a mounting plate; 132-a screw; 134-mounting holes; 150-heat dissipation auxiliary body; 152-second heat dissipating teeth.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the embodiments of the present invention, it should be noted that if the directions or positional relationships indicated by the terms "upper", "inner", etc. are based on the directions or positional relationships shown in the drawings, or the directions or positional relationships that the products of the present invention are usually placed when using, the description is only for convenience of description and simplification of the present invention, and it is not intended to indicate or imply that the device or element to be referred to must have a specific direction, be constructed and operated in a specific direction, and therefore, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used merely to distinguish one description from another, and are not to be construed as indicating or implying relative importance.
In the description of the embodiments of the present invention, "a plurality" means at least 2.
In the description of the embodiments of the present invention, it should be further noted that unless explicitly stated or limited otherwise, the terms "disposed," "mounted," "connected," and "connected" should be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
Examples
Referring to fig. 1, fig. 1 is a schematic structural diagram of a heat dissipation housing 100. The present embodiment provides a heat dissipation case 100, which can be mainly used for dissipating heat of an electronic device, so as to ensure good operation of the electronic device and prolong the service life of the electronic device.
The heat dissipating case 100 mainly includes a heat dissipating body 110, a mounting plate 130, and a heat dissipating sub-body 150. The heat dissipating sub-body 150 is a structural feature for further improving the heat dissipating effect, and the heat dissipating sub-body 150 may not be provided in other embodiments. The mounting plate 130 and the heat dissipation sub-body 150 are connected to the heat dissipation main body 110. Two mounting plates 130 are shown in fig. 1, indicating that two mounting plates 130 are used in this embodiment, and that one or other numbers of mounting plates 130 may be used in other embodiments.
Referring to fig. 1 and 2, fig. 2 is a schematic structural diagram of the front surface of the heat dissipation housing 100, and in order to show the schematic structural diagram of the front surface of the heat dissipation main body 110 more clearly, only one mounting plate 130 is shown in fig. 2. Shown in fig. 1 is a schematic structural view of the back surface of a heat dissipation case 100. The front and back surfaces are both based on two opposite sides of the heat dissipating body 110, and fig. 1 shows the back surface of the heat dissipating body 110, and fig. 2 shows the front surface of the heat dissipating body 110.
The heat dissipation body 110 is provided with first heat dissipation teeth 112 (see fig. 1) and a panel mounting part 114 (see fig. 2). The first heat dissipation teeth 112 are disposed opposite to the panel mounting portion 114 on two sides of the heat dissipation body 110 in the thickness direction (as can be seen from the structures on different sides shown in fig. 1 and 2). A plurality of first heat dissipation teeth 112 (10 in this embodiment, and other numbers in other embodiments) are spaced apart from each other on the back surface of the heat dissipation main body 110. As shown in fig. 1, in the present embodiment, the first heat dissipation teeth 112 are strip-shaped, and in other embodiments, the first heat dissipation teeth 112 may be configured in other shapes according to specific requirements, such as circular ring, S-shaped, W-shaped, or other protrusions without regular shapes. The strip-shaped first heat dissipation teeth 112 also have special heat dissipation advantages, for example, the heat dissipation area is increased, and when air flows through the surface of the strip-shaped first heat dissipation teeth 112, the regular strip shape can play a role in guiding air circulation, so that the circulation rate of the air on the surface of the first heat dissipation teeth 112 is increased, and further, the heat dissipation rate is increased. The first heat dissipation tooth 112 extends freely along a side away from the panel mounting portion 114, but does not extend to a height exceeding the extension of the mounting plate 130 on the side.
The panel mounting portion 114 is mainly used to provide a place for mounting an electronic device. The specific structure of the panel mounting portion 114 can be adapted according to the electronic device to be mounted. Taking the MOS transistor and the control board in the controller in the electric vehicle as an example, the panel mounting portion 114 is designed to have the following structure:
referring to fig. 3 and 4, fig. 3 is a schematic structural view illustrating a MOS transistor and a control board mounted on a heat dissipation case 100, and fig. 4 is an enlarged schematic view of a portion IV in fig. 3.
The panel mounting portion 114 includes an attaching portion 116 and a first clamping portion 118 and a second clamping portion 120 which are oppositely disposed. As shown in fig. 4, the first engaging portion 118 and the second engaging portion 120 are disposed opposite to each other, and the first engaging portion 118 is substantially L-shaped, and the second engaging portion 120 is substantially U-shaped. The bonding portion 116 has an inclined mounting surface, which facilitates the bonding arrangement of the MOS transistors.
Generally, electric vehicles (including electric tricycles, electric quadricycles, electric automobiles, etc.) each include at least a controller and the heat dissipation case 100 provided in the present embodiment, which are connected to each other. The controller generally further includes a control board (generally referred to as a PCB board) and a plurality of spaced MOS transistors. The control board and the MOS transistor are electrically connected (generally, they are soldered) and are mounted on the panel mounting portion 114 (generally, the control board and the MOS transistor are soldered and then mounted on the panel mounting portion 114). The electric vehicle may also have other conventional components commonly found in the market, such as a lighting system, an energy system, a braking system, etc., and will not be described herein again.
The two ends of the control panel are respectively clamped in the first clamping portion 118 and the second clamping portion 120, and the MOS transistor is tiled on the attaching portion 116. Because MOS pipe calorific capacity is great in the course of the work, in order to improve the heat conduction efficiency between MOS pipe and laminating portion 116, and then make the heat of MOS pipe spill more fast, can adopt some fixed means to make the MOS pipe hug closely on laminating portion 116, can also guarantee the connection stability of MOS pipe simultaneously. For example, a plurality of pressing sheets may be disposed at intervals on the attaching portion 116, and each or two pressing sheets may compress one MOS transistor; or the MOS tube can be fixed by adopting an adhesive; or the fitting part 116 is provided with screw holes, the MOS tube is pressed by the nuts when the bolt is screwed into the screw holes, and as long as the number of the screw holes is enough, a user can more flexibly select the position for installing the MOS tube, and the MOS tube can be pressed and fixed by the movable bolts and the nuts. In this embodiment, the MOS transistor is fastened in the following manner:
the heat dissipation case 100 further includes a fixing member 122 for pressing the heat generating device (i.e., the MOS transistor). The heat dissipating body 110 is further provided with fixing grooves 124 to be matched with the fixing pieces 122. As shown in fig. 4, the fixing member 122 is L-shaped, one end of the fixing member 122 extends into the fixing groove 124, and the other end presses the MOS transistor from above. In this embodiment, the fixing element 122 is a spring pressing sheet, and other structures or materials without elasticity may be adopted in other embodiments as long as the fixing element 122 can press the MOS transistor. One end interval that compresses tightly the MOS pipe on mounting 122 is provided with a plurality of teeth that compress tightly (not marked in the figure), and the setting that compresses tightly the tooth can guarantee to have more even stress distribution on the mounting 122 on the one hand for mounting 122 has more excellent comprehensive mechanical properties, and on the other hand has also improved the heat dissipation space of MOS pipe, improves the radiating effect of MOS pipe.
In order to improve the heat dissipation effect of the heat dissipation body 110, two ends of the mounting plate 130 extend in opposite directions along the thickness direction of the heat dissipation body 110 and protrude from the heat dissipation body 110. Referring to fig. 1, 2 and 5, fig. 5 is a view taken along direction a of fig. 2. In combination with the above three figures, it can be clearly observed that the mounting plate 130 protrudes from the heat dissipation body 110 in both directions in the thickness direction of the heat dissipation body 110. Due to the arrangement, the back surface of the heat dissipation main body 110 (i.e., the surface where the first heat dissipation teeth 112 are located) can be in a suspended state, and the heat dissipation effect of the heat dissipation main body 110 is improved.
Referring to fig. 6, fig. 6 is a schematic structural diagram of the mounting plate 130. In this embodiment, the mounting plate 130 may be attached to the heat dissipating body 110 by screws 132. Of course, in other embodiments, other connection manners may be adopted to connect the two. The mounting plate 130 is also provided with mounting holes 134. The user secures the mounting plate 130 in a fixed position (e.g., a corresponding position on the electric vehicle controller) in the application scenario via the mounting holes 134 and the mating securing connectors (e.g., clips, bolts plus stops). After the mounting plate 130 is fixed, the first heat dissipation teeth 112 on the back surface of the heat dissipation body 110 are naturally in a suspended state (i.e., they do not directly abut against the controller), so as to increase the heat dissipation rate of the heat dissipation body 110 from the back surface. Since the first heat dissipation teeth 112 are disposed on the back surface of the heat dissipation body 110, the mounting plate 130 protrudes from the first heat dissipation teeth 112, that is, the mounting plate 130 protrudes from the first heat dissipation teeth 112 along the direction of the height of the first heat dissipation teeth 112, so that the heat dissipation shell 100 can be fixed integrally, and the first heat dissipation teeth 112 can still be in a suspended state.
In this embodiment, the heat dissipation housing 100 includes two mounting plates 130, as shown in fig. 1. The two mounting plates 130 are symmetrically disposed at two ends of the heat dissipating body 110, so as to form a more stable support for the heat dissipating body 110. Of course, if only one mounting plate 130 is used in other embodiments, the mounting position of the mounting plate 130 (e.g., the middle portion of the heat dissipating body 110) can be adjusted appropriately, so that the heat dissipating body 110 can be stably supported.
In order to further improve the heat dissipation effect of the heat dissipation case 100, at least one of two sides of the heat dissipation main body 110 is connected with a heat dissipation sub-body 150 along the width direction of the heat dissipation main body 110, as shown in fig. 1, in this embodiment, two sides of the heat dissipation main body 110 are connected with the heat dissipation sub-bodies 150. The heat dissipating sub-body 150 is disposed at the two sides because the bonding portion 116 is adjacent to one side, so that the transmission distance of heat between the MOS transistor and the heat dissipating sub-body 150 can be shortened, and the heat dissipating effect can be improved. Therefore, the installation position of the heat dissipation sub-body 150 can be adjusted according to different installation positions of different specific heat generating devices, and of course, the installation position can be optionally not adjusted. The arrangement of the heat dissipation sub-body 150 increases the heat dissipation area, so that the heat dissipation efficiency of the MOS transistor can be significantly improved.
The heat dissipating sub-body 150 may have various shapes and various structures, and can increase the heat dissipating area of the heat dissipating casing 100 to some extent, and this embodiment illustrates one of the implementation manners:
the heat dissipating sub-body 150 is provided with a plurality of second heat dissipating teeth 152 at intervals (see fig. 1), and free ends of the plurality of second heat dissipating teeth 152 all extend towards one end away from the heat dissipating main body 110 (the extending direction can be understood by referring to fig. 3, and the second heat dissipating teeth 152 on both sides respectively extend freely along the direction away from the heat dissipating sub-body 150 on the other side). Further, the second heat dissipation teeth 152 are bar-shaped. Of course, the specific shape of the first heat dissipation teeth 112 and the second heat dissipation teeth 152 may not be limited, and both may also take other shapes than a bar shape, such as a ring shape, a wave shape, and the like. Certainly, the strip-shaped second heat dissipation teeth 152 also have special heat dissipation advantages, for example, the heat dissipation area is increased, and when air flows through the surface of the strip-shaped second heat dissipation teeth 152, the regular strip shape can play a role in guiding air circulation, so that the circulation rate of the air on the surface of the second heat dissipation teeth 152 is increased, and further, the heat dissipation rate is increased.
In order to further increase the heat dissipation area of the heat dissipation casing 100 to enhance the heat dissipation effect, a plurality of protrusions (not shown) are disposed on the surface of the second heat dissipation teeth 152. The shape of the protrusion may be various, and it is needless to say that the plurality of protrusions spaced apart may increase the heat dissipation area of the surface of the second heat dissipation tooth 152, thereby improving the heat dissipation capability of the second heat dissipation tooth 152. The arrangement of the projections in this embodiment is in the form of a continuous wave, as shown in fig. 4. Each of the first heat dissipation teeth 112 and each of the second heat dissipation teeth 152 have a continuous wave protrusion on the surface thereof.
The heat dissipating sub-body 150 and the heat dissipating main body 110 may be integrally formed or may be separately connected. In the embodiment, the integrated molding is adopted, so that the heat accumulation at the split joint of the heat sink and the heat pipe is avoided, and the heat dissipation capability of the heat dissipation shell 100 may be reduced due to long-term heat accumulation.
The working principle of the heat dissipation case 100 is as follows:
the control board and the MOS transistor are mounted on the panel mounting portion 114 (generally, the control board and the MOS transistor are welded and then mounted on the panel mounting portion 114). The two ends of the control panel are respectively clamped in the first clamping portion 118 and the second clamping portion 120, and the MOS transistor is tiled on the attaching portion 116. Because MOS pipe calorific capacity is great in the course of the work, in order to improve the heat conduction efficiency between MOS pipe and laminating portion 116, and then make the heat of MOS pipe effluvium more fast, adopt mounting 122 to make the MOS pipe hug closely on laminating portion 116, can also guarantee the connection stability of MOS pipe simultaneously. The two mounting plates 130 are disposed at two ends of the heat dissipating body 110, and after the mounting plates 130 are fixed, the first heat dissipating teeth 112 on the back of the heat dissipating body 110 are naturally in a suspended state (i.e., cannot be directly abutted to the controller), so as to improve the heat dissipating rate of the heat dissipating body 110 from the back. Meanwhile, the heat dissipation sub-bodies 150 are connected to both sides of the heat dissipation main body 110 in the width direction of the heat dissipation main body 110, so that the heat dissipation area is increased, and the heat dissipation efficiency of the MOS transistor can be remarkably improved. The heat dissipation shell 100 provided by the embodiment has the advantages of better ventilation effect, larger heat dissipation area, better heat dissipation effect and capability of greatly improving the heat dissipation effect of an electronic device, thereby prolonging the service life of the electric device. The material of the heat dissipation casing 100 may be metal material with good heat dissipation, such as copper and aluminum, or some non-metal material with good heat dissipation, such as carbon fiber.
The present embodiment may also provide an electric vehicle, which mainly includes a controller and the above heat dissipation case 100 connected to each other. The controller comprises a control board and a plurality of MOS tubes which are arranged at intervals. The control panel and the MOS transistor are electrically connected and are installed on the panel installation portion 114. In the working process of the MOS transistor, the heat productivity is large, and the heat dissipation case 100 has a large heat dissipation area and more air convection heat dissipation channels. Therefore, the heat dissipation shell 100 can improve the heat dissipation rate of the MOS tube in the working process, avoid heat accumulation, guarantee the normal work of the MOS tube, prolong the service life of the MOS tube, further prolong the service life of a controller in an electric vehicle, and reduce the maintenance cost of the electric vehicle.
The above is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and various modifications and changes will occur to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (9)
1. The utility model provides a heat dissipation shell, its characterized in that, includes interconnect's heat dissipation main part and mounting panel, follows on the thickness direction of heat dissipation main part, the both ends of mounting panel extend along opposite direction and all protrusion in the heat dissipation main part, the heat dissipation main part is provided with first heat dissipation tooth and panel installation department, first heat dissipation tooth with the panel installation department set up relatively in both sides in the heat dissipation main part thickness direction are a plurality of first heat dissipation tooth interval set up in the heat dissipation main part, the mounting panel protrusion in first heat dissipation tooth.
2. The heat dissipation case of claim 1, further comprising a fixing member for pressing a heat generating device, wherein the heat dissipation body is further provided with a fixing groove matched with the fixing member.
3. The heat dissipating housing of claim 1, wherein the heat dissipating housing comprises two of the mounting plates, and the two mounting plates are oppositely disposed at two ends of the heat dissipating body.
4. The heat dissipating case according to any one of claims 1 to 3, further comprising a heat dissipating sub-body connected to at least one of both sides of the heat dissipating main body in a width direction of the heat dissipating main body.
5. The heat dissipating shell of claim 4, wherein the heat dissipating sub-body is provided with a plurality of second heat dissipating teeth at intervals, and free ends of the plurality of second heat dissipating teeth extend towards an end away from the heat dissipating main body.
6. The heat dissipation case of claim 5, wherein the second heat dissipation teeth are bar-shaped.
7. The heat dissipation case of claim 5, wherein the second heat dissipation tooth surface is provided with a plurality of protrusions.
8. The heat dissipating case of claim 4, wherein the heat dissipating sub-body is integrally formed with the heat dissipating main body.
9. An electric vehicle, comprising a controller and the heat dissipation housing as claimed in any one of claims 1 to 3, wherein the controller comprises a control board and a plurality of spaced MOS transistors, the control board is electrically connected to the MOS transistors, and the control board and the MOS transistors are mounted on the panel mounting portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822069246.0U CN209824272U (en) | 2018-12-10 | 2018-12-10 | Heat dissipation shell and electric motor car |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201822069246.0U CN209824272U (en) | 2018-12-10 | 2018-12-10 | Heat dissipation shell and electric motor car |
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| CN209824272U true CN209824272U (en) | 2019-12-20 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113645812A (en) * | 2021-08-19 | 2021-11-12 | 华为技术有限公司 | Heat dissipation structure for electronic equipment and electronic equipment |
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2018
- 2018-12-10 CN CN201822069246.0U patent/CN209824272U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113645812A (en) * | 2021-08-19 | 2021-11-12 | 华为技术有限公司 | Heat dissipation structure for electronic equipment and electronic equipment |
| CN113645812B (en) * | 2021-08-19 | 2024-03-15 | 华为数字能源技术有限公司 | Heat radiation structure for electronic equipment and electronic equipment |
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