CN212628952U

CN212628952U - Heat dissipation type MOS pipe

Info

Publication number: CN212628952U
Application number: CN202021213654.XU
Authority: CN
Inventors: 不公告发明人
Original assignee: Mutual Technology Shenzhen Co ltd
Current assignee: Mutual Technology Shenzhen Co ltd
Priority date: 2020-06-28
Filing date: 2020-06-28
Publication date: 2021-02-26
Anticipated expiration: 2030-06-28

Abstract

The utility model discloses a heat dissipation type MOS tube, which comprises a heat dissipation frame, an elastic pressing piece, a limiting strip and an MOS tube, wherein the heat dissipation frame comprises a first workpiece, a second workpiece and a third workpiece; the first workpiece and the third workpiece are arranged in parallel; the second workpiece is arranged between the first workpiece and the third workpiece, and two ends of the second workpiece are respectively and vertically connected with the first workpiece and the third workpiece; the elastic pressing pieces are symmetrically arranged in mounting grooves formed in opposite end faces of the first workpiece and the third workpiece; the limiting strip penetrates through the through holes formed in the first workpiece and the third workpiece and is fixed between the first workpiece and the third workpiece; the MOS pipe is arranged on the end face of the second workpiece, the rest side faces of the MOS pipe are respectively abutted to the limiting strip and the elastic pressing piece, and the pins of the MOS pipe extend out of the heat dissipation frame. The utility model provides a loaded down with trivial details problem of MOS pipe fixed mode, guarantee fully to contact between MOS pipe and the heating panel.

Description

Heat dissipation type MOS pipe

Technical Field

The utility model relates to the field of electronic technology, especially, relate to a heat dissipation type MOS pipe.

Background

MOS pipe is often used on products such as invertion power supply, solar controller, the appearance that discharges, UPS power, especially high-power supply product all need use the MOS pipe, and the MOS pipe is a power device, the temperature is very high during normal work piece, need give the MOS pipe heat dissipation with the aluminium heating panel, all process the fixed orifices on the heating panel at present, then screw up the screw in order to realize that the MOS pipe locks on the heating panel admittedly, but this kind of fixed mode need use auxiliary workpiece, the complex operation, and if not screw up can lead to insufficient contact between MOS pipe and the heating panel, arouse the bad trouble of heat dissipation.

SUMMERY OF THE UTILITY MODEL

The utility model discloses aim at solving the technical problem that the above-mentioned exists to a certain extent, provide a heat dissipation type MOS pipe, solved the loaded down with trivial details problem of MOS pipe fixed mode, guarantee fully to contact between MOS pipe and the heating panel.

The utility model provides a technical scheme that its technical problem adopted is: the heat dissipation type MOS tube comprises a heat dissipation frame, an elastic pressing piece, a limiting strip and an MOS tube, wherein the heat dissipation frame comprises a first workpiece, a second workpiece and a third workpiece; the first workpiece and the third workpiece are arranged in parallel; the second workpiece is arranged between the first workpiece and the third workpiece, and two ends of the second workpiece are respectively and vertically connected with the first workpiece and the third workpiece; the elastic pressing pieces are symmetrically arranged in mounting grooves formed in opposite end faces of the first workpiece and the third workpiece; the limiting strip penetrates through the through holes formed in the first workpiece and the third workpiece and is fixed between the first workpiece and the third workpiece; the MOS pipe is arranged on the end face of the second workpiece, the rest side faces of the MOS pipe are respectively abutted to the limiting strip and the elastic pressing piece, and the pins of the MOS pipe extend out of the heat dissipation frame.

In the embodiment of the utility model, a containing cavity for placing the MOS tube is formed among the first workpiece, the second workpiece and the third workpiece, meanwhile, an elastic pressing piece is arranged in the mounting groove of the first workpiece and the third workpiece through bolts, when the MOS tube is placed in the containing cavity, the MOS tube can extrude the elastic pressing pieces at two ends, at the moment, the elastic pressing pieces can generate deformation force under the action of extrusion force, so that the elastic pressing pieces tightly clamp the MOS tube, the MOS tube is firmly supported on the end surface of the second workpiece and tightly attached to the heat conducting sheet which is glued on the end surface of the second workpiece, thereby the MOS tube is not required to be fixed on the heat dissipation frame by bolts, the MOS tube is fixed by clamping, the problem of complicated fixing mode of the MOS tube is solved, the MOS tube is ensured to be fully contacted with the heat dissipation plate, and the MOS tube can be conveniently detached to be replaced, the heat conducting sheet is ensured, the heat dissipation effect of the MOS tube is ensured, further, when the rear end surface of the MOS tube is abutted against the spacing, the final position of the MOS tube assembly is the final position, and the position ensures that the MOS tube is completely contacted with the heat-conducting fin of the second workpiece, so that the heat dissipation effect of the MOS tube is ensured.

In some preferred embodiments, the elastic pressing member is an elastic sheet with a fixing portion, the fixing portion is assembled in the mounting groove through a bolt, and a bending portion is arranged at a position where the elastic sheet abuts against the outer wall of the MOS tube. So, the assembly that the elasticity of being convenient for compressed tightly the piece position makes the portion of bending and the MOS pipe contact of shell fragment, and when shell fragment chucking MOS pipe, the portion of bending supports tight MOS pipe, guarantees that the MOS pipe supports tight conducting strip and reaches good radiating effect.

In some preferred embodiments, the mounting groove extends downwards from the end surfaces of the first workpiece and the third workpiece, and the bottom surface of the mounting groove is flush with the end surface of the second workpiece, which is provided with the MOS tube. So, guarantee shell fragment and the portion of bending can with the better laminating of MOS pipe, produce sufficient effort and ensure that the MOS pipe pastes tight conducting strip to reach good radiating effect.

In certain preferred embodiments, the first, second and third workpieces are integrally formed.

In some preferred embodiments, the second workpiece is vertically disposed at a position of one third of the total length of the first workpiece and the third workpiece. So, make the side of MOS pipe can laminate first work piece, third work piece, make the whole intracavity that holds that arranges the formation in of MOS pipe, reach better radiating effect.

In some preferred embodiments, the end surface of the second workpiece, which faces away from the side where the MOS tube is installed, extends downward and is provided with a cooling fin. Therefore, the heat dissipation effect of the second workpiece is improved, and the heat dissipation efficiency of the MOS tube is improved.

Compared with the prior art, the beneficial effects are that: the utility model discloses first work piece in the embodiment, form the chamber that holds that is used for placing the MOS pipe between second work piece and the third work piece, it compresses tightly the piece to install elasticity through the bolt in the mounting groove that first work piece and third work piece set up simultaneously, thereby make elasticity compress tightly a chucking MOS pipe, top that stabilizes the MOS pipe is on the terminal surface of second work piece, and paste tightly with the conducting strip that splices on the second work piece terminal surface, thereby need not use the fixed MOS pipe of bolt on the heat dissipation frame, MOS pipe is fixed to mode through the chucking, the loaded down with trivial details problem of MOS pipe fixed mode has been solved, guarantee fully contact between MOS pipe and the heating panel, and can be convenient for pull down the MOS pipe and carry out the change of conducting strip, guarantee the radiating effect of MOS pipe.

While additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

The present invention will be further explained with reference to the drawings and examples.

Fig. 1 is a structural diagram of a heat dissipation MOS transistor according to the present invention;

fig. 2 is an exploded view of the heat dissipation MOS transistor of the present invention;

fig. 3 is a structural diagram of the elastic pressing member of the present invention.

Description of the drawings: 1. a heat dissipation frame; 101. a first workpiece; 102. a second workpiece; 103. a third workpiece; 2. an elastic pressing member; 201. a fixed part; 202. a spring plate; 203. a bending part; 3. a limiting strip; 4. an MOS tube; 5. a heat conductive sheet; 6. mounting grooves; 7. and a heat sink.

Detailed Description

The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic drawings and illustrate the basic structure of the present invention only in a schematic manner, and thus show only the components related to the present invention.

In the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention; the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, as they may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the utility model can be understood in specific cases to those of ordinary skill in the art.

The utility model discloses at the concrete implementation as follows: as shown in fig. 1-3, the heat dissipation type MOS transistor includes a heat dissipation frame 1, an elastic pressing member 2, a limiting strip 3, and an MOS transistor 4, where the heat dissipation frame 1 includes a first workpiece 101, a second workpiece 102, and a third workpiece 103; the first workpiece 101 and the third workpiece 103 are arranged parallel to each other; the second workpiece 102 is arranged between the first workpiece 101 and the third workpiece 103, two ends of the second workpiece are respectively and vertically connected with the first workpiece 101 and the third workpiece 103, and the end face of the second workpiece 102 is glued with the heat-conducting fin 5; the elastic pressing piece 2 is symmetrically arranged in an installation groove 6 formed in the opposite end faces of the first workpiece 101 and the third workpiece 103, the elastic pressing piece 2 is an elastic piece 202 with a fixing part 201, the fixing part 201 of the elastic pressing piece is assembled in the installation groove 6 through a bolt, a bending part 203 is arranged at the abutting position of the elastic piece 202 and the outer wall of the MOS tube 4, the elastic pressing piece 2 can be conveniently assembled through the fixing part 201, the bending part 203 of the elastic piece 202 is in contact with the MOS tube 4, the bending part 203 abuts against the MOS tube 4 when the MOS tube 4 is tightly clamped by the elastic piece 202, and the MOS tube 4 abuts against the heat conducting strip 5 to achieve a good heat dissipation effect; the limiting strip 3 penetrates through holes formed in the first workpiece 101 and the third workpiece 103 and is fixed between the first workpiece 101 and the third workpiece 103; the MOS tube 4 is arranged on the end face of the second workpiece 102 and is tightly attached to the heat conducting fin 5, the rest side faces of the MOS tube 4 are respectively abutted to the limiting strip 3 and the elastic pressing piece 2, and the pins of the MOS tube 4 extend out of the heat dissipation frame 1.

In the embodiment of the utility model, a containing cavity for placing the MOS tube 4 is formed among the first workpiece 101, the second workpiece 102 and the third workpiece 103, meanwhile, the elastic pressing piece 2 is installed in the installation groove 6 arranged on the first workpiece 101 and the third workpiece 103 through the bolt, when the MOS tube 4 is placed in the containing cavity, the MOS tube 4 can extrude the elastic pressing piece 2 at both ends, at the moment, the elastic pressing piece 2 can generate deformation force by the extrusion force, so that the MOS tube 4 is tightly clamped by the elastic pressing piece 2, the MOS tube 4 is firmly supported on the end surface of the second workpiece 102 and is tightly attached to the heat conducting strip 5 glued on the end surface of the second workpiece 102, thereby the MOS tube 4 is not required to be fixed on the heat dissipation frame 1 by the bolt, the MOS tube 4 is fixed in a clamping way, the problem of fussy fixing way of the MOS tube 4 is solved, the full contact between the MOS tube 4 and the heat dissipation plate is ensured, and the replacement of the heat conducting strip 5 can be conveniently carried out by detaching the MOS tube 4, the heat dissipation effect of the MOS tube 4 is ensured, and further, when the rear end face of the MOS tube 4 abuts against the limiting strip 3, the rear end face of the MOS tube 4 is the final position of the assembly of the MOS tube 4, and the position ensures that the MOS tube 4 is in complete contact with the heat conducting fin 5 of the second workpiece 102, so that the heat dissipation effect of the MOS tube is ensured.

In the present embodiment, the mounting groove 6 extends downward from the end surfaces of the first workpiece 101 and the third workpiece 103, and the bottom surface of the mounting groove 6 is flush with the end surface of the second workpiece 102 that is provided with the MOS transistor 4. So, guarantee shell fragment 202 and bend portion 203 can with the better laminating of MOS pipe 4, produce sufficient effort and ensure that MOS pipe 4 pastes tight conducting strip to reach good radiating effect.

In the present embodiment, the first workpiece 101, the second workpiece 102, and the third workpiece 103 are integrally formed.

In the present embodiment, the second workpiece 102 is vertically disposed at a position of one third of the total length of the first workpiece 101 and the third workpiece 103. So, make first work piece 101, third work piece 103 of laminating of side of MOS pipe 4, make MOS pipe 4 whole arrange the intracavity that holds that forms in, reach better radiating effect.

In the present embodiment, the end surface of the second workpiece 102 facing away from the side where the MOS transistor 4 is mounted extends downward and is provided with the heat sink 7. In this way, the heat dissipation effect of the second workpiece 102 is improved, and the heat dissipation efficiency of the MOS transistor 4 is improved.

The basic principles and the main features of the invention and the advantages of the invention have been shown and described above, it will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, but that the invention may be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims

1. A heat dissipation type MOS tube is characterized by comprising:

the heat dissipation frame comprises a first workpiece, a second workpiece and a third workpiece; the first workpiece and the third workpiece are arranged in parallel; the second workpiece is arranged between the first workpiece and the third workpiece, and two ends of the second workpiece are respectively and vertically connected with the first workpiece and the third workpiece;

the elastic pressing pieces are symmetrically arranged in mounting grooves formed in the opposite end faces of the first workpiece and the third workpiece;

the limiting strip penetrates through the through holes formed in the first workpiece and the third workpiece and is fixed between the first workpiece and the third workpiece;

and the MOS tube is arranged on the end face of the second workpiece, the rest side faces of the MOS tube are respectively abutted to the limiting strip and the elastic pressing piece, and the pins of the MOS tube extend out of the heat dissipation frame.

2. The heat dissipation type MOS tube as recited in claim 1, wherein the elastic pressing member is a spring plate with a fixing portion, the fixing portion is assembled in the mounting groove by a bolt, and a bending portion is disposed at a position where the spring plate abuts against an outer wall of the MOS tube.

3. The MOS transistor of claim 1, wherein the mounting groove extends downward from the end surfaces of the first and third workpieces, and the bottom surface of the mounting groove is flush with the end surface of the second workpiece on which the MOS transistor is mounted.

4. The heat dissipating MOS transistor of claim 1, wherein the first, second, and third workpieces are integrally formed.

5. The MOS transistor of claim 1, wherein the second workpiece is vertically disposed about one third of the total length of the first and third workpieces.

6. The MOS transistor of claim 1, wherein the second workpiece has fins extending downwardly from an end surface thereof opposite to the side on which the MOS transistor is mounted.