CN213043894U

CN213043894U - Low temperature ceramic circuit board convenient to installation

Info

Publication number: CN213043894U
Application number: CN202021705820.8U
Authority: CN
Inventors: 黄涛
Original assignee: Naron Technology Jiangsu Co ltd
Current assignee: Naron Technology Jiangsu Co ltd
Priority date: 2020-08-17
Filing date: 2020-08-17
Publication date: 2021-04-23
Anticipated expiration: 2030-08-17

Abstract

The utility model discloses a low temperature ceramic circuit board convenient to installation, the lower fixed surface of circuit mainboard installs ceramic heating panel, the surface of circuit mainboard is close to the equal fixed connection in four corners position and installs that the fixed column is preferred, the surface of circuit mainboard is close to the four corners position and has all seted up mounting groove, the upper surface of circuit mainboard is close to a side surface position fixed mounting and has the contact copper sheet. A low temperature ceramic line board convenient to installation, it is fixed to accomplish the installation fast, and the later stage need only when dismantling the maintenance squeeze fixed shell fragment upper end alright bounce the circuit mainboard under buffer spring's elasticity and demolish, in use buffer spacer and buffer spring will play certain cushioning effect simultaneously, can prevent that low temperature ceramic line board from leading to damaging because of the striking, and can accomplish high efficiency's radiating action, make low temperature ceramic line board reduce the card when the operation and pause.

Description

Low temperature ceramic circuit board convenient to installation

Technical Field

The utility model relates to a circuit board field, in particular to low temperature ceramic circuit board convenient to installation.

Background

The ceramic circuit board is a heat-conducting organic ceramic circuit board which utilizes heat-conducting ceramic powder and organic adhesive to prepare heat-conducting organic ceramic circuit board with heat-conducting coefficient of 9-20W/m.k at the temperature lower than 250 ℃, and has the main advantages that the ceramic material has good high-frequency performance and electrical performance, and has the performances which are not possessed by organic substrates, such as high heat conductivity, excellent chemical stability and thermal stability, and the like, is an ideal packaging material for a new generation of large-scale integrated circuit and power electronic module, has better practical effect, lower production cost and is widely applied to various fields; however, the existing low-temperature ceramic circuit board has certain disadvantages when in use, when in use and installation, the installation and later period disassembly and maintenance are very troublesome, the disassembly, the installation and the disassembly are complicated through screws, the shock resistance and the anti-collision capability are poor, the shock resistance and the breakage resistance are easy, the heat dissipation performance is general, and the heat dissipation can not be better.

SUMMERY OF THE UTILITY MODEL

The utility model discloses a main aim at provides a low temperature ceramic circuit board convenient to installation can effectively solve the problem in the background art.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the utility model provides a low temperature ceramic circuit board convenient to installation, the lower fixed surface of circuit mainboard installs ceramic heating panel, the surface of circuit mainboard is close to the equal fixed connection in four corners position and installs the fixed column preferred, the surface of circuit mainboard is close to the four corners position and has all seted up mounting groove, the upper surface of circuit mainboard is close to one side surface position fixed mounting and has the contact copper sheet.

Preferably, the rotation axis has been seted up at the middle part of connecting the support body, the middle part swing joint of rotation axis installs fixed ceramic rod, fixed jack has been seted up to the other end of fixed ceramic rod, the inside interlude of fixed jack is equipped with the hob, the fixed recess has been seted up to one side that the surface of connecting the support body is located the spread groove, the spiral hole has been seted up to the inside of fixed recess.

Preferably, the fixed ceramic rod is movably connected with the connecting frame body through a rotating shaft, and the fixed ceramic rod is inserted into the fixed insertion hole through a spiral rod and is fixedly connected with the spiral hole in a spiral mode.

Preferably, the ceramic heat dissipation plate is coated on the upper surface of the ceramic heat dissipation plate, the heat conduction silicone grease is fixedly mounted on the lower surface of the ceramic heat dissipation plate, and the ceramic heat dissipation plate is fixedly bonded with the circuit main board through the ceramic heat dissipation plate.

Preferably, the upper end of the fixed column is fixedly provided with a fixed elastic sheet, the surface of the fixed elastic sheet is fixedly provided with a fixed clamping block, the surface of the fixed elastic sheet is fixedly provided with a buffer gasket on the lower surface of the fixed clamping block, the lower end of the fixed column is provided with a fixed screw hole, the outer surface of the fixed column is sleeved with a buffer spring, the number of the fixed elastic sheets is two, and the upper end of the fixed column is arranged between the two fixed elastic sheets and is provided with a straight screw hole.

Compared with the prior art, the utility model discloses following beneficial effect has:

in the utility model, through the arranged fixed column, in installation, an installer can take the circuit mainboard to align four installation grooves with the upper ends of four fixed elastic sheets of the fixed column, then press the circuit mainboard down to clamp the fixed fixture block on the upper surface of the circuit mainboard and contact the circuit mainboard through the buffer gasket, while the lower surface of the circuit mainboard is extruded and fixed with the upper end of the buffer spring, thus the installation and fixation can be rapidly completed, and the circuit mainboard can be bounced up and removed under the elasticity of the buffer spring only by pinching and pressing the upper end of the fixed elastic sheet when disassembling and maintaining are needed in later period, while the buffer gasket and the buffer spring can simultaneously play a certain buffer effect to prevent the low-temperature ceramic circuit board from being damaged due to impact, through the arranged ceramic heat-radiating plate, the ceramic heat-radiating plate arranged in use can conduct the heat on the circuit mainboard to the installer through the heat-conducting silicone grease, then the heat is conducted to the heat-conducting silicone grease, so that the quick and efficient heat dissipation effect can be achieved, and the blockage during the operation of the low-temperature ceramic circuit board is reduced.

Drawings

Fig. 1 is a schematic view of the overall structure of a low-temperature ceramic circuit board convenient to mount according to the present invention;

FIG. 2 is a partial cross-sectional view of a low temperature ceramic circuit board of the present invention for easy installation;

fig. 3 is a view of the local section of the fixing column of the low temperature ceramic circuit board convenient for installation.

In the figure: 1. a circuit main board; 101. installing a groove; 102. a contact copper sheet; 2. connecting the frame body; 201. connecting grooves; 202. a rotating shaft; 203. fixing the ceramic rod; 204. a screw rod; 205. fixing the groove; 206. fixing the jack; 207. a helical bore; 3. a ceramic heat sink plate; 301. a ceramic heat sink; 302. heat-conducting silicone grease; 4. fixing a column; 401. fixing the elastic sheet; 402. a cushion pad; 403. fixing screw holes; 404. a buffer spring; 405. a straight screw; 406. and fixing the clamping block.

Detailed Description

In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to which the reference is made must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, and for example, "connected" may be either fixedly connected or detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

As shown in fig. 1-3, a low-temperature ceramic circuit board 2 convenient to mount, a ceramic heat dissipation plate 3 is fixedly mounted on the lower surface of a circuit main board 1, and fixing columns 4 are fixedly connected and mounted at positions, close to four corners, on the surface of the circuit main board 1;

mounting grooves 101 are formed in the positions, close to four corners, of the surface of the circuit main board 1, and contact copper sheets 102 are fixedly mounted on the positions, close to one side surface, of the upper surface of the circuit main board 1; a rotating shaft 202 is arranged in the middle of the connecting frame body 2, a fixed ceramic rod 203 is movably connected and mounted in the middle of the rotating shaft 202, a fixed insertion hole 206 is arranged at the other end of the fixed ceramic rod 203, a spiral rod 204 is inserted into the fixed insertion hole 206, a fixed groove 205 is arranged on one side, located on the connecting groove 201, of the surface of the connecting frame body 2, and a spiral hole 207 is arranged in the fixed groove 205; the fixed ceramic rod 203 is movably connected with the connecting frame body 2 through a rotating shaft 202, and the fixed ceramic rod 203 is inserted into a fixed insertion hole 206 through a screw rod 204 and is spirally and fixedly connected with a screw hole 207; the ceramic heat dissipation plate 3 is characterized in that a ceramic heat dissipation plate 301 is coated on the upper surface of the ceramic heat dissipation plate 3, heat conduction silicone grease 302 is fixedly installed on the lower surface of the ceramic heat dissipation plate 3, the ceramic heat dissipation plate 3 is fixedly bonded with the circuit main board 1 through the ceramic heat dissipation plate 301, heat on the circuit main board 1 can be conducted to the ceramic heat dissipation plate 3 through the heat conduction silicone grease 302 in use, and then the heat can be conducted to the heat conduction silicone grease 302, so that the quick and efficient heat dissipation effect can be achieved, and the blockage during the operation of the low-; the upper end of the fixed column 4 is fixedly provided with a fixed spring plate 401, the surface of the fixed spring plate 401 is fixedly provided with a fixed fixture block 406, the surface of the fixed spring plate 401 is positioned on the lower surface of the fixed fixture block 406 and is fixedly provided with a buffer gasket 402, the lower end of the fixed column 4 is provided with a fixed screw hole 403, the outer surface of the fixed column 4 is sleeved with a buffer spring 404, the number of the fixed spring plates 401 is two, the upper end of the fixed column 4 is positioned between the two fixed spring plates 401 and is provided with a straight screw hole 405, in the installation process, an installer can take the circuit main board 1 to align the four installation grooves 101 with the upper ends of the four fixed spring plates 401 and then press down the circuit main board 1 to enable the fixed fixture block 406 to be clamped on the upper surface of the circuit main board 1 and to be contacted with the circuit main board 1 through the buffer gasket 402, and later stage need only pinch pressure fixed shell fragment 401 upper end when dismantling the maintenance alright bounce circuit board 1 under buffer spring 404's elasticity and demolish, and in use buffer spacer 402 and buffer spring 404 will play certain cushioning effect simultaneously, can prevent that low temperature ceramic circuit board from leading to damaging because of the striking.

It should be noted that, the utility model relates to a low temperature ceramic circuit board convenient for installation, when using and installing, firstly, the fixed column 4 is fixed on the screw rod preset in the installation position through the screw hole 403, when fixing, the fixed column can be inserted into the screw hole 405 through the screwdriver for rotating and fixing, after the four are fixed, the installer can take the circuit main board 1 to align the four installation grooves 101 thereof with the upper ends of the four fixing elastic pieces 401, then press down the circuit main board 1 to clamp the fixing block 406 on the upper surface of the circuit main board 1 and contact the circuit main board 1 through the buffer gasket 402, while the lower surface of the circuit main board 1 is pressed and fixed with the upper end of the buffer spring 404, thus the installation and fixation can be completed quickly, and the circuit main board 1 can be popped up and removed under the elasticity of the buffer spring 404 only by pinching the upper end of the fixing elastic piece 401 when disassembling and maintaining in later period, and in use, the buffer gasket 402 and the buffer spring 404 can play a certain buffer effect simultaneously, the low-temperature ceramic circuit board can be prevented from being damaged due to impact, in addition, when the flat cable is connected, an installer can insert the flat cable connector into the connecting groove 201 firstly, then fixedly connect the fixed ceramic rod 203 on the contact copper sheet 102 in a pressing mode, then, the spiral rod 204 can be used for spiral fixed installation, the flat cable can be used, the ceramic heat dissipation plate 3 arranged in use can conduct heat on the circuit main board 1 to the user through the heat conduction silicone grease 302, and then conduct the heat conduction silicone grease 302, so that the quick and efficient heat dissipation effect can be achieved, and the blockage of the low-temperature ceramic circuit board in operation is reduced.

The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides a low temperature ceramic circuit board convenient to installation which characterized in that: including circuit mainboard (1), the upper surface of circuit mainboard (1) is close to one side position fixed mounting and has connects support body (2), the lower fixed surface of circuit mainboard (1) installs ceramic cooling plate (3), the surface of circuit mainboard (1) is close to the equal fixed connection in four corners position and installs fixed column (4).

2. A low temperature ceramic circuit board for easy installation according to claim 1, wherein: mounting grooves (101) are formed in the positions, close to four corners, of the surface of the circuit main board (1), and contact copper sheets (102) are fixedly mounted on the positions, close to one side surface, of the upper surface of the circuit main board (1).

3. A low temperature ceramic circuit board for easy installation according to claim 1, wherein: rotation axis (202) have been seted up at the middle part of connecting support body (2), the middle part swing joint of rotation axis (202) installs fixed ceramic rod (203), fixed jack (206) have been seted up to the other end of fixed ceramic rod (203), the inside interlude of fixed jack (206) is equipped with hob (204), fixed recess (205) have been seted up to one side that the surface of connecting support body (2) is located spread groove (201), spiral hole (207) have been seted up to the inside of fixed recess (205).

4. A low temperature ceramic circuit board for easy installation according to claim 3, wherein: the fixed ceramic rod (203) is movably connected with the connecting frame body (2) through a rotating shaft (202), and the fixed ceramic rod (203) is inserted into the fixed insertion hole (206) through the spiral rod (204) and is spirally and fixedly connected with the spiral hole (207).

5. A low temperature ceramic circuit board for easy installation according to claim 1, wherein: ceramic cooling fin (301) have been paintd to the upper surface of ceramic heating panel (3), the lower fixed surface of ceramic heating panel (3) installs heat conduction silicone grease (302), ceramic heating panel (3) are through ceramic cooling fin (301) and circuit mainboard (1) fixed bonding.

6. A low temperature ceramic circuit board for easy installation according to claim 1, wherein: the fixing structure is characterized in that a fixing elastic sheet (401) is fixedly mounted at the upper end of the fixing column (4), a fixing clamping block (406) is fixedly mounted on the surface of the fixing elastic sheet (401), a buffer gasket (402) is fixedly mounted on the lower surface, located on the surface of the fixing clamping block (406), of the fixing elastic sheet (401), a fixing screw hole (403) is formed in the lower end of the fixing column (4), a buffer spring (404) is mounted on the outer surface of the fixing column (4) in a sleeved mode, the number of the fixing elastic sheets (401) is two, and a straight screw hole (405) is formed between the two fixing elastic sheets (401) and at the upper end of the fixing.