CN216719055U - Hard disk heat dissipation device and hard disk assembly - Google Patents

Abstract

The utility model discloses a hard disk cooling device and a hard disk assembly, belonging to the technical field of hard disk cooling, comprising a heat dissipation base plate, a heat dissipation pipe, a heat dissipation fin and a fixed connection piece; the heat dissipation base plate is fixed in position by the fixed connection piece; The radiating pipes are provided with a plurality of them and are uniformly distributed on the top surface of the radiating base plate. Evenly distributed in the heat pipe. The heat dissipation base plate is installed in the server through the fixed connector to keep the contact between the heat dissipation base plate and the solid state drive stable; the heat emitted by the solid state drive is transferred to the heat dissipation pipe, and then the heat dissipation fins make up for the lack of heat dissipation by the heat dissipation pipe. Improve the cooling effect of solid-state drives and reduce the power consumption of heat dissipation.

Description

A hard disk cooling device and hard disk assembly

technical field

The utility model belongs to the technical field of hard disk heat dissipation, in particular to a hard disk heat dissipation device and a hard disk assembly.

Background technique

E1 SSD (EDSFF: Enterprise and Datacenter 1U Short SSDFormFactor, Enterprise and Datacenter Short SSD Form Factor) hard drive is a new solid-state drive introduced in recent years, with two incomparable advantages; one is the transmission speed. The second advantage is the size advantage. Therefore, the application of E1 SSD hard disk is more and more extensive, especially in the server field, using limited space, can greatly increase the storage capacity of the server, and improve the data transmission rate. Some servers now use all E1 SSD hard disk configurations, which have banned traditional mechanical hard disks. However, due to the limited space of the server and the close arrangement of the E1 SSDs, the space for heat dissipation is small. As a result, the temperature of the E1 SSDs is too high during use, which affects the performance of the hard disks and causes the server fans to maintain high power consumption.

Utility model content

In order to solve the problems that solid-state hard disks are closely arranged in the server, resulting in excessively high temperature and high power consumption, the utility model provides a hard disk cooling device and a hard disk assembly.

The utility model is achieved through the following technical solutions:

A hard disk heat dissipation device, comprising a heat dissipation base plate, a heat dissipation pipe, a heat dissipation fin and a fixed connection piece; the heat dissipation base plate is fixed in position by the fixed connection piece; the heat dissipation pipe is provided with a number of and uniformly distributed in the On the top surface of the heat dissipation base plate, the heat dissipation pipe is in the shape of a U with an opening facing one side in the horizontal direction; the heat dissipation fins are provided with a number of them and are evenly distributed in the heat dissipation pipe.

The heat dissipation base plate is installed in the server through fixed connectors to maintain stable contact between the heat dissipation base plate and the solid state drive; the heat emitted by the solid state drive is transferred to the heat dissipation pipe, and then the heat dissipation fins make up for the lack of heat dissipation by the heat dissipation pipe. Improve the cooling effect of solid-state drives and reduce the power consumption of heat dissipation.

A further improvement of the present invention is that the above-mentioned fixed connectors are respectively arranged on at least one set of opposite sides of the heat dissipation base plate. A fixed connector is arranged on at least one pair of opposite sides to improve the installation stability of the heat dissipation base plate.

A further improvement of the present invention is that the above-mentioned fixed connecting piece is a glue nail. The convenience of installing the cooling base plate in the server is improved by the glue nails.

A further improvement of the present invention is that the top surface of the heat dissipation base plate is provided with an embedded groove for accommodating the heat dissipation pipe. The embedded groove forms a fixed support for the heat dissipation pipe, and at the same time, the contact area between the heat dissipation base plate and the heat dissipation pipe can be increased.

A further improvement of the present invention is that the U-shaped heat dissipation pipe includes two straight sections and an arc-shaped transition section connecting the two straight sections, and the two straight sections are in the same vertical plane; in the embedded groove. The heat is transferred to the upper straight section through the arc-shaped transition section, which can effectively prolong the heat dissipation effect. At the same time, the heat dissipation cavity formed by the U-shaped heat dissipation pipe is more convenient to take away the heat by means of wind speed convection to achieve the purpose of cooling.

A further improvement of the present invention is that the above-mentioned heat dissipation fins are arranged vertically in the heat dissipation pipe. The heat dissipation fins separate the space in the heat dissipation cavity formed by the heat dissipation pipe. While improving the heat transfer efficiency between the two straight sections, the separated heat dissipation cavity creates a disturbance to the wind speed to improve the heat dissipation effect.

A further improvement of the present invention is that the top ends of the heat dissipation fins extend upward to the top of the heat dissipation pipes. The air turbulence is formed by the heat dissipation fins extending above the heat pipe, which further improves the performance of heat transfer to the outside.

A hard disk assembly includes a solid state hard disk and a hard disk heat dissipation device, and a thermally conductive glue pad is arranged between the solid state hard disk and a heat dissipation chassis. The contact area between the solid state drive and the heat dissipation base plate is ensured by the thermally conductive rubber pad, so as to avoid gaps and form a rapid outward transfer of heat.

It can be seen from the above technical solutions that the beneficial effects of the present utility model are: the heat dissipation base plate is installed in the server through a fixed connector, so as to keep the contact between the heat dissipation base plate and the solid-state hard disk stable; Transfer, and then make up for the lack of heat dissipation of the heat pipe by the heat dissipation fins, improve the heat dissipation effect of the solid state drive, and reduce the power consumption of heat dissipation.

Description of drawings

In order to illustrate the technical solutions of the present invention more clearly, the accompanying drawings required in the description will be briefly introduced below. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention, which are very important in the art. For those of ordinary skill, other drawings can also be obtained from these drawings without any creative effort.

FIG. 1 is a schematic structural diagram of a heat sink according to a specific embodiment of the present invention.

FIG. 2 is a schematic diagram of an installation structure of a solid-state hard disk and a heat dissipation device according to a specific embodiment of the present invention.

In the attached drawings: 1. Thermally conductive rubber pad, 2. Cooling base plate, 21. Embedded groove, 3. Cooling pipe, 4. Cooling fin, 5. Solid state drive, 6. Fixed connector.

Detailed ways

In order to make the purpose, features and advantages of the present utility model more obvious and understandable, the technical solutions in the present utility model will be described clearly and completely below in conjunction with the accompanying drawings in the specific embodiments. Obviously, the following description The embodiments described above are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments in this patent, all other embodiments obtained by persons of ordinary skill in the art without creative efforts shall fall within the scope of protection of this patent.

As shown in the accompanying drawings, a hard disk assembly includes a solid state disk 5 and a hard disk heat dissipation device, the hard disk heat dissipation device includes a heat dissipation base plate 2, a heat dissipation pipe 3, a heat dissipation fin 4 and a fixed connector 6; the solid state disk 5 and the heat dissipation device A thermally conductive glue pad 1 is arranged between the bottom plates 2 . The contact area between the solid-state hard disk 5 and the heat dissipation base plate 2 is ensured by the thermally conductive rubber pad 1 , so as to avoid gaps and form a rapid outward transfer of heat.

The heat dissipation pipes 3 are provided with a plurality of them and are uniformly distributed on the top surface of the heat dissipation base plate 2 in sequence.

The top surface of the heat dissipation base plate 2 is provided with an embedding groove 21 for accommodating the heat dissipation pipe 3 . The embedded groove 21 forms a fixed support for the heat dissipation pipe 3 , and at the same time, the contact area between the heat dissipation base plate 2 and the heat dissipation pipe 3 can be increased. The U-shaped heat dissipation pipe 3 includes two straight sections and an arc-shaped transition section connecting the two straight sections, the two straight sections are in the same vertical plane; the straight section at the bottom is arranged in the embedding groove 21 . The heat is transferred to the upper straight section through the arc-shaped transition section, which can effectively prolong the heat dissipation effect. At the same time, the heat dissipation cavity formed by the U-shaped heat dissipation pipe 3 is more convenient to take away the heat by means of wind speed convection to achieve the purpose of cooling.

The radiating fins 4 are provided with several and are evenly distributed in the radiating pipe 3 . The heat dissipation fins 4 are vertically arranged in the heat dissipation pipe 3 . The heat dissipation fins 4 separate the space in the heat dissipation cavity formed by the heat dissipation pipe 3, which can increase the heat dissipation area while improving the heat transfer efficiency between the two straight sections; the divided heat dissipation cavity forms a disturbance to the wind speed, to improve the cooling effect.

The top ends of the heat dissipation fins 4 extend upward to the top of the heat dissipation pipes 3 . The air turbulence is formed by the heat dissipation fins 4 extending above the heat dissipation pipe 3, which further improves the performance of heat transfer to the outside.

The position of the heat dissipation base plate 2 is fixed by the fixed connection parts 6 ; the fixed connection parts 6 are respectively arranged on at least one set of opposite sides of the heat dissipation base plate 2 . Disposing the fixed connector 6 on at least one pair of opposite sides can improve the installation stability of the heat dissipation base plate 2 . The fixed connector 6 is a glue nail. The convenience of installing the heat dissipation base plate 2 in the server is improved by the glue nails. The glue nails extend downward through the heat dissipation base plate 2 , and the bottoms of the glue nails are connected with the computer accessories (such as the motherboard) carrying the solid-state drive 5 ;

In order to ensure the heat dissipation effect, the heat dissipation base plate 2 , the heat dissipation pipe 3 and the heat dissipation fins 4 are all made of copper.

To sum up, when the device is in use, the heat dissipation base plate 2 is connected to the motherboard on which the solid state drive 5 is installed through glue nails, and the gap between the heat dissipation base plate 2 and the solid state drive 5 is filled by the thermal conductive glue pad 1, so that the solid state The heat of the hard disk 5 is quickly dissipated to the outside. While fixing the heat dissipation pipe 3 through the embedded groove 21, the contact area with the heat dissipation pipe 3 is increased, and the heat dissipation fins 4 pass through the heat dissipation pipe 3 to form a partition for the internal heat dissipation cavity and improve the contact surface with the air. Speed up the cooling effect.

In the hard disk cooling device and the hard disk assembly described in the utility model, the cooling base plate is installed in the server through the fixed connector, so as to keep the contact between the cooling base plate and the solid state hard disk stable; , and then make up for the lack of heat dissipation of the heat pipe by the heat dissipation fins, improve the heat dissipation effect of the solid state drive, and reduce the power consumption of heat dissipation.

The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments, and the same and similar parts between the various embodiments can be referred to each other.

The terms "first", "second", "third", "fourth", etc. (if any) in the description and claims of the present utility model and the above drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It is to be understood that the data so used may be interchanged under appropriate circumstances so that the embodiments of the invention described herein can be practiced in sequences other than those illustrated or described herein. Furthermore, the terms "comprising" and "having", and any variations thereof, are intended to cover non-exclusive inclusion.

The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Thus, the present invention is not intended to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (8)

1. A hard disk heat dissipation device, characterized in that it comprises a heat dissipation base plate (2), a heat dissipation pipe (3), a heat dissipation fin (4) and a fixed connector (6); the heat dissipation base plate (2) is fixed by the The position of the connecting piece (6) is fixed; a plurality of the radiating pipes (3) are provided and are uniformly distributed on the top surface of the radiating base plate (2) in sequence, and the radiating pipes (3) are as a whole with openings facing the horizontal direction. The radiating fins (4) are provided with a plurality of them and are evenly distributed in the radiating pipes (3). 2 . The heat dissipation device for a hard disk according to claim 1 , characterized in that, the fixed connectors ( 6 ) are respectively disposed on at least one pair of opposite sides of the heat dissipation base plate ( 2 ). 3 . 3. A hard disk heat dissipation device according to claim 2, characterized in that, the fixing connector (6) is a glue nail. 4 . The hard disk heat dissipation device according to claim 1 , wherein the top surface of the heat dissipation bottom plate ( 2 ) is provided with an embedding groove ( 21 ) for accommodating the heat dissipation pipe ( 3 ). 5 . 5 . The hard disk heat dissipation device according to claim 4 , wherein the U-shaped heat dissipation pipe ( 3 ) comprises two straight sections and an arc-shaped transition section connecting the two straight sections, and the two straight sections are located in 5 . in the same vertical plane; the straight section at the bottom is arranged in the embedding groove (21). 6 . The hard disk heat dissipation device according to claim 5 , wherein the heat dissipation fins ( 4 ) are vertically arranged in the heat dissipation pipes ( 3 ). 7 . 7 . The heat dissipation device of a hard disk according to claim 6 , wherein the top ends of the heat dissipation fins ( 4 ) extend upward to above the heat dissipation pipes ( 3 ). 8 . 8. A hard disk assembly, characterized in that it comprises a solid state hard disk (5) and a hard disk cooling device according to any one of claims 1 to 7, wherein a heat conduction is provided between the solid state hard disk (5) and the heat dissipation chassis. Rubber pad (1).

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