CN209133495U - A kind of microelectronic component radiator - Google Patents
A kind of microelectronic component radiator Download PDFInfo
- Publication number
- CN209133495U CN209133495U CN201920158675.7U CN201920158675U CN209133495U CN 209133495 U CN209133495 U CN 209133495U CN 201920158675 U CN201920158675 U CN 201920158675U CN 209133495 U CN209133495 U CN 209133495U
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- China
- Prior art keywords
- microelectronic component
- heat
- radiator
- shield
- thermally conductive
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Abstract
The utility model discloses a kind of microelectronic component radiators, including heat-transfer device and radiator, the lower end of heat-transfer device and the upper end of radiator connect, the upper end of heat-transfer device is microelectronic component support plate, the upper surface of microelectronic component support plate is provided with microelectronic component, the lower end of microelectronic component is mounted on microelectronic component support plate by thermal conductive insulation glue, the lower end of thermal conductive insulation glue is connected with heat conducting bar in turn, heating column and thermally conductive sheet, lateral heat-conducting plate is provided on the outside of heat conducting bar and thermally conductive sheet, lateral heat-conducting plate can connect external radiating device, the outside of radiator is shield, shield is internally provided with radiating fin, the two sides of radiating fin are connected with micro- thermal column, middle part in shield is provided with fan, the wire netting of the lower end setting of fan matches connection with shield screw thread.The microelectronic component is more preferable with the more common radiator of radiator heat dissipation performance, and each component is easy to install and remove, and clears up convenient for follow-up maintenance.
Description
Technical field
The utility model relates to heat abstractor technical field, specially a kind of microelectronic component radiator.
Background technique
With the development of integrated technology and microelectronic packaging technology, the overall power density of electronic component constantly increases, and
The physical size of electronic component and electronic equipment is but gradually intended to small-sized, micromation, and generated heat is accumulated rapidly, led
The heat flow density around integrated device is caused also to increase, so, hot environment will influence whether electronic component and equipment
Performance, especially for small-sized and miniature electronic component, this just needs more efficient thermal control scheme.Therefore, electronics member
The heat dissipation problem of device has evolved into the large focal spot for Current electronic component and electronic equipment manufacturing, and for microelectronics member
The thermal control scheme and radiator of device are exactly the difficult point in this focus.
Utility model content
The purpose of this utility model is to provide a kind of microelectronic component radiators, have reached the effect of high efficiency and heat radiation
Fruit.
To achieve the above object, the utility model provides the following technical solutions: a kind of microelectronic component radiator,
Including heat-transfer device and radiator, the lower end of the heat-transfer device and the upper end of radiator are connected.
The heat-transfer device by microelectronic component support plate, microelectronic component, thermal conductive insulation glue, heat conducting bar, heating column,
Thermally conductive sheet and lateral heat-conducting plate composition, the upper surface of the microelectronic component support plate are provided with microelectronic component, and described
The lower end of microelectronic component is fixedly mounted on microelectronic component support plate by thermal conductive insulation glue, the thermal conductive insulation glue
Lower end is connected with heat conducting bar, and the lower end of the heat conducting bar is fixedly connected with heating column, and the lower end of the heating column is fixedly connected with
Thermally conductive sheet, the heat conducting bar and thermally conductive sheet are transverse direction, and the side of the heat conducting bar and thermally conductive sheet passes through microelectronic component
Support plate is simultaneously connected with lateral heat-conducting plate, and the lateral heat-conducting plate can connect external radiating device.
The radiator by shield, thermal insulation board, easy installation device, heat sink, radiating fin, micro- thermal column, mounting rack,
Motor, flabellum, wire netting and outer mounting ring composition, the thermal insulation board is fixedly mounted on the peripheral lower end of thermally conductive sheet, described heat-insulated
The lower end of plate is fixedly installed with shield, the inside of the shield and the lower end fixed installation for being located at thermally conductive sheet by easy installation device
There is heat sink, the lower end of the heat sink is fixedly installed with several radiating fins, and the two sides of the radiating fin are fixedly connected with
Several micro- thermal columns, the inside of the shield and the lower end for being located at radiating fin are fixedly connected with mounting rack, the mounting rack
Middle part upper end is fixedly installed with motor, and the middle part lower end of the mounting rack is provided with flabellum, and the motor and flabellum pass through rotation
Axis connection, the lower end of the flabellum are provided with wire netting, and the periphery of the wire netting is fixedly installed with outer mounting ring, the outer peace
Internal screw thread is offered on the inside of dress ring, the lower end outside of the shield offers external screw thread, then the outer mounting ring and shield spiral shell
Line matching connection.
Preferably, the easy installation device is made of U-shaped elastic plate, fixture block, card slot and spring, the easy installation device
Outside is fixedly connected with U-shaped elastic plate, and the outer upper end of the U-shaped elastic plate is fixedly connected with fixture block, under the thermal insulation board
Surface offers card slot, and the fixture block and pocket matches are clamped, and is fixedly connected with spring inside the U-shaped elastic plate.
Preferably, the spacing between the radiating fin is equal, and the spacing between micro- thermal column is equal.
Preferably, generated wind direction is from lower end to one end with radiating fin when the flabellum rotates.
Compared with prior art, the utility model has the beneficial effects that
(1), the radiator of microelectronic component radiator is connected to inside card slot by fixture block, convenient for heat dissipation
The shield of device is mounted and dismounted, and is fixedly connected with spring for connecting in the U-shaped elastic plate of fixture block, which can be with
The U-shaped elastic plate of senior general of exerting oneself when preventing user from dismantling is broken, and is played a certain protective role, and can also be to reinforcing blocking
The degree of block and card slot locking.In addition, the wire netting of radiator is mounted on inside outer mounting ring, and outer mounting ring and shield spiral shell
Line connection is opened shield convenient for user and is cleared up internal flabellum.
(2), the microelectronic component reinforces whole heat dissipation performance by three structures with radiator.Firstly, sharp
Microelectronic component is bonded on microelectronic component support plate and heat conducting bar with thermal conductive insulation glue, thermal conductive insulation glue is a kind of ratio
Common adhesive has the adhesives of better heating conduction, and its bonding is securely, not easily to fall off；Secondly, in microelectronics
Heat conducting bar and thermally conductive sheet inside component support plate extend to side, and a part of heat is transferred out to come, and utilize and be connected thereto
Lateral heat-conducting plate heat is concentrated, radiated later using external radiating device；Finally the two of common radiating fin
Side is fixedly connected with micro- thermal column, and thermal column improves the contact area of radiating fin and air slightly for this, in blowing for radiator fan
It can more efficiently radiate under dynamic.
Detailed description of the invention
FIG. 1 is a schematic structural view of the utility model；
Fig. 2 is the enlarged drawing in Fig. 1 at A；
Fig. 3 is the enlarged drawing in Fig. 1 at B.
In figure: 1 heat-transfer device, 101 microelectronic component support plates, 102 microelectronic components, 103 thermal conductive insulation glues, 104
Heat conducting bar, 105 heating columns, 106 thermally conductive sheets, 107 sides are easily pacified to heat-conducting plate, 2 radiators, 201 shields, 202 thermal insulation boards, 203
It is assembling device, 2031 U-shaped elastic plates, 2032 fixture blocks, 2033 card slots, 2034 springs, 204 heat sinks, 205 radiating fins, 206 micro-
Thermal column, 207 mounting racks, 208 motors, 209 flabellums, 2010 wire nettings, 2011 outer mounting rings.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
Fig. 1-3 is please referred to, the utility model provides a kind of technical solution: a kind of microelectronic component radiator, packet
Heat-transfer device 1 and radiator 2 are included, the lower end of heat-transfer device 1 is connect with the upper end of radiator 2.
Heat-transfer device 1 is by microelectronic component support plate 101, microelectronic component 102, thermal conductive insulation glue 103, heat conducting bar
104, heating column 105, thermally conductive sheet 106 and lateral heat-conducting plate 107 form, and the upper surface of microelectronic component support plate 101 is provided with
Microelectronic component 102, and the lower end of microelectronic component 102 is fixedly mounted on microelectronics member device by thermal conductive insulation glue 103
On part support plate 101, thermal conductive insulation glue 103 is a kind of adhesives than common adhesive with better heating conduction, and
It is bonded securely, not easily to fall off, and the lower end of thermal conductive insulation glue 103 is connected with heat conducting bar 104, and the lower end of heat conducting bar 104 is fixed to be connected
It is connected to heating column 105, the lower end of heating column 105 is fixedly connected with thermally conductive sheet 106, and heat conducting bar 104 and thermally conductive sheet 106 are cross
To, and the side of heat conducting bar 104 and thermally conductive sheet 106 passes through microelectronic component support plate 101 and is connected with lateral heat-conducting plate 107,
Lateral heat-conducting plate 107 can connect external radiating device, can carry out auxiliary heat dissipation, improve integral heat sink performance.
Radiator 2 by shield 201, thermal insulation board 202, easy installation device 203, heat sink 204, radiating fin 205, it is micro- dissipate
Plume 206, mounting rack 207, motor 208, flabellum 209, wire netting 2010 and outer mounting ring 2011 form, and thermal insulation board 202 is fixed
It is mounted on the peripheral lower end of thermally conductive sheet 106, the lower end of thermal insulation board 202 is fixedly installed with shield 201 by easy installation device 203,
Easy installation device 203 is made of U-shaped elastic plate 2031, fixture block 2032, card slot 2033 and spring 2034, easy installation device 203
Outside is fixedly connected with U-shaped elastic plate 2031, and the outer upper end of U-shaped elastic plate 2031 is fixedly connected with fixture block 2032, thermal insulation board
202 lower surface offers card slot 2033, and fixture block 2032 matches clamping, fixed company inside U-shaped elastic plate 2031 with card slot 2033
It is connected to spring 2034, the U-shaped elastic plate 2031 of senior general of exerting oneself when can prevent user from dismantling of spring 2034 is broken, and is played certain
Protective effect, and can also to reinforce fixture block and card slot locking degree, keep shield 201 easy for removal and installation, shield
201 inside and be located at thermally conductive sheet 106 lower end be fixedly installed with heat sink 204, if the lower end of heat sink 204 is fixedly installed with
Dry radiating fin 205, the two sides of radiating fin 205 are fixedly connected with several micro- thermal columns 206, and between radiating fin 205
Spacing is equal, and the spacing between micro- thermal column 206 is equal, and thermal column 206 improves connecing for radiating fin 205 and air slightly for this
Contacting surface product, can more efficiently radiate under the blowing of radiator fan, the inside of shield 201 and be located at radiating fin
205 lower end is fixedly connected with mounting rack 207, and the middle part upper end of mounting rack 207 is fixedly installed with motor 208, mounting rack 207
Middle part lower end is provided with flabellum 209, motor 208 and flabellum 209 and passes through rotation axis connection, generated wind when rotating of flabellum 209
The lower end Xiang Weicong is to one end with radiating fin 205, and the lower end of flabellum 209 is provided with wire netting 2010, wire netting 2010
Periphery is fixedly installed with outer mounting ring 2011, and the inside of outer mounting ring 2011 offers internal screw thread, and the lower end outside of shield 201 is opened
Equipped with external screw thread, then outer mounting ring 2011 matches connection with 201 screw thread of shield, and wire netting 2010 easy to disassemble makes follow-up maintenance
It is more convenient with clearing up.
The electric elements occurred in this article are electrically connected with extraneous main controller and 220V alternating current, and main controller can be meter
Calculation machine etc. plays the conventionally known equipment of control.
In use, the radiator 2 of the device is mounted on heat-transfer device 1 using easy installation device 203, the side of side
External radiator can be connected to thermally conductive version 107.Heat on microelectronic component 102 passes sequentially through heat conducting bar 104, thermally conductive
Column 105 and thermally conductive sheet 106 are transmitted to heat sink 202, are radiated later by the radiating fin 205 on heat sink 202, radiate
The two sides of fin 205 are provided with micro- thermal column 206, and thermal column 206 improves the contact surface of radiating fin 205 Yu air slightly for this
Product, can more efficiently radiate under the blowing of radiator fan.When needing to being cleared up inside radiator 2,
Easy installation device 203 and the outer mounting ring 2011 being threadedly coupled can be achieved to be rapidly assembled and disassembled, convenient for daily maintenance and clearly
Reason.
It should be noted that, in this document, relational terms such as first and second and the like are used merely to a reality
Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation
In any actual relationship or order or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to
Non-exclusive inclusion, so that the process, method, article or equipment including a series of elements is not only wanted including those
Element, but also including other elements that are not explicitly listed, or further include for this process, method, article or equipment
Intrinsic element.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired
Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.
Claims (4)
1. a kind of microelectronic component radiator, including heat-transfer device (1) and radiator (2), it is characterised in that: described
The lower end of heat-transfer device (1) is connect with the upper end of radiator (2)；
The heat-transfer device (1) by microelectronic component support plate (101), microelectronic component (102), thermal conductive insulation glue (103),
Heat conducting bar (104), heating column (105), thermally conductive sheet (106) and lateral heat-conducting plate (107) composition, the microelectronic component support plate
(101) upper surface is provided with microelectronic component (102), and the lower end of the microelectronic component (102) by it is thermally conductive absolutely
Edge glue (103) is fixedly mounted on microelectronic component support plate (101), and the lower end of the thermal conductive insulation glue (103), which is connected with, leads
The lower end of hot rod (104), the heat conducting bar (104) is fixedly connected with heating column (105), and the lower end of the heating column (105) is solid
Surely be connected with thermally conductive sheet (106), the heat conducting bar (104) and thermally conductive sheet (106) are transverse direction, and the heat conducting bar (104) and
The side of thermally conductive sheet (106) passes through microelectronic component support plate (101) and is connected with lateral heat-conducting plate (107), described laterally to lead
Hot plate (107) can connect external radiating device；
The radiator (2) is by shield (201), thermal insulation board (202), easy installation device (203), heat sink (204), radiating fin
Piece (205), micro- thermal column (206), mounting rack (207), motor (208), flabellum (209), wire netting (2010) and outer mounting ring
(2011) it forms, the thermal insulation board (202) is fixedly mounted on the peripheral lower end of thermally conductive sheet (106), under the thermal insulation board (202)
End is fixedly installed with shield (201) by easy installation device (203), the inside of the shield (201) and is located at thermally conductive sheet (106)
Lower end be fixedly installed with heat sink (204), the lower end of the heat sink (204) is fixedly installed with several radiating fins (205),
The two sides of the radiating fin (205) are fixedly connected with several micro- thermal columns (206), the inside of the shield (201) and are located at
The lower end of radiating fin (205) is fixedly connected with mounting rack (207), and the middle part upper end of the mounting rack (207) is fixedly installed with
The middle part lower end of motor (208), the mounting rack (207) is provided with flabellum (209), and the motor (208) and flabellum (209) are logical
Rotation axis connection is crossed, the lower end of the flabellum (209) is provided with wire netting (2010), and the periphery of the wire netting (2010) is fixed
It is equipped with outer mounting ring (2011), internal screw thread, the lower end of the shield (201) is offered on the inside of the outer mounting ring (2011)
Outside offers external screw thread, then the outer mounting ring (2011) matches connection with shield (201) screw thread.
2. a kind of microelectronic component radiator according to claim 1, it is characterised in that: the easy installation device
(203) it is made of U-shaped elastic plate (2031), fixture block (2032), card slot (2033) and spring (2034), the easy installation device
(203) it is fixedly connected on the outside of U-shaped elastic plate (2031), the outer upper end of the U-shaped elastic plate (2031) is fixedly connected with
The lower surface of fixture block (2032), the thermal insulation board (202) offers card slot (2033), the fixture block (2032) and card slot (2033)
Matching clamping, the U-shaped elastic plate (2031) is internal to be fixedly connected with spring (2034).
3. a kind of microelectronic component radiator according to claim 1, it is characterised in that: the radiating fin
(205) spacing between is equal, and the spacing between micro- thermal column (206) is equal.
4. a kind of microelectronic component radiator according to claim 1, it is characterised in that: the flabellum (209)
Generated wind direction is from lower end to one end with radiating fin (205) when rotation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920158675.7U CN209133495U (en) | 2019-01-29 | 2019-01-29 | A kind of microelectronic component radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920158675.7U CN209133495U (en) | 2019-01-29 | 2019-01-29 | A kind of microelectronic component radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209133495U true CN209133495U (en) | 2019-07-19 |
Family
ID=67250172
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920158675.7U Expired - Fee Related CN209133495U (en) | 2019-01-29 | 2019-01-29 | A kind of microelectronic component radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209133495U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110729261A (en) * | 2019-11-18 | 2020-01-24 | 湖南中部芯谷科技有限公司 | Heat dissipation assembly for industrial electronic component test |
| CN111696933A (en) * | 2020-06-03 | 2020-09-22 | 杭州富阳钰宝机床厂 | Intelligent controller for motor |
-
2019
- 2019-01-29 CN CN201920158675.7U patent/CN209133495U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110729261A (en) * | 2019-11-18 | 2020-01-24 | 湖南中部芯谷科技有限公司 | Heat dissipation assembly for industrial electronic component test |
| CN110729261B (en) * | 2019-11-18 | 2022-04-08 | 湖南中部芯谷科技有限公司 | Heat dissipation assembly for industrial electronic component test |
| CN111696933A (en) * | 2020-06-03 | 2020-09-22 | 杭州富阳钰宝机床厂 | Intelligent controller for motor |
| CN111696933B (en) * | 2020-06-03 | 2022-02-15 | 江门市力丰电机有限公司 | Intelligent controller for motor |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190719 Termination date: 20200129 |
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| CF01 | Termination of patent right due to non-payment of annual fee |