CN205985070U - LED wiring board assembly - Google Patents
LED wiring board assembly Download PDFInfo
- Publication number
- CN205985070U CN205985070U CN201621007502.8U CN201621007502U CN205985070U CN 205985070 U CN205985070 U CN 205985070U CN 201621007502 U CN201621007502 U CN 201621007502U CN 205985070 U CN205985070 U CN 205985070U
- Authority
- CN
- China
- Prior art keywords
- heat
- circuit board
- layer
- board assembly
- aluminium plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 25
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 25
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000004411 aluminium Substances 0.000 claims description 21
- 229920001296 polysiloxane Polymers 0.000 claims description 13
- 230000004888 barrier function Effects 0.000 claims description 10
- 238000004806 packaging method and process Methods 0.000 claims description 5
- 239000004033 plastic Substances 0.000 claims description 5
- 229920003023 plastic Polymers 0.000 claims description 5
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 2
- 229910002027 silica gel Inorganic materials 0.000 claims description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 6
- 230000017525 heat dissipation Effects 0.000 abstract description 5
- 239000003292 glue Substances 0.000 abstract description 3
- 239000000377 silicon dioxide Substances 0.000 abstract 4
- 238000005538 encapsulation Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Led Device Packages (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The utility model discloses a circuit board technical field's a LED wiring board assembly, including the line layer, the bottom of line layer is provided with the series thermal silica layer, the bottom on series thermal silica layer is provided with heat dissipation aluminum plate, the perpendicular louvre that is equipped with between heat dissipation aluminum plate and the series thermal silica layer, heat dissipation aluminum plate's bottom is equipped with radiating fin perpendicularly, the top of line layer is provided with the insulating layer, the inner chamber of insulating layer evenly is provided with the recess, the inner chamber of recess is provided with the LED chip, it glues to be provided with the encapsulation in the gap between LED chip and the recess, the utility model discloses simple structure, convenient to use, design benefit, the stable performance has very strong practicality and novelty, utilizes heat dissipation aluminum plate, series thermal silica layer, louvre and radiating fin's cooperation to use for the radiating effect of circuit board strengthens greatly, thereby has improved the life of circuit board, is fit for large -scale using widely.
Description
Technical field：
This utility model is related to wiring board techniques field, specially a kind of LED circuit board assembly.
Background technology：
LED illumination and backlight are widely paid close attention to because of its efficient, energy-conservation etc. and are applied.Yet with LED especially
It is that great power LED heating directly applies its luminous efficiency and service life it is therefore desirable to configuration radiating subassembly uses.LED at present
Supporting radiating subassembly to be LED component be integrally attached on printed wiring board by leg welding simultaneously, then pass through heat-conducting glue
Pad is connecting heat sink.The assembling mode of this assembly has connection complexity, and radiation processes pass through wiring board and heat-conducting glue
Pad reaches heat sink radiating, and radiating efficiency is low, speed is slow, and whole package assembly thermal resistance is big, affects device lifetime.So LED line
The heat dissipation problem of road board component is a problem demanding prompt solution in application process, the radiating of our exigences good one
Plant LED circuit board assembly.
Utility model content：
The purpose of this utility model is to provide a kind of LED circuit board assembly, to solve proposition in above-mentioned background technology
Wiring board radiating is bad, the problem of impact service life.
For achieving the above object, this utility model provides following technical scheme：A kind of LED circuit board assembly, including circuit
Layer, the bottom of described line layer is provided with heat conduction silicone, and the bottom of described heat conduction silicone is provided with heat-dissipating aluminium plate, described scattered
Vertical between hot aluminium sheet and heat conduction silicone be provided with louvre, the bottom of described heat-dissipating aluminium plate is vertically provided with radiating fin, described
The top of line layer is provided with insulating barrier, and the inner chamber of described insulating barrier is uniformly arranged fluted, and the inner chamber of described groove is provided with
LED chip, is provided with packaging plastic in the gap between described LED chip and groove.
Preferably, described louvre is all arranged between heat conduction silicone and heat-dissipating aluminium plate at equal intervals, described radiating
Fin is uniformly arranged on the bottom of heat-dissipating aluminium plate at equal intervals.
Preferably, the bottom of described heat-dissipating aluminium plate is saw-tooth-type structures.
Preferably, described insulating barrier is epoxy resin layer.
Compared with prior art, the beneficial effects of the utility model are：This utility model structure is simple, easy to use, if
Meter is ingenious, using reliability, stable performance, has very strong practicality and novelty, using heat-dissipating aluminium plate, heat conduction silicone, dissipates
Hot hole and radiating fin with the use of so that the radiating effect of wiring board greatly enhances, thus improve the use of wiring board
In the life-span, it is suitable for promoting the use of on a large scale.
Brief description：
Fig. 1 is this utility model structural representation.
In figure：1 line layer, 2 heat conduction silicones, 3 heat-dissipating aluminium plates, 4 louvres, 5 radiating fins, 6 insulating barriers, 7 grooves,
8LED chip, 9 packaging plastics.
Specific embodiment：
Below in conjunction with the accompanying drawing in this utility model embodiment, the technical scheme in this utility model embodiment is carried out
Clearly and completely description is it is clear that described embodiment is only a part of embodiment of this utility model rather than whole
Embodiment.Based on the embodiment in this utility model, those of ordinary skill in the art are not under the premise of making creative work
The every other embodiment being obtained, broadly falls into the scope of this utility model protection.
Refer to Fig. 1, this utility model provides a kind of technical scheme：A kind of LED circuit board assembly, including line layer 1, institute
The bottom stating line layer 1 is provided with heat conduction silicone 2, and the bottom of described heat conduction silicone 2 is provided with heat-dissipating aluminium plate 3, described scattered
Vertical between hot aluminium sheet 3 and heat conduction silicone 2 be provided with louvre 4, the bottom of described heat-dissipating aluminium plate 3 is vertically provided with radiating fin 5,
The top of described line layer 1 is provided with insulating barrier 6, and the inner chamber of described insulating barrier 6 is uniformly arranged fluted 7, described groove 7 interior
Chamber is provided with LED chip 8, is provided with packaging plastic 9 in the gap between described LED chip 8 and groove 7.
Wherein, described louvre 4 is all arranged between heat conduction silicone 2 and heat-dissipating aluminium plate 3 at equal intervals, in order to improve
Radiating effect, described radiating fin 5 is uniformly arranged on the bottom of heat-dissipating aluminium plate 3 at equal intervals, in order to improve radiating effect, described
The bottom of heat-dissipating aluminium plate 3 is saw-tooth-type structures, increases the contact area with air, thus improving radiating effect, described insulating barrier 6
For epoxy resin layer, prevent from leaking electricity.
Operation principle：During use, the heat of LED chip 8 is directly delivered to heat conduction silicone 2, heat conductive silica gel by line layer 1
Heat is passed to heat-dissipating aluminium plate 3 by layer 2, thus heat is distributed, wherein louvre 4 and radiating fin 5 further increase
Radiating efficiency, being disposed to of groove 7 conveniently installs LED chip 8, and packaging plastic 9 is to fix LED chip 8 further；Dissipate
Thermal effect good so that the service life of whole wiring board is improved, so that the service life of LED chip 8 is carried
High.
While there has been shown and described that embodiment of the present utility model, for the ordinary skill in the art,
It is appreciated that these embodiments can be carried out with multiple changes in the case of without departing from principle of the present utility model and spirit, repair
Change, replace and modification, scope of the present utility model is defined by the appended claims and the equivalents thereof.
Claims (4)
1. a kind of LED circuit board assembly, including line layer (1) it is characterised in that：The bottom of described line layer (1) is provided with leads
Hot layer of silica gel (2), the bottom of described heat conduction silicone (2) is provided with heat-dissipating aluminium plate (3), described heat-dissipating aluminium plate (3) and thermal conductive silicon
Vertically it is provided with louvre (4), the bottom of described heat-dissipating aluminium plate (3) is vertically provided with radiating fin (5), described line between glue-line (2)
The top of road floor (1) is provided with insulating barrier (6), and the inner chamber of described insulating barrier (6) is uniformly arranged fluted (7), described groove (7)
Inner chamber be provided with LED chip (8), be provided with packaging plastic (9) in the gap between described LED chip (8) and groove (7).
2. a kind of LED circuit board assembly according to claim 1 it is characterised in that：Described louvre (4) is all equidistant
Be arranged between heat conduction silicone (2) and heat-dissipating aluminium plate (3), described radiating fin (5) is uniformly arranged on radiating at equal intervals
The bottom of aluminium sheet (3).
3. a kind of LED circuit board assembly according to claim 1 it is characterised in that：The bottom of described heat-dissipating aluminium plate (3) is
Saw-tooth-type structures.
4. a kind of LED circuit board assembly according to claim 1 it is characterised in that：Described insulating barrier (6) is epoxy resin
Layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621007502.8U CN205985070U (en) | 2016-08-30 | 2016-08-30 | LED wiring board assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621007502.8U CN205985070U (en) | 2016-08-30 | 2016-08-30 | LED wiring board assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205985070U true CN205985070U (en) | 2017-02-22 |
Family
ID=58038915
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621007502.8U Expired - Fee Related CN205985070U (en) | 2016-08-30 | 2016-08-30 | LED wiring board assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205985070U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108495447A (en) * | 2018-05-18 | 2018-09-04 | 扬州市玄裕电子有限公司 | A kind of flexible circuit board for car light circuit |
| CN110518108A (en) * | 2019-07-09 | 2019-11-29 | 安徽捷鑫光电科技有限公司 | A kind of LED light bar preparation method |
-
2016
- 2016-08-30 CN CN201621007502.8U patent/CN205985070U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108495447A (en) * | 2018-05-18 | 2018-09-04 | 扬州市玄裕电子有限公司 | A kind of flexible circuit board for car light circuit |
| CN108495447B (en) * | 2018-05-18 | 2024-05-07 | 江苏云创智能科技有限公司 | A flexible line way board for car light circuit |
| CN110518108A (en) * | 2019-07-09 | 2019-11-29 | 安徽捷鑫光电科技有限公司 | A kind of LED light bar preparation method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170222 Termination date: 20180830 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |