CN201066978Y - Multi-layer heat radiator - Google Patents
Multi-layer heat radiator Download PDFInfo
- Publication number
- CN201066978Y CN201066978Y CNU2007200970751U CN200720097075U CN201066978Y CN 201066978 Y CN201066978 Y CN 201066978Y CN U2007200970751 U CNU2007200970751 U CN U2007200970751U CN 200720097075 U CN200720097075 U CN 200720097075U CN 201066978 Y CN201066978 Y CN 201066978Y
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- CN
- China
- Prior art keywords
- heat
- radiating fin
- multilayer
- conductive assembly
- fin group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a multi-layer radiating device, which comprises a radiating fin group, a first heat conduction component and a radiating metal coupon. The bottom of the radiating fin group is used to contact with a heating component to radiate heat energy; the first heat conduction component is adhered at the top end of the radiating fin group to conduct the heat energy of the radiating fin group; the radiating metal coupon is adhered on the first heat conduction component to absorb the conducted heat energy of the first heat conduction component. The object of the utility model is to absorb the heat energy layer by layer by using the heat conduction component and the radiating metal coupon on the basis that a fan is not being used and to effectively insulate the thermal radiation of the heating component. So the effects of electricity-saving, silent sound and space-saving are reached.
Description
Technical field
The utility model relates to a kind of heat abstractor of heat generating component, and particularly a kind of multilayer heat abstractor successively absorbs heat energy by heat-conductive assembly and heat dissipation metal plate.
Background technology
In recent years, because semiconductor industry flourish, under advanced person's manufacture of semiconductor cooperated, semiconductor chip was except volume dwindles day by day, and processing speed also more significantly promotes, but the heat energy that also causes chip simultaneously and produced is high.Therefore, for the development trend of electronic product volume-diminished and speed lifting, the heat dissipation problem that how to solve semiconductor chip has been the subject under discussion that can not be ignored.
The radiating mode of semiconductor chip in the past, be above the contact plane of semiconductor chip and air, to be close to fin, by increasing the area that semiconductor chip contacts with air, in order to reach the effect of heat radiation, but the temperature of semiconductor chip in recent years, along with the together significantly lifting of processing speed of semiconductor chip, traditional fin applies and uses.
Therefore, in order to improve the heat dissipation of fin, the radiating mode that generally uses at present dispels the heat as ventilation type, as shown in Figure 1, be to be provided with the high heat-conduction coefficient metal fin 13 of many fins, be close to heat generating component 12 surfaces on the printed circuit board (PCB) 11, using increases the area that heat generating component 12 contacts with air, and extract or blow to air-flow out high thermal conductivity coefficient metal fin 13 by the rotation of fan 14 in conjunction with fan 14, the heat energy that heat generating component 12 is produced is taken away, and then reached the effect of heat radiation.Problem such as but will produce noise, power consumption as radiating mode and take up room with this.
Electronic product development trend, function little towards volume reaches power saving more and strides forward now, and above-mentioned known ventilation type heat radiation must external additional power supply drive fan, and obviously has on volume and need to promote part.
The utility model content
The utility model provides a kind of multilayer heat abstractor, purpose is under the prerequisite of not using fan, utilizes the method for heat radiation successively, allow heat energy progressively sublevel be absorbed, and can effectively block the thermal radiation of heat generating component, reaching does not need fan can effectively absorb and the effect of discharging heat energy.
For reaching aforementioned purpose, the utility model is arranged at described multilayer heat abstractor in the electronic product with plastic casing.Multilayer heat abstractor of the present utility model is made up of radiating fin group, first heat-conductive assembly, heat dissipation metal plate; Described radiating fin group is distributed the heat generating component of heat energy in order to contact; Described first heat-conductive assembly is attached to this radiating fin group top, in order to conduct the heat energy of this radiating fin group; Described heat dissipation metal plate is attached on this first heat-conductive assembly, in order to absorbing the heat energy that this first heat-conductive assembly is conducted, and blocks the thermal radiation of this heat generating component.
The utility model also comprises one second heat-conductive assembly, and described second heat-conductive assembly is attached between described heat dissipation metal plate and this plastic casing, in order to the heat energy that conducts described heat dissipation metal plate to this plastic casing.
Multilayer heat abstractor of the present utility model, utilize heat-conductive assembly and heat dissipation metal plate, form a plurality of heat dissipating layers in order to successively absorbing heat energy, and replace fan with heat dissipation metal plate, improve thermal energy conduction ability between different heat dissipating layers by heat-conductive assembly, reach power saving, the quiet and effect that do not take up space.Wherein, the area of thermal conductive metal plate is big more, and the effect of its heat radiation is good more and have more and prevent thermal-radiating effect.
Description of drawings
Fig. 1 is known ventilation type radiating mode schematic diagram;
Fig. 2 is a multilayer heat abstractor schematic diagram of the present utility model;
Fig. 3 is a multilayer heat abstractor schematic perspective view of the present utility model.
Reference numeral
11 printed circuit board (PCB)s
12 heat generating components
13 radiating fin groups
14 radiator fans
101 printed circuit board (PCB)s
102 heat generating components
103 radiating fin groups
201 first heat-conductive assemblies
202 heat dissipation metal plates
203 second heat-conductive assemblies
204 plastic casings
Embodiment
Be the description that above-mentioned purpose of the present utility model, feature, advantage can be become apparent, below especially exemplified by preferred embodiment, and conjunction with figs., do to describe in detail:
The multilayer heat abstractor that the utility model provides, purpose is under the prerequisite of not using fan, utilizes the method for heat radiation successively, allow heat energy progressively sublevel be absorbed, and effectively block the thermal radiation of heat generating component, reaching does not need fan can effectively absorb and the effect of discharging heat energy.
Fig. 2, Fig. 3 are multilayer heat abstractor schematic diagram of the present utility model.Comprise printed circuit board (PCB) 101, heat generating component 102, radiating fin group 103, first heat-conductive assembly 201, heat dissipation metal plate 202, second heat-conductive assembly 203, and assembly such as plastic casing 204 shown in the figure.Wherein, printed circuit board (PCB) 101 is in order to be provided with the circuit substrate of electronic building brick; Heat generating component 102 is a semiconductor chip, for example central processing unit, north and south bridge chip group and system single chip etc.; Radiating fin group 103 is selected from the good material of thermal conductivity, for example the combination of the group of copper, aluminium, magnesium, iron, tin, lead, zinc, Jin Jiyin is made, and be coated with heat-conducting glue at radiating fin group 103 and heat generating component 102 contact-making surfaces, distribute the heat generating component 102 of heat energy in order to contact; First heat-conductive assembly 201 is attached to radiating fin group top, in order to the heat energy of heat loss through conduction fins group 103 for having the heat-conducting silicon rubber of two-sided gum; Heat dissipation metal plate 202 is main sheet metal for aluminium material, the area of heat dissipation metal plate maximizes in optimal mode, and be attached on first heat-conductive assembly 201, in order to absorbing the heat energy that first heat-conductive assembly 201 is conducted, and block the thermal radiation of heat generating component 102; The material of second heat-conductive assembly 203 is identical with first heat-conductive assembly 201, and difference is that second heat-conductive assembly 203 is to be attached on the heat dissipation metal plate 202, in order to the heat energy of heat loss through conduction sheet metal 202 to plastic casing 204; Plastic casing 204 is the outermost layer assembly of electronic product, and each forms layer plastic casing 204 compressings, makes each form layer and produces bonding state closely, in order to protection electronic product and heat radiation.
The heat conduction flow process of whole multilayer heat abstractor, be to make the heat absorption of phase I by being close to radiating fin 103 on the heat generating component 102, good and big than heat generating component 102 because of radiating fin 103 thermal conductivity with the contact area of air, so can improve the radiating efficiency of heat generating component 102, then relend by first heat-conductive assembly 201, with the thermal energy conduction of radiating fin 103 to heat dissipation metal plate 202, make heat dissipation metal plate 202 carry out the heat absorption of second stage, at last by second heat-conductive assembly 203 with the thermal energy conduction of heat dissipation metal plate 202 to plastic casing 204, make plastic casing 204 carry out the heat absorption of phase III, so far finish the heat conduction flow process of whole heat generating component 102, make multilayer heat abstractor of the present utility model under the prerequisite of not using fan, utilize heat-conductive assembly and heat dissipation metal plate 202 successively to absorb heat energy, and effectively block the thermal radiation of heat generating component 102, reach power saving, quiet and do not take up space effect.
Though the utility model discloses as above with a preferred embodiment; yet be not in order to qualification the utility model, any affiliated technical field technical staff is not in breaking away from spirit and scope of the present utility model; when doing a little change and retouching, all belong to scope of patent protection of the present utility model.
Claims (7)
1. a multilayer heat abstractor is characterized in that, includes:
One radiating fin group, the bottom is in order to contact described heat generating component to distribute heat energy;
One first heat-conductive assembly is attached to described radiating fin group top, in order to conduct the heat energy of described radiating fin group; And
One heat dissipation metal plate is attached on described first heat-conductive assembly, in order to absorb the heat energy that described first heat-conductive assembly is conducted.
2. multilayer heat abstractor as claimed in claim 1 is characterized in that, described multilayer heat abstractor also comprises:
One second heat-conductive assembly is attached between described heat dissipation metal plate and this plastic casing, in order to the heat energy that conducts described heat dissipation metal plate to this plastic casing.
3. multilayer heat abstractor as claimed in claim 1 is characterized in that, is coated with a heat-conducting glue between the contact-making surface of described radiating fin group and described heat generating component.
4. multilayer heat abstractor as claimed in claim 1 is characterized in that, described radiating fin group and heat radiating metal are that group's combination of copper, aluminium, magnesium, iron, tin, lead, zinc, Jin Jiyin is made.
5. multilayer heat abstractor as claimed in claim 1 is characterized in that, described heat generating component is the semiconductor chip.
6. multilayer heat abstractor as claimed in claim 1 is characterized in that the size of described heat dissipation metal plate, shape and plastic casing are complementary, or with the plastic casing equal in length, in order to block the thermal radiation of described heat generating component.
7. multilayer heat abstractor as claimed in claim 2 is characterized in that, described first heat-conductive assembly and second heat-conductive assembly are the heat-conducting silicon rubber with two-sided gum.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007200970751U CN201066978Y (en) | 2007-08-14 | 2007-08-14 | Multi-layer heat radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007200970751U CN201066978Y (en) | 2007-08-14 | 2007-08-14 | Multi-layer heat radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201066978Y true CN201066978Y (en) | 2008-05-28 |
Family
ID=39484163
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007200970751U Expired - Fee Related CN201066978Y (en) | 2007-08-14 | 2007-08-14 | Multi-layer heat radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201066978Y (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102368170A (en) * | 2011-08-23 | 2012-03-07 | 李佟梅 | Magnesium alloy heat radiator |
| CN102427953A (en) * | 2009-05-07 | 2012-04-25 | 永茂电机有限公司 | Thermally conductive ring for a wheel assembly |
| CN106469694A (en) * | 2015-08-18 | 2017-03-01 | 富士电机株式会社 | Electronic electric equipment |
| CN106667488A (en) * | 2016-12-26 | 2017-05-17 | 上海联影医疗科技有限公司 | Cooling device for circulator, circulator and magnetic resonance equipment |
-
2007
- 2007-08-14 CN CNU2007200970751U patent/CN201066978Y/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102427953A (en) * | 2009-05-07 | 2012-04-25 | 永茂电机有限公司 | Thermally conductive ring for a wheel assembly |
| CN102368170A (en) * | 2011-08-23 | 2012-03-07 | 李佟梅 | Magnesium alloy heat radiator |
| CN106469694A (en) * | 2015-08-18 | 2017-03-01 | 富士电机株式会社 | Electronic electric equipment |
| CN106667488A (en) * | 2016-12-26 | 2017-05-17 | 上海联影医疗科技有限公司 | Cooling device for circulator, circulator and magnetic resonance equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080528 Termination date: 20100814 |