CN210579419U - Circuit board with good pressure resistance - Google Patents
Circuit board with good pressure resistance Download PDFInfo
- Publication number
- CN210579419U CN210579419U CN201920670265.0U CN201920670265U CN210579419U CN 210579419 U CN210579419 U CN 210579419U CN 201920670265 U CN201920670265 U CN 201920670265U CN 210579419 U CN210579419 U CN 210579419U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- heat dissipation
- condenser
- dust collection
- heating panel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 49
- 238000010438 heat treatment Methods 0.000 claims abstract description 12
- 239000000428 dust Substances 0.000 claims description 37
- 239000012717 electrostatic precipitator Substances 0.000 claims description 13
- 238000009434 installation Methods 0.000 abstract description 8
- 230000001681 protective effect Effects 0.000 description 6
- 238000001816 cooling Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 150000001450 anions Chemical class 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to a circuit board technical field just discloses a circuit board that crushing resistance is good. This circuit board that compressive property is good, including the lag, the inboard joint of lag has the circuit board body, the heating panel is installed to the bottom of circuit board body, the bottom adhesion of heating panel has the heat dissipation dish, the side-mounting of heat dissipation dish has the condenser, the side of condenser is connected with the conducting strip, the bottom of heat dissipation dish is seted up flutedly, the conducting strip is installed in the recess. The utility model discloses, five louvres are seted up to the heating panel through circuit board body bottom installation inside, and the heat dissipation dish of heating panel bottom adhesion, and the heat conduction area can be promoted to the heat dissipation dish, and the heat conduction piece of installation and condenser electric connection and the fin that the screw installation was passed through at recess middle part in the recess that the heat dissipation dish bottom was seted up have improved thermal dissipation efficiency, have improved the radiating ability of circuit board, have guaranteed the stability and the reliability of circuit board work operation.
Description
Technical Field
The utility model relates to a circuit board technical field specifically is a circuit board that crushing resistance is good.
Background
The circuit board can almost not be separated from electronic equipment which can be seen by people, the circuit board is small enough to electronic components such as electronic watches, calculators, general computers and computer communication electronic equipment, and the circuit board is used for electrical interconnection among the electronic components.
With the development trend of high density of circuit boards, the production requirements of the circuit boards are higher and higher. The heat dissipation treatment of the circuit board is not good, so that the circuit board is corroded, and the service life of the circuit board is influenced. Along with the continuous powerful of circuit board function, the circuit board design is also more and more complicated, and the integrated level is higher and higher, and the interval between each components and parts on the face is littleer and more. Some high-power electronic components can release certain operating temperature in the course of the work, if the heat dissipation is improper, not only influence self life-span, also probably influence the life-span of other electronic components of its next door simultaneously, and then influence the stability of circuit board. Particularly, some circuit boards used in high precision fields have very strict requirements on the temperature of the circuit board, and once the problem of non-ideal heat dissipation occurs, serious negative effects may be brought to the work.
SUMMERY OF THE UTILITY MODEL
Not enough to prior art, the utility model provides a circuit board that compressive property is good possesses advantages such as compressive property is good and the radiating effect is good, has solved the poor and not too ideal problem of radiating effect of compressive property.
The utility model provides a technical scheme that its technical problem adopted is: the utility model provides a circuit board that crushing resistance can be good, includes the lag, the inboard joint of lag has the circuit board body, the heating panel is installed to the bottom of circuit board body, the bottom adhesion of heating panel has the cooling disc, the side-mounting of cooling disc has the condenser, the side of condenser is connected with the conducting strip, the bottom of cooling disc is seted up flutedly, the conducting strip is installed in the recess, the side-mounting of heating panel has the suction box, the side-mounting of suction box has electrostatic precipitator, and the inboard of suction box is equipped with electrostatic precipitator net.
Furthermore, radiating holes are formed in the side face of the radiating plate, and the number of the radiating holes is five.
Furthermore, the heat conducting fins are electrically connected with the condenser and are in a continuous arc shape.
Furthermore, the side surface of the heat dissipation disc is welded with a plurality of heat dissipation fins, and the plurality of heat dissipation fins are distributed on the side surface of the heat dissipation disc in an annular array.
Furthermore, the middle part of the groove is fixedly provided with a radiating fin through a screw, and the radiating fin is circular.
Furthermore, the top of the dust collection box is communicated with a connecting pipe, and the other end of the connecting pipe is provided with a dust collection head.
The utility model has the advantages that:
1. the utility model discloses, through the inboard joint circuit board body of lag, the lag can avoid the circuit board body to receive the impact force and receive the book, cause the circuit board to damage, five louvres are seted up to the inside heating panel of circuit board body bottom installation, and the heat dissipation dish of heating panel bottom adhesion, thermal conduction area can be promoted to the heat dissipation dish, the fin that screw installation was passed through at installation and condenser electric connection's conducting strip and recess middle part in the recess that the heat dissipation dish bottom was seted up, thermal dissipation efficiency has been improved, the radiating ability of circuit board has been improved, the stability and the reliability of circuit board work operation have been guaranteed.
2. The utility model discloses, through heating panel side-mounting suction box, suction box side-mounting's electrostatic precipitator, electrostatic precipitator's theory of operation is that high-tension field makes the air take place the ionization, and electrostatic precipitator net production anion at the inboard electrostatic precipitator of suction box, and the dust passes through the connecting pipe from the dust absorption head and gets into the suction box in, adsorbs on electrostatic precipitator net, realizes cleaing away the dust, avoids the dust to adsorb and causes circuit board circuit to corrode at the circuit board.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below.
Fig. 1 is a front view of a circuit board with good voltage resistance according to the present invention;
fig. 2 is a front view of a circuit board with good voltage resistance according to the present invention;
fig. 3 is a structural diagram of the heat dissipation plate of the circuit board with good pressure resistance of the present invention.
Description of reference numerals: 1. a protective sleeve; 2. a circuit board body; 3. a heat dissipation plate; 4. heat dissipation holes; 5. a heat dissipation plate; 6. a condenser; 7. a heat conductive sheet; 8. a screw; 9. a heat sink; 10. a groove; 11. heat dissipation fins; 12. a dust collection box; 13. an electrostatic precipitator; 14. a connecting pipe; 15. a dust collection head; 16. an electrostatic dust removal net.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
Referring to fig. 1-3, a circuit board with good pressure resistance comprises a protective cover 1, a circuit board body 2 is fastened to the inner side of the protective cover 1, the protective cover 1 can prevent the circuit board body 2 from being damaged due to impact force, a heat dissipation plate 3 is mounted at the bottom of the circuit board body 2, a heat dissipation plate 5 is bonded to the bottom of the heat dissipation plate 3, the heat dissipation plate 5 can increase the heat conduction area, a condenser 6 is mounted on the side surface of the heat dissipation plate 5, a heat conduction sheet 7 is connected to the side surface of the condenser 6, a groove 10 is formed in the bottom of the heat dissipation plate 5, the heat conduction sheet 7 is mounted in the groove 10, a dust collection box 12 is mounted on the side surface of the heat dissipation plate 3, an electrostatic dust collector 13 is mounted on the side surface of the dust collection box 12, an electrostatic dust collection net 16 is arranged on the inner side of the dust collection box 12, the electrostatic dust collector 13 generates, dust enters the dust collection box 12 from the dust collection head 15 through the connecting pipe 14 and is adsorbed on the electrostatic dust collection net 16, so that the dust is removed, and the circuit corrosion of the circuit board body 2 caused by the adsorption of the dust on the circuit board body 2 is avoided.
Wherein, the side of the heat dissipation plate 3 is provided with heat dissipation holes 4, and the number of the heat dissipation holes 4 is five.
Wherein, the heat conducting strip 7 is electrically connected with the condenser 6, and the heat conducting strip 7 is in a continuous arc shape.
Wherein, the side of the heat dissipation disc 5 is welded with a plurality of heat dissipation fins 11, and the plurality of heat dissipation fins 11 are distributed on the side of the heat dissipation disc 5 in an annular array.
Wherein, the middle part of recess 10 has fin 9 through 8 fixed mounting of screw, and the shape of fin 9 is circular, and the heat conduction piece 7 of installation and condenser 6 electric connection in the recess 10 that the bottom of heat dissipation dish 5 was seted up and the fin 9 of screw 8 installation is passed through in the middle part of recess 10, have improved thermal dissipation efficiency, have improved the radiating ability of circuit board body 2, have guaranteed the stability and the reliability of circuit board body 2 work operation.
Wherein, the top of the dust collection box 12 is communicated with a connecting pipe 14, and the other end of the connecting pipe 14 is provided with a dust collection head 15.
When in use, firstly, the inner side of the protective sleeve 1 is clamped with the circuit board body 2, the protective sleeve 1 can prevent the circuit board body 2 from being broken by impact force to cause the circuit board body 2 to be damaged, five heat dissipation holes 4 are arranged in the heat dissipation plate 3 arranged at the bottom of the circuit board body 2, the heat dissipation plate 5 adhered at the bottom of the heat dissipation plate 3 can increase the heat conduction area, the heat conduction sheet 7 electrically connected with the condenser 6 is arranged in the groove 10 arranged at the bottom of the heat dissipation plate 5, and the heat dissipation sheet 9 arranged at the middle part of the groove 10 through the screw 8 improves the heat dissipation efficiency, improves the heat dissipation capacity of the circuit board body 2, ensures the stability and reliability of the working operation of the circuit board body 2, the dust suction box 12 is arranged at the side surface of the heat dissipation plate 3, the electrostatic dust collector 13 is arranged at the side surface of the dust suction box 12, and, the electrostatic precipitator 13 produces the anion on the inboard electrostatic precipitator net 16 of dust collection box 12, and the dust gets into the dust collection box 12 through connecting pipe 14 from dust absorption head 15 in, adsorbs on electrostatic precipitator net 16, realizes cleaing away the dust, avoids the dust to adsorb and causes circuit corrosion of circuit board body 2 at circuit board body 2.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (6)
1. The utility model provides a circuit board that crushing resistance can be good, includes lag (1), its characterized in that: the inboard joint of lag (1) has circuit board body (2), heating panel (3) are installed to the bottom of circuit board body (2), the bottom bonding of heating panel (3) has radiator plate (5), the side-mounting of radiator plate (5) has condenser (6), the side of condenser (6) is connected with conducting strip (7), recess (10) are seted up to the bottom of radiator plate (5), install in recess (10) conducting strip (7), the side-mounting of radiator plate (3) has dust collection box (12), the side-mounting of dust collection box (12) has electrostatic precipitator (13), and the inboard of dust collection box (12) is equipped with electrostatic precipitator net (16).
2. The circuit board with good pressure resistance as claimed in claim 1, wherein: radiating holes (4) are formed in the side face of the radiating plate (3), and the number of the radiating holes (4) is five.
3. The circuit board with good pressure resistance as claimed in claim 1, wherein: the heat conducting fins (7) are electrically connected with the condenser (6), and the heat conducting fins (7) are in a continuous arc shape.
4. The circuit board with good pressure resistance as claimed in claim 1, wherein: the side of the heat dissipation disc (5) is welded with a plurality of heat dissipation fins (11), and the plurality of heat dissipation fins (11) are distributed on the side of the heat dissipation disc (5) in an annular array.
5. The circuit board with good pressure resistance as claimed in claim 1, wherein: the middle part of the groove (10) is fixedly provided with a radiating fin (9) through a screw (8), and the radiating fin (9) is circular.
6. The circuit board with good pressure resistance as claimed in claim 1, wherein: the top of the dust collection box (12) is communicated with a connecting pipe (14), and the other end of the connecting pipe (14) is provided with a dust collection head (15).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920670265.0U CN210579419U (en) | 2019-05-12 | 2019-05-12 | Circuit board with good pressure resistance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920670265.0U CN210579419U (en) | 2019-05-12 | 2019-05-12 | Circuit board with good pressure resistance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210579419U true CN210579419U (en) | 2020-05-19 |
Family
ID=70641521
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920670265.0U Expired - Fee Related CN210579419U (en) | 2019-05-12 | 2019-05-12 | Circuit board with good pressure resistance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210579419U (en) |
-
2019
- 2019-05-12 CN CN201920670265.0U patent/CN210579419U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200519 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |