CN213522908U

CN213522908U - HDI high density lamination heat dissipation type circuit board

Info

Publication number: CN213522908U
Application number: CN202022848111.1U
Authority: CN
Inventors: 潘康超; 潘康基; 叶俊涛
Original assignee: Guangdong Yingshuo Electronics Co ltd
Current assignee: Guangdong Yingshuo Electronics Co ltd
Priority date: 2020-12-01
Filing date: 2020-12-01
Publication date: 2021-06-22
Anticipated expiration: 2030-12-01

Abstract

The utility model discloses a HDI high density lamination heat dissipation type circuit board, including mount pad, shock attenuation seat and heat-conducting plate, the shock attenuation seat is installed through buffer spring in the top of mount pad, the heat-conducting plate is installed through the bolt in the inside of shock attenuation seat, the base plate is installed at the top of heat-conducting plate, the radiator is installed to the top both sides of base plate, install the radiating seat in the radiator, the welding of the inside equidistance of radiating seat has radiating fin, radiating fan is installed through the mounting cover in radiating fin's top. The utility model discloses an internally mounted at the base plate has the radiator, can produce wind-force through the cooling fan circular telegram in the radiator, and wind-force can accelerate the flow of the inside air of mount pad to can improve device's radiating effect, but effectively solve the radiating drawback of conduction formula heat dissipation, also be convenient for take the heat out of the device inside simultaneously and dispel the heat, avoid the inside heat accumulation that produces of device, guarantee the life of device.

Description

HDI high density lamination heat dissipation type circuit board

Technical Field

The utility model relates to a circuit board technical field specifically is a HDI high density lamination heat dissipation type circuit board.

Background

The circuit board enables the circuit to be miniaturized and visualized, plays an important role in the batch production of fixed circuits and the optimization of the layout of electrical appliances, namely a flexible circuit board and a rigid circuit board are combined together according to relevant process requirements through processes such as pressing and the like, and a High Density Interconnection (HDI) circuit board is a field which is developed fastest in the printed circuit board industry.

The existing HDI high-density lamination heat dissipation type circuit board has the following defects:

1. the conventional HDI high-density laminated circuit board has poor heat dissipation effect, and only can conduct conduction type heat dissipation, but the conduction type heat dissipation has low heat dissipation efficiency and cannot take heat out of the interior of the device for heat dissipation, so that the heat in the interior of the device is accumulated, and the service life of the device is shortened;

2. the conventional HDI high-density laminated circuit board electronic equipment is exposed and connected, so that dust falls on the circuit board and the service life of the circuit board is influenced.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a HDI high density lamination heat dissipation type circuit board to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a HDI high density lamination heat dissipation type circuit board, includes mount pad, cushion socket and heat-conducting plate, two sets of screw thread post are installed to the inside both sides of mount pad, the cushion socket is installed through buffer spring in the top of mount pad, the bottom of cushion socket evenly is equipped with the louvre, the heat-conducting plate is installed through the bolt in the inside of cushion socket, the base plate is installed at the top of heat-conducting plate, the radiator is installed to the top both sides of base plate, install the cushion socket in the radiator, the inside equidistance welding of cushion socket has radiating fin, radiating fan is installed through the mount cover in radiating fin's top, the dust cover is installed through screw thread post and connecting bolt cooperation in the top of mount pad.

Preferably, the top of mount pad is equipped with the wiring groove, and the both sides welding of mount pad has fixed ear.

Preferably, damping springs are installed on two sides of the damping seat, and one ends of the damping springs are connected with the inner wall of the installation seat.

Preferably, a processor is mounted on the top of the substrate, and a voltage stabilizer is mounted on the top of the substrate away from the processor.

Preferably, the louver is installed to the both sides of radiating seat, and the fixed plate is installed at the both ends of radiating seat.

Preferably, the inside fixed mounting of dust cover has the mesh board, and the top of dust cover is equipped with the inlet wire groove.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the utility model discloses an internally mounted at the base plate has the radiator, can produce wind-force through the cooling fan circular telegram in the radiator, and wind-force can accelerate the flow of the inside air of mount pad to can improve device's radiating effect, but effectively solve the radiating drawback of conduction formula heat dissipation, also be convenient for take the heat out of the device inside simultaneously and dispel the heat, avoid the inside heat accumulation that produces of device, guarantee the life of device.

2. The utility model discloses an install the dust cover at the top of mount pad, can protect the inside device of mount pad through the dust cover, effectively solved the exposed problem of connecting of the inside electronic component of mount pad, guaranteed that the inside electronic component of mount pad does not receive the destruction of dust, guaranteed electronic component's security, extension inner plant's life.

3. The utility model discloses an install buffer spring in the bottom of shock attenuation seat, shock attenuation seat can subdue through buffer spring's elastic force and receive the shaking force to multiplicable shock attenuation seat absorbing function can solve the shaking force and act on the problem that causes the device to damage on the device, has guaranteed the security of device, has prolonged the life of device.

Drawings

Fig. 1 is a schematic view of the internal structure of the present invention;

FIG. 2 is a schematic side sectional view of the present invention;

FIG. 3 is a schematic view of a partial structure of the heat sink of the present invention;

fig. 4 is a schematic view of a local structure of the dust cover of the present invention.

In the figure: 1. a mounting seat; 101. a wiring slot; 102. a threaded post; 2. a shock absorbing seat; 201. a damping spring; 202. a buffer spring; 203. heat dissipation holes; 3. a heat conducting plate; 301. a substrate; 302. a processor; 303. a voltage regulator; 4. a heat sink; 401. a heat dissipation base; 402. mounting a cover; 403. a heat radiation fan; 404. a heat dissipating fin; 405. a blind window; 5. a dust cover; 501. a connecting bolt; 502. mesh plates.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to which the reference is made must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, and for example, "connected" may be either fixedly connected or detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Referring to fig. 1-4, the present invention provides an embodiment: a HDI high-density lamination heat dissipation type circuit board comprises a mounting seat 1, a shock absorption seat 2 and a heat conduction plate 3, wherein two groups of threaded columns 102 are mounted on two sides inside the mounting seat 1, the mounting seat 1 is matched with a dust cover 5 to protect internal devices, the service life of the device is prolonged, the shock absorption seat 2 is mounted at the top of the mounting seat 1 through a buffer spring 202, the shock absorption seat 2 can absorb vibration force through the elastic force of the buffer spring 202, so that the shock absorption functionality of the shock absorption seat 2 can be improved, the problem that the device is damaged due to the action of the vibration force on the device can be solved, the safety of the device is guaranteed, the service life of the device is prolonged, heat dissipation holes 203 are uniformly arranged at the bottom of the shock absorption seat 2, the heat dissipation structure of the device can be increased through the heat dissipation holes 203, the heat dissipation effect of the device is improved, the heat conduction plate 3 is mounted inside, the heat dissipation device has good heat conductivity, heat generated by the operation of the substrate 301 can be dissipated through the heat dissipation holes 203, the heat dissipation effect of the device is improved, the substrate 301 is installed at the top of the heat conduction plate 3, the substrate 301 is made of aluminum and has good heat dissipation performance, the heat radiators 4 are installed on two sides of the top of the substrate 301, the heat dissipation structure of the device can be increased through the heat radiators 4, the heat dissipation performance of the device is improved, the heat dissipation seats 401 are installed in the heat radiators 4, the heat dissipation fins 404 are welded in the heat dissipation seats 401 at equal intervals, the heat generated by the operation of the substrate 301 can be conducted to the heat dissipation fins 404 through the heat dissipation seats 401, the heat dissipation area of the device can be increased through the multiple groups of heat dissipation fins 404, the heat dissipation effect of the device is improved, the heat dissipation fans are installed at the tops of the heat, thereby can improve the radiating effect of device, but effectively solve the radiating drawback of conduction formula heat dissipation, also be convenient for take the heat out of the device inside with the heat simultaneously and dispel the heat, avoid the inside heat accumulation that produces of device, the life of device has been guaranteed, threaded post 102 and connecting bolt 501 cooperation are passed through at the top of mount pad 1 and dust cover 5 is installed, can protect the inside device of mount pad 1 through dust cover 5, avoid the exposed connection of the inside electronic component of mount pad 1, it does not receive the destruction of dust to have guaranteed inside electronic component, electronic component's security has been guaranteed, the life of internal device is prolonged.

Further, the top of mount pad 1 is equipped with wiring groove 101, and wiring groove 101 can be convenient for connect wire, and the device of being convenient for carries out the wiring, and the both sides welding of mount pad 1 has fixed ear, can install the device of being convenient for through fixed ear and bolt cooperation, has improved the installation effectiveness of device.

Further, damping spring 201 is installed to the both sides of cushion socket 2, and damping spring 201's one end and the interior wall connection of mount pad 1, can effectively subdue cushion socket 2 through damping spring 201 and buffer spring 202's cooperation and receive the shaking force, has guaranteed the security of 2 internal arrangement of cushion socket, has prolonged the life of device.

Further, the processor 302 is installed at the top of the substrate 301, the processor 302 can be convenient for control the operation of the cooling fan 403, intelligent control is achieved, the voltage stabilizer 303 is installed above the top of the substrate 301 far away from the processor 302, the voltage stabilizer 303 can adjust input voltage, and the safety of the device is guaranteed.

Further, louvers 405 are installed on two sides of the heat dissipation seat 401, the louvers 405 can increase the heat dissipation structure of the device, the heat dissipation performance of the device is improved, fixing plates are installed at two ends of the heat dissipation seat 401, the heat dissipation seat 401 can be conveniently fixed to the top of the substrate 301 through the matching of the fixing plates and bolts, and the heat dissipation seat 401 can be conveniently installed.

Further, the inside fixed mounting of dust cover 5 has mesh plate 502, and mesh plate 502 multiplicable device heat radiation structure that prevents dust can be put inside dust access device, and the device of also being convenient for simultaneously dispels the heat, and the top of dust cover 5 is equipped with the inlet wire groove, and the inlet wire groove can be convenient for the device and connect the wire, and the staff of being convenient for carries out wiring work.

The working principle is as follows: vibration force can be subdued through buffer spring 202's elastic force to cushion socket 2, thereby the absorbing functional nature of cushion socket 2 has been multiplicable, the security of base plate 301 and top radiator 4 has been guaranteed, the life of device has been prolonged, heat conduction to radiating fin 404 that can produce base plate 301 operation through radiating seat 401, heat radiating area through multiunit radiating fin 404 multiplicable device, can produce wind-force through radiator fan 403 circular telegram simultaneously and can dispel the heat to the heat on radiating fin 404, wind-force takes the heat to take the heat out of mount pad 1 inside from mesh board 502 simultaneously, avoid the inside heat accumulation that produces of mount pad 1, the radiating effect of device has been improved.

The details of the present invention are well known to those skilled in the art.

Finally, it is to be noted that: the above embodiments are only used for illustrating the technical solutions of the present invention and not for limiting, and although the present invention has been described in detail with reference to the examples, it should be understood by those skilled in the art that the technical solutions of the present invention can be modified and replaced with equivalents without departing from the spirit and scope of the technical solutions of the present invention, which should be covered by the scope of the claims of the present invention.

Claims

1. The utility model provides a HDI high density lamination heat dissipation type circuit board, includes mount pad (1), shock mount (2) and heat-conducting plate (3), its characterized in that: two groups of threaded columns (102) are arranged on two sides in the mounting seat (1), a damping seat (2) is arranged at the top of the mounting seat (1) through a buffer spring (202), the bottom of the shock absorption seat (2) is uniformly provided with heat dissipation holes (203), the heat conduction plate (3) is arranged in the shock absorption seat (2) through bolts, the top of the heat conducting plate (3) is provided with a base plate (301), two sides of the top of the base plate (301) are provided with radiators (4), a heat radiating seat (401) is installed in the heat radiator (4), heat radiating fins (404) are welded in the heat radiating seat (401) at equal intervals, the top of the radiating fin (404) is provided with a radiating fan (403) through a mounting cover (402), the top of the mounting seat (1) is provided with a dust cover (5) through the matching of the threaded column (102) and the connecting bolt (501).

2. The HDI high-density build-up heat dissipation type circuit board of claim 1, wherein: the top of mount pad (1) is equipped with wire connection groove (101), and the both sides welding of mount pad (1) has fixed ear.

3. The HDI high-density build-up heat dissipation type circuit board of claim 1, wherein: damping spring (201) are installed to the both sides of shock attenuation seat (2), and the inner wall connection of the one end and mount pad (1) of damping spring (201).

4. The HDI high-density build-up heat dissipation type circuit board of claim 1, wherein: the processor (302) is installed on the top of base plate (301), and the top of base plate (301) is far away from the top of processor (302) and is installed stabiliser (303).

5. The HDI high-density build-up heat dissipation type circuit board of claim 1, wherein: shutter (405) are installed to the both sides of radiating seat (401), and the fixed plate is installed at the both ends of radiating seat (401).

6. The HDI high-density build-up heat dissipation type circuit board of claim 1, wherein: the inside fixed mounting of dust cover (5) has mesh board (502), and the top of dust cover (5) is equipped with the inlet wire groove.