CN219352182U

CN219352182U - Radiating device of power semiconductor device

Info

Publication number: CN219352182U
Application number: CN202223168274.0U
Authority: CN
Inventors: 沈良金
Original assignee: Shenzhen Sainengsi Technology Co ltd
Current assignee: Shenzhen Sainengsi Technology Co ltd
Priority date: 2022-11-28
Filing date: 2022-11-28
Publication date: 2023-07-14
Anticipated expiration: 2032-11-28

Abstract

The utility model relates to the technical field of semiconductor device radiating devices, in particular to a power semiconductor device radiating device, which comprises a radiating box, wherein air holes are formed in the front side and the rear side of the radiating box, a fan is arranged in the middle of the side wall of the radiating box, a combined groove is formed in the inner part of the upper right side of the radiating box, a radiating groove is formed in the middle of the bottom of the radiating box, a radiating assembly is arranged on the inner wall of the radiating box and at a position corresponding to the radiating groove, a power semiconductor device body is arranged on the upper side of the radiating assembly, a protective cover is arranged on the upper side of the radiating box, a connecting sheet is arranged on the lower left side of the protective cover, and an air deflector is arranged at the corner of the inner wall of the protective cover; the heat dissipation assembly comprises a supporting frame, a hard dustproof net is arranged in the middle of the side wall of the supporting frame, a soft dustproof net is arranged on the upper side of the supporting frame, the whole structure is simple, the use is convenient, and the stability and the practicability are high.

Description

Radiating device of power semiconductor device

Technical Field

The utility model relates to the technical field of semiconductor device heat dissipation devices, in particular to a power semiconductor device heat dissipation device.

Background

The power electronic device is also called a power semiconductor device, and the power semiconductor device usually generates heat in the use process, if the heat cannot be timely and outwards emitted, the heat can affect the performance of the power semiconductor device, so that people usually use a power semiconductor device heat dissipation device for dissipating heat of the power semiconductor device, the conventional power semiconductor device heat dissipation device usually has a common heat dissipation performance, and the fixing mode of the power semiconductor device heat dissipation device is complex, so that the power semiconductor device heat dissipation device needs to take more time in installation.

Accordingly, there is a need for a power semiconductor device heat sink that ameliorates the above-described problems.

Disclosure of Invention

The present utility model is directed to a heat dissipating device for a power semiconductor device, which solves the above-mentioned problems.

In order to achieve the above purpose, the present utility model provides the following technical solutions:

the utility model provides a power semiconductor device heat abstractor, includes the heat dissipation box, the bleeder vent has all been seted up to the front and back both sides of heat dissipation box, the fan is installed to the lateral wall department in the middle of having of heat dissipation box, the upper right side of heat dissipation box is inside to be seted up the integrated slot, the heat dissipation groove has been seted up to the bottom department in the middle of the heat dissipation box, the inner wall of heat dissipation box and the position that corresponds with the heat dissipation groove install cooling module, cooling module's upside is provided with the power semiconductor device body, the protective cover is installed to the upside of heat dissipation box, the connection piece is installed to the left downside of protective cover, aviation baffle is installed to the inner wall corner of protective cover;

the heat dissipation assembly comprises a supporting frame, a hard dustproof net is arranged in the middle of the side wall of the supporting frame, a soft dustproof net is arranged on the upper side of the supporting frame, a supporting plate is arranged on the upper side of the soft dustproof net, heat conduction silica gel is arranged in the middle of a base surface of the supporting plate, evenly distributed fins are arranged at the bottom of the supporting plate, an extension plate is arranged in the middle of the side wall of the supporting plate, and a spring is arranged between the bottom of the extension plate and the heat dissipation box.

As a preferable scheme of the utility model, the inner wall of the air vent is provided with a stainless steel wire net, the right side wall of the radiating box and the position corresponding to the fan are provided with through holes with the sizes matched with the right side wall of the radiating box, and the inner wall of each through hole is provided with the stainless steel wire net.

As a preferable scheme of the utility model, a limit rod is arranged in the heat dissipation box and positioned at the corner of the heat dissipation assembly, a groove matched with the heat dissipation box is formed in the left side of the heat dissipation box and corresponds to the connecting sheet, a threaded hole is formed in the middle of the groove, and an air deflector is arranged at the corner of the left lower side of the inner wall of the heat dissipation box.

As a preferable scheme of the utility model, the hard dustproof net is made of a stainless steel net plate, and the soft dustproof net is made of a nylon net.

As a preferable scheme of the utility model, the fins and the supporting plates are made of aluminum plates, and the fins and the extending plates are fixedly connected with the supporting plates in a welding mode.

As a preferable scheme of the utility model, the base surface of the protective cover is provided with the heat dissipation groove, the inner side wall of the protective cover is provided with the heat dissipation component at the position corresponding to the heat dissipation groove, and the right end of the protective cover is provided with the connecting plate matched with the combination groove.

Compared with the prior art, the utility model has the beneficial effects that:

in this power semiconductor device heat abstractor, through the heat conduction silica gel and the fin structure of the radiating component that set up, make this device can be with the direct outside conduction of the heat that produces on the power semiconductor device body, simultaneously, all be equipped with radiating component on radiating box and the shield, make this device can dispel the heat simultaneously to the upper and lower two sides of power semiconductor device body, in addition, fan and stereoplasm dust screen, soft dust screen, aviation baffle cooperation use, on the one hand, the accessible quickens the mode of air circulation to dispel the heat to the power semiconductor device body, on the other hand can also quicken the outside conduction of heat on the fin, and then further quickened the radiating rate of this device, in addition, the setting of spring and backup pad, gag lever post, make this device can fix the power semiconductor device body through the mode of compressing tightly from top to bottom, thereby the step of fixing alone to the power semiconductor device body has been saved, and then make this device simple and convenient to the fixed mode of power semiconductor device body.

Drawings

FIG. 1 is a schematic diagram of the overall structure of the present utility model;

FIG. 2 is a schematic diagram of the internal structure of the heat dissipation case of the present utility model;

FIG. 3 is a schematic view of the internal part of the heat dissipation case of the present utility model;

FIG. 4 is a schematic diagram of a heat dissipating assembly according to the present utility model;

fig. 5 is a schematic structural view of a protective cover according to the present utility model.

In the figure: 1. a heat dissipation box; 101. a limit rod; 2. ventilation holes; 3. a fan; 4. a combination groove; 5. a heat sink; 6. a heat dissipation assembly; 601. a support frame; 602. a hard dust screen; 603. a soft dust screen; 604. a support plate; 605. thermally conductive silica gel; 606. a fin; 607. an extension plate; 608. a spring; 7. a power semiconductor device body; 8. a protective cover; 9. a connecting sheet; 10. and an air deflector.

Detailed Description

The technical solutions of the embodiments of the present utility model will be clearly and completely described below in conjunction with the embodiments of the present utility model, and it is apparent that the described embodiments are only some embodiments of the present utility model, but not all embodiments, and all other embodiments obtained by those skilled in the art without making any inventive effort based on the embodiments of the present utility model are within the scope of protection of the present utility model.

In order that the utility model may be readily understood, several embodiments of the utility model will be described more fully hereinafter with reference to the accompanying drawings, in which, however, the utility model may be embodied in many different forms and is not limited to the embodiments described herein, but instead is provided for the purpose of providing a more thorough and complete disclosure of the utility model.

It will be understood that when an element is referred to as being "mounted" on another element, it can be directly on the other element or intervening elements may also be present, and when an element is referred to as being "connected" to the other element, it may be directly connected to the other element or intervening elements may also be present, the terms "vertical", "horizontal", "left", "right" and the like are used herein for the purpose of illustration only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs, and the terms used herein in this description of the utility model are for the purpose of describing particular embodiments only and are not intended to be limiting of the utility model, with the term "and/or" as used herein including any and all combinations of one or more of the associated listed items.

Referring to fig. 1-5, the present utility model provides a technical solution:

the utility model provides a power semiconductor device heat abstractor, including radiating box 1, bleeder vent 2 has all been seted up to radiating box 1 front and back both sides, the fan 3 is installed to radiating box 1's have lateral wall centre department, radiating box 1's upper right side is inside to be seted up composite groove 4, radiating box 1's bottom centre department has seted up radiating groove 5, radiating box 1's inner wall and the position that corresponds with radiating groove 5 install radiator unit 6, radiator unit 6's upside is provided with power semiconductor device body 7, protective cover 8 is installed to radiating box 1's upside, connecting piece 9 is installed to protective cover 8's lower left side, air deflector 10 is installed at protective cover 8's inner wall corner;

wherein, stainless steel wire net is installed to the inner wall of bleeder vent 2, the right side wall of heat dissipation box 1 and the through-hole rather than the size looks adaptation is seted up to the position that corresponds with fan 3, and stainless steel wire net is installed to the inner wall of through-hole, the gag lever post 101 is installed to the inside of heat dissipation box 1 and the corner that is located radiator assembly 6, the recess rather than the looks adaptation is seted up in the left side of heat dissipation box 1 and the position that corresponds with connection piece 9, and the screw hole is seted up to the centre of recess, aviation baffle 10 is installed to the left side corner of heat dissipation box 1 inner wall, radiating groove 5 has been seted up to the basal plane of protective cover 8, the inside wall of protective cover 8 and the position that corresponds with radiating groove 5 install radiator assembly 6, the connecting plate rather than the combination groove 4 looks adaptation is installed to the right-hand member of protective cover 8.

In this embodiment, please refer to fig. 2-5, the heat dissipation component 6 includes a supporting frame 601, a hard dust screen 602 is installed in the middle of the side wall of the supporting frame 601, the hard dust screen 602 is made of a stainless steel mesh plate, a soft dust screen 603 is installed on the upper side of the supporting frame 601, the soft dust screen 603 is made of a nylon mesh, a supporting plate 604 is installed on the upper side of the soft dust screen 603, a heat-conducting silica gel 605 is installed in the middle of the base surface of the supporting plate 604, uniformly distributed fins 606 are installed at the bottom of the supporting plate 604, the fins 606 and the supporting plate 604 are made of aluminum plates, an extension plate 607 is installed in the middle of the side wall of the supporting plate 604, the fins 606 and the extension plate 607 are fixedly connected with the supporting plate 604 in a welding manner, a spring 608 is installed between the bottom of the extension plate 607 and the heat dissipation box 1, the heat-conducting silica gel 605 and the fins 606 of the heat dissipation component 6 are structured through the arranged, the device can conduct heat generated on the power semiconductor device body 7 directly outwards, meanwhile, the heat radiating components 6 are arranged on the heat radiating box 1 and the protective cover 8, so that the device can radiate heat on the upper surface and the lower surface of the power semiconductor device body 7 simultaneously, in addition, the fan 3 is matched with the hard dustproof net 602, the soft dustproof net 603 and the air deflector 10 for use, on one hand, the device can radiate heat on the power semiconductor device body 7 in a mode of accelerating air circulation, on the other hand, the device can also accelerate the heat on the fins 606 to conduct outwards, so that the heat radiating speed of the device is further accelerated, in addition, the spring 608, the supporting plate 604 and the limiting rod 101 are arranged, the device can fix the power semiconductor device body 7 in an up-down compression mode, and thus the step of independently fixing the power semiconductor device body 7 is omitted, and further, the fixing mode of the device to the power semiconductor device body 7 is simple and convenient.

The working flow of the utility model is as follows: when the power semiconductor device radiating device is used, the device is placed at a proper position, then the protective cover 8 is pulled and taken down to the left side, then the power semiconductor device body 7 is placed on the radiating component 6 in the radiating box 1, the positioning hole of the power semiconductor device body 7 is aligned with the limiting rod 101, then the protective cover 8 is pressed on the power semiconductor device body 7 from top to bottom, then the protective cover 8 is pushed to the right side until the right end of the protective cover 8 stretches into the combining groove 4, at the moment, the springs 608 of the upper radiating component 6 and the lower radiating component 6 are both in a compressed state, the upper radiating component 7 and the lower radiating component 6 are clamped, then the protective cover 8 is fixed on the radiating box 1 through the bolts by using the bolts through the through holes on the connecting piece 9, then the fan 3 is started, the air circulation speed of the device can be accelerated, through the structure of the heat conducting silica gel 605 and the fins 606 of the heat radiating assembly 6, the device can directly conduct the heat generated on the power semiconductor device body 7 outwards, meanwhile, the heat radiating assemblies 6 are arranged on the heat radiating box 1 and the protective cover 8, so that the device can simultaneously radiate the upper surface and the lower surface of the power semiconductor device body 7, in addition, the fan 3 is matched with the hard dustproof net 602, the soft dustproof net 603 and the air deflector 10 for use, on one hand, the heat of the power semiconductor device body 7 can be radiated in a way of accelerating air circulation, on the other hand, the heat on the fins 606 can be accelerated to conduct outwards, and the radiating speed of the device is further accelerated, in addition, the arrangement of the springs 608, the supporting plates 604 and the limiting rods 101 ensures that the device can fix the power semiconductor device body 7 in a way of up-down compression, therefore, the step of independently fixing the power semiconductor device body 7 is omitted, and the fixing mode of the device to the power semiconductor device body 7 is simple and convenient.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a power semiconductor device heat abstractor, includes radiating box (1), its characterized in that: the novel heat dissipation box is characterized in that ventilation holes (2) are formed in the front side and the rear side of the heat dissipation box (1), a fan (3) is arranged in the middle of the side wall of the heat dissipation box (1), a combined groove (4) is formed in the right upper side of the heat dissipation box (1), a heat dissipation groove (5) is formed in the middle of the bottom of the heat dissipation box (1), a heat dissipation assembly (6) is arranged on the inner wall of the heat dissipation box (1) and at the position corresponding to the heat dissipation groove (5), a power semiconductor device body (7) is arranged on the upper side of the heat dissipation assembly (6), a protective cover (8) is arranged on the upper side of the heat dissipation box (1), a connecting sheet (9) is arranged on the left lower side of the protective cover (8), and an air deflector (10) is arranged at the corner of the inner wall of the protective cover (8).

The heat dissipation assembly (6) comprises a supporting frame (601), a hard dustproof net (602) is arranged in the middle of the side wall of the supporting frame (601), a soft dustproof net (603) is arranged on the upper side of the supporting frame (601), a supporting plate (604) is arranged on the upper side of the soft dustproof net (603), heat conducting silica gel (605) is arranged in the middle of the base surface of the supporting plate (604), fins (606) are uniformly distributed at the bottom of the supporting plate (604), an extension plate (607) is arranged in the middle of the side wall of the supporting plate (604), and a spring (608) is arranged between the bottom of the extension plate (607) and the heat dissipation box (1).

2. The heat sink of a power semiconductor device according to claim 1, wherein: stainless steel wire gauze is installed to the inner wall of bleeder vent (2), the right side wall of radiating box (1) and with the through-hole of its size looks adaptation has been seted up to the position that corresponds of fan (3) to the stainless steel wire gauze is installed to the inner wall of through-hole.

3. The heat sink of a power semiconductor device according to claim 1, wherein: the novel heat dissipation box is characterized in that a limit rod (101) is arranged in the heat dissipation box (1) and located at the corner of the heat dissipation assembly (6), a groove matched with the heat dissipation box is formed in the left side of the heat dissipation box (1) and corresponds to the connecting sheet (9), a threaded hole is formed in the middle of the groove, and an air deflector (10) is arranged at the corner of the left lower side of the inner wall of the heat dissipation box (1).

4. The heat sink of a power semiconductor device according to claim 1, wherein: the hard dustproof net (602) is made of stainless steel net plates, and the soft dustproof net (603) is made of nylon nets.

5. The heat sink of a power semiconductor device according to claim 1, wherein: the fins (606) and the support plates (604) are made of aluminum plates, and the fins (606) and the extension plates (607) are fixedly connected with the support plates (604) in a welding mode.

6. The heat sink of a power semiconductor device according to claim 1, wherein: the base surface of the protective cover (8) is provided with a heat dissipation groove (5), the inner side wall of the protective cover (8) and the position corresponding to the heat dissipation groove (5) are provided with a heat dissipation component (6), and the right end of the protective cover (8) is provided with a connecting plate matched with the combination groove (4).