CN211019731U - Communication equipment - Google Patents
Communication equipment Download PDFInfo
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- CN211019731U CN211019731U CN201921474966.3U CN201921474966U CN211019731U CN 211019731 U CN211019731 U CN 211019731U CN 201921474966 U CN201921474966 U CN 201921474966U CN 211019731 U CN211019731 U CN 211019731U
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- casing
- heat dissipation
- board
- heat
- daughter board
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Abstract
The communication equipment comprises a machine shell, wherein a daughter board and a mother board are arranged in the machine shell, the daughter board and the mother board are connected through a connector, and the daughter board and the mother board are respectively positioned at two ends of the machine shell. The mother board and the daughter boards are both contacted with the shell, the daughter boards and the mother board are both provided with heat dissipation columns, the heat dissipation columns are of hollow structures, and through holes are uniformly distributed on the heat dissipation columns. Compared with the prior art, the scheme has the advantages that the daughter board and the motherboard can be well radiated without arranging the radiating fan in the casing, the radiating efficiency is improved, and the manufacturing cost of the communication equipment is reduced. Specifically speaking, the daughter board and the mother board are in contact with the casing, heat generated by the daughter board and the mother board is directly led into the casing, and the heat can be rapidly dissipated to the outside due to the contact of the casing and the outside air, so that the heat dissipation efficiency of the communication equipment is improved, the volume of the communication equipment is reduced due to no need of a heat dissipation fan, and the communication equipment is easy to maintain.
Description
Technical Field
The present disclosure relates to the field of communications, and in particular, to a communication device.
Background
Communication equipment circuit board can produce a large amount of heat energy at the course of the work, and this heat energy does not in time distribute away and causes communication equipment trouble easily, consequently, communication equipment generally all need set up heat radiation structure. The heat dissipation structure design is an important element to be considered in the design of equipment hardware.
In the prior art, communication equipment mostly adopts a fan for heat dissipation, the space at the front end of a machine frame is used for configuring various service board cards, and the rear end part is used for setting a power supply and a heat dissipation fan. However, the design of the cooling fan needs to occupy a large space, and the design difficulty inside the machine frame is increased. Aiming at a high-power chip in the equipment, the heat dissipation function is realized by using the heat dissipation fins mostly, but the heat dissipation fins can conduct heat to other areas in the equipment, so that the integral temperature of the equipment is increased, and the heat dissipation efficiency is lower.
SUMMERY OF THE UTILITY MODEL
Aiming at the technical problems of low heat dissipation efficiency and high cost caused by unreasonable heat dissipation structure of the communication equipment in the prior art, the communication equipment is provided, the heat dissipation efficiency of the communication equipment is improved, and the cost of the communication equipment is reduced.
To achieve the above object, some embodiments of the present disclosure provide a communication device, including a housing having a heat dissipation capability, a circuit board is arranged in the casing, the circuit board comprises a daughter board and a mother board, the daughter board is connected with the mother board through a connector with data exchange capacity, the daughter board is arranged at one end of the casing, the mother board is arranged at the other end of the casing, and one end of the case where the motherboard is disposed is opposite to one end of the case where the daughter board is disposed, the connector is positioned between the motherboard and the daughter board, one side surface with the largest surface area of the motherboard and the daughter board is respectively contacted with the casing, the heat dissipation plate is characterized in that heat dissipation columns which are not in contact with the shell are arranged on the mother plate and the daughter plates, the heat dissipation columns are of hollow structures, and through holes are uniformly distributed in the heat dissipation columns.
The communication equipment comprises a machine shell, wherein a daughter board and a mother board are arranged in the machine shell, the daughter board and the mother board are connected through a connector, and the daughter board and the mother board are respectively positioned at two ends of the machine shell. The mother board and the daughter boards are both contacted with the shell, the daughter boards and the mother board are both provided with heat dissipation columns, the heat dissipation columns are of hollow structures, and through holes are uniformly distributed on the heat dissipation columns. Compared with the prior art, the scheme has the advantages that the daughter board and the motherboard can be well radiated without arranging the radiating fan in the casing, the radiating efficiency is improved, and the manufacturing cost of the communication equipment is reduced. Specifically speaking, the daughter board and the mother board are in contact with the casing, heat generated by the daughter board and the mother board is directly led into the casing, and the heat can be rapidly dissipated to the outside due to the contact of the casing and the outside air, so that the heat dissipation efficiency of the communication equipment is improved, the volume of the communication equipment is reduced due to no need of a heat dissipation fan, and the communication equipment is easy to maintain.
Preferably, a chip is arranged on the motherboard, a heat conduction boss is arranged on the case, the chip is in contact with the heat conduction boss, the chip is orthographically projected onto the heat conduction boss, and the obtained orthographically projected is completely located on the heat conduction boss.
The heat conduction boss is mainly used for improving the heat dissipation efficiency, namely, the heat generated by the chip is larger than the heat generated by other positions of the circuit board, so that an independent heat dissipation structure is adopted for the chip to improve the heat dissipation efficiency of the communication equipment.
Preferably, a flexible heat conducting pad is arranged between the heat conducting boss and the chip, the flexible heat conducting pad is bonded on the heat conducting boss, and the heat conducting boss and the shell are of an integrated structure.
The flexible heat conducting pad mainly plays a role in buffering, the chip is damaged due to impact, and the performance of the communication equipment is optimized.
Preferably, the chip is fixed to the motherboard, and a screw with a spring is provided on the motherboard.
Preferably, the casing is provided with heat dissipation holes, the heat dissipation holes are formed in a surface of the casing not in contact with the motherboard or the daughter board, and the casing is further provided with a filter screen covering all the heat dissipation holes.
The radiating holes are mainly used for radiating heat, and radiating efficiency of the communication equipment is improved.
The filter screen is mainly used for preventing dust in the air from entering the machine shell, so that the working environment of the mother board and the daughter board is optimized, and the service life of the communication equipment is prolonged.
Preferably, the filter screen joint in on the casing be provided with joint portion on the casing, joint portion include with filter screen complex bayonet socket, joint portion bond in on the casing.
The setting of joint portion makes the filter screen easily assemble, has reduced communication equipment's manufacturing cost.
Preferably, ribs for improving the strength of the casing are uniformly distributed on the casing and protrude out of the casing, the ribs and the casing are of an integrated structure, and two adjacent ribs are parallel to each other.
The setting of rib lies in increasing the area of contact of casing and air, improves communication equipment's radiating efficiency.
In addition, the strength of the shell can be improved due to the arrangement of the ribs, and the performance of the communication equipment is optimized.
Preferably, the ribs are evenly provided with vent holes, the vent holes penetrate through the ribs, the vent holes in two adjacent ribs are staggered, the ribs are also evenly provided with convex points, the convex points and the ribs are of an integrated structure, the convex points are hemispheric, and the convex points are provided with pits.
The arrangement of the ventilation holes, the salient points and the pits is used for increasing the contact area of the machine shell and air, so that the heat dissipation efficiency of the machine shell is improved, and the performance of the communication equipment is optimized.
The present disclosure has the following beneficial effects:
1. the casing is adopted for heat dissipation, a heat dissipation fan is not needed, the size of the communication equipment is reduced, and the manufacturing cost of the communication equipment is reduced.
2. The casing is adopted for heat dissipation, noise is not generated in the heat dissipation process of the communication equipment, and the performance of the communication equipment is optimized.
3. The daughter board and the mother board are both contacted with the casing, and heat energy generated by the daughter board and the mother board is directly conducted to the casing, so that the heat dissipation efficiency of the communication equipment is improved.
4. The arrangement of the heat dissipation column can avoid overhigh local temperature of the daughter board and the motherboard, and the service life of the communication equipment is prolonged.
Drawings
The following drawings are merely exemplary, not all drawings of the disclosed embodiments, and other drawings may be obtained by those skilled in the art in light of the disclosed embodiments.
Fig. 1 is a schematic illustration of the present disclosure.
Fig. 2 is a schematic view of the internal structure of the present disclosure.
Fig. 3 is a left side view of fig. 1.
Fig. 4 is a schematic view of the clamping portion.
Fig. 5 is a schematic view of a tendon.
Detailed Description
The present disclosure is further described below with reference to the accompanying drawings, and the following embodiments are merely exemplary and are not all embodiments of the technical solutions of the present disclosure.
As shown in fig. 1, fig. 2, and fig. 3, a communication device includes a housing 1 with heat dissipation capability, a circuit board is disposed in the housing 1, the circuit board includes a daughter board 3 and a motherboard 2, and the daughter board 3 is connected to the motherboard 2 through a connector 4 with data exchange capability.
The daughter board 3 is disposed at one end of the casing 1, the motherboard 2 is disposed at the other end of the casing 1, one end of the casing 1 on which the motherboard 2 is disposed is opposite to one end of the casing 1 on which the daughter board 3 is disposed, and the connector 4 is disposed between the motherboard 2 and the daughter board 3.
The mother board 2 and the daughter board 3 are in contact with the chassis 1 at one side surface having the largest surface area.
The motherboard 2 and the daughter board 3 are both provided with heat dissipation columns 5 which are not in contact with the case 1, the heat dissipation columns 5 are of hollow structures, and through holes are uniformly distributed on the heat dissipation columns 5.
The casing 1 in the present disclosure can be made of a metal material, and since the metal material has good heat conduction and heat dissipation capabilities, the casing 1 made of the metal material will greatly improve the heat dissipation efficiency of the communication device. Illustratively, the cabinet 1 may be made of aluminum alloy.
In this disclosure, the heat that daughter board 3, mother board 2 produced conducts to casing 1 earlier, because casing 1 and external contact, this heat will be given off to the external air by casing 1 rapidly, because this scheme adopts direct contact's mode to realize the transmission of heat energy, this scheme has improved the transmission efficiency of heat energy greatly, and then has improved communication equipment's radiating efficiency.
In addition, because a heat radiation fan is not required to be arranged in the casing 1, the volume of the communication equipment is reduced, and the performance of the communication equipment is optimized. Moreover, because a cooling fan is not needed, the communication equipment does not generate noise in the cooling process.
In addition, the arrangement of the heat dissipation column 5 is mainly used for dissipating heat on the daughter board 3 and the motherboard 2 into the enclosure 1, so that the damage of the daughter board 3 or/and the motherboard 2 caused by overhigh local temperature on the daughter board 3 or/and the motherboard 2 is avoided, and the service life of the communication equipment is prolonged.
As shown in fig. 2 and 3, in some possible embodiments, a chip 6 is disposed on the motherboard 2, a heat-conducting boss 7 is disposed on the chassis 1, the chip 6 is in contact with the heat-conducting boss 7, and the chip 6 is orthographically projected onto the heat-conducting boss 7, where the orthographically projected is completely located on the heat-conducting boss 7.
The chip 6 is a structure provided on the motherboard 2 for implementing a certain function, and the chip 6 is a conventional structure in the prior art and will not be described here. The chip 6 generates a large amount of heat energy during operation, and therefore, the chip 6 needs higher heat dissipation efficiency compared with other areas on the motherboard 2, and therefore, the chip 6 can be cooled by the chassis 1 and the heat conducting boss 7, so as to improve the heat dissipation efficiency of the chassis 1.
The shape of the heat-conducting bump 7 is not limited, and may be freely selected by those skilled in the art, but the chip 6 should be able to completely contact with the heat-conducting bump 7, so as to avoid that the chip 6 is not locally contacted with the heat-conducting bump 7, which may cause the local temperature of the chip 6 to be too high.
In some possible embodiments, a flexible thermal pad 8 is disposed between the thermal conductive boss 7 and the chip 6, the flexible thermal pad 8 is bonded to the thermal conductive boss 7, and the thermal conductive boss 7 and the chassis 1 are of an integral structure.
Flexible heat conduction pad 8 has the heat conduction pad of elastic deformation ability promptly, and setting up of flexible heat conduction pad 8 mainly plays buffer function, avoids chip 6 to be damaged.
The chip 6 is fixed to the motherboard 2, and a screw with a spring is provided on the motherboard 2. This take screw of spring welds or other fixed modes on the screw promptly and is fixed with the spring, and the fix with screw is on the mother board, and the one end and the fix with screw of spring, the daughter board can be contradicted to the other end of spring to play buffer function, prevent that the mother board from damaging because the striking.
As shown in fig. 2 and 4, in some possible embodiments, heat dissipation holes 11 are formed in the casing 1, the heat dissipation holes 11 are formed in a surface of the casing 1 that is not in contact with the motherboard 2 and the daughter board 3, and a screen 12 that covers all the heat dissipation holes 11 is further formed in the casing 1.
The shape of the heat dissipation holes 11 is not limited, and those skilled in the art can freely select the shape, and since the heat dissipation holes 11 have the function of assisting heat dissipation, the heat dissipation holes 11 should not be disposed on the surface of the casing 1 contacting the motherboard 2 and the daughter board 3, and the heat dissipation holes 11 disposed on other surfaces of the casing 1 can perform reasonable heat dissipation to the space in the casing 1.
For example, the heat dissipation holes 11 may be matched with the heat dissipation posts 5 to dissipate heat in some spaces inside the enclosure 1, so as to optimize the working environment of the daughter board 3 and the motherboard 2 and prolong the service life of the communication device.
As shown in fig. 5, the filter screen 12 is connected to the housing 1, a connecting portion 13 is disposed on the housing 1, the connecting portion 13 includes a bayonet connected to the filter screen 12, and the connecting portion 13 is bonded to the housing 1.
The filter screen 12 can generate a certain elastic deformation, and when the filter screen 12 is assembled, the elastic deformation is utilized to assemble the filter screen 12 with the bayonet.
In some possible embodiments, ribs 14 for improving the strength of the casing 1 are further uniformly distributed on the casing 1, the ribs 14 protrude out of the casing 1, and the ribs 14 and the casing 1 are of an integral structure, and two adjacent ribs 14 are parallel to each other.
The equipartition has ventilation hole 15 on the rib 14, ventilation hole 15 runs through rib 14 to, ventilation hole 15 on two adjacent ribs 14 staggers each other still the equipartition has bump 16 on the rib 14, bump 16 and rib 14 formula structure as an organic whole, bump 16 is the hemisphere, and be provided with the pit on the bump 16.
The arrangement of the salient points 16 and the pits increases the contact area of the ribs 14 and air, and further improves the heat dissipation efficiency of the casing 1.
In some possible embodiments, an area is formed between two adjacent ribs 14, the heat dissipation holes 11 may be uniformly distributed in the area, and the filter screen 12 and the clamping portion 13 are located in the area to avoid interference between the ribs 14 and the filter screen 12.
Obviously, the screen 12 may have a long bar shape, and a plurality of long bar-shaped screens 12 are provided on the cabinet 1 to realize the assembly of the screen 12 with the cabinet 1.
While several possible embodiments of the disclosure have been described above with reference to the accompanying drawings, it is to be understood that these embodiments are not all embodiments of the disclosure, and that other embodiments may be devised by those skilled in the art without departing from the inventive concept, and that such embodiments are within the scope of the disclosure.
Claims (8)
1. A communication device comprises a casing (1) with heat dissipation capability, a circuit board is arranged in the casing (1), the circuit board comprises a daughter board (3) and a mother board (2), the daughter board (3) and the mother board (2) are connected through a connector (4) with data exchange capability, and the communication device is characterized in that: daughter board (3) set up in the wherein one end of casing (1), mother board (2) set up in the other end of casing (1), and, set up on casing (1) the one end of mother board (2) with set up on casing (1) the one end of daughter board (3) is relative, connector (4) are located mother board (2) with between daughter board (3), mother board (2) the biggest side of surface area of daughter board (3) respectively with casing (1) contact mother board (2) daughter board (3) all be provided with on not with heat dissipation post (5) of casing (1) contact, heat dissipation post (5) are hollow structure, and the equipartition has the through-hole on heat dissipation post (5).
2. The communication device of claim 1, wherein: the heat conduction module is characterized in that a chip (6) is arranged on the motherboard (2), a heat conduction boss (7) is arranged on the case (1), the chip (6) is in contact with the heat conduction boss (7), the chip (6) is orthographically projected onto the heat conduction boss (7), and the obtained orthographically projected is completely positioned on the heat conduction boss (7).
3. The communication device of claim 2, wherein: a flexible heat conducting pad (8) is arranged between the heat conducting boss (7) and the chip (6), the flexible heat conducting pad (8) is bonded on the heat conducting boss (7), and the heat conducting boss (7) and the shell (1) are of an integrated structure.
4. The communication device of claim 3, wherein: the chip (6) is fixed on the motherboard (2), and a screw with a spring is arranged on the motherboard (2).
5. The communication device of claim 1, wherein: the heat dissipation device is characterized in that heat dissipation holes (11) are formed in the machine shell (1), the heat dissipation holes (11) are formed in the surface, which is not in contact with the mother board (2) and the daughter board (3), of the machine shell (1), and a filter screen (12) covering all the heat dissipation holes (11) is further arranged on the machine shell (1).
6. The communication device of claim 5, wherein: filter screen (12) joint in on casing (1) be provided with joint portion (13) on casing (1), joint portion (13) include with filter screen (12) complex bayonet socket, joint portion (13) bond in on casing (1).
7. The communication device of claim 1, wherein: the strength of the casing (1) is improved by ribs (14) evenly distributed on the casing (1), the ribs (14) protrude out of the casing (1), the ribs (14) and the casing (1) are of an integrated structure, and the adjacent two ribs (14) are parallel to each other.
8. The communications device of claim 7, wherein: the equipartition has ventilation hole (15) on rib (14), ventilation hole (15) run through rib (14) to, ventilation hole (15) on two adjacent ribs (14) stagger each other still the equipartition has bump (16) on rib (14), bump (16) and rib (14) formula structure as an organic whole, bump (16) are the hemisphere, and be provided with the pit on bump (16).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921474966.3U CN211019731U (en) | 2019-09-05 | 2019-09-05 | Communication equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921474966.3U CN211019731U (en) | 2019-09-05 | 2019-09-05 | Communication equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211019731U true CN211019731U (en) | 2020-07-14 |
Family
ID=71478401
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921474966.3U Active CN211019731U (en) | 2019-09-05 | 2019-09-05 | Communication equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211019731U (en) |
-
2019
- 2019-09-05 CN CN201921474966.3U patent/CN211019731U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP02 | Change in the address of a patent holder |
Address after: Room 215, block C, phase V, information port, 1078 Jianshe 4th Road, Xiaoshan District, Hangzhou City, Zhejiang Province, 311200 Patentee after: HANGZHOU CHENXIAO TECHNOLOGY Co.,Ltd. Address before: 310051 Room 301, building 1, 51 Chengye Road, Puyan street, Binjiang District, Hangzhou City, Zhejiang Province Patentee before: HANGZHOU CHENXIAO TECHNOLOGY Co.,Ltd. |
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| CP02 | Change in the address of a patent holder |