CN213482808U

CN213482808U - Wind-liquid integrated heat dissipation case

Info

Publication number: CN213482808U
Application number: CN202021724134.5U
Authority: CN
Inventors: 葛新法; 俞青锋; 翁奇财
Original assignee: 715th Research Institute of CSIC
Current assignee: 715th Research Institute of CSIC
Priority date: 2020-08-18
Filing date: 2020-08-18
Publication date: 2021-06-18
Anticipated expiration: 2030-08-18

Abstract

The utility model discloses a wind-liquid integral type heat dissipation machine case mainly includes fan assembly, power module, upper guide, lower baffle, fan assembly down, goes up to enclose the frame, encloses frame, quick-witted case frame etc. down, with fin and the integrative integration of installation guide rail on the liquid cooling baffle to at the frame that encloses of machine case set up the fan assembly, the emergent air-cooled structure of formation makes coolant liquid circulation circuit when the trouble leads to the electronic module temperature to rise, can go out through the heat transfer of emergent air-cooled structure on with electronic module. The utility model is applied to the third generation signal processing equipment, the liquid cooling cold plate is integrated with the radiating fins, and the radiating fins and the module installation slide rail form an integrated compact heat exchanger, thereby effectively improving the cooling efficiency of emergency air cooling; the fan assemblies are arranged in the upper and lower surrounding frames of the case, so that the space in the middle of the case is prevented from being occupied; the cooling air is not in direct contact with the electronic module during emergency air cooling, so that the environmental adaptability of the electronic module is enhanced.

Description

Wind-liquid integrated heat dissipation case

Technical Field

The utility model relates to a radiating field of computer, concretely relates to wind-liquid integral type heat dissipation machine case.

Background

The development of electronic technology presents two major trends: the first is pursuit of miniaturization and integration, and the second is pursuit of high frequency and high operation speed, so that the heat flux density of a single chip is rapidly increased. For example, the heat flow density generated by a computer CPU chip in the operation process reaches 60-100W/cm 2, and even reaches 103W/cm2 orders of magnitude in a semiconductor laser. The normal working temperature range of the electronic device is-5-60 ℃, the maximum allowable working temperature is 100-120 ℃, and overhigh temperature can endanger the junction of a semiconductor, damage the connection interface of a circuit, increase the resistance value of a conductor and form mechanical force damage. Statistically, a failure rate of 55% of electronic devices is caused by a temperature exceeding a predetermined value. Therefore, the electronic heat dissipation problem has become a bottleneck restricting the development of the electronic industry, and the traditional air cooling technology can not meet the increasing heat dissipation requirement of the electronic system. The unit heat capacity of liquid is larger than that of gas, so that the cooling mode using the liquid as the circulating working medium can achieve the cooling effect higher than that of air cooling. Liquid cooling technology is recently being applied to high heat flux density computer heat dissipation. The liquid cooling is usually indirect cooling, i.e. the heat of the electronic component device is first conducted to a heat-dissipating cold plate, in which the heat is removed by a cooling liquid.

In the liquid cooling mode, under special conditions such as failure of a liquid cooling system, outage of cooling liquid and the like, electronic equipment fails due to insufficient cooling. In the military computer field, its high reliability and low maintenance time requirements place a demand on the liquid cooling regime that must have emergency cooling capability. Chinese patent application publication No. CN105929917A and application publication No. 2016.09.07 disclose a silent cooling system applied to a server. The cooling system comprises a plurality of fans and a plurality of cold plates, wherein the fans are arranged at the disk array position at the front part of the case, the cold plates comprise cold plates arranged at the top of the case and heating element cold plates in contact with a plurality of heating elements in the case, water cooling pipes are arranged in the top cold plates, and each heating element cold plate is connected with the top cold plate through a heat conduction pipe. The heat dissipation system mainly exchanges heat between the heat source dispersed inside and the liquid cooling plate through the fan inside the case. The fan is arranged in the case, which not only influences the placement of components in the case, but also is not convenient for the fan to run, and simultaneously causes the space in the case to be larger, so that the structure of the case is not compact; meanwhile, when a circulation loop of the water cooling liquid breaks down, the water cooling liquid in the cold plate cannot circulate, and heat generated by the components cannot be discharged from the cold plate, so that the components in the case work at high temperature, and the working efficiency and the service life of the components are reduced.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to overcome the not enough of prior art existence, and provide a wind-liquid integral type heat dissipation machine case.

The purpose of the utility model is accomplished through following technical scheme: the air-liquid integrated radiating case mainly comprises an upper air outlet, an upper fan assembly, a power supply module, an upper air inlet, an upper guide plate, a front handle, a front cover plate, a lower guide plate, a lower air inlet, a lower fan assembly, a lower air outlet, a rear handle, a rear cover plate, an upper surrounding frame, a lower surrounding frame, a case frame, a stand column, an upper slide rail and a lower slide rail, wherein the upper end and the lower end of the stand column extending along the vertical direction of the case frame are respectively provided with the upper guide plate and the lower guide plate, the front cover plate is arranged in front of the case frame, the front handle is arranged on the front cover plate, the rear cover plate is arranged behind the case frame, the rear cover plate is provided with the rear handle, the lower wall surface of the upper guide plate is convexly provided with upper convex ribs, an upper slide rail for installing an electronic module is formed between the upper convex ribs, the upper wall surface of the lower guide plate is convexly provided with lower convex ribs, the lower slide rail, the power module is arranged on the upper part of the upper radiating fin of the upper guide plate, the front side and the rear side of the upper radiating fin of the upper guide plate are respectively provided with an upper air inlet and an upper air outlet, an upper fan component for taking away heat is arranged beside the upper radiating fin, the front side and the rear side of the lower radiating fin of the lower guide plate are respectively provided with a lower air inlet and a lower air outlet, a lower fan component is also arranged beside the lower radiating fin, the outer side surface of the upper heat-conducting plate is also provided with an upper enclosing frame surrounding the upper radiating fin, the upper fan component is arranged in the upper enclosing frame, the upper enclosing frame is provided with the upper air inlet and the upper air outlet, the outer side surface of the lower heat-conducting plate is also provided with a lower enclosing frame surrounding the lower radiating fin, the lower fan component is arranged in the lower enclosing frame, the lower air inlet and the lower air outlet are arranged on the lower enclosing frame, the upper enclosing frame is positioned at the top of the chassis frame to, and a control module for controlling the upper fan assembly and the lower fan assembly to work is also arranged in the case frame.

An upper cooling liquid channel for cooling liquid to flow circularly is arranged in the upper guide plate, an upper liquid inlet and an upper liquid outlet which are communicated with the upper cooling liquid channel are simultaneously arranged on the upper guide plate, and an upper radiating fin is fixedly connected to the upper wall surface of the upper guide plate.

A lower cooling liquid channel for cooling liquid to flow circularly is arranged in the lower heat conducting plate, a lower liquid inlet and a lower liquid outlet which are communicated with the lower cooling liquid channel are simultaneously arranged on the lower heat conducting plate, and lower radiating fins are fixedly connected on the lower wall surface of the lower heat conducting plate.

The upper radiating fins and the lower radiating fins are radiating fins and heat conducting fins arranged at intervals.

The upper liquid outlet of the upper heat-conducting plate is communicated with the lower liquid inlet of the lower heat-conducting plate through a communicating pipe.

The utility model has the advantages that: the utility model is applied to the third generation signal processing equipment, the liquid cooling cold plate is integrated with the radiating fins, and the radiating fins and the module installation slide rail form an integrated compact heat exchanger, thereby effectively improving the cooling efficiency of emergency air cooling; when the temperature of the electronic module rises due to the fault of the circulation loop of the cooling liquid, the heat on the electronic module can be transferred out by starting the heat dissipation fan of the fan component; the fan assemblies arranged in the upper and lower surrounding frames of the case avoid the space in the middle of the case from being occupied, so that the internal space of the case is effectively utilized, and the structure is more compact; the cooling air is not in direct contact with the electronic module during emergency air cooling, so that the environmental adaptability of the electronic module is enhanced.

Drawings

Fig. 1 is a schematic structural diagram of the present invention.

Fig. 2 is the structural schematic diagram of the liquid cooling heat dissipation part of the present invention.

Fig. 3 is a schematic structural view of the air-cooled heat dissipating part of the present invention.

Description of reference numerals: the cooling device comprises an upper air outlet 1, an upper fan assembly 2, a power supply module 3, an upper heat dissipation fin 4, an upper air inlet 5, a lower cooling liquid channel 6, an upper guide plate 7, a front handle 8, a front cover plate 9, a lower guide plate 10, a lower air inlet 11, a lower heat dissipation fin 12, a lower fan assembly 13, a lower air outlet 14, a rear handle 16, a rear cover plate 17, a communication pipe 18, an upper liquid inlet 19, a lower cooling liquid channel 20, an upper surrounding frame 21, a lower surrounding frame 22, a case frame 23, a stand column 231, an upper sliding rail 71 and a lower sliding rail 101.

Detailed Description

The present invention will be described in detail with reference to the accompanying drawings:

example (b): as shown in the accompanying drawings, the air-liquid integrated heat dissipation case mainly comprises an upper air outlet 1, an upper fan assembly 2, a power module 3, an upper air inlet 5, an upper guide plate 7, a front handle 8, a front cover plate 9, a lower guide plate 10, a lower air inlet 11, a lower fan assembly 13, a lower air outlet 14, a rear handle 16, a rear cover plate 17, an upper enclosure frame 21, a lower enclosure frame 22, a case frame 23, a stand column 231, an upper slide rail 71 and a lower slide rail 101, wherein the upper end and the lower end of the stand column 231 extending along the vertical direction of the case frame 2 are respectively provided with the upper guide plate 7 and the lower guide plate 10, the front surface of the case frame 2 is provided with the front cover plate 9, the front cover plate 9 is provided with the front handle 8, the rear surface of the case frame 2 is provided with the rear cover plate 17, the rear cover. An upper convex rib is convexly arranged on the lower wall surface of the upper guide plate 7, an upper sliding rail 71 for mounting an electronic module is formed between the upper convex ribs, a lower convex rib is convexly arranged on the upper wall surface of the lower guide plate 10, a lower sliding rail 101 for mounting the electronic module is formed between the lower convex ribs, the electronic module is mounted on a metal heat conducting plate and is fixed in a slot formed by the upper sliding rail 71 and the lower sliding rail 101 through a wedge-shaped locking device, the heat of the electronic module is conducted to the upper guide plate 7 and the lower guide plate 10 through the metal heat conducting plate, the power module 3 is arranged on the upper part of an upper radiating fin 4 of the upper guide plate 7, the power module 3 is convenient to take and place, meanwhile, the power module 3 can be radiated through the upper radiating fin 4, the normal work of the power module 3 is ensured, an upper air inlet 5 and an upper air outlet 1 are respectively arranged on the front side and the rear side of the upper, the front side and the rear side of a lower radiating fin 12 of the lower guide plate 10 are respectively provided with a lower air inlet 11 and a lower air outlet 14, and a lower fan assembly 13 is also arranged beside the lower radiating fin 12 and is provided with a fan assembly, so that the radiating performance of the radiating fin can be improved. In other embodiments, the fan assembly is not arranged, and the heat dissipation fins are dissipated through natural wind; or the air inlet and the air outlet are connected with ventilation pipelines, and the external air-cooled ventilation pipelines are used for radiating the radiating fins. The upper air outlet 1 is arranged at the rear part of the case frame 23, the upper air inlet 5 is arranged at the front part of the case frame 23, the upper fan assembly 2 is arranged at the position of the upper air outlet 1 in the case frame 23, namely the upper fan assembly 2 is positioned at the rear part of the case frame 23, and the upper fan assembly 2 takes away heat on the upper radiating fins 4 through air suction; the lower air outlet 14 is arranged at the rear part of the case frame 23, the lower air inlet 11 is arranged at the front part of the case frame 23, the lower fan assembly 13 is arranged at the position of the lower air outlet 14 in the case frame 23, namely, the lower fan assembly 13 is positioned at the rear part of the case frame 23, and the lower fan assembly 13 takes away heat on the lower radiating fins 12 through air suction. The staff works in the place ahead of chassis frame 23, avoids fan unit exhaust hot-blast to influence the staff. In other embodiments, the air outlet may be disposed at the front of the chassis frame 23, the air inlet may be disposed at the rear of the chassis frame 23, and the fan assembly is disposed at the position of the air outlet in the chassis frame 23, that is, in front of the chassis frame 23; or the fan assembly is arranged at the air inlet position in the case frame 23, and the fan assembly blows air to the radiating fins. The outer side surface of the upper heat conducting plate 7 is further provided with an upper surrounding frame 21 surrounding the upper heat radiating fins 4, the upper fan assembly 2 is arranged in the upper surrounding frame 21, the upper surrounding frame 21 is provided with an upper air inlet 5 and an upper air outlet 1, the outer side surface of the lower heat conducting plate 10 is further provided with a lower surrounding frame 22 surrounding the lower heat radiating fins 12, the lower fan assembly 13 is arranged in the lower surrounding frame 22, and the lower surrounding frame 22 is provided with a lower air inlet 11 and a lower air outlet 14. The heat exchanger and the fan assembly jointly form an emergency air cooling structure. The top frame 21 is disposed on the top of the frame 23 to form a top of the case covering the top of the case, and the bottom frame 22 is disposed on the bottom of the frame 23 to form a base of the case supporting the case. And a control module for controlling the upper fan assembly 2 and the lower fan assembly 13 to work is also arranged in the case frame 23. When the circulation loop of the cooling liquid breaks down to enable the temperature of the electronic module to rise to a set value, the control module controls the upper fan assembly 2 and the lower fan assembly 13 to automatically start working. The problem that the equipment fails because heat in the box body cannot be discharged due to the fact that a worker does not know that the circulation loop breaks down is avoided.

An upper cooling liquid channel 6 for cooling liquid to flow circularly is arranged in the upper guide plate 7, an upper liquid inlet 19 and an upper liquid outlet which are communicated with the upper cooling liquid channel 6 are simultaneously arranged on the upper guide plate 7, and an upper heat radiating fin 4 is fixedly connected to the upper wall surface of the upper guide plate 7. A lower cooling liquid channel 20 for the cooling liquid to flow circularly is arranged in the lower heat conducting plate 10, a lower liquid inlet and a lower liquid outlet 15 communicated with the lower cooling liquid channel 20 are simultaneously arranged on the lower heat conducting plate 10, and a lower radiating fin 12 is fixedly connected on the lower wall surface of the lower heat conducting plate 10. The upper heat radiating fins 4 and the lower heat radiating fins 12 constitute a heat radiating fin. The upper radiating fins 4 and the lower radiating fins 12 are radiating fins and heat conducting fins arranged at intervals. Compared with the prior art, when the temperature of the electronic module is increased due to the fault of the circulation loop of the cooling liquid, the heat on the upper guide plate 7 and the lower guide plate 10 can be conducted out through the radiating fins, and the radiating fins can guarantee the normal work of the electronic module during the fault repair of the circulation loop of the cooling liquid. The upper liquid outlet of the upper heat conducting plate 7 is communicated with the lower liquid inlet of the lower heat conducting plate 10 through a communicating pipe 18, so that the structure is simplified, a circulation loop is reduced, pipelines are saved, and a cooling liquid channel is not required to be arranged on the box wall. In this embodiment, the communication pipe 18 is a liquid-permeable hard pipe, so that the communication pipe 18 can be supported outside the chassis frame 23 without a fixed structure. In other embodiments, the communicating tube 18 is a flexible tube and is fixed to the chassis frame 23 by a fixing structure such as a hoop. In other embodiments, the communicating pipe 18 is not arranged, so that the upper guide plate 7 and the lower guide plate are 10 independent circulation loops to improve the heat dissipation performance of the chassis; or a cooling liquid channel for communicating an upper liquid outlet of the upper guide plate 7 with a lower liquid inlet of the lower guide plate 10 is arranged in the wall of the case frame 23 without the communicating pipe 18.

It should be understood that equivalent substitutions or changes to the technical solution and the inventive concept of the present invention should be considered to fall within the scope of the appended claims for the skilled person.

Claims

1. The utility model provides a wind-liquid integral type heat dissipation machine case which characterized in that: comprises an upper air outlet (1), an upper fan component (2), a power module (3), an upper air inlet (5), an upper guide plate (7), a front handle (8), a front cover plate (9), a lower guide plate (10), a lower air inlet (11), a lower fan component (13), a lower air outlet (14), a rear handle (16), a rear cover plate (17), an upper enclosing frame (21), a lower enclosing frame (22), a case frame (23), upright posts (231), an upper slide rail (71) and a lower slide rail (101), wherein the upper end and the lower end of the upright post (231) extending along the vertical direction of the case frame (23) are respectively provided with the upper guide plate (7) and the lower guide plate (10), the front cover plate (9) is arranged in front of the case frame (23), the front handle (8) is arranged on the front cover plate (9), the rear cover plate (17) is arranged behind the case frame (23), and the rear handle (16) is arranged on the, an upper convex rib is convexly arranged on the lower wall surface of the upper guide plate (7), an upper slide rail (71) used for installing an electronic module is formed between the upper convex ribs, a lower convex rib is convexly arranged on the upper wall surface of the lower guide plate (10), a lower slide rail (101) used for installing the electronic module is formed between the lower convex ribs, the electronic module is installed on the metal heat-conducting plate and is fixed in a slot formed by the upper slide rail (71) and the lower slide rail (101) through a wedge-shaped locking device, the power supply module (3) is arranged on the upper part of an upper radiating fin (4) of the upper guide plate (7), an upper air inlet (5) and an upper air outlet (1) are respectively arranged on the front side and the rear side of the upper radiating fin (4), an upper fan assembly (2) used for taking away heat is further arranged beside the upper radiating fin (4), and a lower air inlet (11) and a lower air outlet (14) are respectively arranged, the lower fan assembly (13) is also arranged beside the lower radiating fins (12), an upper enclosing frame (21) surrounding the upper radiating fins (4) is further arranged on the outer side face of the upper guide plate (7), the upper fan assembly (2) is arranged in the upper enclosing frame (21), an upper air inlet (5) and an upper air outlet (1) are formed in the upper enclosing frame (21), a lower enclosing frame (22) surrounding the lower radiating fins (12) is further arranged on the outer side face of the lower guide plate (10), the lower fan assembly (13) is arranged in the lower enclosing frame (22), a lower air inlet (11) and a lower air outlet (14) are formed in the lower enclosing frame (22), the upper enclosing frame (21) is located at the top of the case frame (23) to form a case top covering the case top, the lower enclosing frame (22) is located at the bottom of the case frame (23) to form a case base supporting the case, and a control module for controlling the upper fan assembly (2) and the lower fan assembly (13) to work is further arranged in the case frame (23).

2. The wind-liquid integrated heat dissipation case of claim 1, wherein: an upper cooling liquid channel (6) for cooling liquid to flow circularly is arranged in the upper guide plate (7), an upper liquid inlet (19) and an upper liquid outlet which are communicated with the upper cooling liquid channel (6) are simultaneously arranged on the upper guide plate (7), and an upper heat radiating fin (4) is fixedly connected to the upper wall surface of the upper guide plate (7).

3. The wind-liquid integrated heat dissipation case of claim 1, wherein: the lower guide plate (10) is internally provided with a lower cooling liquid channel (20) for cooling liquid to flow circularly, the lower guide plate (10) is simultaneously provided with a lower liquid inlet and a lower liquid outlet (15) which are communicated with the lower cooling liquid channel (20), and the lower wall surface of the lower guide plate (10) is fixedly connected with a lower radiating fin (12).

4. The wind-liquid integrated heat dissipation case of claim 1 or 2, wherein: the upper radiating fins (4) and the lower radiating fins (12) are radiating fins and heat conducting fins arranged at intervals.

5. The wind-liquid integrated heat dissipation case of claim 1, wherein: an upper liquid outlet of the upper guide plate (7) is communicated with a lower liquid inlet of the lower guide plate (10) through a communicating pipe (18).