CN222547850U

CN222547850U - A heat dissipation device for the mainboard inside a metal shell communication dispatching device

Info

Publication number: CN222547850U
Application number: CN202421005784.2U
Authority: CN
Inventors: 张双利; 王洪波; 李高岭; 卢东旭; 赵小君
Original assignee: Beijing Jindiyuan Technology Co ltd
Current assignee: Beijing Jindiyuan Technology Co ltd
Priority date: 2024-05-10
Filing date: 2024-05-10
Publication date: 2025-02-28
Anticipated expiration: 2034-05-10

Abstract

The utility model discloses an internal main board heat dissipation device of metal shell communication scheduling equipment, relates to the technical field of terminal heat dissipation devices, and aims to solve the problem that the old terminal equipment board cannot be additionally provided with a heat dissipation device and the working performance of the communication scheduling equipment is affected. Wherein the one end of top mount pad is provided with two first fixed stabilizer blades, extend to the both sides of CPU on the equipment mainboard, the one end of bottom mount pad is provided with many fixed stabilizer blades of second, the top mount pad passes through bolt and bottom mount pad fixed connection, top mount pad and bottom mount pad are located both sides about the equipment mainboard, the one end of first fixed stabilizer blade is provided with the kink, be provided with the mounting hole on the kink, the one end of fixing base is provided with the erection column, the other end and the top mount pad fixed connection of fixing base, the heat collecting piece is installed between fixing base and top mount pad, the heat collecting piece passes through heat conduction copper pipe and is connected with the heat dissipation net. A heat sink suitable for a legacy terminal board is provided.

Description

Inside mainboard heat abstractor of metal casing communication scheduling equipment

Technical Field

The utility model relates to the technical field of terminal heat dissipation devices, in particular to an internal main board heat dissipation device of metal shell communication scheduling equipment.

Background

With the powerful and intelligent functions of the command and dispatch system, a part of automatic control system is added in the terminal equipment. The core of the automatic control system is a Central Processing Unit (CPU), the CPU takes the core of the whole system, larger heat is generated in the working process, and the heat dissipation problem becomes the primary factor of the terminal equipment. The heat generated by the CPU is dissipated through the metal casing of the package, but since the heat generated by the CPU is large, the metal cover depending on itself cannot meet the heat dissipation requirement, and thus a reinforced auxiliary heat dissipation system is required.

In various test processes, copper pipe heat dissipation is found to be the first choice of the terminal equipment, and special heat conducting liquid is filled in the CPU heat dissipation copper pipe, so that heat generated by a CPU core can be rapidly transferred to the whole externally-added radiator, and each part of the radiator participates in heat dissipation, thereby achieving the aim of cooling. However, the terminal equipment board of the existing communication scheduling equipment is of a mature structure, the installation of the heat dissipation copper pipe device cannot be met, and in order to enable the heat dissipation copper pipe to dissipate heat, the terminal equipment board which accords with the installation of the heat dissipation copper pipe needs to be redesigned. In order not to affect the working performance of the communication scheduling device, the old terminal device board needs a novel main board heat dissipation device.

Disclosure of utility model

The utility model aims to provide a heat dissipation device for an internal main board of a metal shell communication scheduling device, which solves the problem that the old terminal device board cannot be added with a heat dissipation device, so that the working performance of the communication scheduling device is affected.

In order to achieve the above object, the present utility model provides the following technical solutions:

The internal main board radiating device of the metal shell communication scheduling equipment comprises a mounting seat, a heat collecting plate, a heat conducting copper pipe, a radiating grid and a radiating fan;

The utility model provides a heat-collecting device, including the installation seat, the installation seat includes top mount pad, bottom mount pad and fixing base, the one end of top mount pad is provided with two first fixed stabilizer blades, first fixed stabilizer blade is in symmetry sets up on the top mount pad to extend to the both sides of CPU on the equipment mainboard, the bottom mount pad with the one end of top mount pad syntropy is provided with many second fixed stabilizer blades, the second fixed stabilizer blade is in evenly set up on the bottom mount pad, the top mount pad pass through the bolt with bottom mount pad fixed connection, the top mount pad with the bottom mount pad is located the upper and lower both sides of equipment mainboard respectively, first fixed stabilizer blade is kept away from the one end of top mount pad is provided with ascending kink, be provided with the mounting hole on the kink, the one end of fixing base be provided with the erection column that the mounting hole cooperation was used, the erection column cartridge is in the mounting hole, the other end of fixing base pass through the bolt with top mount pad fixed connection, the heat-collecting piece is installed between the fixing base with the top mount pad, the heat-collecting fin is closely laminated with the copper pipe is fixed connection, the heat dissipation fin is in the heat dissipation grid.

Compared with the prior art, the application has the following technical effects:

According to the top mounting seat and the bottom mounting seat of the mounting seat in the main board heat dissipation device in the metal shell communication scheduling equipment, the main board of the equipment can be fixed on the upper side and the lower side of the main board of the equipment, so that the stability of the mounting seat after being mounted is guaranteed, the heat collection sheet is fixedly mounted on the top mounting seat by the fixing seat, namely, the fixing of the heat collection sheet is realized by the sight, the close contact between the heat collection sheet and the CPU is guaranteed, heat can be effectively transferred to the heat collection sheet, the heat dissipation area is increased, meanwhile, the heat can be effectively transferred to the heat dissipation grid by the heat conduction copper pipe connected with the heat collection sheet, the heat is dissipated as soon as possible by the heat dissipation fan, the working temperature of the CPU is reduced, and the working stability of the CPU is guaranteed. The method adopts the mode of holding and installing, does not need to redesign the old terminal equipment board, and saves the cost of design and equipment updating.

Drawings

The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate embodiments of the utility model and together with the description serve to explain the utility model and do not constitute a limitation on the utility model. In the drawings:

Fig. 1 is an assembly schematic diagram of an internal motherboard heat dissipating device according to an embodiment of the present utility model;

FIG. 2 is a side view of the internal motherboard heat sink of FIG. 1;

FIG. 3 is a schematic view of the bottom mounting block of FIG. 1;

fig. 4 is a schematic view of the top mount of fig. 1.

Reference numerals:

10-top mount pad, 11-first fixed stabilizer blade, 12-kink, 13-spacing hole, 20-bottom mount pad, 21-second fixed stabilizer blade, 22-stopper, 30-fixing base, 31-extension, 32-erection column, 40-heat collecting piece, 50-heat conduction copper pipe, 60-heat dissipation net, 70-radiator fan.

Detailed Description

In order to make the technical problems, technical schemes and beneficial effects to be solved more clear, the utility model is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.

It will be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present utility model, the meaning of "a plurality" is two or more, unless explicitly defined otherwise. The meaning of "a number" is one or more than one unless specifically defined otherwise.

In the description of the present utility model, it should be understood that the directions or positional relationships indicated by the terms "upper", "lower", "front", "rear", "left", "right", etc., are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present utility model.

In the description of the present utility model, unless explicitly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected, mechanically connected, electrically connected, directly connected, indirectly connected via an intervening medium, or in communication between two elements or in an interaction relationship between two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

As shown in fig. 1 to 3, the heat dissipating device for the main board in the metal shell communication scheduling device provided by the utility model comprises a mounting seat, a heat collecting plate 40, a heat conducting copper pipe 50, a heat dissipating grid 60 and a heat dissipating fan 70;

The mount pad includes top mount pad 10, bottom mount pad 20 and fixing base 30, the one end of top mount pad 10 is provided with two first fixed stabilizer blades 11, first fixed stabilizer blades 11 set up on top mount pad 10 symmetry, and extend to the both sides of CPU on the equipment mainboard, the one end of bottom mount pad 20 and top mount pad 10 syntropy is provided with many second fixed stabilizer blades 21, the second fixed stabilizer blades 21 evenly set up on bottom mount pad 20, top mount pad 10 passes through bolt and bottom mount pad 20 fixed connection, top mount pad 10 and bottom mount pad 20 are located the upper and lower both sides of equipment mainboard respectively, the one end that top mount pad 10 was kept away from to first fixed stabilizer blade 11 is provided with ascending kink 12, be provided with the mounting hole on the kink 12, the one end of fixing base 30 is provided with the erection column 32 that uses with the mounting hole cooperation, erection column 32 cartridge is in the mounting hole, the other end of fixing base 30 passes through bolt and top mount pad 10 fixed connection, heat collecting piece 40 installs between fixing base 30 and top mount pad 10, heat collecting piece 40 closely laminates with the CPU, heat collecting piece 40 passes through heat conduction 50 and heat dissipation grid 60, heat dissipation grid 70 fixed mounting on heat dissipation grid 60.

As an embodiment, the heat dissipation grid 60 includes a heat dissipation tube 61 and a plurality of heat dissipation fins 62, the heat dissipation fins 62 are arranged in parallel, two sides of the heat dissipation tube 61 are arranged perpendicular to the heat dissipation fins 62, the number of the heat conduction copper tubes 50 is two, two ends of the heat conduction copper tubes 50 are fixedly connected with and communicated with two ends of the heat collection fin 40 and the heat dissipation tube 61 respectively, the heat dissipation fan 70 is fixedly connected with the heat dissipation fins 62 through a mounting frame, and the heat dissipation fan 70 is externally connected with a power supply.

The heat dissipation grid 60 composed of the heat dissipation tube 61 and the plurality of heat dissipation fins 62 can dissipate heat transferred by the heat collection fins 40 through the heat conduction copper tubes 50, and meanwhile, the heat dissipation can be better achieved by matching the heat dissipation fans 70.

As an embodiment, the fixing base 30 has a U-shaped structure, the mounting post 32 is disposed at the extension end 31 of the fixing base 30, the fixing end of the mounting base is fixedly connected with the top mounting base 10, and the mounting post 32 is disposed at the end of the extension end 31. Further, the extension end 31 of the fixing base 30 is an arc structure protruding upwards.

The fixing base 30 with the U-shaped structure can fix the heat collecting plate 40 at two sides of the heat collecting plate 40, so that shielding to the back surface of the heat collecting plate 40 is reduced as much as possible, and the heat dissipation function of the heat collecting plate 40 is guaranteed. Because the heat collecting plate 40 has a certain thickness, the extension end 31 is arranged to be an upward protruding arc structure, and the heat collecting plate 40 can be better held and fixed.

As an embodiment, the lower surface of the top mount 10 is a two-stage stepped structure, and the height of the steps is the same as the thickness of the device motherboard.

Through the second grade ladder structure that sets up, reserved sufficient installation space for the equipment mainboard between top mount pad 10 and bottom mount pad 20, guaranteed the stability of mount pad after the installation, also avoided causing the damage to the equipment mainboard.

As an alternative, the second fixing leg 21 is provided with a foam pad on the side facing the main board of the device.

The foam pad reduces the damage of the bottom mounting plate to the pins on the back of the equipment main board.

As an implementation manner, a limiting block 22 is arranged on one side, facing the top mounting seat 10, of the bottom mounting seat 20, and limiting holes 13 matched with the limiting block 22 are formed in the top mounting seat 10 and the fixing seat 30.

The setting of stopper 22 and spacing hole 13 has played the effect of direction for the installation of top mount pad 10 and fixing base 30, can be better fix a position the screw hole on top mount pad 10, fixing base 30 and the bottom mount pad 20.

As an embodiment, the heat dissipating device further includes a water cooling head fixedly connected with the top mount 10, a water conduit, and a water cooling tube fixedly connected with the heat sink 62, the water cooling tube being disposed parallel to the heat dissipating tube 61, the water cooling head being communicated with the water cooling tube through the water conduit.

Through the water-cooled head, the water channel pipe and the water-cooled pipe which are arranged, the heat dissipation performance of the main board heat dissipation device is further improved.

The foregoing is merely illustrative embodiments of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art can easily think about variations or substitutions within the technical scope of the present utility model, and the utility model should be covered. Therefore, the protection scope of the present utility model shall be subject to the protection scope of the claims.

Claims

1. A heat dissipation device for a mainboard inside a metal shell communication dispatching device, characterized in that it comprises a mounting seat, a heat collecting sheet, a heat conducting copper tube, a heat dissipation grid and a heat dissipation fan;

The mounting seat comprises a top mounting seat, a bottom mounting seat and a fixing seat, one end of the top mounting seat is provided with two first fixing legs, the first fixing legs are symmetrically arranged on the top mounting seat and extend to both sides of the CPU on the device motherboard, the bottom mounting seat is provided with a plurality of second fixing legs at one end in the same direction as the top mounting seat, the second fixing legs are evenly arranged on the bottom mounting seat, the top mounting seat is fixedly connected to the bottom mounting seat by bolts, the top mounting seat and the bottom mounting seat are respectively located at the upper and lower sides of the device motherboard, an upward bending portion is provided at one end of the first fixing leg away from the top mounting seat, a mounting hole is provided on the bending portion, one end of the fixing seat is provided with a mounting column used in conjunction with the mounting hole, the mounting column is inserted into the mounting hole, the other end of the fixing seat is fixedly connected to the top mounting seat by bolts, the heat collecting sheet is installed between the fixing seat and the top mounting seat, the heat collecting sheet is tightly fitted with the CPU, the heat collecting sheet is connected to the heat dissipation grid through the heat-conducting copper tube, and the heat dissipation fan is fixedly installed on the heat dissipation grid.

2. According to the internal mainboard heat dissipation device of the metal shell communication dispatching equipment according to claim 1, it is characterized in that the heat dissipation grid includes a heat pipe and a plurality of heat sinks, the plurality of heat sinks are arranged in parallel, the two side edges of the heat pipe are arranged perpendicular to the heat sink, there are two heat-conducting copper pipes, the two ends of the heat-conducting copper pipes are respectively fixedly connected to the heat collecting plate and the two ends of the heat pipe, and are connected, the heat dissipation fan is fixedly connected to the heat sink through a mounting frame, and the heat dissipation fan is externally connected to a power supply.

3. According to the internal motherboard heat dissipation device of the metal shell communication dispatching equipment according to claim 1, it is characterized in that the fixing base is a U-shaped structure, the mounting column is arranged at the extended end of the fixing base, the fixed end of the mounting base is fixedly connected to the top mounting base, and the mounting column is arranged at the end of the extended end.

4. The internal mainboard heat dissipation device of a metal shell communication dispatching device according to claim 3 is characterized in that the extended end of the fixing seat is an arc-shaped structure protruding upward.

5. The internal motherboard heat dissipation device of a metal shell communication dispatching device according to claim 1 is characterized in that the lower surface of the top mounting seat is a two-level stepped structure, and the height of the steps is the same as the thickness of the device motherboard.

6. The internal motherboard heat dissipation device of a metal shell communication dispatching device according to claim 1, characterized in that a foam pad is provided on the side of the second fixed leg facing the device motherboard.

7. The internal mainboard heat dissipation device of a metal shell communication dispatching device according to claim 1 is characterized in that a limiting block is provided on the side of the bottom mounting seat facing the top mounting seat, and limiting holes matching the limiting block are provided on the top mounting seat and the fixed seat.

8. According to claim 2, the internal motherboard heat dissipation device of the metal shell communication dispatching equipment is characterized in that the heat dissipation device also includes a water cooling head, a water conduit and a water cooling pipe, the water cooling head is fixedly connected to the top mounting seat, the water cooling pipe is fixedly connected to the heat sink, the water cooling pipe is arranged in parallel with the heat dissipation pipe, and the water cooling head is connected to the water cooling pipe through the water conduit.