CN212086779U - Electric appliance box and air conditioner that radiating efficiency is high - Google Patents
Electric appliance box and air conditioner that radiating efficiency is high Download PDFInfo
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- CN212086779U CN212086779U CN202020767669.4U CN202020767669U CN212086779U CN 212086779 U CN212086779 U CN 212086779U CN 202020767669 U CN202020767669 U CN 202020767669U CN 212086779 U CN212086779 U CN 212086779U
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- heat dissipation
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- dissipation mechanism
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Abstract
The utility model provides an electrical apparatus box and air conditioner that radiating efficiency is high. The electrical box comprises a shell; the two main boards are arranged inside the shell, each main board is provided with a mounting surface and a back surface which are opposite, and each mounting surface is provided with a heating element; the heat dissipation mechanism is arranged inside the shell; the two main boards are parallel to each other, and the two back faces are arranged oppositely. The utility model provides an electrical apparatus box and air conditioner that radiating efficiency is high, with two mainboard parallel arrangement, two backs set up in opposite directions, thereby make all components and parts that generate heat all be in the week side of two mainboards, heat dissipation mechanism can carry out the contact heat transfer with all components and parts that generate heat simultaneously, overcome the transmission path length that needs cause through the air transfer heat among the prior art, the problem that radiating efficiency is low, and with set up the profile modeling structure in the heat dissipation mechanism, increase the area of contact between components and parts and the heat dissipation mechanism that generate heat, thereby further increase the radiating effect.
Description
Technical Field
The utility model relates to an electronic components heat dissipation technical field, especially an electrical apparatus box and air conditioner that radiating efficiency is high.
Background
Along with the high-speed development of power electronic technology, the quantity of electronic components is more and more, generally, electronic components are respectively arranged on two main boards according to functions or types, so as to avoid the problems that the quantity of electronic components on a single main board is too large, the heat flux density is high, and the heat productivity of electronic equipment is large.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problem of poor heat dissipation effect of an electric appliance box in the prior art, the electric appliance box and the air conditioner are high in heat dissipation efficiency, and all electronic components can directly contact with a heat dissipation mechanism to dissipate heat by oppositely arranging the electronic components of the two mainboards.
An electrical box comprising:
a housing;
the two main boards are arranged inside the shell, each main board is provided with a mounting surface and a back surface which are opposite, and each mounting surface is provided with a heating element;
the heat dissipation mechanism is arranged inside the shell;
the two main boards are parallel to each other, the two back faces are arranged oppositely, part of the heat dissipation mechanism is in contact with one mounting face, and part of the heat dissipation mechanism is in contact with the other mounting face.
The heat dissipation mechanism is provided with a profiling structure corresponding to the heating elements one by one, and the heating elements are arranged in the corresponding profiling structures.
The heat dissipation mechanism comprises a first heat dissipation structure and a second heat dissipation structure, the first heat dissipation structure is in contact with one of the installation surfaces, the second heat dissipation structure is in contact with the other installation surface, and one end of the first heat dissipation structure is communicated with one end of the second heat dissipation structure.
The first heat dissipation structure comprises a plate-shaped body and a cooling pipeline, the plate-shaped body is directly or indirectly adhered to the corresponding mounting surface, the cooling pipeline is arranged in the plate-shaped body, and two ends of the cooling pipeline penetrate through the plate-shaped body and the shell to be communicated with the outside.
The second heat dissipation structure is the same as the first heat dissipation structure in structure, and the cooling pipeline of the second heat dissipation structure is communicated with the cooling pipeline of the first heat dissipation structure.
The section of the heat dissipation mechanism is U-shaped.
The heat dissipation mechanism is directly or indirectly adhered to the mounting surface.
Part of the heating components are directly attached to the heat dissipation mechanism, and the rest of the heating components are indirectly attached to the heat dissipation mechanism through the heat transfer element.
The heat transfer member includes a heat conductive paste.
Heating element includes IPM module, electric capacity and choke, IPM module with the electric capacity sets up in one on the installation face, the choke sets up in another on the installation face, IPM module with the electric capacity with first heat radiation structure bonding sets up, the choke pass through the pouring sealant fixed set up in on the second heat radiation structure.
The first heat dissipation structure is provided with a first plane and a second plane, the distance from the first plane to the installation surface is larger than the distance from the second plane to the installation surface, the IPM module is in contact with the first plane for heat conduction, and the capacitor is in contact with the second plane for heat conduction.
The material of the plate-like body comprises aluminum and the material of the cooling line comprises copper.
The refrigerant flowing in the cooling pipeline comprises water or a refrigerant.
An air conditioner comprises the electrical box.
The utility model provides an electrical apparatus box and air conditioner that radiating efficiency is high, with two mainboard parallel arrangement, two backs set up in opposite directions, thereby make all components and parts that generate heat all be in the week side of two mainboards, heat dissipation mechanism can carry out the contact heat transfer with all components and parts that generate heat simultaneously, overcome the transmission path length that needs cause through the air transfer heat among the prior art, the problem that radiating efficiency is low, and with set up the profile modeling structure in the heat dissipation mechanism, increase the area of contact between components and parts and the heat dissipation mechanism that generate heat, thereby further increase the radiating effect.
Drawings
Fig. 1 is a schematic structural diagram of an electrical box and an electrical box of an embodiment of an air conditioner with high heat dissipation efficiency according to the present invention;
fig. 2 is a cross-sectional view of an electrical box and an electrical box of an embodiment of an air conditioner with high heat dissipation efficiency provided by the present invention;
in the figure:
2. a main board; 21. a heat generating element; 3. a heat dissipation mechanism; 4. a first heat dissipation structure; 5. a second heat dissipation structure; 31. a plate-like body; 32. a cooling pipeline; 41. a first plane; 42. a second plane.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention.
The electrical box shown in fig. 1 and 2 comprises: an electrical box comprising: the shell is used for accommodating electronic components and plays a certain role in isolating and preventing dust, wherein the electronic components generate heat to form heating components; the two main boards 2 are arranged inside the shell, each main board 2 is provided with a mounting surface and a back surface which are opposite to each other, each mounting surface is provided with a heating element 21, and all the heating elements 21 are respectively arranged on the mounting surfaces of the two main boards 2 according to the conditions of type, function and the like; the heat dissipation mechanism 3 is arranged in the shell and used for dissipating heat of the interior of the electrical box and the electronic components; the two main boards 2 are parallel to each other, and the two back surfaces are arranged oppositely, so that the mounting surface of one main board 2 faces a direction away from the other main board 2, that is, the two mounting surfaces face the inner surface of the housing, all the heating elements 21 are exposed between the mounting surface and the inner surface of the housing, the heat dissipation mechanism 3 is divided into two parts, part of the heat dissipation mechanism 3 is in contact with one mounting surface, and part of the heat dissipation mechanism 3 is in contact with the other mounting surface, wherein the heat dissipation mechanism 3 can be arranged in a U shape and the like according to the shape of the main board 2.
The heat dissipation mechanism 3 is provided with a profiling structure corresponding to the heat generating components 21 one by one, the heat generating components 21 are arranged in the corresponding profiling structures, the contact area between the heat generating components 21 and the heat dissipation mechanism 3 is increased, and therefore the heat dissipation effect is increased, each part of the heat dissipation mechanism 3 is particularly arranged according to the shape of the heat generating components 21 on the corresponding mounting surface, and therefore the heat generating components 21 are in contact with the heat dissipation mechanism 3 to the maximum extent, and therefore the heat dissipation effect is increased.
The heat dissipation mechanism 3 comprises a first heat dissipation structure 4 and a second heat dissipation structure 5, the first heat dissipation structure 4 is arranged in contact with one installation surface, the second heat dissipation structure 5 is arranged in contact with the other installation surface, and one end of the first heat dissipation structure 4 is communicated with one end of the second heat dissipation structure 5, namely the first heat dissipation structure 4 and the second heat dissipation structure 5 jointly obtain cold energy from the same cold source, and the second heat dissipation structure 5 can utilize the connection relation between the first heat dissipation structure 4 and the second heat dissipation structure 5 to enable the second heat dissipation structure 5 to have the effect of avoiding the trend that the second heat dissipation structure 4 is far away from the corresponding installation surface, and similarly, the first heat dissipation structure 4 also has the same effect on the second heat dissipation structure 5. Thereby ensuring the installation reliability between the heat dissipation mechanism 3 and the two main boards 2.
The first heat dissipation structure 4 includes a plate-shaped body 31 and a cooling pipeline 32, the plate-shaped body 31 is directly or indirectly adhered to the corresponding mounting surface, the cooling pipeline 32 is disposed in the plate-shaped body 31, two ends of the cooling pipeline 32 penetrate through the plate-shaped body 31 and the housing to communicate with the outside, and a refrigerant in the cooling pipeline 32 directly exchanges heat with the heat generating component 21 through the plate-shaped body 31, so that a problem of low heat dissipation efficiency caused by heat transfer by air in the prior art is solved, and a heat dissipation effect is increased.
The second heat dissipation structure 5 has the same structure as the first heat dissipation structure 4, and the cooling pipeline 32 of the second heat dissipation structure 5 is communicated with the cooling pipeline 32 of the first heat dissipation structure 4, that is, the heat dissipation mechanism 3 can obtain the refrigerant from the same refrigerant source, and distribute and recover the refrigerant at the communication position between the first heat dissipation structure 4 and the second heat dissipation structure 5, thereby ensuring reliable heat dissipation of the first heat dissipation structure 4 and the second heat dissipation structure 5.
The section of the heat dissipation mechanism 3 is U-shaped, that is, the U-shaped heat dissipation mechanism 3 is buckled on the two main boards 2.
The heat dissipation mechanism 3 is directly or indirectly adhered to the installation surface, so that the heat dissipation mechanism 3 and the two main boards 2 are reliably fixed, the two main boards 2 are oppositely arranged on the back surface in the installation process, and then the heat dissipation mechanism 3 is sleeved in one end of the main board 2 and adhered.
Part of the heating components 21 are directly jointed with the heat dissipation mechanism 3, the rest of the heating components 21 are indirectly jointed with the heat dissipation mechanism 3 through heat transfer elements, the heating components 21 with regular shapes are directly jointed with the heat dissipation mechanism 3, and the heating components 21 with irregular shapes conduct heat through the heat transfer elements, the heat dissipation effect of the irregular heating component 21 can be increased without changing the shapes of the heating component 21 and the heat dissipation mechanism 3, and similarly, the first heat dissipation structure 4 is in direct contact with part of the heating component 21 on the corresponding mounting surface, the second heat dissipation structure 5 is indirectly bonded to the remaining heating component 21 on the mounting surface via a heat transfer member, and is directly in contact with the corresponding heating component 21 on the mounting surface, and is indirectly bonded to the remaining heating component 21 on the mounting surface via a heat transfer member.
The heat transfer member includes a heat conductive paste.
The first heat dissipation structure 4 has a first plane 41 and a second plane 42, the distance from the first plane 41 to the installation surface is greater than the distance from the second plane 42 to the installation surface, and since the height of the IPM module on the same installation surface is less than the height of the capacitor, the IPM module is in contact with the first plane 41 to conduct heat, and the capacitor is in contact with the second plane 42 to conduct heat, that is, the first plane 41 and the second plane 42 are used to form the profiling structure.
The material of the plate-like body 31 comprises aluminum and the material of the cooling line 32 comprises copper.
The refrigerant flowing through the cooling line 32 includes water or refrigerant.
An air conditioner comprises the electrical box.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (14)
1. An electrical box characterized in that: the method comprises the following steps:
a housing;
the two main boards (2) are arranged inside the shell, each main board (2) is provided with a mounting surface and a back surface which are opposite, and each mounting surface is provided with a heating element (21);
the heat dissipation mechanism (3) is arranged in the shell;
the two main boards (2) are parallel to each other, the back faces of the two main boards are arranged oppositely, part of the heat dissipation mechanisms (3) are in contact with one mounting face, and part of the heat dissipation mechanisms (3) are in contact with the other mounting face.
2. The appliance cartridge of claim 1, wherein: the heat dissipation mechanism (3) is provided with a profiling structure corresponding to the heating components (21) one by one, and the heating components (21) are arranged in the corresponding profiling structure.
3. The appliance cartridge of claim 1, wherein: the heat dissipation mechanism (3) comprises a first heat dissipation structure (4) and a second heat dissipation structure (5), the first heat dissipation structure (4) is in contact with one installation surface, the second heat dissipation structure (5) is in contact with the other installation surface, and one end of the first heat dissipation structure (4) is communicated with one end of the second heat dissipation structure (5).
4. The appliance cartridge of claim 3, wherein: the first heat dissipation structure (4) comprises a plate-shaped body (31) and a cooling pipeline (32), the plate-shaped body (31) is directly or indirectly adhered to the corresponding mounting surface, the cooling pipeline (32) is arranged in the plate-shaped body (31), and two ends of the cooling pipeline (32) penetrate through the plate-shaped body (31) and the shell to be communicated with the outside.
5. The appliance cartridge of claim 4, wherein: the second heat dissipation structure (5) is identical to the first heat dissipation structure (4) in structure, and the cooling pipeline (32) of the second heat dissipation structure (5) is communicated with the cooling pipeline (32) of the first heat dissipation structure (4).
6. The appliance cartridge of claim 3, wherein: the section of the heat dissipation mechanism (3) is U-shaped.
7. The appliance cartridge of claim 1, wherein: the heat dissipation mechanism (3) is directly or indirectly adhered to the mounting surface.
8. The appliance cartridge of claim 1, wherein: part of the heating element (21) is directly attached to the heat dissipation mechanism (3), and the rest of the heating element (21) is indirectly attached to the heat dissipation mechanism (3) through a heat transfer element.
9. The appliance cartridge of claim 8, wherein: the heat transfer member includes a heat conductive paste.
10. The appliance cartridge of claim 3, wherein: heating element (21) includes IPM module, electric capacity and choke, IPM module with the electric capacity sets up in one on the installation face, the choke sets up in another on the installation face, IPM module with the electric capacity with first heat radiation structure (4) bonding sets up, the choke pass through the pouring sealant fixed set up in on second heat radiation structure (5).
11. The appliance cartridge of claim 10, wherein: the first heat dissipation structure (4) is provided with a first plane (41) and a second plane (42), the distance from the first plane (41) to the installation surface is larger than the distance from the second plane (42) to the installation surface, the IPM module is in contact with the first plane (41) for heat conduction, and the capacitor is in contact with the second plane (42) for heat conduction.
12. The appliance cartridge of claim 4, wherein: the material of the plate-shaped body (31) comprises aluminum and the material of the cooling line (32) comprises copper.
13. The appliance cartridge of claim 4, wherein: the refrigerant flowing in the cooling pipeline (32) comprises water or refrigerant.
14. An air conditioner, characterized in that: an appliance box comprising any of claims 1 to 13.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020767669.4U CN212086779U (en) | 2020-05-11 | 2020-05-11 | Electric appliance box and air conditioner that radiating efficiency is high |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020767669.4U CN212086779U (en) | 2020-05-11 | 2020-05-11 | Electric appliance box and air conditioner that radiating efficiency is high |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212086779U true CN212086779U (en) | 2020-12-04 |
Family
ID=73567067
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020767669.4U Active CN212086779U (en) | 2020-05-11 | 2020-05-11 | Electric appliance box and air conditioner that radiating efficiency is high |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212086779U (en) |
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2020
- 2020-05-11 CN CN202020767669.4U patent/CN212086779U/en active Active
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