CN215121756U - Power device heat radiation structure and electrical equipment - Google Patents
Power device heat radiation structure and electrical equipment Download PDFInfo
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- CN215121756U CN215121756U CN202121714855.2U CN202121714855U CN215121756U CN 215121756 U CN215121756 U CN 215121756U CN 202121714855 U CN202121714855 U CN 202121714855U CN 215121756 U CN215121756 U CN 215121756U
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Abstract
The utility model discloses a power device heat radiation structure, electrical equipment, power device heat radiation structure include quick-witted case and power device, and power device's power device main part is overhanging in quick-witted case, and power device main part and quick-witted case sealing connection. In the heat dissipation structure of the power device, the power device main body extends out of the case, so that the power device main body directly dissipates heat outside the case, namely the power device main body directly dissipates heat outwards; meanwhile, because a radiator, a gasket and a heat conduction interface material are not required to be arranged, parts are reduced, the cost is reduced, the production process is simplified, and the production efficiency is improved.
Description
Technical Field
The utility model relates to a power device heat dissipation technical field, more specifically say, relate to a power device heat radiation structure, electrical equipment.
Background
In an electrical apparatus, a power device is a main heating element, and for example, the power device is an IGBT, a diode, a MOS transistor, or the like. In order to ensure the normal operation of the power device, the heat dissipation is required.
At present, a pin of a power device is welded on a PCB, a pressure plate compresses the power device and a gasket on a radiator through a screw, the gasket plays insulating and heat conducting roles between the power device and the radiator, and a sealing strip is arranged between the radiator and a main box body so as to realize the sealing inside the main box body. The heat generated by the power device is transmitted to the air outside the main box body through the gasket and the radiator in sequence. To reduce the contact resistance, a thermally conductive interface material is typically applied to both sides of the gasket. However, the heat dissipation structure still has a large thermal resistance, resulting in low heat dissipation efficiency and poor heat dissipation effect.
At present, an insulating power device can be selected, the heat of the power device is transferred to the air through a radiator, and in order to reduce contact thermal resistance, a heat conduction interface material is coated between the radiator and the power device. However, the heat dissipation structure still has a large thermal resistance, resulting in low heat dissipation efficiency and poor heat dissipation effect.
In addition, the heat dissipation structure needs to be provided with a radiator, a gasket and a heat conduction interface material, so that the cost of the whole structure is high; the radiator needs to be installed and the heat-conducting interface material needs to be coated, so that the production process is complicated and the production efficiency is low.
In summary, how to dissipate heat of a power device to improve heat dissipation efficiency and heat dissipation effect is a problem to be solved urgently by those skilled in the art.
SUMMERY OF THE UTILITY MODEL
In view of this, the present invention provides a heat dissipation structure for power device to improve heat dissipation efficiency and heat dissipation effect. Another object of the present invention is to provide an electrical apparatus including the above heat dissipation structure for power device.
In order to achieve the above object, the utility model provides a following technical scheme:
a heat dissipation structure of a power device comprises a case and the power device, wherein a power device main body of the power device extends out of the case, and the power device main body is connected with the case in a sealing mode.
Optionally, the inner end of the power device main body located in the chassis is provided with a flange, and the flange is connected with the chassis in a sealing manner.
Optionally, the flange is one and annular, and the flange is sleeved on the power device main body;
or, the number of the flanges is at least two, and the flanges are distributed along the circumferential direction of the power device main body in sequence.
Optionally, the power device heat dissipation structure further includes a circuit board, the connection portion of the power device is electrically connected to the circuit board, the connection portion is disposed on the inner end surface of the power device main body, and the inner end surface of the power device main body is an end surface of the power device main body located in the chassis.
Optionally, the connection portion is a pin or a bump.
Optionally, the circuit board is fixed to the chassis.
Optionally, the circuit board is located on an inner end surface of the power device main body, and the circuit board presses the power device to the chassis through a fixed connection between the circuit board and the chassis.
Optionally, the chassis is provided with a circuit board support portion, and the circuit board is fixed to the circuit board support portion.
Optionally, the circuit board supporting parts are supporting columns, and the number of the supporting columns is at least two;
and/or the circuit board is detachably fixed on the circuit board supporting part.
Optionally, the power device heat dissipation structure further includes a pressing plate, the pressing plate is located between the power device main body and the circuit board, the pressing plate is located on the inner end face of the power device main body, and the pressing plate is fixedly connected to the chassis through the pressing plate to press the power device to the chassis.
Optionally, the pressing plate is provided with a first yielding hole for the connecting part to pass through.
Optionally, a gap is provided between the pressure plate and the circuit board;
the pressing plate is fixed on the case through the pressing plate fastening piece, and the circuit board is provided with a second abdicating hole for the pressing plate fastening piece to pass through.
Optionally, the power device heat dissipation structure further includes a pressing plate, the pressing plate is located on an inner end surface of the power device main body, the pressing plate is fixedly connected to the chassis through the pressing plate to press the power device to the chassis, and the inner end surface of the power device main body is an end surface of the power device main body located in the chassis.
Optionally, the chassis is provided with a pressing plate supporting portion, and the pressing plate is fixed to the pressing plate supporting portion.
Optionally, the pressure plate supporting parts are supporting columns, and the number of the supporting columns is at least two;
and/or the pressing plate is detachably fixed on the pressing plate supporting part.
Optionally, the power device is a package, and the outer surface of the power device main body 1 is coated with a waterproof layer and/or a weather-resistant coating.
Optionally, the power device heat dissipation structure further includes a fan configured to perform forced convection heat transfer between a portion of the power device main body located outside the chassis and the cooling gas.
Optionally, the power device heat dissipation structure further includes a container for accommodating a cooling medium, and a portion of the power device main body located outside the chassis is located in the container.
Optionally, the power device heat dissipation structure further includes a forced convection driver for performing forced convection heat exchange between the power device main body and the cooling medium.
Optionally, if the cooling medium is a gas, the forced convection driver is a fan;
if the cooling medium is a liquid, the forced convection driver is a delivery pump.
Based on the power device heat radiation structure that the aforesaid provided, the utility model also provides an electrical equipment, this electrical equipment include power device heat radiation structure, power device heat radiation structure is above-mentioned arbitrary power device heat radiation structure.
Compared with the prior art, the heat dissipation of the power device does not need to pass through a radiator, a gasket and a heat conduction interface material, so that the thermal resistance is reduced, and the heat dissipation efficiency and the heat dissipation effect are improved; meanwhile, because a radiator, a gasket and a heat conduction interface material are not required to be arranged, parts are reduced, the cost is reduced, the production process is simplified, and the production efficiency is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
Fig. 1 is a schematic partial structural view of a heat dissipation structure of a power device according to an embodiment of the present invention;
fig. 2 is a front view of a heat dissipation structure of a power device according to a first embodiment of the present invention;
fig. 3 is a bottom view of a heat dissipation structure of a power device according to a first embodiment of the present invention;
FIG. 4 is a sectional view taken along line A-A of FIG. 2;
fig. 5 is a schematic partial structural view of a heat dissipation structure of a power device according to a second embodiment of the present invention;
fig. 6 is a front view of a heat dissipation structure of a power device according to a second embodiment of the present invention;
FIG. 7 is a sectional view taken along line B-B of FIG. 6;
fig. 8 is a schematic structural diagram of a part of a heat dissipation structure of a power device according to a third embodiment of the present invention;
fig. 9 is a front view of a heat dissipation structure of a power device according to a third embodiment of the present invention;
fig. 10 is a cross-sectional view taken along line C-C of fig. 9.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
As shown in fig. 1-10, the embodiment of the present invention provides a heat dissipation structure for a power device, which includes a chassis 1 and a power device 6, wherein the power device 6 mainly includes a power device main body 61 and a connecting portion 62 disposed on the power device main body 61, and the connecting portion 62 is used for electrically connecting with a circuit board 2.
In order to improve the heat dissipation efficiency and the heat dissipation effect, the power device main body 61 extends out of the case 1, and the power device main body 61 is hermetically connected with the case 1.
Specifically, the case 1 is provided with a through hole from which the power device main body 61 protrudes out of the case 1.
In the heat dissipation structure of the power device provided in the above embodiment, the power device main body 61 extends outside the chassis 1, so that the power device main body 61 directly radiates outside the chassis 1, that is, the power device main body 61 directly radiates outside, compared with the prior art, the heat dissipation of the power device 6 does not need to pass through a radiator, a gasket and a heat conduction interface material, thereby reducing the thermal resistance, and improving the heat dissipation efficiency and the heat dissipation effect; meanwhile, because a radiator, a gasket and a heat conduction interface material are not required to be arranged, parts are reduced, the cost is reduced, the production process is simplified, and the production efficiency is improved.
The power device main body 61 is hermetically connected to the chassis 1 to protect the protection requirement of the chassis 1, for example, the protection level of the entire heat dissipation structure of the power device is IP65 or above. Specifically, the power device main body 61 and the case 1 are hermetically connected by a sealing ring 7, a sealant or other sealing structure, which is not limited in this embodiment.
For sealing, the inner end of the power device main body 61 located in the case 1 is provided with a flange 63, and the flange 63 is hermetically connected with the case 1. It is understood that the inner end of the power device body 61 is the end of the power device body 61 located in the case 1.
The sealing structure between the flange 63 and the enclosure 1 is selected according to actual needs, for example, the flange 63 is connected to the enclosure 1 by a sealing ring 7 in a sealing manner, or the flange 63 is sealed to the enclosure 1 by a sealant, and the like, which is not limited in this embodiment.
In practical application, the power device 6 may not be provided with the flange 63, that is, the power device body 61 is hermetically connected to the chassis at the through hole by a sealing member, or the power device body 61 is hermetically connected to the chassis at the through hole by a sealant, and the like, which is not limited in this embodiment.
The flange 63 is arranged on the power device 6, so that when the flange 63 cannot move to the through hole continuously, the power device 6 is installed in place, that is, the power device 6 is positioned by the cooperation of the flange 63 and the case 1, the power device 6 is convenient to install, and the length of the power device body 61 extending out of the case 1 is also convenient to ensure.
The flange 63 may be formed in a ring shape, and in this case, the flange 63 may be one. The specific shape of the flange 63 is selected according to actual needs, and for example, the flange 63 has a circular or square ring shape.
In practical applications, at least two of the flanges 63 may be selected and sequentially distributed along the circumferential direction of the power device body 61. In this case, the flange 63 may have other shapes such as an arc shape or a rectangular shape, which is not limited in this embodiment. It is understood that the power device body 61 may have a rectangular parallelepiped shape, a cylindrical shape, or the like. The circumferential direction of the power device body 61 is the distribution direction of the side wall between the inner end and the outer end of the power device body 61. The outer end of the power device body 61 is the end of the power device body 61 outside the case 1.
In the practical application process, the power device heat dissipation structure may further include a circuit board 2, the connection portion 62 of the power device 6 is electrically connected to the circuit board 2, the connection portion 62 is disposed on the inner end surface of the power device main body 61, and the inner end surface of the power device main body 61 is an end surface of the power device main body 61 located in the chassis 1.
The specific structure of the connecting portion 62 is selected according to actual needs. As shown in fig. 1 to 7, the connecting portion 62 is a pin, and at this time, the optional circuit board 2 is provided with a via hole through which the pin passes; as shown in fig. 8 to 10, the connecting portion 62 is a protrusion, and in this case, the circuit board 2 may be selected to be provided with a protrusion 22 or a groove electrically connected to the protrusion.
The circuit board 2 is fixed to the housing 1 for stability. At this time, in order to fix the power device 6, the circuit board 2 may be optionally located on the inner end surface of the power device main body 61, and the circuit board 2 presses the power device 6 to the case 1 through its fixed connection with the case 1.
The fixing structure of the circuit board 2 is selected according to actual needs. Specifically, the case 1 is provided with a circuit board support portion 3, and the circuit board 2 is fixed to the circuit board support portion 3. It is understood that the circuit board support portion 3 and the power device main body 61 are located on the same side of the circuit board 2.
The circuit board support part 3 can be a support column, and at least two support columns are provided; the circuit board support part 3 may also be a support ring, and in this case, one support ring is sufficient.
The above-described circuit board 2 is detachably fixed to the circuit board support portion 3 for the purpose of maintenance and repair. For example, the circuit board 2 is detachably fixed to the circuit board support portion 3 by a circuit board fastener 8. The circuit board fastener 8 may be a screw or a bolt, which is not limited in this embodiment.
Of course, the circuit board 2 may be adhered to the circuit board support portion 3, and is not limited to the above embodiment.
In the above power device heat dissipation structure, the power device 6 may be fixed by another method. Specifically, the heat dissipation structure of the power device further includes a pressing plate 4, the pressing plate 4 is located between the power device main body 61 and the circuit board 2, the pressing plate 4 is located on the inner end face of the power device main body 61, and the pressing plate 4 is fixedly connected with the chassis 1 through the pressing plate 4 so as to press the power device 6 to the chassis 1.
The size and shape of the platen 4 are selected according to actual needs. In order to reduce costs, the pressure plate 4 may be chosen smaller than the circuit board 2, so that the pressure plate 4 is also prevented from interfering with the fixing of the circuit board 2.
In order to increase the pressing force of the pressing plate 4, the pressing plate 4 may be optionally provided with first yielding holes 41 for the connection portions 62 to pass through, wherein the connection portions 62 correspond to the first yielding holes 41 one to one, or one first yielding hole 41 is provided for all the connection portions 62 to pass through.
In the practical application process, the pressing plate 4 may also be selected not to have the first yielding hole 41, and at this time, at least two pressing plates 4 may be selected to ensure the pressing effect.
In order to facilitate fixing of the pressing plate 4, it is optional to provide a gap between the pressing plate 4 and the circuit board 2. The size of the gap is selected according to actual needs.
In practical application, the optional pressing plate 4 is fixed to the chassis 1 through the pressing plate fastening member 9, the circuit board 2 has a second relief hole 11 for the pressing plate fastening member 9 to pass through, and the pressing plate fastening member 9 may be a bolt or a screw, and is selected according to practical requirements. Of course, the pressing plate 4 may be bonded to the chassis 1, and is not limited to the above embodiment. The pressing plate 4 can be detachably and fixedly connected with the case 1, and the pressing plate 4 can also be detachably and fixedly connected with the case 1.
The power device heat dissipation structure may also include the pressing plate 4 without the circuit board 2, in this case, the pressing plate 4 is located on the inner end surface of the power device main body, and the pressing plate 4 is fixedly connected with the chassis 1 through the pressing plate 4 so as to press the power device 6 to the chassis 1.
In order to fix the pressing plate 4, the casing 1 is provided with a pressing plate supporting portion 5, and the pressing plate 4 is fixed on the pressing plate supporting portion 5. It is understood that the platen support portion 5 and the power device main body 61 are located on the same side of the circuit board 2.
The pressing plate support portion 5 may be at least two support columns. The platen support portion 5 may be a single support ring.
The platen 4 is detachably fixed to the platen support portion 5 for maintenance and repair. For example, the platen 4 is detachably fixed to the platen support portion 5 by a platen fastener 9. The fastening member 9 for the pressure plate may be a screw or a bolt, but this embodiment is not limited thereto.
Of course, the platen 4 may be bonded to the platen support portion 5, and is not limited to the above embodiment.
In the practical application process, if the power device heat dissipation structure comprises the pressing plate 4, the circuit board 2, the circuit board supporting part 3 and the pressing plate supporting part 5, the pressing plate 4 can be selected to be smaller than the circuit board 2, and the circuit board supporting part 3 is located on the periphery of the pressing plate supporting part 5, so that the pressing plate 4 and the circuit board 2 are prevented from mutually interfering and fixing each other.
In order to improve the protection performance, the power device 6 may be selected as a package. Further, the outer surface of the power device main body 61 is coated with a waterproof layer and/or a weather-resistant coating. In the practical application process, the protection performance of the power device 6 may also be improved by other ways, which is not limited in this embodiment.
In the above power device heat dissipation structure, the power device body 61 directly dissipates heat outside the enclosure 1, for example, the power device body 61 directly performs heat convection with the cooling gas outside the enclosure 1. The convection heat transfer can be natural convection or forced convection. In order to improve the heat dissipation effect, the heat convection can be selected as forced convection. Specifically, the heat dissipation structure of the power device further includes a fan for performing forced convection heat transfer on the portion of the power device main body 61 located outside the chassis 1 and the cooling air.
The specific position and type of the fan are selected according to actual needs, and this embodiment does not limit this.
In practical applications, the power device heat dissipation structure may further include a container for accommodating a cooling medium, and a portion of the power device main body (61) located outside the chassis (1) is located in the container. At this time, the cooling medium may be a gas, a liquid, or a solid. In order to enhance the cooling effect, the cooling medium may be selected to be liquid.
In order to realize the forced convection, the power device heat dissipation structure further includes a forced convection driver for performing forced convection heat exchange between the power device main body 61 and the cooling medium. Specifically, if the cooling medium is a gas, the forced convection driver is a fan; if the cooling medium is a liquid, the forced convection drive is a transfer pump.
In the practical application process, the container can be selected to be in sealing connection with the case 1, so that the installation direction of the power device 6 is not limited, and the application range is wide.
In order to more specifically describe the heat dissipation structure of the power device provided in this embodiment, three embodiments are provided below.
Example one
As shown in fig. 1 to 4, the heat dissipation structure of the power device provided in the first embodiment includes: case 1, power device 6, circuit board 2 and clamp plate 4.
The power device body 61 of the power device 6 is extended from the casing 1, and the power device body 61 is provided with a flange 63, and the flange 63 is hermetically connected to the casing 1 by a seal ring 7. The connecting portion 62 of the power device 6 is a pin, and the pin penetrates through the circuit board 2.
Above-mentioned quick-witted case 1 is provided with clamp plate supporting part 5 and circuit board supporting part 3, clamp plate 4 is fixed in clamp plate supporting part 5 through fastener 9 for the clamp plate in order to compress tightly power device 6 in quick-witted case 1, circuit board 2 is fixed in circuit board supporting part 3 through fastener 8 for the circuit board, clamp plate 4 is located between power device main part 61 and circuit board 2, the clearance has between clamp plate 4 and the circuit board 2, clamp plate 4 is provided with the first hole of stepping down 41 that supplies the pin to pass, circuit board 2 has the second hole of stepping down 11 that supplies fastener 9 for the clamp plate to pass.
Example two
As shown in fig. 5 to 7, the heat dissipation structure of the power device provided in the second embodiment includes: case 1, power device 6 and circuit board 2.
The power device body 61 of the power device 6 is extended from the casing 1, and the power device body 61 is provided with a flange 63, and the flange 63 is hermetically connected to the casing 1 by a seal ring 7. The connecting portion 62 of the power device 6 is a pin, and the pin penetrates through the circuit board 2.
The case 1 is provided with a circuit board support portion 3, and the circuit board 2 is fixed to the circuit board support portion 3 by a circuit board fastening member 8 to press the power device 6 against the case 1.
EXAMPLE III
As shown in fig. 8 to 10, the heat dissipation structure of the power device provided in the third embodiment includes: case 1, power device 6 and circuit board 2.
The power device body 61 of the power device 6 is extended from the casing 1, and the power device body 61 is provided with a flange 63, and the flange 63 is hermetically connected to the casing 1 by a seal ring 7. The connecting portion 62 of the power device 6 is a bump, and the bump is electrically connected to the protruding portion 22 of the circuit board 2.
The case 1 is provided with a circuit board support portion 3, and the circuit board 2 is fixed to the circuit board support portion 3 by a circuit board fastening member 8 to press the power device 6 against the case 1.
Based on the power device heat dissipation structure provided by the above embodiment, this embodiment further provides an electrical apparatus, where the electrical apparatus includes a power device heat dissipation structure, and the power device heat dissipation structure is the power device heat dissipation structure described in the above embodiment.
Since the power device heat dissipation structure provided by the above embodiment has the above technical effects, and the electrical equipment includes the above power device heat dissipation structure, the electrical equipment also has corresponding technical effects, and details are not repeated herein.
The type of the electrical device is selected according to actual needs, for example, the electrical device is an inverter, and the like, which is not limited in this embodiment.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (21)
1. The heat dissipation structure of the power device is characterized by comprising a case (1) and the power device (6), wherein a power device main body (61) of the power device (6) extends out of the case (1), and the power device main body (61) is hermetically connected with the case (1).
2. The power device heat dissipation structure according to claim 1, wherein an inner end of the power device main body (61) located in the case (1) is provided with a flange (63), and the flange (63) is hermetically connected with the case (1).
3. The power device heat dissipation structure of claim 2,
the flange (63) is annular, and the flange (63) is sleeved on the power device main body (61);
or, the number of the flanges (63) is at least two, and the flanges are distributed in sequence along the circumferential direction of the power device main body (61).
4. The power device heat dissipation structure according to claim 1, further comprising a circuit board (2), wherein the connection portion (62) of the power device (6) is electrically connected to the circuit board (2), the connection portion (62) is disposed on an inner end surface of the power device main body (61), and the inner end surface of the power device main body (61) is an end surface of the power device main body (61) located in the case (1).
5. The power device heat dissipation structure according to claim 4, wherein the connection portion (62) is a pin or a bump.
6. The power device heat dissipation structure according to claim 4, wherein the circuit board (2) is fixed to the chassis (1).
7. The power device heat dissipation structure according to claim 6, wherein the circuit board (2) is located on an inner end surface of the power device main body (61), and the circuit board (2) presses the power device (6) against the chassis (1) through its fixed connection with the chassis (1).
8. The power device heat dissipation structure according to claim 6, wherein the chassis (1) is provided with a circuit board support portion (3), and the circuit board (2) is fixed to the circuit board support portion (3).
9. The power device heat dissipation structure according to claim 8, wherein the circuit board support portion (3) is at least two support columns;
and/or the circuit board (2) is detachably fixed on the circuit board supporting part (3).
10. The power device heat dissipation structure according to claim 4, further comprising a pressure plate (4), wherein the pressure plate (4) is located between the power device main body (61) and the circuit board (2), the pressure plate (4) is located on an inner end surface of the power device main body (61), and the pressure plate (4) is fixedly connected with the case (1) through the pressure plate to press the power device (6) to the case (1).
11. The power device heat dissipation structure according to claim 10, wherein the pressure plate (4) is provided with a first relief hole (41) through which the connection portion (62) passes.
12. The power device heat dissipation structure of claim 10,
a gap is arranged between the pressing plate (4) and the circuit board (2);
the pressing plate (4) is fixed on the case (1) through the pressing plate fastening piece (9), and the circuit board (2) is provided with a second yielding hole (11) for the pressing plate fastening piece (9) to penetrate through.
13. The power device heat dissipation structure according to claim 1, further comprising a pressure plate (4), wherein the pressure plate (4) is located on an inner end surface of the power device main body (61), and the pressure plate (4) is fixedly connected with the chassis (1) through the pressure plate to press the power device (6) against the chassis (1), and the inner end surface of the power device main body (61) is an end surface of the power device main body (61) located in the chassis (1).
14. The power device heat dissipation structure according to claim 10 or 13, wherein the chassis (1) is provided with a platen support portion (5), and the platen (4) is fixed to the platen support portion (5).
15. The power device heat dissipation structure according to claim 14, wherein the platen support portion (5) is at least two support columns;
and/or the pressure plate (4) is detachably fixed on the pressure plate supporting part (5).
16. The power device heat dissipation structure according to claim 1, wherein the power device (6) is a package, and an outer surface of the power device main body (61) is coated with a waterproof layer and/or a weather-resistant coating.
17. The power device heat dissipation structure according to claim 1, further comprising a fan for performing forced convection heat exchange between a portion of the power device main body (61) located outside the case (1) and the cooling gas.
18. The power device heat dissipation structure according to claim 1, further comprising a container for containing a cooling medium, wherein a portion of the power device main body (61) located outside the chassis (1) is located inside the container.
19. The power device heat dissipation structure according to claim 18, further comprising a forced convection driver for performing forced convection heat exchange between the power device main body (61) and the cooling medium.
20. The power device heat dissipation structure of claim 19,
if the cooling medium is gas, the forced convection driver is a fan;
if the cooling medium is a liquid, the forced convection driver is a delivery pump.
21. An electrical apparatus comprising a power device heat dissipation structure, wherein the power device heat dissipation structure is the power device heat dissipation structure of any one of claims 1-20.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121714855.2U CN215121756U (en) | 2021-07-26 | 2021-07-26 | Power device heat radiation structure and electrical equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121714855.2U CN215121756U (en) | 2021-07-26 | 2021-07-26 | Power device heat radiation structure and electrical equipment |
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| CN215121756U true CN215121756U (en) | 2021-12-10 |
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| CN202121714855.2U Active CN215121756U (en) | 2021-07-26 | 2021-07-26 | Power device heat radiation structure and electrical equipment |
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