JP2017060292A - Electric power conversion system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electric power conversion system which efficiently radiates heat generated by a control circuit board.SOLUTION: An electric power conversion system includes: power semiconductor modules 10U, 10V, 10W for power conversion; a control circuit board 11 on which a circuit component 43 for driving the power semiconductor modules is mounted; a metallic housing 4 which houses the power semiconductor modules and the control circuit board; and a substrate holding part which holds the control circuit board in the housing with a held surface 11b of the control circuit board and a holding surface 45 of the housing facing each other. The substrate holding part includes: a first heat conduction member 47 disposed between the holding surface and the held surface; and screw fastening means 46 which fixes the control circuit board to the housing by a screw member 48 tightening so that the first heat conduction member closely contacts with the held surface and the holding surface therebetween.SELECTED DRAWING: Figure 6

Description

  The present invention relates to a power conversion device including a power semiconductor module for power conversion, a control circuit board on which circuit components for driving the power semiconductor module are mounted, and a housing for housing these.

As this type of power conversion device, a power conversion device described in Patent Document 1 is known.
In this power converter, a power module, a capacitor module, a metal holding plate, and a control circuit board are housed in a metal housing. Here, the holding plate is fixed to the inside of the housing by a screw member, and the capacitor module and the control circuit board are fixed to the holding plate.

JP 2007-282370 A

In the power conversion device of Patent Document 1, since the circuit components mounted on the control circuit board generate heat, it is desired to dissipate the heat generated in the control circuit board to the outside air by transmitting the heat from the holding plate to the housing. . However, the contact thermal resistance of the joint between the holding plate fixed by the screw member and the housing is large, and the heat generated in the control circuit board is not easily transmitted from the holding plate to the housing.
Therefore, the power converter of Patent Document 1 cannot efficiently dissipate the heat generated in the control circuit board.
The present invention has been made paying attention to the unsolved problems of the above-described conventional example, and an object thereof is to provide a power converter that can efficiently dissipate heat generated in a control circuit board.

  To achieve the above object, a power conversion device according to an aspect of the present invention includes a power semiconductor module for power conversion, a control circuit board on which circuit components for driving the power semiconductor module are mounted, a power semiconductor module, and a control A metal housing that houses the circuit board, and a substrate holding unit that holds the control circuit board inside the housing with the held surface of the control circuit board and the holding surface of the housing facing each other. The control circuit board is fixed to the housing by tightening the screw member so that the heat conducting member interposed between the holding surface and the held surface and the heat conducting member are in close contact between the held surface and the holding surface. Screw fastening means.

  According to the power conversion device of the present invention, the heat conducting member of the board holding part is disposed in close contact with the screw fastening means in a state of being interposed between the holding surface of the housing and the held surface of the control circuit board. Therefore, the contact thermal resistance among the control circuit board, the heat conducting member, and the casing can be reduced, and the heat generated in the control circuit board is easily transmitted to the casing. Therefore, the heat generated in the control circuit board can be efficiently radiated.

It is a perspective view showing the power converter of a 1st embodiment concerning the present invention. It is sectional drawing of the power converter device of 1st Embodiment which follows the plane A in FIG. It is sectional drawing of the power converter device of 1st Embodiment which follows the plane B orthogonal to the plane A in FIG. It is an expansion | deployment perspective view which shows the structural member of the power converter device of 1st Embodiment. It is a figure which shows the structure of the periphery of the opening part of the housing | casing by which the cooler is detachably fixed in the power converter device of 1st Embodiment. It is a figure which shows the structure of the housing | casing which hold | maintains a control circuit board in the power converter device of 1st Embodiment. It is a perspective view which shows the structure of the cooler currently used with the power converter device of 1st Embodiment. It is a perspective view which shows the power semiconductor module used with the power converter device of 1st Embodiment. It is a figure which shows the state by which the cooler was fixed to a part of housing | casing in the power converter device of 1st Embodiment, and the holding | maintenance part integrated with the housing | casing is shown with the dashed-two dotted line. It is an equivalent circuit of the power semiconductor module used with the power converter device of a 1st embodiment. It is a figure which shows the structure of the housing | casing which hold | maintains a control circuit board in the power converter device of 2nd Embodiment which concerns on this invention. It is a figure which shows the structure of the housing | casing which hold | maintains a control circuit board in the power converter device of 3rd Embodiment which concerns on this invention. It is a figure which shows the structure of the housing | casing which hold | maintains a control circuit board in the power converter device of 4th Embodiment which concerns on this invention. It is a figure which shows the structure of the housing | casing which hold | maintains a control circuit board in the power converter device of 5th Embodiment which concerns on this invention. It is a figure which shows the structure of the housing | casing which hold | maintains a control circuit board in the power converter device of 6th Embodiment which concerns on this invention. It is a figure which shows the structure of the housing | casing which thermally radiates the heat | fever of a control circuit board in the power converter device of 7th Embodiment which concerns on this invention. It is a figure which shows the structure of the housing | casing which thermally radiates the heat | fever of a control circuit board in the power converter device of 8th Embodiment which concerns on this invention. It is a figure which shows the structure of the housing | casing which thermally radiates the heat | fever of a control circuit board in the power converter device of 9th Embodiment which concerns on this invention.

Next, first to ninth embodiments of the present invention will be described with reference to the drawings. In the following description of the drawings, the same or similar parts are denoted by the same or similar reference numerals. However, it should be noted that the drawings are schematic, and the relationship between the thickness and the planar dimensions, the ratio of the thickness of each layer, and the like are different from the actual ones. Therefore, specific thicknesses and dimensions should be determined in consideration of the following description. Moreover, it is a matter of course that portions having different dimensional relationships and ratios are included between the drawings.
The following first to ninth embodiments exemplify apparatuses and methods for embodying the technical idea of the present invention, and the technical idea of the present invention is the material of the component, The shape, structure, arrangement, etc. are not specified below. The technical idea of the present invention can be variously modified within the technical scope defined by the claims described in the claims.

[Power Converter of First Embodiment]
Hereinafter, the power converter of a 1st embodiment concerning one mode of the present invention is explained, referring to drawings suitably.
As shown in FIG. 1, the power conversion device 1 according to the first embodiment of the present invention includes a housing 2 and a cooler 3 that is detachably fixed to the bottom surface of the housing 2.
As shown in FIGS. 2 and 3, the housing 2 has three insulated gate bipolar transistor (IGBT) modules 10U, 10V, and 10W joined to the cooler 3, and these IGBT modules 10U, 10V, and 10W. A control circuit board 11, a smoothing capacitor 12, a DC input connector 13, and an AC output connector 14 on which a drive circuit and the like are mounted are housed.

[Case]
The housing 2 includes a case 4, a cover 5, and a gasket 6.
Case 4 is formed of aluminum or an aluminum alloy.
As shown in FIG. 4, the case 4 includes a bottom portion 4a and a side wall portion 4b that rises from the entire circumference of the bottom portion 4a. A pair of the upper portions 4c having a polygonal shape open at the upper end of the side wall portion 4b and face each other. The holding portion 32 is formed integrally with the case 4 across the side wall portions 4b, 4b.
The case 4 is a member that is long in the left-right direction in FIG. 4. When the upper opening 4 c is closed with the cover 5 via the gasket 6, a rectangular storage space S <b> 1 is formed at the center in the long direction, Storage spaces S2, S3 narrower than the storage space S1 are formed at both ends in the longitudinal direction.

A mounting flange portion 7 is formed on the entire periphery of the upper end of the side wall portion 4 b of the case 4 so as to protrude outward, and a screw hole 7 a is formed at a predetermined location of the mounting flange portion 7.
A rectangular IGBT module opening 8 that opens in the storage space S <b> 1 is formed in the bottom 4 a of the case 4. The longitudinal direction of the IGBT module opening 8 is formed so as to extend in the short direction of the bottom 4a (oblique vertical direction in FIG. 4), and both ends of the IGBT module opening 8 in the longitudinal direction are sidewalls. It opens to the lower end of the part 4b.

In addition, a plurality of first female screw portions 25 are formed at predetermined intervals on the bottom portion 4a along one long side edge of the IGBT module opening 8, and the other length of the IGBT module opening 8 is formed. A plurality of second female screw portions 26 and third female screw portions 27 are formed at a predetermined interval in the bottom portion 4a along the side edge.
As shown in FIG. 5A, the first male screw portion 25 is a cap nut-shaped member that bulges inside the case 4, and has a female screw 25 a that opens downward.

As shown in FIG. 5B, the second male screw portion 26 is a cap nut-shaped member that bulges inside the case 4, and has a female screw 26 a that opens downward. The third female screw portion 27 is formed with a female screw 27 a that protrudes from the outer periphery of the second male screw portion 26 toward the IGBT module opening 8 and communicates toward the inside and the outside of the case 4.
As shown in FIGS. 3 and 4, the holding portion 32 is integrally formed between the pair of side wall portions 4 b, 4 b facing each other, and is rectangular in plan view located above the IGBT module opening 8. It is a member. A plurality of holding projections 40a to 40e are formed on the surface of the holding portion 32 so as to protrude, and a plurality of lead frame insertion slits 41 communicating in the front and back direction are formed.

FIG. 6 shows a specific structure in which the holding projection part 40 a of the holding part 32 holds the control circuit board 11.
An internal thread portion 46 is formed in the axial center position from the upper surface 45 in the holding projection portion 40a having a flat upper surface and a cylindrical appearance.
The control circuit board 11 is formed with an insertion hole 11a.
Thermal conductive grease 47 is provided between the upper surface 45 of the holding projection 40 a and the lower surface 11 b around the insertion hole 11 a of the control circuit board 11.
Then, by screwing the male screw portion 48a of the screw member 48 inserted through the insertion hole 11a from above the control circuit board 11 into the female screw portion 46, the heat conduction grease 47 is formed on the upper surface 45 of the holding projection 40a and the control circuit board. The control circuit board 11 is held by the holding protrusion 40a in a state of being in close contact with the lower surface 11b.

The other holding projections 40b to 40e of the holding part 32 also hold the control circuit board 11 with the same configuration as that shown in FIG.
As shown in FIG. 4, the cover 5 is a plate-like member made of aluminum or an aluminum alloy and formed in the same shape as the outer peripheral shape of the mounting flange portion 7 of the case 4. A screw insertion hole 5 a is formed at a position corresponding to the screw hole 7 a of the mounting flange portion 7 of the case 4 of the cover 5. Note that the cover 5 may also be formed using copper or a copper alloy as a material.
As shown in FIG. 4, the gasket 6 is formed in the same shape as the mounting flange portion 7, and a screw insertion hole 6 a is formed at a position corresponding to the screw hole 7 a of the mounting flange portion 7.

[Cooler]
The cooler 3 is a member formed of aluminum or an aluminum alloy as a material, and includes a cooling water supply port 15a and a cooling water discharge port 15b as shown in FIG. The block-shaped cooler body 15 provided with a rectangular joining surface 15c and a pair of plate-like fixing portions projecting outward from a pair of long sides of the joining surface 15c and provided with screw insertion holes 16a at a predetermined interval 16.

[IGBT module]
The IGBT module 10U shown in FIG. 8 has a rectangular parallelepiped resin package 17, an unillustrated upper arm semiconductor chip, an upper arm wiring pattern portion, an upper arm wiring conductor plate, a lower arm semiconductor chip, and a lower arm wiring pattern. , A lower arm wiring conductor plate and a ground wiring pattern portion are embedded.
On the first side surface 17a of the resin package 17, a positive side connection terminal 18 connected to the collector of the upper arm semiconductor chip via the upper arm wiring pattern portion, a ground wiring pattern portion, and a lower arm wiring conductor plate are provided. The negative electrode side connection terminal 19 connected to the emitter of the lower arm semiconductor chip protrudes outward through the second side surface 17b on the back surface with respect to the first side surface 17a, and the lower arm wiring pattern portion and the upper arm An output terminal 20 connected to the emitter of the upper arm semiconductor chip and the collector of the lower arm semiconductor chip protrudes outward through the wiring conductor plate.

Further, on the upper surface of the resin package 17, a plurality of upper arm lead frames 21 connected to a plurality of upper arm control electrodes (a gate electrode, an emitter current sense electrode, a temperature detection electrode, etc. described later), and a lower arm A plurality of lower arm lead frames 22 connected to a plurality of arm control electrodes are provided protruding upward.
The other two IGBT modules 10V and 10W also have the same configuration as the IGBT module 10U shown in FIG.

  FIG. 10 shows an equivalent circuit of three IGBT modules 10U, 10V, and 10W. Between the positive electrode side connection terminal 18 and the negative electrode side connection terminal 19, a reverse conducting IGBT module QU that constitutes an upper arm; The reverse conducting IGBT module QL constituting the lower arm is connected in series, and the output terminal 20 is provided between the reverse conducting IGBT module QU and the reverse conducting IGBT module QL. Here, reference numeral 21g is a gate electrode of the reverse conducting IGBT module QU, reference numeral 21es is an emitter current sensing electrode of the reverse conducting IGBT module QUA, reference numeral 22g is a gate electrode of the reverse conducting IGBT module QUI, and reference numeral 22es is It is an emitter current sense electrode of the reverse conducting IGBT module QL.

[Assembly of Power Converter of First Embodiment]
Next, the assembly procedure of the power conversion device 1 of the first embodiment will be described.
The three IGBT modules 10U, 10V, and 10W are sintered at a position indicated by a two-dot chain line square shape of the joint surface 15c of the cooler 3 shown in FIG. 7 (a position spaced by a predetermined interval in the longitudinal direction of the joint surface 15c). It joins by the metal sintered material and solder by a process (refer FIG. 4).
The three IGBT modules 10U, 10V, and 10W integrated with the cooler 3 are as shown in FIG. 9 (in FIG. 9, the holding portion 32 is indicated by a two-dot chain line). 8 is inserted into the storage space S1 of the case 4 from the bottom 4a side.

At this time, the upper arm lead frame 21 and the lower arm lead frame 22 protruding from the upper surfaces of the IGBT modules 10U, 10V, and 10W pass through the plurality of lead frame insertion slits 41 of the holding portion 32 and Project upward.
And the fixing | fixed part 16 of the cooler 3 is contact | abutted to the bottom part 4a along a pair of long side edge part of the opening part 8 for IGBT modules, and a cooler is made to the 1st internal thread part 25 and the 2nd internal thread part 26 of the bottom part 4a. The screw members 30 that correspond to the screw insertion holes 16 a of the pair of three fixing portions 16 and pass through the screw insertion holes 16 a are screwed into the first female screw portion 25 and the second female screw portion 26.

Thereby, the cooler 3 is detachably attached to the bottom 4a of the case 4 in a state where the IGBT modules 10U, 10V, and 10W are disposed in the storage space S1 of the case 4.
The control circuit board 11 is a slightly small rectangular member with respect to the holding portion 32 of the case 4 and is mounted with a circuit component 43 (see FIG. 3) for driving the IGBT modules 10U, 10V, and 10W. .
Then, the heat conduction grease 47 is provided on the upper surface 45 of the holding projections 40 a to 40 e formed on the holding part 32. Next, the control circuit board 11 is placed so that the insertion holes 11 a correspond to the holding protrusions 40 a to 40 e of the holding part 32. The screw member 48 inserted into the insertion hole 11a of the holding projections 40a to 40e is screwed into the female screw portion 46 formed in the holding projections 40a to 40e, whereby the holding circuit 32 holds the control circuit board 11. .

  Here, as shown in FIG. 3, the upper arm lead frame 21 and the lower arm lead frame 22 that protrude from the upper surfaces of the three IGBT modules 10U, 10V, and 10W and pass through the lead frame insertion slit 41 of the holding portion 32 are as follows. The control circuit board 11 is inserted into a through hole (not shown) having a land, and the upper arm lead frame 21, the lower arm lead frame 22 and the through hole are soldered.

Further, as shown in FIG. 2, a smoothing capacitor 12 is disposed adjacent to the three IGBT modules 10U, 10V, and 10W in the storage space S1 of the case 4, and the positive side connection of the three IGBT modules 10U, 10V, and 10W is connected. The terminal 18 and the negative electrode side connection terminal 19 are connected to the positive and negative electrodes of the smoothing capacitor 12.
The AC output connector 14 is disposed in the storage space S <b> 2 of the case 4, and the three IGBT 10 </ b> U, 10 V, and 10 W output terminals 20 and the AC output connector 14 are connected via the bus bar 33. The bus bar 33 is supported by AC output terminal blocks 29 and 31 arranged in the storage space S <b> 1 of the case 4.

Further, the DC input terminal block 28 and the DC input connector 13 are disposed in the storage space S3 of the case 4, and the DC input connector 13 and the smoothing capacitor 12 are connected via the bus bar 34. The bus bar 34 is supported on the upper part of the DC input terminal block 28.
2 and 3, the gasket 6 is placed on the mounting flange portion 7 of the case 4, the outer peripheral edge portion of the cover 5 is placed on the gasket 6, and the screw insertion hole 5 a of the cover 5 and the screw of the gasket 6 are placed. By screwing the screw member 35 inserted into the insertion hole 6 a into the screw hole 7 a of the mounting flange portion 7, the upper opening of the case 4 is closed. As a result, the IGBT modules 10U, 10V, and 10W, the control circuit board 11, the smoothing capacitor 12, the DC input connector 13, and the AC output connector 14 housed in the housing 2 are liquid-tightly sealed with the outside air. .

[Operation of Power Conversion Device of First Embodiment]
In this state, DC power is supplied from an external converter (not shown) via the DC input connector 13, and a gate signal composed of, for example, a pulse width modulation signal is supplied from the control circuit board 11 to the IGBT modules 10U, 10V, and 10W. To do. That is, by controlling on / off with a gate signal shifted by 120 degrees with respect to the three IGBT modules 10U, 10V, and 10W, a three-phase alternating current of U phase, V phase, and W phase is loaded via the AC output connector 14. Is output.

In the control circuit board 11, the circuit components 43 that operate the IGBT modules 10U, 10V, and 10W are heated. Here, the holding part 32 supporting the control circuit board 11 inside the housing 2 is a part formed integrally with the case 4 constituting the housing 2, and the holding part 32 having no joint part and No contact thermal resistance occurs between the cases 4.
The power semiconductor module according to the present invention corresponds to the IGBT modules 10U, 10V, and 10W, the casing according to the present invention corresponds to the case 4 and the cover 5, and the held surface of the control circuit board according to the present invention is the lower surface. 11b, the holding surface of the housing according to the present invention corresponds to the upper surface 45 of the holding projections 40a to 40e, and the substrate holding unit according to the present invention is the holding projections 40a to 40e, the heat conduction grease 47, and the screw member. 48, the first heat conducting member according to the present invention corresponds to the heat conducting grease 47, and the circuit component according to the present invention corresponds to the circuit component 43.

[Effect of the power conversion device of the first embodiment]
Next, the effect of the power converter device 1 of 1st Embodiment is demonstrated.
The control circuit board 11 housed in the housing 2 has a heat conduction grease 47 interposed between the lower surface 11b and the upper surface 45 of the holding projections 40a to 40e, and the male screw portion 48a of the screw member 48 is connected to the female screw portion. 46, since the heat conduction grease 47 is brought into close contact with the upper surface 45 of the holding projections 40a to 40e and the lower surface 11b of the control circuit board, the control circuit board 11, the heat conduction grease 47, and the holding projection The thermal conductivity of the portions 40a to 40e is improved, and the contact thermal resistance is reduced. For this reason, the heat generated in the circuit component 43 of the control circuit board 11 is easily transferred from the control circuit board 11 to the case 4 via the holding portion 32, so that the heat of the control circuit board 11 can be efficiently radiated. it can.

  Here, in the power converter 1 of the first embodiment, a heat conductive sheet is interposed instead of the heat conductive grease 47 between the lower surface 11b of the control circuit board 11 and the upper surface 45 of the holding projections 40a to 40e, The same effect can be obtained even when the heat conductive sheet is in close contact with the upper surface 45 of the holding projections 40a to 40e and the lower surface 11b of the control circuit board. In that case, the 1st heat conductive member which concerns on this invention respond | corresponds to a heat conductive sheet.

Further, since the case 4 and the holding part 32 are made of a metal (aluminum, aluminum alloy) having high thermal conductivity, the heat generated in the control circuit board 11 is easily transferred from the holding part 32 to the case 4, and the control circuit The cooling efficiency of the substrate 11 can be increased.
Further, since the control circuit board 11 is fixed to the holding projections 40a to 40e of the holding part 32 via the screw member 48, vibration of the control circuit board 11 is suppressed even when an external force is transmitted from the housing 2. Thus, deterioration due to vibration of the control circuit board 11 can be prevented.
Further, since the cooler 3 joined to the case 4 is also formed of a metal (aluminum or aluminum alloy) having high thermal conductivity, heat generated in the control circuit board 11 is further transferred from the holding portion 32 to the case 4. Therefore, the cooling efficiency of the control circuit board 11 can be further improved.

[Power Converter of Second Embodiment]
Next, the power converter device of 2nd Embodiment which concerns on 1 aspect of this invention is demonstrated with reference to FIG. In addition, the same code | symbol is attached | subjected to the same component as the power converter device 1 of 1st Embodiment shown in FIGS. 1-10, and description is abbreviate | omitted.
In the power conversion device according to the second embodiment, a land 50 is formed by providing a conductive member on the lower surface 11b of the control circuit board 11 facing the upper surface 45 of the holding projection 40a. Then, the land 50 and the upper surface 45 of the holding projection 40a are soldered by the solder portion 51, and the control circuit board 11 is held by the holding projection 40a.
The other holding projections 40b to 40e also hold the control circuit board 11 with the same configuration as that shown in FIG.
In addition, the board | substrate holding part which concerns on this invention respond | corresponds to the holding | maintenance protrusion parts 40a-40e, the land 50, and the solder part 51. FIG.

According to the power converter of the second embodiment, the land 50 provided on the lower surface 11 b of the control circuit board 11 housed in the housing 2 and the upper surface 45 of the holding projections 40 a to 40 e are soldered by the solder portion 51. Since it is held by bonding, the thermal conductivity of the control circuit board 11, the land 50, the solder part 51, and the holding projections 40a to 40e becomes good, and the contact heat between the control circuit board 11 and the holding projections 40a to 40e. Resistance decreases. For this reason, the heat generated in the circuit component 43 of the control circuit board 11 is easily transferred from the control circuit board 11 to the case 4 via the holding portion 32, so that the heat of the control circuit board 11 can be efficiently radiated. it can.
Moreover, since the power converter of 2nd Embodiment loses fixation of the control circuit board 11 by a screw member, and a number of parts and an assembly man-hour reduce, it can aim at reduction of manufacturing cost.

[Power Converter of Third Embodiment]
Next, the power converter device of 3rd Embodiment which concerns on 1 aspect of this invention is demonstrated with reference to FIG.
In the power conversion device of the third embodiment, the land 50 is provided on the lower surface 11b of the control circuit board 11, and the land 50 and the upper surface 45 of the holding projection 40a are soldered together by the solder part 51, and the control circuit board. The control circuit board 11 is held by the holding projection 40a by screwing the male screw portion 48a of the screw member 48 inserted into the insertion hole 11a from above 11 into a female screw portion 46 provided on the holding projection 40a. .
The other holding projections 40b to 40e also hold the control circuit board 11 with the same configuration as that shown in FIG.
In addition, the board | substrate holding | maintenance part which concerns on this invention respond | corresponds to the holding | maintenance protrusion parts 40a-40e, the land 50, the solder part 51, and the screw member 48. FIG.

According to the power conversion device of the third embodiment, similarly to the second embodiment, the land 50 provided on the lower surface 11b of the control circuit board 11 housed in the housing 2 and the upper surfaces 45 of the holding projections 40a to 40e. Are held by solder joints by the solder part 51, the thermal conductivity of the control circuit board 11, the land 50, the solder part 51, and the holding projections 40a to 40e becomes good, and the control circuit board 11 and the holding projection The contact thermal resistance between 40a to 40e is reduced, and the heat generated in the circuit component 43 of the control circuit board 11 is easily transferred from the control circuit board 11 to the case 4 via the holding portion 32. Therefore, the control circuit board 11 Can be efficiently dissipated.
In the power converter of the third embodiment, the control circuit board 11 and the holding projections 40a to 40e are fixed by the screw member 48, so that the control circuit board 11 vibrates even when an external force is transmitted from the housing 2. It is suppressed and the deterioration by the vibration of the control circuit board 11 can be prevented.

[Power Converter of Fourth Embodiment]
Next, the power converter device of 4th Embodiment which concerns on 1 aspect of this invention is demonstrated with reference to FIG.
The power converter of the fourth embodiment is provided with lands 52 having a large contact area that contacts the lower surface 11b of the control circuit board 11 as compared to the lands 50 shown in the power converter of the third embodiment of FIG. The other structure is the same as that of the power converter of the third embodiment.
According to the power conversion device of the fourth embodiment, heat generated in the control circuit board 11 is more easily transmitted to the land 52 having a large contact area in contact with the lower surface 11b as compared with the land 50 of the third embodiment. Compared with the power converter of the third embodiment, the heat of the control circuit board 11 can be dissipated more efficiently.

[Power Converter of Fifth Embodiment]
Next, the power converter device of 5th Embodiment which concerns on 1 aspect of this invention is demonstrated with reference to FIG.
In the power conversion device of the fifth embodiment, a conductive member is provided on the inner peripheral surface of the insertion hole 11 a of the control circuit board 11 to form a via 55, and the conductive member is continuously provided on the periphery of the upper opening of the via 55. An upper land 56 is formed, and a conductive member is continuously provided on the periphery of the lower opening of the via 55 to form a lower land 57. Further, the lower land 57 and the upper surface 45 of the holding projection 40a are soldered together by the solder portion 58, and the male screw portion 48a of the screw member 48 inserted through the via 55 from above the control circuit board 11 is held by the holding projection. The control circuit board 11 is held by the holding projection 40a by being screwed into the female screw portion 46 provided in the portion 40a.

Further, the other holding projections 40b to 40e also hold the control circuit board 11 with the same configuration as that shown in FIG.
In addition, the board | substrate holding part which concerns on this invention respond | corresponds to the holding | maintenance protrusion parts 40a-40e, the via | veer 55, the lower land 57, the solder part 58, and the screw member 48. FIG.
According to the power conversion device of the fifth embodiment, the heat generated in the control circuit board 11 is efficiently transmitted to the via 55, the upper land 56, and the lower land 57 formed in the control circuit board 11 and via the solder portion 58. As a result, the heat is easily transmitted from the holding projections 40a to 40e to the case 4, so that the heat of the control circuit board 11 can be efficiently radiated.
In the power converter of the fifth embodiment, the control circuit board 11 and the holding projections 40a to 40e are fixed by the screw member 48, so that the control circuit board 11 vibrates even when an external force is transmitted from the housing 2. It is suppressed and the deterioration by the vibration of the control circuit board 11 can be prevented.

[Power Converter of Sixth Embodiment]
Next, a power conversion device according to a sixth embodiment of the present invention will be described with reference to FIG.
In the power conversion device of the sixth embodiment, a conductive member is provided on the inner peripheral surface of the insertion hole 11 a of the control circuit board 11 to form a via 55, and the conductive member is continuously provided on the periphery of the upper opening of the via 55. An upper land 56 is formed, and a conductive member is continuously provided on the periphery of the lower opening of the via 55 to form a lower land 57.
Further, the lower land 57 and the upper surface 45 of the holding projection 40 a are soldered together by the solder part 60, and the solder part 61 is filled in the internal space of the via 55.

Further, the other holding projections 40b to 40e also hold the control circuit board 11 with the same configuration as that shown in FIG.
In addition, the board | substrate holding part which concerns on this invention respond | corresponds to the holding | maintenance protrusion parts 40a-40e, the via | veer 55, the lower side land 57, and the solder parts 60 and 61. FIG.
According to the power conversion device of the sixth embodiment, the heat generated in the control circuit board 11 is efficiently transmitted to the via 55, the upper land 56, and the lower land 57 formed in the control circuit board 11 and via the solder part 60. As a result, the heat is easily transmitted from the holding projections 40a to 40e to the case 4, so that the heat of the control circuit board 11 can be efficiently radiated.
Moreover, since the power converter of 6th Embodiment loses fixation of the control circuit board 11 by a screw member, and a number of parts and an assembly man-hour reduce, it can aim at reduction of manufacturing cost.

[Power Converter of Seventh Embodiment]
Next, the power converter device of 7th Embodiment which concerns on 1 aspect of this invention is demonstrated with reference to FIG.
In the power conversion device of the seventh embodiment, the heat radiating protrusion 62 is formed on the holding portion 32 of the case 4 at a position different from the above-described holding protrusions 40a to 40e. The heat radiating protrusion 62 is located below the position where the circuit component 43 of the control circuit board 11 is mounted.
A land 63 is formed by providing a conductive member on the lower surface of the control circuit board 11 where the circuit component 43 is mounted.
The land 63 formed on the control circuit board 11 and the upper surface 64 of the heat dissipation protrusion 62 are soldered together by a solder portion 65.
The heat radiating portion according to the present invention corresponds to the heat radiating protrusion 62.
According to the power conversion device of the seventh embodiment, heat generated in the circuit component 43 of the control circuit board 11 is easily transmitted from the land 63, the solder part 65, and the heat dissipation protrusion 62 to the case 4 via the holding part 32. Therefore, the heat of the control circuit board 11 can be radiated efficiently.

[Power Converter of Eighth Embodiment]
Next, a power conversion device according to an eighth embodiment of the present invention will be described with reference to FIG.
In the power conversion device of the eighth embodiment, the heat conduction grease 66 is interposed between the lower surface of the position where the circuit component 43 of the control circuit board 11 is mounted and the upper surface 64 of the heat dissipation protrusion 62.
The second heat conducting member according to the present invention corresponds to the heat conducting grease 66.
According to the power conversion device of the eighth embodiment, since the heat conduction grease 66 is interposed between the lower surface of the control circuit board 11 on which the circuit component 43 is mounted and the upper surface 64 of the heat dissipation protrusion 62, the control circuit The heat generated in the circuit component 43 of the board 11 is easily transmitted from the heat conduction grease 66 and the heat radiation protrusion 62 to the case 4 via the holding part 32, and the heat of the control circuit board 11 can be efficiently radiated.
Here, even if a heat conductive sheet is interposed instead of the heat conductive grease 66 between the lower surface of the control circuit board 11 and the upper surface 64 of the heat dissipation protrusion 62, the same effect can be obtained. In that case, the 2nd heat conductive member which concerns on this invention respond | corresponds to a heat conductive sheet.

[Power Converter of Ninth Embodiment]
Furthermore, the power converter device of 9th Embodiment which concerns on 1 aspect of this invention is demonstrated with reference to FIG.
In the control circuit board 11 of the power conversion device of the ninth embodiment, the circuit wiring part 70 is provided on the lower surface of the position where the circuit component 43 is mounted, and the lower surface of the circuit wiring part 70 is covered with the insulating sheet 71. It is electrically insulated.
In addition, heat conductive grease 72 is interposed between the insulating sheet 71 and the upper surface 64 of the heat dissipation protrusion 62.

According to the power conversion device of the ninth embodiment, since the heat conduction grease 72 is interposed between the insulating sheet 71 covering the circuit wiring part 70 and the upper surface 64 of the heat dissipation protrusion 62, the control circuit board 11 Heat generated in the circuit component 43 and the circuit wiring unit 70 is easily transmitted from the heat conduction grease 66 and the heat radiation protrusion 62 to the case 4 through the holding unit 32, and heat from the control circuit board 11 can be efficiently radiated. Can do.
Here, instead of the heat conduction grease 72 interposed between the insulating sheet 71 and the upper surface 64 of the heat dissipation protrusion 62, the upper surface 64 of the insulation sheet 71 and the heat dissipation protrusion 62 may be soldered with a solder part. Similar effects can be obtained.

DESCRIPTION OF SYMBOLS 1 Power converter 2 Housing | casing 3 Cooler 4 Case 4a Bottom part 4b Side wall part 4c Top opening part 5 Cover 5a Screw insertion hole 6 Gasket 6a Screw insertion hole 7 Mounting flange part 7a Screw hole 8 IGBT module opening part 10U, 10V, 10W IGBT module 11 Control circuit board 11a Insertion hole 11b Lower surface 12 of control circuit board Smoothing capacitor 13 DC input connector 14 AC output connector 15 Cooler body 15a, 46a Cooling water supply port 15b, 46b Cooling water discharge port 15c Bonding surface 16 Fixed Portion 16a Screw insertion hole 17 Resin package 17a First side face 17b Second side face 18 Positive side connection terminal 19 Negative side connection terminal 20 Output terminal 21 Upper arm lead frame 21g Gate electrode 21es of reverse conducting IGBT module QUA Reverse conducting IGBT Emission of module QUA Current sensing electrode 22 leads the lower arm frame 22
22g Gate electrode 22es of reverse conducting IGBT module QU Emitter current sensing electrode 25 of reverse conducting IGBT module QL First female screw portion 25a Female screw 26 Second female screw portion 26a Female screw 27 Third female screw portion 27a Female screw 28 DC input terminal block 29, 31 AC Output terminal block 30, 35 Screw member 32 Holding portion 33, 34 Busbar S1, S2, S3 Storage space 40a-40e Holding projection 41 Lead frame insertion slit 43 Circuit component 45 Upper surface 46 of holding projection 46 Female thread 47, 66, 72 Thermal conduction grease 48 Screw member 48a Male thread portion 50, 52, 63 Land 51, 58, 60, 61, 65 Solder portion 55 Via 56 Upper land 57 Lower land 62 Heat radiation protrusion 64 Heat radiation protrusion upper surface 70 Circuit wiring portion 71 Insulation sheet QU Reverse conducting IGBT module QL Reverse Through IGBT module

Claims (11)

A power semiconductor module for power conversion;
A control circuit board on which circuit components for driving the power semiconductor module are mounted;
A metal housing for housing the power semiconductor module and the control circuit board;
A board holding section that holds the control circuit board inside the casing with the held surface of the control circuit board and the holding surface of the casing facing each other,
The substrate holder is
A first heat conducting member interposed between the holding surface and the held surface;
Screw fastening means for fastening the control circuit board to the housing by tightening a screw member so that the first heat conducting member is in close contact between the held surface and the holding surface. A power conversion device.   The power converter according to claim 1, wherein the first heat conducting member is a heat conducting grease.   The power converter according to claim 1, wherein the first heat conducting member is a heat conducting sheet. A power semiconductor module for power conversion;
A control circuit board on which circuit components for driving the power semiconductor module are mounted;
A metal housing for housing the power semiconductor module and the control circuit board;
A board holding section that holds the control circuit board inside the casing with the held surface of the control circuit board and the holding surface of the casing facing each other,
The substrate holder is
Lands formed on the held surface;
A power conversion device comprising: a solder portion that solder-joins the land and the holding surface.   The power converter according to claim 4, wherein the board holding unit includes screw fastening means for fastening the control circuit board to the housing by fastening a screw member. A power semiconductor module for power conversion;
A control circuit board on which circuit components for driving the power semiconductor module are mounted;
A metal housing for housing the power semiconductor module and the control circuit board;
A board holding section that holds the control circuit board inside the casing with the held surface of the control circuit board and the holding surface of the casing facing each other,
The substrate holder is
A via formed in communication with the thickness direction of the control circuit board so as to open at the held surface;
A land formed at the periphery of the opening on the held surface side;
A solder part for soldering the land and the holding surface;
And a screw fastening means for fastening the control circuit board to the housing by fastening the screw member that has passed through the via. A power semiconductor module for power conversion;
A control circuit board on which circuit components for driving the power semiconductor module are mounted;
A metal housing for housing the power semiconductor module and the control circuit board;
A board holding section that holds the control circuit board inside the casing with the held surface of the control circuit board and the holding surface of the casing facing each other,
The substrate holder is
A via formed in communication with the thickness direction of the control circuit board so as to open at the held surface;
A land formed at the periphery of the opening on the held surface side;
A solder part for soldering the land and the holding surface, and
A power conversion device, wherein the internal space of the via is filled with solder and the internal space is filled. A land formed on the back surface of the control circuit board where the circuit component is mounted;
A heat dissipating portion provided at a position facing the back surface of the position where the circuit component of the control circuit board of the housing is mounted;
The power conversion device according to claim 1, further comprising a solder portion that solder-joins the land and the heat dissipation portion. A heat dissipating portion provided at a position facing the back surface of the position where the circuit component of the control circuit board of the housing is mounted;
The power converter according to any one of claims 1 to 7, further comprising: a second heat conducting member interposed between the back surface and the heat radiating portion.   The power converter according to claim 9, wherein the second heat conducting member is a heat conducting grease. The power converter according to claim 9, wherein the second heat conducting member is a heat conducting sheet.

Images