WO2013105166A1 - Power conversion apparatus - Google Patents

Power conversion apparatus Download PDF

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Publication number
WO2013105166A1
WO2013105166A1 PCT/JP2012/007310 JP2012007310W WO2013105166A1 WO 2013105166 A1 WO2013105166 A1 WO 2013105166A1 JP 2012007310 W JP2012007310 W JP 2012007310W WO 2013105166 A1 WO2013105166 A1 WO 2013105166A1
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WO
WIPO (PCT)
Prior art keywords
heat
power module
heat transfer
substrate
semiconductor power
Prior art date
Application number
PCT/JP2012/007310
Other languages
French (fr)
Japanese (ja)
Inventor
泰仁 田中
美里 柴田
Original Assignee
富士電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2012005490 priority Critical
Priority to JP2012-005490 priority
Application filed by 富士電機株式会社 filed Critical 富士電機株式会社
Publication of WO2013105166A1 publication Critical patent/WO2013105166A1/en

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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/003Constructional details, e.g. physical layout, assembly, wiring, busbar connections
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

Provided is a power conversion apparatus, which can efficiently dissipate heat to a cooling body without having a housing in a path for dissipating heat of a heat generating circuit component mounted on a substrate. This power conversion apparatus is provided with: a semiconductor power module (11) having a cooling member (13) provided on one surface thereof, said cooling member being bonded to a cooling body; and a mounting substrate (22), which has a circuit component mounted on the other surface side of the semiconductor power module, said circuit component including a heat generating circuit component (39) that drives the semiconductor power module. The cooling member has substrate heat absorbing portions (13b, 13c), which extend to the vicinity of the mounting substrate.

Description

Power converter

The present invention supports a mounting board on which a circuit component including a heat generating circuit component for driving the semiconductor switching element is mounted at a predetermined interval on a semiconductor power module including a semiconductor switching element for power conversion. The present invention relates to a power conversion device.

As this type of power conversion device, a power conversion device described in Patent Document 1 is known. In this power conversion device, a water cooling jacket is disposed in a casing, and a semiconductor power module including an IGBT as a semiconductor switching element for power conversion is disposed on the water cooling jacket to cool the power conversion apparatus.
In addition, a control circuit board is disposed in the housing at a predetermined distance on the opposite side of the semiconductor power module from the water-cooling jacket, and the heat generated by the control circuit board is supported by the heat dissipation member. The heat transmitted to the metal base plate is further transmitted to the water cooling jacket through the side wall of the casing that supports the metal base plate.

Japanese Patent No. 4657329

By the way, in the conventional example described in Patent Document 1, the heat generated in the control circuit board is radiated through the path of the control circuit board → the heat radiating member → the metal base plate → the housing → the water cooling jacket. Yes. For this reason, when the housing is used as a part of the heat transfer path, the housing is also required to have good heat transfer properties, and the material is limited to a metal having high thermal conductivity, which is reduced in size and weight. However, there is an unsolved problem that it is difficult to select a lightweight material such as a resin and it is difficult to reduce the weight.

Also, since the housing is often required to be waterproof and dustproof, apply a liquid sealant or sandwich rubber packing between the metal base plate and the housing and between the housing and the water cooling jacket. Etc. are generally performed. Liquid sealants and rubber packings generally have a low thermal conductivity, and there is an unsolved problem that the thermal resistance increases and the cooling efficiency decreases due to the presence of these in the thermal cooling path.

In order to solve this unresolved issue, it is necessary to dissipate the heat generated by the substrate and mounted components by natural convection from the case and case cover, increasing the surface area of the case and case cover. For this reason, the outer shape of the housing and the housing lid is increased, and the power converter is increased in size.
Accordingly, the present invention has been made paying attention to the unsolved problems of the above-described conventional example, and efficiently cools the cooling body without interposing a casing in the heat radiation path of the heat generating circuit component mounted on the substrate. It aims at providing the power converter device which can thermally radiate.

In order to achieve the above object, a first embodiment of a power conversion device according to the present invention includes a semiconductor power module including a cooling member bonded to a cooling body on one surface, and the other surface side of the semiconductor power module, And a mounting board on which circuit components including a heat generating circuit component for driving the semiconductor power module are mounted. The cooling member has a substrate heat absorbing portion extending in the vicinity of the mounting substrate.
According to this configuration, the heat generated by the heat-generating component of the mounting board can be absorbed by the board heat-absorbing portion of the cooling member that cools the semiconductor power module and radiated to the cooling body, and the mounting board can be provided without providing a separate heat dissipation path. It is possible to reliably dissipate the heat generated by the heat generating parts.

Moreover, the 2nd aspect of the power converter device which concerns on this invention has the said board | substrate heat absorption part extended from the one surface side of the said semiconductor power module to the other surface side through the side surface of the said semiconductor power module.
According to this configuration, the heat generated by the mounting substrate can be reliably transferred to the substrate heat absorbing portion of the cooling member via the heat transfer plate, so that the heat dissipation effect can be improved and the mounting substrate can be prevented from bending. be able to.

Moreover, the 3rd aspect of the power converter device which concerns on this invention has the said board | substrate heat absorption part extended from the one surface side of the said semiconductor power module to the other surface side through the said semiconductor power module inside.
According to this configuration, the heat transfer member interposed between the mounting board and the heat transfer plate can reliably transfer the heat generated by the heat generating components of the mounting board to the heat transfer plate.

A fourth aspect of the power conversion device according to the present invention is a semiconductor power module in which a semiconductor switching element for power conversion is built in a case body, and a cooling member that contacts the cooling body is formed on one surface of the case body. And a mounting substrate on which circuit components including a heat generating circuit component for driving the semiconductor switching element are mounted and supported at a predetermined distance from the other surface of the semiconductor power module. And the said cooling member has a board | substrate heat absorption part extended to the said mounting board | substrate vicinity of the other surface side of the said semiconductor power module.
According to this configuration, the heat generated by the heat-generating component of the mounting board can be absorbed by the board heat-absorbing portion of the cooling member that cools the semiconductor power module and radiated to the cooling body, and the mounting board can be provided without providing a separate heat dissipation path. It is possible to reliably dissipate the heat generated by the heat generating parts.

Moreover, the 5th form of the power converter device which concerns on this invention is provided with the heat exchanger plate which heat-transfers the heat_generation | fever of the said mounting board to the board | substrate heat absorption part of the said cooling member.
According to this configuration, the heat generated by the mounting substrate can be reliably transferred to the substrate heat absorbing portion of the cooling member via the heat transfer plate, so that the heat dissipation effect can be improved and the mounting substrate can be prevented from bending. be able to.

In the sixth aspect of the power conversion device according to the present invention, a heat transfer member is interposed between the mounting substrate and the heat transfer plate.
According to this configuration, the heat transfer member interposed between the mounting board and the heat transfer plate can reliably transfer the heat generated by the heat generating components of the mounting board to the heat transfer plate.

In the seventh aspect of the power conversion device according to the present invention, the substrate heat absorbing portion extends from one surface side of the semiconductor power module to the other surface side through the side surface of the semiconductor power module.
According to this configuration, it is possible to absorb the heat generated by the heat-generating component mounted on the mounting board and dissipate it to the cooling body without changing the specifications of the semiconductor power module.

According to an eighth aspect of the power conversion device of the present invention, the substrate heat absorbing portion extends from one surface side of the semiconductor power module to the other surface side through the inside of the semiconductor power module.
According to this configuration, since the substrate heat absorbing portion extends to the other surface side through the inside of the semiconductor power module, heat generated in the semiconductor power module can also be absorbed.

In the ninth aspect of the power conversion device according to the present invention, the cooling member is made of a metal material having high thermal conductivity.
According to this configuration, since the cooling member is made of a metal material having high thermal conductivity such as aluminum, aluminum alloy, copper, etc., the heat generated by the heat generating component of the mounting board can be efficiently radiated to the cooling body.

Moreover, as for the 10th aspect of the power converter device which concerns on this invention, the said heat exchanger plate is comprised with the metal material with high heat conductivity.
According to this configuration, since the heat transfer plate is made of a metal material having high thermal conductivity such as aluminum, aluminum alloy, copper, etc., heat generated by the heat generating component of the mounting substrate can be transferred to the substrate heat absorbing portion of the cooling member. .
Moreover, the 11th aspect of the power converter device which concerns on this invention is comprised by the insulator in which the said heat-transfer member has insulation.
According to this configuration, since the heat transfer member inserted between the mounting board and the heat transfer plate has an insulating property, even when the heat transfer plate is made of a metal material having high thermal conductivity, electrical insulation is ensured. can do.

Moreover, the 12th aspect of the power converter device which concerns on this invention is comprised by the elastic body in which the said heat-transfer member has a stretching property.
According to this configuration, since the heat transfer member has elasticity, the contact area with the circuit component mounted on the mounting board can be widened, and efficient heat transfer can be performed.

In a thirteenth aspect of the power conversion device according to the present invention, the heat transfer member is formed of an elastic body having elasticity, and the heating circuit component is mounted on the heat transfer member side mounting surface of the mounting board. Has been.
According to this configuration, since the heat transfer member has elasticity, the contact area with the heat generating circuit component mounted on the mounting board can be widened, and more efficient heat transfer can be performed.

According to the present invention, the heat generated by the mounting board on which the circuit components including the heat generating circuit components are mounted can be absorbed by the substrate heat absorbing portion of the cooling member that cools the semiconductor power module and can be dissipated to the cooling body. Heat generated from the semiconductor power module and the mounting substrate can be efficiently radiated to the cooling body. For this reason, since a housing | casing is not used as a heat-transfer path | route, while being able to reduce a housing weight, the freedom degree of design of a housing | casing can be improved.

It is sectional drawing which shows the whole structure of 1st Embodiment of the power converter device which concerns on this invention. It is an expanded sectional view showing the important section of a 1st embodiment. It is a perspective view of a power converter. It is a perspective view which shows the relationship between a semiconductor power module and a cooling member. It is sectional drawing which shows the state which attached the mounting board | substrate to the heat-transfer support plate. It is a figure explaining the heat dissipation path | route of a heat generating circuit component. It is a perspective view of the power converter device which shows the 2nd Embodiment of this invention. It is a perspective view which shows the relationship between the semiconductor power module of 2nd Embodiment, and a cooling member. FIG. 8 is a plan view of FIG. 7. It is sectional drawing which shows the other example of a cooling member.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a cross-sectional view showing the overall configuration of a power converter according to the present invention.
In the figure, reference numeral 1 denotes a power converter, and the power converter 1 is housed in a housing 2. The casing 2 is formed by molding a synthetic resin material, and includes a lower casing 2A and an upper casing 2B that are divided vertically with a cooling body 3 having a water-cooling jacket structure interposed therebetween.

The lower housing 2A is a bottomed rectangular tube. The lower housing 2A is covered with a cooling body 3 at the open top, and a film capacitor 4 is accommodated therein.
The upper housing 2B includes a rectangular tube 2a having an open upper end and a lower end, and a lid 2b that closes the upper end of the rectangular tube 2a. The lower end of the rectangular tube 2a is closed by the cooling body 3. Although not shown, a sealing material such as application of a liquid sealant or sandwiching rubber packing is interposed between the lower end of the rectangular tube 2a and the cooling body 3.

In the cooling body 3, a water supply port 3 a and a water discharge port 3 b of cooling water as a cooling medium are opened to the outside of the housing 2. These water supply port 3a and drainage port 3b are connected to a cooling water supply source such as a radiator (not shown) via a flexible hose, for example. The cooling body 3 is formed, for example, by injection molding aluminum or aluminum alloy having high thermal conductivity.
And the cooling body 3 is made into the flat surface where the upper surface and the lower surface are mutually parallel, and the wide water supply channel | path 3c corresponding to the width | variety of the cooling member 13 mentioned later is formed between the water supply port 3a and the drain port 3b. Further, the cooling body 3 is formed with an insertion hole 3d through which the positive and negative connection terminals 4a covered with insulation of the film capacitor 4 held in the lower housing 2A are vertically inserted.

As is apparent from FIG. 2, the power conversion apparatus 1 includes a semiconductor power module 11 that incorporates, for example, an insulated gate bipolar transistor (IGBT) as a semiconductor switching element that constitutes, for example, an inverter circuit for power conversion. .
This semiconductor power module 11 has an IGBT built in a flat rectangular parallelepiped insulative case body 12, and the lower surface of the case body 12 has high thermal conductivity such as aluminum, aluminum alloy, copper (for example, 100 W · m −1 · K −1 or more) The cooling member 13 made of a metal material is in contact.

As shown in FIGS. 2 to 4, the cooling member 13 is in contact with the lower surface of the case body 12 of the semiconductor power module 11 and extends in the longitudinal direction of the case body 12 so as to be slightly longer than both ends. The bottom plate portion 13a is formed in a U-shaped cross section with substrate heat absorbing portions 13b and 13c that are bent from both ends in the longitudinal direction and extend upward through both side surfaces in the longitudinal direction of the case body 12. A female screw portion 13d is formed on the upper end side of the substrate heat absorbing portions 13b and 13c.

Further, the case body 12 and the cooling member 13 are formed with insertion holes 15 through which fixing screws 14 as fixing members are inserted at the four corners as viewed from above. In addition, on the upper surface of the case body 12, substrate fixing portions 16 having a predetermined height are formed to protrude at four locations inside the insertion hole 15.
A drive circuit board 21 on which a drive circuit for driving an IGBT built in the semiconductor power module 11 is mounted is fixed to the upper end of the board fixing portion 16. In addition, a control circuit, a power supply circuit, and the like including a heat generation circuit component having a relatively large heat generation amount or a high heat generation density for controlling the IGBT built in the semiconductor power module 11 with a predetermined interval above the drive circuit board 21. A control circuit board 22 as a mounting board on which is mounted is fixed.

Then, as shown in FIG. 2, the drive circuit board 21 inserts the male screw part 24a of the joint screw 24 into the insertion hole 21a formed at a position facing the board fixing part 16, and the male screw part 24a is inserted into the board fixing part. It is fixed by screwing into a female screw portion 16a formed on the upper surface of 16.
Further, as shown in FIG. 2, the control circuit board 22 inserts a fixing screw 25 into an insertion hole 22 a formed at a position facing the female screw portion 24 b formed at the upper end of the joint screw 24. The joint screw 24 is fixed by being screwed to the female thread portion 24b.

The control circuit board 22 is supported by the heat transfer plate 32 so as to form a heat radiation path to the cooling body 3. The heat transfer plate 32 is made of a metal having a high thermal conductivity (for example, 100 W · m −1 · K −1 or more) such as aluminum, an aluminum alloy, or copper.
Further, as shown in FIG. 2, the heat transfer plate 32 has protrusions 32 a and 32 b protruding from the control circuit board 22 and the heat transfer member 35 on both ends in the longitudinal direction of the case body 12 of the semiconductor power module 11. Mounting flange portions 32c and 32d extending downward from both ends of the protruding portions 32a and 32b are formed. Here, each of the attachment flange portions 32c and 32d is formed so as to come into contact with the outside of the tip end portions of the substrate heat absorption portions 13b and 13c of the cooling member 13 described above.

The mounting flange portions 32c and 32d are brought into contact with the substrate heat absorbing portions 13b and 13c by screwing the fixing screws 33 into the female screw portions 13d of the substrate heat absorbing portions 13b and 13c through the insertion holes 32e formed therein. It is fixed in the state.
The control circuit board 22 is fixed to the heat transfer plate 32 by a fixing screw 36 via a heat transfer member 35. The heat transfer member 35 is an elastic body having elasticity, and has the same outer dimensions as the control circuit board 22. As the heat transfer member 35, a member having improved heat transfer property by interposing a metal filler inside silicon rubber is applied.

Further, on the control circuit board 22, a heat generating circuit component 39 is mounted on the lower surface side as shown in FIG.
Then, the control circuit board 22 is connected to the heat transfer member 35 and the heat transfer plate 32 as shown in FIG.
As shown in FIG. 5, the connection between the control circuit board 22 and the heat transfer plate 32 includes a spacer 40 as a gap adjustment member having a heat transfer plate management height H lower than the thickness T of the heat transfer member 35. Used. The spacer 40 is temporarily fixed by bonding or the like to the outer peripheral side of the female screw portion 41 to which the fixing screw 36 formed on the heat transfer plate 32 is screwed. Here, the heat transfer plate management height H of the spacer 40 is set so that the compression rate of the heat transfer member 35 is about 5 to 30%. Thus, by compressing the heat transfer member 35 to about 5 to 30%, the heat resistance can be reduced and an efficient heat transfer effect can be exhibited.

On the other hand, the heat transfer member 35 is formed with an insertion hole 35a through which the joint screw 24 can be inserted and an insertion hole 35b through which the spacer 40 can be inserted. Then, the heat transfer member 35 is placed on the heat transfer plate 32 so that the spacer 40 temporarily fixed to the heat transfer plate 32 is inserted into the insertion hole 35 b, and the control circuit board 22 is placed on the heat transfer plate 32. Is placed so that the heat generating circuit component 39 is in contact with the heat transfer member 35.
In this state, the fixing screw 36 is screwed into the female screw portion 41 of the heat transfer plate 32 through the insertion hole 22b of the control circuit board 22 and the central opening of the spacer 40. Then, the fixing screw 36 is tightened until the upper surface of the heat transfer member 35 substantially coincides with the upper surface of the spacer 40.

For this reason, the heat transfer member 35 is compressed at a compression rate of about 5 to 30%, so that the heat resistance is reduced and an efficient heat transfer effect can be exhibited. At this time, since the compression rate of the heat transfer member 35 is managed by the height H of the spacer 40, appropriate tightening is performed without causing insufficient tightening or excessive tightening.
Further, the heat generating circuit component 39 mounted on the lower surface side of the control circuit board 22 is embedded in the heat transfer member 35 by the elasticity of the heat transfer member 35. For this reason, the contact between the heat generating circuit component 39 and the heat transfer member 35 is performed without excess or deficiency, and the contact between the heat transfer member 35 and the control circuit board 22 and the heat transfer plate 32 is favorably performed. And the thermal resistance between the control circuit board 22 and the heat transfer plate 32 can be reduced.

An insulating sheet 42 is attached to the lower surface of the heat transfer plate 32 in order to shorten the insulation distance.
Then, as shown in FIG. 2, the fixing screw 14 is inserted into the insertion hole 15 of the semiconductor power module 11 and the cooling member 13, and the fixing screw 14 is screwed into the female screw portion 3 e formed in the cooling body 3. The semiconductor power module 11 and the cooling member 13 are fixed to the cooling body 3.

Next, a method for assembling the power conversion device 1 according to the first embodiment will be described.
First, as described above with reference to FIG. 2, the control circuit board 22 is superposed on the heat transfer plate 32 via the heat transfer member 35, and the heat transfer member 35 is compressed at a compression rate of about 5 to 30% by the fixing screw 36. In this state, the control circuit board 22, the heat transfer member 35, and the heat transfer plate 32 are fixed to form the control circuit board unit UC.

On the other hand, the semiconductor power module 11 and the cooling member 13 formed on the lower surface of the semiconductor power module 11 are fixed to the upper surface of the cooling body 3 with fixing screws 14.
In the semiconductor power module 11, the drive circuit board 21 is mounted on the board fixing part 16 formed on the upper surface of the semiconductor power module 11 before or after fixing to the cooling body 3. Then, the drive circuit board 21 is fixed to the board fixing portion 16 by four joint screws 24 from above.

Then, the control circuit board 22 of the control circuit board unit UC is placed on the upper surface of the joint screw 24, and the protrusions 32 a and 32 b of the heat transfer plate 32 are placed on the upper ends of the board heat absorption parts 13 b and 13 c of the cooling member 13. To do. In this state, the control circuit board unit UC is fixed on the joint screw 24 by the four fixing screws 25, and the heat transfer plate 32 of the control circuit board unit UC is connected to the board heat absorbing portions 13b and 13c by the fixing screws 33.

Thereafter, as shown in FIG. 1, the bus bar 50 is connected to the positive and negative DC input terminals 11 a of the semiconductor power module 11, and the positive and negative connection terminals 4 a of the film capacitor 4 penetrating the cooling body 3 at the other end of the bus bar 50. Are connected by a fixing screw 51. Further, a crimp terminal 53 fixed to the tip of a connection cord 52 connected to an external converter (not shown) is fixed to the DC input terminal 11 a of the semiconductor power module 11.

Further, a bus bar 55 is connected to the three-phase AC output terminal 11 b of the semiconductor power module 11 with a fixing screw 56, and a current sensor 57 is disposed in the middle of the bus bar 55. Then, a crimp terminal 59 fixed to the tip of a motor cable 58 connected to an external three-phase electric motor (not shown) is connected to the other end of the bus bar 55 with a fixing screw 60.
Thereafter, the lower housing 2A and the upper housing 2B are fixed to the lower surface and the upper surface of the cooling body 3 via a sealing material, and the assembly of the power conversion device 1 is completed.

In this state, DC power is supplied from an external converter (not shown), and the power supply circuit, the control circuit, and the like mounted on the control circuit board 22 are set in an operating state. A signal is supplied to the semiconductor power module 11 through an electrical connection line (not shown) via a drive circuit mounted on the drive circuit board 21. As a result, the IGBT built in the semiconductor power module 11 is controlled to convert DC power into AC power. The converted AC power is supplied from the three-phase AC output terminal 11b to the motor cable 58 via the bus bar 55 to drive and control a three-phase electric motor (not shown).

At this time, the IGBT built in the semiconductor power module 11 generates heat. This generated heat is cooled by the cooling water supplied to the cooling body 3 because the cooling member 13 formed in the semiconductor power module 11 is in direct contact with the cooling body 3.
On the other hand, the control circuit and the power supply circuit mounted on the control circuit board 22 include heat generating circuit components 39, and the heat generating circuit components 39 generate heat. At this time, the heat generating circuit component 39 is mounted on the lower surface side of the control circuit board 22.

A heat transfer plate 32 is provided on the lower surface side of the control circuit board 22 via a heat transfer member 35 having high thermal conductivity, elasticity, and electrical insulation.
For this reason, the contact area between the heat generating circuit component 39 and the heat transfer member 35 increases, and the heat resistance between the heat generating circuit component 39 and the heat transfer member 35 decreases as the contact area increases. Therefore, the heat generated by the heat generating circuit component 39 is efficiently transferred to the heat transfer member 35. Since the heat transfer member 35 itself is compressed at a compression rate of about 5 to 30% to increase the thermal conductivity, the heat transferred to the heat transfer member 35 is efficiently transferred as shown in FIG. It is transmitted to the heat transfer plate 32.

And since the board | substrate heat absorption parts 13b and 13c of the cooling member 13 formed in the semiconductor power module 11 are connected to the heat-transfer plate 32, the heat | fever transmitted to the heat-transfer plate 32 is the board | substrate heat absorption part 13b and It is transmitted to the bottom plate part 13a through 13c. Since the bottom plate portion 13 a is in direct contact with the upper surface of the cooling body 3, the transmitted heat is radiated to the cooling body 3.
Thus, according to the first embodiment, the heat generated by the heat generating circuit component 39 mounted on the control circuit board 22 is directly transferred to the heat transfer member 35 without passing through the control circuit board 22 having a large thermal resistance. Efficient heat dissipation.

The heat transferred to the heat transfer member 35 is transferred to the heat transfer plate 32 and further transferred to the bottom plate portion 13a via the substrate heat absorbing portions 13b and 13c of the cooling member 13. At this time, the substrate heat absorbing portions 13b and 13c are provided along the longitudinal ends of the semiconductor power module 11 as shown in FIG. For this reason, a wide heat transfer area can be taken, and a wide heat dissipation path can be secured.

Further, since the heat transfer plate 32 is fixed to the substrate heat absorbing portions 13b and 13c of the cooling member 13 by the bent mounting flange portions 32c and 32d, the control circuit substrate 22 can be prevented from rolling. Furthermore, since the control circuit board 22 is supported by the heat transfer plate 32 via the heat transfer member 35, the heat transfer plate 32 can prevent the control circuit board 22 from being bent.
In addition, since the bottom plate portion 13a and the substrate heat absorption portions 13b and 13c are integrated in the cooling member 13, there is no joint between the components between the bottom plate portion 13a and the substrate heat absorption portions 13b and 13c. Therefore, an efficient heat conduction path can be formed.

Further, since the casing 2 is not included in the heat dissipation path from the control circuit board 22 on which the heat generating circuit component 39 is mounted to the cooling body 3, it is necessary to use a metal such as aluminum having high conductivity for the casing 2. Since it can be made of a synthetic resin material, the weight can be reduced.
Furthermore, since the heat dissipation path can be formed by the power converter 1 alone without the heat dissipation path depending on the housing 2, the semiconductor power module 11, the drive circuit board 21, and the control circuit board 22 are configured. The power conversion device 1 can be applied to various types of housings 2 and cooling bodies 3.

Further, since the metal heat transfer plate 32 is fixed to the control circuit board 22, the rigidity of the control circuit board 22 can be increased. For this reason, even when vertical vibrations or rolls are applied to the power conversion device 1 as in the case where the power conversion device 1 is applied as a motor drive circuit that drives a vehicle driving motor, the heat transfer plate 32 provides rigidity. Can be increased. Therefore, it is possible to provide the power conversion device 1 that is less affected by vertical vibrations and rolls.

In the first embodiment, the case where the heat transfer member 35 has the same outer shape as the control circuit board 22 in the control circuit board unit UC has been described. However, the present invention is not limited to the above configuration, and the heat transfer member 35 may be provided only at a location where the heat generating circuit component 39 exists.
In the first embodiment, the case where the heat generating circuit component 39 is mounted on the heat transfer member 35 on the back surface side of the control circuit board 22 has been described. However, the present invention is not limited to this, and the heat generating circuit component is not limited thereto. When 39 is mounted on the upper surface side of the control circuit board 22, the heat transfer plate 32 may be disposed on the upper surface side via the heat transfer member 35.

In the first embodiment, the case where there is only one type of substrate on which the heat generating circuit component 39 is mounted is the control circuit substrate 22. However, the present invention is not limited to the above-described configuration. For example, when there are a plurality of mounting boards on which the heat generating circuit components 39 are mounted, each mounting board is unitized as described above, and a plurality of mounting boards are provided on the cooling member 13. The substrate heat absorbing portion may be formed to form a heat dissipation path for each substrate unit.

Next, a second embodiment of the present invention will be described with reference to FIGS.
In the second embodiment, the substrate heat absorbing portion of the cooling member 13 formed in the semiconductor power module 11 is extended upward through the semiconductor power module 11.
That is, in the second embodiment, as shown in FIGS. 7 and 8, the direct current input terminals 11 ap and 11 an and the direct current input terminals 11 ap and 11 an are connected along the positive and negative direct current input terminals 11 ap and 11 an in the case body 12 of the semiconductor power module 11. Through holes 12aa, 12ab and 12ac are formed outside the input terminals 11ap and 11an, respectively.

Similarly, along the three-phase AC output terminals 11bu, 11bv and 11bw in the case body 12, between the AC output terminals 11bu and 11bw, between the AC output terminals 11bv and 11bw, and outside the AC output terminals 11bu and 11bw, respectively. Through holes 12ba, 12bb, 12bc, and 12bd are formed.
As shown in FIG. 8, the cooling member 13 is inserted into the through holes 12aa, 12ab and 12ac at both ends of the bottom plate portion 13a in the direction perpendicular to the longitudinal direction of the semiconductor power module 11, and extends upward. Substrate heat absorbing portions 13da, 13db and 13dc and substrate heat absorbing portions 13ea, 13eb, 13ec and 13ed extending through the through holes 12ba, 12bb, 12bc and 12bd are formed.

Correspondingly, projecting portions 32 f and 32 g projecting outward are formed at both ends of the heat transfer plate 32 of the control circuit board 22 in the direction orthogonal to the longitudinal direction of the semiconductor power module 11. The mounting flange portions 32ha, 32hb, and 32hc and the mounting flange portion are respectively located at the positions corresponding to the outer surfaces of the substrate heat absorption portions 13da, 13db, and 13dc and the substrate heat absorption portions 13ea, 13eb, 13ec, and 13ed at the tips of the protruding portions 32f and 32g. 32ia, 32ib, 32ic and 32id are formed extending downward.

A female screw portion 13f is formed on the upper end side of each of the substrate heat absorbing portions 13da to 13dc and 13ea to 13ed of the cooling member 13, and on the lower end side of each of the mounting flange portions 32ha to 32hc and 32ia to 32id of the heat transfer plate 32. A screw insertion hole 32j is formed.
Then, as shown in FIG. 9, the mounting flange portions 32ha to 32hc and the mounting flange portion of the heat transfer plate 32 of the control board unit UC are provided on the outer surfaces of the substrate heat absorption portions 13da to 3dc and the substrate heat absorption portions 13ea to 13ed of the cooling member 13. The inner surfaces of 32ia to 32id are brought into contact with each other.

In this state, the fixing screws 34 are screwed into the female screw portions 13f of the substrate heat absorbing portions 13da to 13dc and 13ea to 13ed through the screw insertion holes 32j of the mounting flange portions 32ha to 32hc and 32ia to 32id, and tightened, thereby tightening the substrate heat absorption. The portions 13da to 13dc and 13ea to 13ed and the mounting flange portions 32ha to 32hc and 32ia to 32id are fixed.

The other configurations are the same as those of the first embodiment described above, and the same reference numerals are given to the corresponding portions to those in FIGS. 3 and 4 and the detailed description thereof will be omitted.
According to the second embodiment, the substrate heat absorbing portions 13da to 13dc and 13ea to 13ed of the cooling member 13 are formed through the through holes 12aa to 12ac formed in the case body 12 from the lower side of the case body 12 of the semiconductor power module 11. 12ba-12bd is inserted and protrudes upward.

The protrusions 13e and 13f of the heat transfer plate 32 of the control circuit board unit UC are placed on the upper ends of the substrate heat absorbing portions 13da to 13dc and 13ea to 13ed, and the outer surfaces of the substrate heat absorbing portions 13da to 13dc and 13ea to 13ed are mounted. The mounting flange portions 32ha to 32hc and the inner surfaces of 32ia to 32id are brought into contact with each other and fixed with fixing screws 34.
Therefore, as in the first embodiment, the heat generated by the heat generating circuit component 39 mounted on the lower surface side of the control circuit board 22 is transferred to the heat transfer plate 32 via the heat transfer member 35, and this heat transfer is performed. The heat transferred to the plate 32 is absorbed by the substrate heat absorbing portions 13da to 13dc and 13ea to 13ed of the cooling member 13 through the mounting flange portions 32ha to 32hc and 32ia to 32id.

The heat absorbed by the substrate heat absorbing portions 13da to 13dc and 13ea to 13ed is radiated from the bottom plate portion 13a to the cooling body 3. Therefore, the heat generated by the heat generating circuit component 39 mounted on the control circuit board 22 can be efficiently radiated to the cooling body 3 through the heat transfer member 35, the heat transfer plate 32, and the cooling member 13.
In other words, the heat generating circuit component 39 mounted on the control circuit board 22 through the cooling member 13, the heat transfer plate 32, and the heat transfer member 35 can be efficiently cooled by the cooling body 3.

Also in the second embodiment, the same effect as that of the first embodiment described above can be obtained. In the second embodiment, the substrate heat absorbing portions 13da to 13dc and 13ea to 13ed of the cooling member 13 are passed upward through the through holes 12aa to 12ac and 12ba to 12bd formed in the case body 12 of the semiconductor power module 11. It is extended. For this reason, the inside of the semiconductor power module 11 can be cooled by the substrate heat absorbing portions 13da to 13dc and 13ea to 13ed, and the cooling effect of the semiconductor power module 11 can be further improved.

In addition, in the said 1st and 2nd embodiment, although the case where the baseplate part 13a of the cooling member 13 contacted the upper surface of the cooling body 3 directly was demonstrated, it is not limited to this and is shown in FIG. It can also be configured as follows.
That is, an opening 61 reaching the water supply passage 3 c is formed at a central position on the upper surface of the cooling body 3 facing the lower surfaces of the semiconductor power module 11 and the cooling member 13, and the bottom plate portion 13 a of the cooling member 13 is formed around the opening 61 An O-ring 62 that contacts the lower surface of the substrate is disposed. On the other hand, a plurality of cooling fins 63 that are inserted into the opening 61 of the cooling body 3 are formed on the lower surface of the cooling member 13 that faces the opening 61.

The cooling member 13 is placed on the cooling body 3 so that the cooling fins 63 are inserted into the openings 61, and the case body 12 of the semiconductor power module 11 is placed on the cooling member 13. The semiconductor power module 11 and the cooling member 13 are fastened together with the screws 14. At this time, since the lower surface of the bottom plate portion 13a of the cooling member 13 contacts the O-ring 62, it is possible to prevent the cooling water filled in the opening 61 from leaking to the outside.

In this case, a plurality of cooling fins 63 are formed on the cooling member 13, and these cooling fins 63 are brought into contact with the cooling water through the openings 61 of the cooling body 3. For this reason, the cooling effect of the cooling member 13 can be further improved, the heat generating circuit components mounted on the semiconductor power module 11 and the control circuit board 22 can be radiated more efficiently, and the inside of the upper housing 2B The temperature rise can be reliably prevented.

In the first and second embodiments described above, the case where the power conversion device according to the present invention is applied to an electric vehicle has been described. However, the present invention is not limited to this, and a hybrid vehicle or a railway vehicle that travels on a rail. The present invention can also be applied to any electric drive vehicle. Furthermore, the power conversion device of the present invention can be applied to a case where an actuator such as an electric motor in other industrial equipment is driven as well as an electrically driven vehicle.

According to the present invention, the cooling member of the semiconductor power module has the substrate heat absorbing portion extending in the vicinity of the mounting substrate on which the circuit components including the heat generating circuit components are mounted. Provided a power converter that can absorb heat at the substrate heat absorption part of the cooling member that cools the heat and dissipate heat to the cooling body, and can reliably dissipate heat generated by the heat generating components of the mounting board without providing a separate heat dissipation path can do.

DESCRIPTION OF SYMBOLS 1 ... Power converter device, 2 ... Housing | casing, 2A ... Lower housing | casing, 2B ... Upper housing | casing, 3 ... Cooling body, 4 ... Film capacitor, 5 ... Storage battery storage part, 11 ... Semiconductor power module, 12 ... Case body, 12aa to 12ac, 12ba to 12bd ... through hole, 13 ... cooling member, 13a ... bottom plate, 13b, 13c, 13da to 13dc, 13ea to 13ea ... substrate heat absorbing part, 21 ... drive circuit board, 22 ... control circuit board, 24 ... Joint screw, 32 ... Heat transfer plate, 32a, 32b ... Projection, 32c, 32d ... Mounting flange, 32f, 32g ... Projection, 32ha-32hc, 32ia-32id ... Mounting flange, 35 ... Heat transfer member, 40 ... spacer (space adjusting member), 61 ... opening, 62 ... O-ring, 63 ... cooling fin

Claims (13)

  1. A semiconductor power module having a cooling member bonded to a cooling body on one surface;
    On the other side of the semiconductor power module, a mounting substrate on which circuit components including a heat generating circuit component for driving the semiconductor power module are mounted, and
    The power conversion device, wherein the cooling member has a substrate heat absorbing portion extending in the vicinity of the mounting substrate.
  2. 2. The power conversion device according to claim 1, wherein the substrate heat absorbing portion extends from one surface side of the semiconductor power module to the other surface side through the side surface of the semiconductor power module.
  3. The power conversion device according to claim 1, wherein the substrate heat absorption part extends from one side of the semiconductor power module to the other side through the inside of the semiconductor power module.
  4. A semiconductor power module in which a semiconductor switching element for power conversion is built in a case body, and a cooling member that contacts the cooling body is formed on one surface of the case body;
    Mounting a circuit component including a heat generating circuit component for driving the semiconductor switching element, and a mounting substrate supported at a predetermined interval between the other surface of the semiconductor power module;
    The cooling member has a substrate heat absorbing portion extending near the mounting substrate on the other surface side of the semiconductor power module.
  5. 5. The power conversion device according to claim 4, wherein the substrate heat absorbing portion extends from one surface side of the semiconductor power module to the other surface side through the side surface of the semiconductor power module.
  6. 5. The power conversion device according to claim 4, wherein the substrate heat absorbing portion extends from one side of the semiconductor power module to the other side through the inside of the semiconductor power module.
  7. The power conversion device according to any one of claims 1 to 6, further comprising a heat transfer plate that transfers heat generated by the mounting substrate to a substrate heat absorbing portion of the cooling member.
  8. The power conversion device according to claim 7, wherein a heat transfer member is interposed between the mounting substrate and the heat transfer plate.
  9. The power converter according to any one of claims 1 to 6, wherein the cooling member is made of a metal material having a high thermal conductivity.
  10. The power conversion device according to claim 7, wherein the heat transfer plate is made of a metal material having high thermal conductivity.
  11. The power conversion device according to claim 8, wherein the heat transfer member is formed of an insulating material.
  12. The power conversion device according to claim 8, wherein the heat transfer member is made of an elastic body having elasticity.
  13. The power conversion according to claim 8, wherein the heat transfer member is formed of an elastic body having elasticity, and the heat generating circuit component is mounted on the heat transfer member side mounting surface of the mounting board. apparatus.
PCT/JP2012/007310 2012-01-13 2012-11-14 Power conversion apparatus WO2013105166A1 (en)

Priority Applications (2)

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JP2012-005490 2012-01-13

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CN201280061309A CN103999343B (en) 2012-01-13 2012-11-14 Power conversion means

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000174180A (en) * 1998-12-02 2000-06-23 Shibafu Engineering Kk Semiconductor device
JP2004282804A (en) * 2003-03-12 2004-10-07 Toshiba Corp Inverter device
JP2005032912A (en) * 2003-07-10 2005-02-03 Hitachi Industrial Equipment Systems Co Ltd Power conversion apparatus
JP2009094175A (en) * 2007-10-05 2009-04-30 Hitachi Ltd Controller
JP2009159767A (en) * 2007-12-27 2009-07-16 Denso Corp Power conversion apparatus
JP2009240023A (en) * 2008-03-26 2009-10-15 Nidec Shibaura Corp Motor controller, brushless motor, and power tool

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3960189B2 (en) * 2002-10-10 2007-08-15 株式会社日立製作所 Power converter
JP4857017B2 (en) * 2006-04-27 2012-01-18 日立オートモティブシステムズ株式会社 Power converter

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000174180A (en) * 1998-12-02 2000-06-23 Shibafu Engineering Kk Semiconductor device
JP2004282804A (en) * 2003-03-12 2004-10-07 Toshiba Corp Inverter device
JP2005032912A (en) * 2003-07-10 2005-02-03 Hitachi Industrial Equipment Systems Co Ltd Power conversion apparatus
JP2009094175A (en) * 2007-10-05 2009-04-30 Hitachi Ltd Controller
JP2009159767A (en) * 2007-12-27 2009-07-16 Denso Corp Power conversion apparatus
JP2009240023A (en) * 2008-03-26 2009-10-15 Nidec Shibaura Corp Motor controller, brushless motor, and power tool

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CN103999343A (en) 2014-08-20
CN103999343B (en) 2017-05-10

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