CN220042760U - Sealed isolation type power box - Google Patents
Sealed isolation type power box Download PDFInfo
- Publication number
- CN220042760U CN220042760U CN202320859482.0U CN202320859482U CN220042760U CN 220042760 U CN220042760 U CN 220042760U CN 202320859482 U CN202320859482 U CN 202320859482U CN 220042760 U CN220042760 U CN 220042760U
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- China
- Prior art keywords
- heat
- heat conducting
- box body
- body shell
- electronic device
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- 238000002955 isolation Methods 0.000 title abstract description 5
- 229910052751 metal Inorganic materials 0.000 claims abstract description 36
- 239000002184 metal Substances 0.000 claims abstract description 36
- 230000017525 heat dissipation Effects 0.000 claims abstract description 28
- 229910002804 graphite Inorganic materials 0.000 claims description 20
- 239000010439 graphite Substances 0.000 claims description 20
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 19
- 239000003292 glue Substances 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 238000009434 installation Methods 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 229920003023 plastic Polymers 0.000 claims description 4
- 239000004033 plastic Substances 0.000 claims description 4
- 239000000741 silica gel Substances 0.000 claims description 4
- 229910002027 silica gel Inorganic materials 0.000 claims description 4
- 239000007769 metal material Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 230000005855 radiation Effects 0.000 claims 1
- 230000035939 shock Effects 0.000 abstract description 4
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000009423 ventilation Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a sealed isolation type power supply box, which comprises a box body shell, a heat conducting metal sheet, a heat radiating sheet and a combined heat conducting gasket, wherein the box body shell is used for providing a sealed type supporting and protecting structure, the bottom of the box body shell is an electronic device mounting area, and the top of the box body shell is a heat radiating area; one end of the heat conducting metal sheet is fixed in an electronic device mounting area at the inner bottom of the box body shell, and the other end of the heat conducting metal sheet extends and is fixed in a heat dissipation area at the inner top of the box body shell; the radiating fin is arranged outside the top of the box body shell and is tightly attached to the box body shell of the radiating area; the combined heat conducting pad is arranged between the heat conducting metal sheet and the electronic device and is used for improving the heat conducting capacity between the heat conducting metal sheet and the electronic device. According to the utility model, through the combination type heat conducting pad matched with the fully-closed structure design, the heat conducting pad has the waterproof, dampproof and shock-resistant properties under the condition of meeting the heat dissipation capability requirement, improves the adaptability to severe environments, and is particularly suitable for military electronic products.
Description
Technical Field
The utility model belongs to the field of electronic device packaging, and particularly relates to a sealed isolation type power supply box.
Background
In the prior art, in order to solve the heating problem of electronic devices such as power supplies and the like, air cooling is generally adopted for heat dissipation, and forced air cooling is adopted for heat dissipation in most cases, in order to solve the electronic shielding problem in the heat dissipation process, a waveguide window is often adopted as a ventilation opening, although the electromagnetic shielding and heat dissipation problems are solved to a certain extent, the problems of water resistance and moisture resistance cannot be solved, particularly for military electronic products, the service environment is severe, and the requirements on water resistance, moisture resistance and shock resistance are high; in order to solve the waterproof and dampproof problems, a general technical means is to use a sealing box body as a power supply shell, however, in the prior art, the sealing shell is difficult to meet the heat dissipation requirement due to the assembly problem and the heat conduction material problem; therefore, a power supply box body with a brand new heat dissipation structure is urgently needed, and the power supply box body has good waterproof and moistureproof effects on the premise of meeting heat dissipation.
Disclosure of Invention
The utility model aims to provide a sealed isolation type power box, which solves the problem that the heat dissipation capacity, the dampproof, the waterproof and the shock resistance of the power box cannot be achieved in the prior art.
In order to solve the technical problems, the utility model adopts the following technical scheme:
a sealed and isolated power box, comprising
The electronic device is wrapped in the box body shell, the electronic device is used for providing a sealed supporting and protecting structure, the bottom of the box body shell is an electronic device installation area, the top of the box body shell is a heat dissipation area, and the box body shell of the heat dissipation area is made of heat-conducting metal materials or heat-conducting plastics;
the heat conduction metal sheet is an integrated metal sheet, one end of the heat conduction metal sheet is fixed in an electronic device mounting area at the inner bottom of the box body shell, and the other end of the heat conduction metal sheet extends and is fixed in a heat dissipation area at the inner top of the box body shell;
the radiating fin is arranged outside the top of the box body shell and is tightly attached to the box body shell of the radiating area;
the combined heat conducting pad is arranged between the heat conducting metal sheet and the electronic device and is used for improving the heat conducting capacity between the heat conducting metal sheet and the electronic device.
The combined heat conducting pad comprises a heat conducting pad and a graphite layer attached to one side surface of the heat conducting substrate, and the graphite layer is arranged on one side close to the electronic device.
Preferably, the box body shell comprises a middle shell and end covers which are arranged at two ends of the middle shell and can be detached.
Preferably, a heat conducting window is formed in the middle of the top of the middle shell, a heat conducting plate is covered on the heat conducting window on the inner side of the middle shell, a groove is formed on the heat conducting plate, the heat radiating fin is arranged on the groove, and the lower side surface of the heat conducting plate is fixedly connected with the upper end of the heat conducting metal sheet in a heat conducting mode.
The utility model leads out heat to the top of the box body shell through the heat conducting metal sheet, leads out through the heat conducting plate, and then dissipates heat to the air through the radiating fin.
Compared with the prior art, the utility model has the following beneficial effects:
the utility model adopts a totally-enclosed structure, and is superior to the prior art in terms of the technical principle of wind cooling heat dissipation in terms of water resistance, moisture resistance and shock resistance. The utility model solves the problem of low heat dissipation efficiency caused by the fact that the heat conduction metal sheets cannot be tightly attached in the installation process of the electronic device by arranging the combined heat conduction gasket, so that the utility model can meet the heat dissipation capability requirement of the electronic device under the condition of not adopting forced ventilation.
Drawings
Fig. 1 is a schematic structural diagram of a sealed and isolated power box according to an embodiment of the utility model.
Fig. 2 is a top view of a sealed and isolated power box.
Fig. 3 is a side view of a sealed and isolated power box.
Fig. 4 is a schematic structural view of a combined heat conductive pad.
Fig. 5 is a schematic structural view of a combined heat conducting pad with a back adhesive.
Fig. 6 is a schematic diagram of the case housing structure.
Fig. 7 is a schematic view of a heat conductive metal sheet.
Fig. 8 is a schematic view of the electronic device installation within the intermediate housing.
100-of a box shell, 101-of a middle shell, 102-of an end cover, 103-of a heat conduction window, 104-of a heat conduction plate, 105-of a boss and 106-of a bolt; 200-heat conduction metal sheets, 201-first heat conduction parts, 202-intermediate heat conduction parts, 203-second heat conduction parts; 300-heat sink; 400-first combined heat-conducting pad, 401-heat-conducting pad, 402-graphite layer, 403-back glue, 500-second combined heat-conducting pad 401, 600-electronic device, 601-set screw, 602-skirt board.
Detailed Description
Embodiments of the present utility model are described in further detail below with reference to the accompanying drawings and examples. The following examples are illustrative of the utility model but are not intended to limit the scope of the utility model.
As shown in fig. 1-3, a sealed and isolated power box comprises
The electronic device 600 is wrapped in the box body housing 100, and is used for providing a sealed supporting and protecting structure, the bottom of the box body housing 100 is an electronic device 600 installation area, the top of the box body housing 100 is a heat dissipation area, and the box body housing 100 of the heat dissipation area is made of a heat-conducting metal material or a heat-conducting plastic;
the heat conductive metal sheet 200 is an integrated metal sheet, one end of which is fixed at the mounting area of the electronic device 600 at the inner bottom of the case housing 100, and the other end of which extends and is fixed at the heat dissipation area at the inner top of the case housing 100;
the radiating fin 300 is arranged outside the top of the box body housing 100 and is tightly attached to the box body housing 100 of the radiating area;
the first combined heat conductive pad 400 is disposed between the heat conductive metal sheet 200 and the electronic device 600, for improving heat conductive capability between the heat conductive metal sheet 200 and the electronic device 600.
The electronic device 600 of the present utility model is not limited to a power supply, and includes a circuit board or a controller on the circuit board, etc. which require heat dissipation components, when in installation, a portion to be heat-dissipated is attached to the first combined heat conductive pad 400, and heat is efficiently conducted to the metal heat sink 300 through the deformation capability of the first combined heat conductive pad 400, and is conducted to a heat dissipation area at the inner top of the case housing 100 through the metal heat sink 300, and then is dissipated to the outside air through the heat sink 300.
As a specific example, as shown in fig. 4, the first combined heat-conducting pad 400 includes a heat-conducting pad 401 and a graphite layer 402 attached to a surface of one side of the heat-conducting substrate, where the graphite layer 402 is disposed on a side close to the electronic device 600; the heat conducting pad 401 is a heat conducting silica gel pad, and the thickness is 0.5-3mm. The heat-conducting silica gel gasket adopted by the utility model has certain deformability, can well fill gaps between the metal radiating fin 300 and the electronic device 600, transfers heat, and particularly improves the heat-conducting capability obviously in the case of uneven surface of the electronic device 600; the common product types are XK-P80, XK-P60, XK-P50, XK-P45, XK-P30, XK-P20 and XK-P10. The graphite layer 402 is a graphite sheet commonly used in the prior art, and the graphite sheet has very good heat conduction performance in the plane direction, so that when the graphite sheet contacts with the electronic device 600, heat can be rapidly dispersed, the electronic device 600 is rapidly cooled, and the contact area between the graphite sheet and the heat conduction pad 401 is large, so that the heat can be well transferred to the heat conduction pad 401. The thickness of the graphite flake in the prior art is usually 0.03-2.0mm, and the graphite flake is thinner, for example, 0.05-0.15mm, so that the bonding capability between the graphite flake and the electronic device 600 is better, and meanwhile, the integral heat dissipation performance is not influenced because the heat dissipation capability in the direction perpendicular to the plane is not strong.
As an improved embodiment, as shown in fig. 5, a back adhesive 403 fixedly connected to the electronic device 600 is disposed on a back surface of the heat conducting pad 401 opposite to the graphite layer 402, and the back adhesive 403 may be a heat conducting adhesive coated on a side surface of the heat conducting pad 401 or may be a heat conducting double sided adhesive. The specific glue type of the back glue 403 may be ultra-high temperature heat-conducting glue, organic silicon heat-conducting glue, epoxy resin AB glue, polyurethane glue or heat-conducting silicone grease, etc.
As shown in fig. 2, 3 and 6, the case housing 100 includes a middle housing 101 and end caps 102 detachably disposed at two ends of the middle housing 101, a heat conducting window 103 is provided in the middle of the top of the middle housing 101, a heat conducting plate 104 is covered on the heat conducting window 103 inside the middle housing 101, the heat conducting plate 104 and the heat conducting window 103 above the heat conducting plate 104 together form a groove, the heat sink 300 is mounted in the groove, and the lower side surface of the heat conducting plate 104 is fixedly connected with the upper end of the heat conducting metal sheet 200 in a heat conducting manner. The heat-conducting plate 104 is made of a metal plate with good heat-conducting property, such as a copper plate, so that the material of the box housing 100 can be used without limitation, such as a plastic housing or an iron housing with low cost.
In some embodiments, as shown in fig. 6, the middle casing 101 around the heat conducting window 103 protrudes downwards to form a boss 105, so that the heat conducting plate 104 is convenient to install, and the heat conducting plate 104 can be fixed on the boss 105 by bolts 106 or can be fixed on the boss 105 by welding.
In some embodiments, as shown in fig. 3, the end cover 102 is fixed at an end of the middle housing 101 by using bolts 106 to achieve detachable connection, and the end cover 102 may be made of the same material as the middle housing 101 or different materials, such as engineering plastics, iron shells, aluminum shells, and the like.
In some embodiments, as shown in fig. 7, the heat conducting metal sheet 200 is a copper sheet, and the copper sheet is bent in the middle to form a U shape, and includes a first heat conducting portion 201 at the bottom, a second heat conducting portion 203 at the top, and a middle heat conducting portion 202 connecting the two heat conducting portions, where the first heat conducting portion 201 is disposed on the inner bottom surface of the middle case 101, and is used for conducting out heat on the electronic device 600, and the second heat conducting portion 203 is fixed on the heat conducting plate 104 at the top in the middle case 101; because the bottom heat conduction surface of the electronic device 600 is often uneven and needs to be assembled, the first combined heat conduction pad 400 is required to be provided to improve the contact tightness; since the first heat conduction portion 201 and the second heat conduction portion 203 are intended to be in contact heat conduction, and require a large area, they may be provided in a thin plate shape, and the intermediate heat transfer portion 202 is used for heat transfer, and thus may be provided in a narrow band shape.
As shown in fig. 8, the electronic device 600 is provided with a skirt 602 around for fixing, the skirt 602 is provided with a plurality of screw holes, the electronic device 600 can be fixed on the inner bottom plate of the middle housing 101 (corresponding screw holes are provided on the bottom plate) by fixing screws 601, and the first combined heat conducting pad 400 and the first heat conducting portion 201 below the electronic device 600 can be tightly pressed by screws, so that heat on the electronic device 600 can be efficiently transferred to the heat conducting metal sheet 200, and meanwhile, the first combined heat conducting pad 400 has elasticity and has better anti-seismic performance.
It should be noted that, the second heat conducting portion 203 of the heat conducting metal sheet 200 and the heat conducting plate 104 may be welded, screwed or glued to each other, and the heat dissipation performance is not affected by these fixing methods because the contact area between the second heat conducting portion 203 and the heat conducting plate 104 is large and the flatness of the plane is good.
As shown in fig. 1, in some embodiments, since the bottom of the heat sink 300 is not sufficiently processed to be flat or the heat sink 300 is not firmly installed and fixed, and cannot be fixed in a welded form, a second combined heat conductive pad 500 for improving heat dissipation capability may be provided between the bottom of the heat sink 300 and the heat conductive plate 104, the type of the second combined heat conductive pad 500 is identical to that of the first combined heat conductive pad 400, and the graphite layer 402 of the second combined heat conductive pad 500 is disposed at a side contacting the heat sink 300.
It should be noted that, the heat sink 300 is an air heat sink 300 commonly used in the prior art, and the specific shape and structure do not affect the implementation of the technical solution of the present utility model, so the present utility model is not repeated.
The above embodiments are only for illustrating the present utility model, and are not limiting of the present utility model. While the utility model has been described in detail with reference to the embodiments, those skilled in the art will appreciate that various combinations, modifications, and substitutions can be made thereto without departing from the spirit and scope of the utility model as defined in the appended claims.
Claims (7)
1. A sealed and isolated power box is characterized by comprising
The electronic device is wrapped in the box body shell, the electronic device is used for providing a sealed supporting and protecting structure, the bottom of the box body shell is an electronic device installation area, the top of the box body shell is a heat dissipation area, and the box body shell of the heat dissipation area is made of heat-conducting metal materials or heat-conducting plastics;
the heat conduction metal sheet is an integrated metal sheet, one end of the heat conduction metal sheet is fixed in an electronic device mounting area at the inner bottom of the box body shell, and the other end of the heat conduction metal sheet extends and is fixed in a heat dissipation area at the inner top of the box body shell;
the radiating fin is arranged outside the top of the box body shell and is tightly attached to the box body shell of the radiating area;
the combined heat conducting gasket is arranged between the heat conducting metal sheet and the electronic device and is used for improving the heat conducting capacity between the heat conducting metal sheet and the electronic device;
the combined heat conducting pad comprises a heat conducting pad and a graphite layer attached to one side surface of the heat conducting substrate, and the graphite layer is arranged on one side close to the electronic device.
2. The sealed and isolated power box of claim 1, wherein: the heat conducting pad is a heat conducting silica gel pad with the thickness of 0.5-3mm.
3. The sealed and isolated power box of claim 1, wherein: the graphite layer is a graphite sheet, and the surface of the graphite sheet is provided with back glue fixedly connected with the heat-conducting silica gel gasket or the electronic device.
4. The sealed and isolated power box of claim 1, wherein: the heat conduction metal sheet is a copper sheet, and the middle of the copper sheet is bent to form a U shape.
5. The sealed and isolated power box of claim 1, wherein: the box body shell comprises a middle shell and end covers which are arranged at two ends of the middle shell and can be detached.
6. The sealed and isolated power box of claim 5, wherein: the heat conduction window is arranged in the middle of the top of the middle shell, the heat conduction window on the inner side of the middle shell is covered with the heat conduction plate, the heat conduction window above the heat conduction plate forms a groove, the radiating fin is arranged in the groove, and the lower side surface of the heat conduction plate is fixedly connected with the upper end of the heat conduction metal sheet in a heat conduction mode.
7. The sealed and isolated power box of claim 1, wherein: and a combined heat conducting pad for improving heat radiation capacity is arranged between the bottom of the radiating fin and the heat conducting plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320859482.0U CN220042760U (en) | 2023-04-14 | 2023-04-14 | Sealed isolation type power box |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320859482.0U CN220042760U (en) | 2023-04-14 | 2023-04-14 | Sealed isolation type power box |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220042760U true CN220042760U (en) | 2023-11-17 |
Family
ID=88721112
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320859482.0U Active CN220042760U (en) | 2023-04-14 | 2023-04-14 | Sealed isolation type power box |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220042760U (en) |
-
2023
- 2023-04-14 CN CN202320859482.0U patent/CN220042760U/en active Active
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant |