KR20230020313A - Electronic device units and modules with improved heat dissipation, and elastic clamp applied to the same - Google Patents

Abstract

The present invention relates to an electronic device unit and module with improved heat dissipation using an elastic clamp, and more specifically, to an electronic device unit and module in which the heat dissipation performance is improved by comprising an elastic clamp for pressing and fixing a power component toward a housing so that the power component and the housing come into close contact with each other.

Description

Electronic device units and modules with improved heat dissipation performance, and elastic clamps applied thereto

The present invention relates to an electronic element unit and module with improved heat dissipation performance using an elastic clamp, and more particularly, by constructing an elastic clamp for pressurizing and fixing a power component to a housing side, heat dissipation performance by bringing a power component and a housing into close contact with each other. It relates to an electronic element unit and module that improves.

Recently, as part of reducing carbon emissions, interest in eco-friendly vehicles is increasing. Battery Electric Vehicles (BEVs) and Hybrid Electric Vehicles (HEVs), which are eco-friendly vehicles, use electricity as a power source. It is composed of elements and the most important thing is to control electricity.

At this time, a large number of PCBs (Printed Circuit Boards) are used for electrical control, and most of the parts consume power as switching elements to generate a lot of heat, so structural control for heat dissipation is required.

In the case of power components such as FET or DIODE among heat-generating components, the assembly method affects heat dissipation performance and package size, so the component structure is one of the important factors in determining the overall electronic component design concept.

When power components are arranged horizontally, a structure that can effectively dissipate heat is possible, but the size of the product must be larger than that of vertical placement, and components such as metal PCB, bolts (1ea per part), and TIM are added, which is a factor in increasing the unit price. do.

When power components are placed vertically on the PCB, they may be vulnerable to heat dissipation compared to horizontal placement. In particular, when assembling using clamps, plastic deformation of the clamps occurs and the force to adhere power components is insufficient, heat dissipation of power components problems may arise.

1 (a) is a view showing a structure in which power components of a conventional electronic device module are vertically arranged, and FIG. 1 (b) is a configuration exploded view of a conventional electronic device module in a state in which power components are vertically arranged. c) is a side cross-sectional view of a conventional electronic device module in a state in which power components are vertically arranged. Referring to FIGS. 1(a) to 1(c) , it can be seen that in a conventional electronic device module in which power components are vertically arranged, a clamp fixed with bolts presses and fixes the power components toward the housing. Here, it can be seen that the conventional electronic device module has a structure in which power parts closely attached to the housing are cooled by cooling water flowing inside the housing.

However, in the conventional electronic device module, when the clamp is plastically deformed due to heat or fatigue failure, the force for fixing the power component is reduced and the power component does not come into close contact with the housing, which may cause heat dissipation problems. In addition, the conventional electronic device module may require a plurality of connecting members such as bolts for fixing the clamp, which may complicate the assembling process.

Therefore, it is necessary to develop an electronic device module having improved heat dissipation performance and solving the above problems by designing a structure of an electronic device module capable of attaching power components to a housing while vertically arranging power components on a PCB.

Korean Patent Publication No. 10-2016-0005523 Korean Patent Publication No. 10-2019-0028079

The present invention has been made to solve the above problems, and an object of the present invention is to provide an electronic element unit and module with improved heat dissipation performance of power components vertically disposed on a PCB.

Another object of the present invention is to provide an elastic clamp capable of continuously adhering a power component to a housing for effective heat dissipation.

In addition, an object of the present invention is to provide an electronic device module in which an assembly process is simplified through fitting, pressing and fixing between components of the electronic device module so that connecting members such as bolts and screws are unnecessary.

An electronic element unit according to an embodiment of the present invention includes a housing; PCB (Printed Circuit Board) located on the upper side of the housing; power components arranged in a direction perpendicular to the PCB; an elastic clamp for fixing the power component; a heat dissipation pad positioned between the clamp and the power component; and a top cover that is coupled to the housing and covers the PCB, the power component, and the elastic clamp.

Here, the elastic clamp may fix the power component by pressing it toward the housing.

In one embodiment, the elastic clamp may bring the power component into close contact with the housing through pressure generated when the top cover is coupled to the housing.

In one embodiment, the elastic clamp may be fitted and coupled with a coupling rail formed inside the top cover.

In one embodiment, the power component may be cooled on both sides through the housing and the heat dissipation pad.

In one embodiment, the heat dissipation pad is made of a soft material and may make surface contact with the elastic clamp and the power component.

An elastic clamp according to an embodiment of the present invention is an electronic device module that accommodates a power component fixed therein by a clamp and has an outer wall consisting of a top cover, comprising: a pair of barrier ribs facing each other; and a connecting portion connecting the barrier ribs.

Here, the pair of barrier ribs, a first barrier rib coupled to the top cover; and a second barrier rib in close contact with the power component.

In one embodiment, when the pair of barrier ribs are made of an elastic material and pressed inward by an external force, a repulsive force may be generated outward.

In one embodiment, the first barrier rib may be formed with a slit having a predetermined length.

In one embodiment, when the first barrier rib is pressed to the inside of the slit by an external force, a repulsive force may be generated to the outside of the slit.

In one embodiment, the first barrier rib is fitted with the top cover, and an embossed protrusion outwardly may be formed to increase the coupling force of the fitting.

In one embodiment, the first barrier rib, press-fit protrusion formed on the side portion to increase the coupling force of the fitting; may further include.

An electronic device module according to an embodiment of the present invention includes a housing; PCB (Printed Circuit Board) located on the upper side of the housing; a plurality of power components arranged in a vertical direction on the PCB; a plurality of elastic clamps respectively fixing the plurality of power components; a plurality of heat dissipation pads respectively positioned between the plurality of clamps and the power component; and a top cover that is coupled to the housing and covers the PCB, the power component, and the elastic clamp.

Here, the elastic clamp may press and fix the power component toward the housing.

In one embodiment, the plurality of power components may be arranged in a line.

In one embodiment, the top cover may be formed with a plurality of coupling rails on the inside so that the elastic clamp is fitted.

In one embodiment, the heat dissipation pad may extend in a direction in which the power component is disposed and contact a plurality of the power component.

In one embodiment, an insulating member positioned between the housing and the power component; may further include.

According to the present invention, an effect of simultaneously improving assemblability and heat dissipation performance of power components vertically disposed on a PCB may occur.

In addition, according to the present invention, in fixing power components, an effect of bringing the power components into close contact with the housing as uniformly as possible can occur through the pressing and fixing method of the elastic clamp.

In addition, according to the present invention, by pressurizing and fixing the power component using a structure in which a clamp and a top cover are combined, cost reduction and assembly man-hours can be shortened through simplifying the assembly process.

1 is a view showing a structure in which power components of a conventional electronic device module are vertically arranged;
2 is a cross-sectional view showing the structure of an electronic element unit according to an embodiment of the present invention.
3 is a view showing a coupling form of an elastic clamp and a top cover according to an embodiment of the present invention.
Figure 4 is a perspective view showing the structure of an elastic clamp according to an embodiment of the present invention.
5 is a front view and a side view showing the structure of an elastic clamp according to an embodiment of the present invention.
6 is a perspective view and an exploded view showing the structure and configuration of an electronic device module according to an embodiment of the present invention.

The detailed description of the present invention is intended to completely explain the present invention to those skilled in the art. Throughout the specification, when a part is said to “include” a certain component or to “characterize” a certain structure or shape, this excludes other components or excludes other structures and shapes unless otherwise stated. It does not mean that it does, but it can include other components, structures and shapes.

Since the present invention can apply various transformations and have various embodiments, specific embodiments will be presented and described in detail in the detailed description. However, this is not intended to limit the content of the invention by the examples, and should be understood to include all conversions, equivalents, or substitutes included in the spirit and technical scope of the present invention.

<Electronic element unit>

2 is a cross-sectional view showing the structure of an electronic element unit 100 according to an embodiment of the present invention. Referring to FIG. 2 , the electronic element unit 100 may include a housing 10, a PCB 20, a power part 30, an elastic clamp 40, a heat dissipation pad 50, and a top cover 60. there is. A description of each component is as follows.

The housing 10 provides a space in which components of an electronic device, such as a PCB 20 to be described later, are mounted. The housing 10 is in contact with a power component 30 to be described later and includes a metal material having excellent heat conductivity emitted from the power component 30 . In particular, the housing 10 may be made of a metal material such as aluminum having excellent thermal conductivity.

The PCB 20 is a printed circuit board, and a circuit diagram is drawn on its outer surface, and a power component 30 to be described later is mounted thereon, so that a plurality of power components 30 can be electrically connected. In one embodiment, the PCB 20 may be mounted on the upper side of the housing 10 .

The power component 30 is configured to be operated by an electrical signal, and may be mounted by inserting a lead portion having a predetermined length into the PCB 20 . The power component 30 may be mounted on the PCB 20 in such a way that lead portions are soldered. Here, the power component 30 may be disposed in a vertical direction of the PCB 20 .

In one embodiment, one surface of the power component 30 may come into contact with the housing 10 and be cooled by cooling water flowing inside the housing 10 . That is, heat emitted from the power component 30 may be transferred through the housing 10 that is in surface contact with the power component 30 and dissipated to the outside.

In addition, the power component 30 may be in surface contact with a heat dissipation pad 50 to be described later on the other surface opposite to one surface in contact with the housing 10 . Here, the power component 30 may be cooled on both sides by dissipating heat to the outside by the housing 10 and the heat dissipation pad 50 .

Furthermore, as described above, the electronic element unit 100 according to an embodiment of the present invention increases the heat dissipation efficiency of the power component 30 to secure a sufficient lifespan of the power component 30 without cooling water in the housing 10. can do. Accordingly, the electronic device unit 100 according to an exemplary embodiment of the present invention can reduce the overall package size by the area of the cooling water passage in the housing 10 .

The elastic clamp 40 serves to fix the power component 30, and for this purpose, the power component 30 may be fixed by pressing one side. In one embodiment, the elastic clamp 40 may be fixed by pressing the power component 30 toward the housing 10 so as to come into close contact with the housing 10 .

In one embodiment, the elastic clamp 40 may be combined with the top cover 60 to be described later, and when the top cover 60 and the housing 10 are coupled, the pressure applied inward by the top cover 60 The elastic clamp 40 may be fixed by pressing. At this time, the elastic clamp 40 may bring the power component 30 into close contact with the housing 10 through pressure coupled between the top cover 60 and the housing 10 .

In one embodiment, the elastic clamp 40 may be fitted and coupled with a coupling rail 61 formed on the inside of the top cover 60 to be described later. Specifically, the elastic clamp 40 may be coupled to the top cover 60 and fixed to the inside of the top cover 60, and pressurized and fixed to the inside by a coupling force between the top cover 60 and the housing 10. can That is, the elastic clamp 40 can be pressurized and fixed to the electronic device unit 100 without a connecting member such as a bolt for being fixed to the housing 10, unlike conventional electronic device clamps.

The heat dissipation pad 50 is interposed between the elastic clamp 40 and the power component 30, and can dissipate heat emitted from the power component 30 to the elastic clamp 40 and the outside. Here, the heat dissipation pad 50 is made of a soft material and is in surface contact with the elastic clamp 40 and the power component 30 to efficiently dissipate heat emitted from the power component 30 .

In one embodiment, the heat dissipation pad 50 is preferably made of TIM (THERMAL INTERFACE MATERIAL), which is a thermal conductive material capable of lowering the contact resistance between the elastic clamp 40 and the power component 30.

The top cover 60 is combined with the housing 10 to prevent other components such as the PCB 20, the power component 30, and the elastic clamp 40 from being exposed to the outside. In order to perform this role, the top cover 60 may be configured to cover the entire exterior of the electronic device unit 100 so that all internal components of the electronic device unit 100 are covered.

Figure 3 is a view showing the coupling form of the elastic clamp 40 and the top cover 60 according to an embodiment of the present invention. Referring to FIG. 3 , the top cover 60 may be fitted and coupled with the elastic clamp 40, and for this purpose, a coupling rail 61 suitable for the size of the elastic clamp 40 may be formed inside.

Here, the coupling rail 61 may be configured in the form of a rail protruding in an L-shape in cross section, and one or more coupling rails 61 are formed so that one side of the elastic clamp 40 is between the coupling rails 61 It can be inserted and fixed.

<Elastic clamp>

4 is a perspective view showing the structure of an elastic clamp 40 according to an embodiment, and FIGS. 5 (a) and 5 (b) show the structure of an elastic clamp 40 according to an embodiment of the present invention. It is a front view and a side view. Referring to FIGS. 4, 5(a) and 5(b) , the elastic clamp 40 may include a pair of barrier ribs 41 and a connection portion 42. Due to this structure, the partition walls 41 of the elastic clamp 40 can be pressed inward to each other by an external force, and the partition walls 41 made of an elastic material can generate a repulsive force against the external force in an outward direction. That is, the elastic clamp 40 may be formed of a spring structure having elasticity against the longitudinal deformation of the partition wall 41 .

In one embodiment, the partition wall 41 may include a first partition wall 41a and a second partition wall 41b. Specifically, the partition wall 41 may include a first partition wall 41a coupled to the top cover 60 and a second partition wall 41b contacting the power component 30 .

In one embodiment, the first barrier rib 41a may include a slit 1 formed in a central portion with a predetermined length from the upper side. Here, the slit 1 serves to form elasticity in the left and right deformation of the elastic clamp 40 . Specifically, when the first barrier rib 41a is pressed to the inside of the slit 1 by an external force, a repulsive force may be generated to the outside of the slit 1 . That is, the elastic clamp 40 may be formed as a spring structure having elasticity against deformation in the left and right directions due to the slit 1 .

In one embodiment, the slit 1 may be formed from the upper side to the lower side such that the first partition wall 41a has a U-shape.

In one embodiment, the first barrier rib 41a may be fitted with the top cover 60, and an embossed protrusion 2 may be formed outward to increase the bonding strength of the fitting. Here, the protrusion 2 guides the first partition wall 41a to come into close contact with the inside of the coupling rail 61 when the first partition wall 41a is inserted into the coupling rail 61 of the top cover 60, so that the fitting is coupled. bonding strength can be improved. At the same time, it is possible to induce an improvement in the coupling force of the fitting through the frictional force between the protrusion 2 and the top cover 60 .

In one embodiment, the first barrier rib (41a) may be formed with a press-fitting protrusion (3) on the side portion to increase the coupling force of the fitting. Here, the press-fitting protrusion 3 is inserted into the groove formed inside the coupling rail 61 when the first partition wall 41a is inserted into the coupling rail 61 of the top cover 60 and fitted. The bonding strength of the bond can be improved.

<Electronic device module>

6(a) and 6(b) are a perspective view and an exploded view illustrating the structure and configuration of an electronic device module 1000 according to an embodiment of the present invention. 6(a) and 6(b), the electronic device module 1000 includes a housing 10, a PCB 20, a plurality of power parts 30, a plurality of elastic clamps 40, a plurality of It may be composed of a heat dissipation pad 50 and a top cover 60 . That is, the electronic device module 1000 may be formed by disposing a plurality of electronic device units 100 in one housing 10 and top cover 60 .

In one embodiment, in the electronic device module 1000 , a plurality of power parts 30 may be arranged in a row in the housing 10 . Here, the heat dissipation pad 50 may be formed to extend in a direction in which the plurality of power components 30 are disposed. That is, one heat dissipation pad 50 may be in contact with the plurality of power components 30 to dissipate heat emitted from the plurality of power components 30 .

In one embodiment, a plurality of coupling rails 61 may be formed on the inside of the top cover 60 so as to be fitted and coupled to each of the plurality of elastic clamps 40 . Here, the plurality of coupling rails 61 may be arranged according to the positions of the plurality of elastic clamps 40 .

In one embodiment, the electronic device module 1000 may further include an insulating member 70 interposed between the housing 10 and the power component 30 . The insulating member 70 serves to block electricity from flowing from the power component 30 to the housing 10 . In order to fulfill this role, the insulating member 70 does not contain a conductive material, has a uniform density and thickness, and covers all outer surfaces of the power component 30 in contact with the housing 10. That is, the insulating member 70 is interposed between the power component 30 and the housing 10 to prevent power from flowing between the power booster 30 and the housing 10, thereby preventing malfunction of the power component 30.

Although described with reference to the preferred embodiments of the present invention, those skilled in the art will variously modify and change the present invention within the scope not departing from the spirit and scope of the present invention described in the claims below. You will understand that it can be done.

1000: electronic element module
100: electronic element unit
10: housing
20: PCB
30: power parts
40: elastic clamp
41: bulkhead, 41a: first bulkhead, 41b: second bulkhead
42: connection part
50: heat dissipation pad
60: top cover 61: coupling rail
70: insulation member
1: slit, 2: protrusion, 3: press-in projection

Claims (16)

housing;
PCB (Printed Circuit Board) located on the upper side of the housing;
power components arranged in a direction perpendicular to the PCB;
an elastic clamp for fixing the power component;
a heat dissipation pad positioned between the clamp and the power component; and
A top cover combined with the housing to cover the PCB, the power part, and the elastic clamp; includes,
The elastic clamp,
Pressing and fixing the power component toward the housing
An electronic element unit characterized by a.
According to claim 1,
The elastic clamp,
Adhering the power component to the housing through pressure generated when the top cover is coupled to the housing
An electronic element unit characterized by a.
According to claim 1,
The elastic clamp,
To be fitted with a coupling rail formed on the inside of the top cover
An electronic element unit characterized by a.
According to claim 1,
The power component,
Cooling on both sides through the housing and the heat dissipation pad
An electronic element unit characterized by a.
According to claim 1,
The heat dissipation pad,
Made of a soft material and making surface contact with the elastic clamp and the power part
An electronic element unit characterized by a.
In the electronic device module, which accommodates power components fixed by clamps therein and whose outer wall is composed of a top cover,
A pair of bulkheads facing each other; and
Including; a connection portion connecting the barrier ribs,
The pair of bulkheads,
a first barrier rib coupled to the top cover; and
Consisting of a second barrier rib in close contact with the power component
An elastic clamp for an electronic element unit, characterized in that.
According to claim 6,
The pair of bulkheads,
It is made of an elastic material, and when it is pressed inward by an external force, a repulsive force is generated outward.
An elastic clamp for an electronic element unit, characterized in that.
According to claim 6,
The first bulkhead,
A slit of a certain length is formed
An elastic clamp for an electronic element unit, characterized in that.
According to claim 8,
The first bulkhead,
When the inside of the slit is pressed by an external force, a repulsive force is generated outside the slit
An elastic clamp for an electronic element unit, characterized in that.
According to claim 6,
The first bulkhead,
It is fitted and coupled with the top cover,
Formed with an embossed protrusion to the outside so that the bonding force of the fitting is increased.
An elastic clamp for an electronic element unit, characterized in that.
According to claim 10,
The first bulkhead,
Further comprising a press-fitting protrusion formed on the side portion so as to increase the bonding force of the fitting coupling.
An elastic clamp for an electronic element unit, characterized in that.
housing;
PCB (Printed Circuit Board) located on the upper side of the housing;
a plurality of power components arranged in a vertical direction on the PCB;
a plurality of elastic clamps respectively fixing the plurality of power components;
a plurality of heat dissipation pads respectively positioned between the plurality of clamps and the power component; and
A top cover combined with the housing to cover the PCB, the power part, and the elastic clamp; includes,
The elastic clamp,
Pressing and fixing the power component toward the housing
An electronic device module, characterized in that.
According to claim 12,
The plurality of power components,
arranged in a row
An electronic device module, characterized in that.
According to claim 12,
The top cover,
A plurality of coupling rails are formed on the inside so that the elastic clamp is fitted and coupled.
An electronic device module, characterized in that.
According to claim 12,
The heat dissipation pad,
Extending in the direction in which the power component is disposed and making contact with a plurality of the power component
An electronic device module, characterized in that.
According to claim 12,
Further comprising an insulating member located between the housing and the power component.
An electronic device module, characterized in that.

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