CN209089331U - Cabinet with semiconductor power device heat dissipation base - Google Patents

Abstract

A kind of cabinet with semiconductor power device heat dissipation base, the heat dissipation base are made of the seat stand and seat back for being rendered as L shape after combining, and have filleting on the seat stand of heat dissipation base, for being embedded in the tail portion for compressing elastic slice.The heat dissipation base has the identical unit of multiple structures, each unit is for installing a semiconductor power device, the structure of each unit is rendered as " L ", has gusset for being isolated between unit and unit, and the heat dissipation base is composed after arranging such as individual unit.

Description

Cabinet with semiconductor power device heat dissipation base

Technical field

The utility model, which belongs to, is driven by electricity technical field, in particular to a kind of to have semiconductor power device heat dissipation base Cabinet.

Background technique

The fields such as new-energy automobile, rail traffic, Industry Control at present, as Vehicular charger, DC converter, exchange are handed over Parallel operation and the two-in-one system of aforementioned system integrate and three-in-one system is integrated etc., can all use MOSFET, IGBT semiconductor In power electronic device set to pcb board, to realize the switch control of circuit.Due to MOSFET, IGBT electronic device is in reality In the switch control of existing circuit reliably, accurately, the advantages that service life is long, and working frequency is high, thus be widely used.However The power loss of MOSFET, IGBT electronic device itself can bring serious fever, how solve device temperature rise, guarantee circuit just Often work, becoming must solve the problems, such as in design of circuit system.

When in MOSFET, IGBT power electronic device set to pcb board, the existing method for solving heat dissipation problem is adopted mostly Fixation is bonded with thermal component with by power device screw, just there are be used to lock-screw for needs in structure design in this way The working space of Wrench.The design limitation effective use of casing structure, causes the cabinet volume to become larger, and weight increases, So that material and assembling cost can all increase.

Utility model content

The utility model provides a kind of cabinet with semiconductor power device heat dissipation base, to solve existing power electronic The problem of device poor heat radiation.

One of the utility model embodiment, a kind of cabinet with semiconductor power device heat dissipation base, the heat dissipation base It is made of the seat stand and seat back that are rendered as L shape after combining, there is filleting on the seat stand of heat dissipation base, compress elastic slice for being embedded in Tail portion.The heat dissipation base has the identical unit of multiple structures, and each unit is used to install a semiconductor power device, The structure of each unit is rendered as " L ", has gusset for being isolated between unit and unit, and the heat dissipation base is as single single It is composed after identical permutation.

Heat dissipation base and chassis backplane or chassis shell body are integrally formed.The outer surface of the chassis backplane has for cooling down Water channel, which is used for the coolant liquid of cooling housing temperature of circulating.

Technical solution used by the utility model, functionally essence are a kind of semiconductor power dissipation from electronic devices compressions Structure including heat dissipation base, polymer insulation gasket, compresses the electronics such as elastic slice and its MOSFET or IGBT that need radiating treatment Device.

Heat dissipation base structure uses aluminum alloy material, at low cost, manufactures mature production technology, and thermal diffusivity is high.Macromolecule Insulation spacer structure, material use macromolecule polymer material, have at low cost, versatility height, and insulating properties is high.The compression Elastic piece structure, material are stainless steel material, and elasticity is good, and intensity is high, and corrosion resistance is good, the electronic devices collection such as MOSFET or IGBT It closes and is used on pcb board as power device.

In the present invention, heat dissipation base can be die casting, produced using die casting, have production technology at The advantages that ripe, suitable to produce in enormous quantities, high production efficiency, precision is high, at low cost, is convenient for following process.

Polymer insulation gasket is cutting part, is wrapped using high-volume, is then cut using stamping die, has life Produce high-efficient, yield is big, and yield is high, at low cost, versatility it is good in order to standardize use the advantages that.

Compression elastic slice is sheet metal component, using stamping die, convenient for producing in enormous quantities, has high production efficiency, precision is high, good The advantages that product are high, at low cost.

The utility model compared with prior art, has the advantages that

1, purchase screw cost is saved, while can simplify screw group device (man power vehicle) and equipment in subsequent assembly technique Cost, to reduce screw number simultaneously, be fixed caused by reducing after screw loosening it is not firm and influence MOSFET or The heat dissipation effect of the electronic devices such as person IGBT influences the service life of device and the power of product and working frequency etc..

2, due to being fixed without using screw, thus the spanner or automatic screw that need when being assembled without the concern for screw The operating space of equipment optimizes structure space service efficiency, reduces volume to simplify structure design, reduces weight Amount and cost.

3, heat dissipation base can be integrated into an overall structure with the entire chassis shell body of product, and from radiating mode, (heat is passed Lead, heat radiation, thermal convection) in heat transfer consider, due to being integrated into an overall construction design, so that radiating efficiency is more Height, heat dissipation effect are more preferable.Water channel is arranged on the shell of cabinet can be further improved cooling effect.

4, structure assembling is simple and reliable, does not need to put into big tooling device, uses to limit at two in structure and fix, from And the mode of dual fail-safe guarantees the fixing of structure in structure.

5, the utility model structure design compatibility is good, and compressing elastic slice can optimize according to actual needs, together When can also using with structure glue auxiliary by the way of, thus increase this structure design fixing.

Detailed description of the invention

The following detailed description is read with reference to the accompanying drawings, the utility model illustrative embodiments above-mentioned and other Objects, features and advantages will become prone to understand.In the accompanying drawings, it is practical new that this is shown by way of example rather than limitation Several embodiments of type, in which:

The front view of semiconductor power device heat dissipation base in Fig. 1 the utility model embodiment.

The decomposition diagram of semiconductor power device heat dissipation base in Fig. 2 the utility model embodiment.

Semiconductor power device heat dissipation base side sectional view in Fig. 3 the utility model embodiment.

The assembling schematic diagram of semiconductor power device heat dissipation base in Fig. 4 the utility model embodiment.

The schematic perspective view of semiconductor power device heat dissipation base in Fig. 5 the utility model embodiment.

The schematic diagram of the compression elastic slice of semiconductor power device heat dissipation base in Fig. 6 the utility model embodiment.

The stereoscopic schematic diagram of cabinet inside structure in Fig. 7 the utility model embodiment.

Stereoscopic schematic diagram in Fig. 8 the utility model embodiment outside chassis backplane.

The stereoscopic schematic diagram of chassis backplane channel structure in Fig. 9 the utility model embodiment.

Wherein, 1 --- circuit board, 2 --- compression elastic slice, 3 --- heat dissipation base, 4 --- polymer insulation pad, 5 --- Semiconductor power device (MOSFET or IGBT), 101 --- the first limit, 102 --- the second limit, 20 --- cabinet, 201 --- heat dissipation base, 202 --- chassis backplane, 203 --- water channel.

Specific embodiment

Structural representation for a kind of semiconductor power device heat dissipation base of the utility model after assembling as shown in Figure 1 Figure.It is illustrated in figure 2 the structural schematic diagram of the discrete state of semiconductor power device heat dissipation base.Wherein, semiconductor power device Part heat dissipation base includes PCB circuit board, compresses elastic slice, heat dissipation base, polymer insulation pad and the power being installed therein electricity Sub- device MOSFET or IGBT element.

According to one or more embodiments, as shown in Figure 3 and Figure 5.Semiconductor power device heat dissipation base, the heat dissipation base It is made of the seat stand and seat back that are rendered as L shape after combining, there is filleting on the seat stand of heat dissipation base, compress elastic slice for being embedded in Tail portion.The heat dissipation base has the identical unit of multiple structures, and each unit is used to install a semiconductor power device, The structure of each unit is rendered as " L ", has gusset for being isolated between unit and unit, and the heat dissipation base is as single single It is composed after identical permutation.

Semiconductor power device is inverted in the unit for being inserted into the heat dissipation base afterwards upward by pin, also, semiconductor function Felt pad is posted between the radiating surface of rate device and the seat back side of heat dissipation base.

According to one or more embodiments, felt pad is polymer insulation gasket.

According to one or more embodiments, as shown in Figure 6.It compresses elastic slice and is rendered as serpentine, in the compression elastic slice of serpentine Head and tail portion are equipped with buckle, and the head of the compression elastic slice compresses elastic slice tight against the encapsulating face of the semiconductor power device Tail portion is embedded in the filleting on the seat stand of heat dissipation base.The pin of semiconductor power device pass through circuit board via hole, and with Welding circuit board is fixed.The seat stand of heat dissipation base is rendered as concave shape.

According to one or more embodiments, the cabinet with semiconductor power device heat dissipation base, the bottom surface of heat dissipation base It is fitted closely with chassis backplane or heat dissipation base is integrally formed with chassis backplane or chassis shell body.As shown in Figure 7 and Figure 8.Machine The outer surface of bottom plate can have for cooling water channel, coolant liquid of the water channel for the cooling housing temperature that circulates.Such as Fig. 9 It is shown.

According to one or more embodiments, the cabinet with semiconductor power device heat dissipation base, semiconductor power device Heat dissipation base assemble method, as shown in Figure 4.Primary 0.10- is gently smeared in the position of corresponding MOSFET or IGBT element Then polymer insulation gasket is bonded assembling with MOSFET or IGBT element by the heat-conducting silicone grease after 0.20mm.

After assembling, the component of polymer insulation gasket and MOSFET or IGBT element is assembled into heat dissipation base from top to bottom In, then compression elastic slice is fixed to from top to bottom in heat dissipation base guiding angle and carries out prepackage fixation.

Then with tool fixture by compress elastic slice compress from top to bottom, hear " " a sound after, indicate compress bullet Piece is completed with heat dissipation base, is limited, is avoided wherein compressing elastic slice and having buckle at two after assembling with heat dissipation base The risk that elastic slice is loosened and slid is compressed after the reliability tests such as shock-testing or vibration-testing, and then influences electronic device The heat dissipation of MOSFET or IGBT element.

Then pcb board is assembled from top to bottom and completes welding operation after the welding foot of MOSFET or IGBT element.This Kind dissipation from electronic devices compressing structure improves small product size service efficiency, to reduce the weight of product since structure is simple Amount and cost.

It is worth noting that being created although foregoing teachings describe the utility model by reference to several specific embodiments Spirit and principle, it should be appreciated that, it is not limited to the specific embodiments disclosed for the utility model, draws to various aspects Divide and does not also mean that the feature in these aspects cannot combine, it is this to divide the convenience merely to statement.The utility model purport Covering various modifications and equivalent arrangements included in spirit and scope of the appended claims.

Claims (10)

1. a kind of cabinet with semiconductor power device heat dissipation base, which is characterized in that the heat dissipation base by being in after combining It is now the seat stand of L shape and seat back composition,

There is filleting, for being embedded in the tail portion for compressing elastic slice on the seat stand of heat dissipation base.

2. the cabinet according to claim 1 with semiconductor power device heat dissipation base, which is characterized in that the heat dissipation Pedestal has the identical unit of multiple structures, and each unit is for installing a semiconductor power device, the structure of each unit Be rendered as " L ", have gusset between unit and unit for being isolated, the heat dissipation base combined after being arranged such as individual unit and At.

3. the cabinet according to claim 2 with semiconductor power device heat dissipation base, which is characterized in that described partly to lead Body power device is inverted in the unit for being inserted into the heat dissipation base afterwards upward by pin, also,

Felt pad is posted between the radiating surface of semiconductor power device and the seat back side of heat dissipation base.

4. the cabinet according to claim 3 with semiconductor power device heat dissipation base, which is characterized in that described is exhausted Edge pad is polymer insulation gasket.

5. the cabinet according to claim 4 with semiconductor power device heat dissipation base, which is characterized in that the compression Elastic slice is rendered as serpentine, is equipped with buckle on the compression elastic slice head of serpentine and tail portion, the head of the compression elastic slice is tight against described The encapsulating face of semiconductor power device compresses in the filleting on the seat stand of the tail portion insertion heat dissipation base of elastic slice.

6. the cabinet according to claim 5 with semiconductor power device heat dissipation base, which is characterized in that described partly to lead The pin of body power device passes through the via hole of circuit board, and fixes with welding circuit board.

7. the cabinet according to claim 2 with semiconductor power device heat dissipation base, which is characterized in that heat dissipation base Seat stand be rendered as concave shape.

8. the cabinet according to claim 1 with semiconductor power device heat dissipation base, which is characterized in that described dissipates The bottom surface of hot pedestal is fitted closely with chassis backplane.

9. the cabinet according to claim 1 with semiconductor power device heat dissipation base, which is characterized in that described dissipates Hot pedestal and chassis backplane or chassis shell body are integrally formed.

10. cabinet according to claim 8 or claim 9, which is characterized in that the outer surface of the chassis backplane has for cooling down Water channel, which is used for the coolant liquid of cooling housing temperature of circulating.