CN211580446U - Integrated circuit board mounting structure - Google Patents
Integrated circuit board mounting structure Download PDFInfo
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- CN211580446U CN211580446U CN201922303347.4U CN201922303347U CN211580446U CN 211580446 U CN211580446 U CN 211580446U CN 201922303347 U CN201922303347 U CN 201922303347U CN 211580446 U CN211580446 U CN 211580446U
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- circuit board
- radiating
- plate
- mounting
- clamping groove
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Abstract
The utility model discloses an integrated circuit board mounting structure, which comprises a circuit board body, a heat dissipation plate, a mounting plate and a mounting piece, wherein the circuit board body, the heat dissipation plate and the mounting plate are fixedly connected through the mounting piece; the radiating fins are arranged on the upper side of the radiating plate, a plurality of radiating fins are arranged side by side, radiating holes are formed in the two sides of each radiating fin, and the radiating holes are through holes; the heat dissipation plate is arranged on the upper side of the circuit board body, and the mounting plate is arranged on the lower side of the circuit board body; the mounting piece comprises a connecting part and a fixing part, the connecting part is of a structure in a shape like a Chinese character 'shan', a first clamping groove and a second clamping groove are formed in the connecting part, and the heat dissipation plate and the circuit board body are respectively clamped in the first clamping groove and the second clamping groove in a matched mode; the fixing part is provided with a fixing hole, and the fixing hole is fixed with the mounting plate through a screw; the utility model discloses an aspect has strengthened the heat dispersion of circuit board, and on the other hand need not punch fixedly to the circuit board plate body, has protected the integrality of circuit board.
Description
Technical Field
The utility model relates to a circuit board installation technical field specifically is an integrated circuit board mounting structure.
Background
An integrated circuit board is a carrier on which an integrated circuit is mounted. But often the integrated circuit board is also brought on. The integrated circuit board is mainly made of silica gel, so the integrated circuit board is generally green. The integrated circuit board is also called as a printed circuit board or a printed circuit board, and the circuit board enables the circuit to be miniaturized and visualized, and plays an important role in the batch production of fixed circuits and the optimization of the layout of electrical appliances.
The existing circuit board has a simple and crude installation mode in the installation process, and a punching machine on the circuit board is directly fixed, so that a circuit on the circuit board can be damaged, and the normal work of the circuit board is influenced.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an integrated circuit board mounting structure to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: an integrated circuit board mounting structure comprises a circuit board body, a heat dissipation plate, a mounting plate and a mounting piece, wherein the circuit board body, the heat dissipation plate and the mounting plate are fixedly connected through the mounting piece; the radiating fins are arranged on the upper side of the radiating plate, a plurality of radiating fins are arranged side by side, radiating holes are formed in the two sides of each radiating fin, and the radiating holes are through holes; the heat dissipation plate is arranged on the upper side of the circuit board body, and the mounting plate is arranged on the lower side of the circuit board body; the mounting piece comprises a connecting part and a fixing part, the connecting part is of a structure in a shape like a Chinese character 'shan', a first clamping groove and a second clamping groove are formed in the connecting part, and the heat dissipation plate and the circuit board body are respectively clamped in the first clamping groove and the second clamping groove in a matched mode; the fixing part is provided with a fixing hole, and the fixing hole is fixed with the mounting plate through a screw.
Preferably, the lower side of the first clamping groove and the upper side of the second clamping groove are respectively provided with a buffer pad, and the upper side and the lower side of the connecting part are respectively provided with a fastening pin.
Preferably, the fixed part sets up the middle part at connecting portion, fixed part and connecting portion junction downside are provided with the boss, the boss cross-section is isosceles right triangle, and the right-angle side coincides with connecing portion, fixed part respectively.
Preferably, the mounting panel upside is provided with the shock pad, the shock pad is made by rubber materials, and the shock pad is the strip, is provided with many along the mounting panel surface.
Preferably, the heat dissipation plate and the heat dissipation fins are made of metal aluminum or metal copper, the heat dissipation fins and the heat dissipation plate are arranged in an inclined mode, and the included angle between the heat dissipation fins and the heat dissipation plate is 75-80 degrees.
Compared with the prior art, the beneficial effects of the utility model are that: the utility model discloses a set up heating panel, mounting panel and install the circuit board body, strengthened the heat dispersion of circuit board on the one hand, on the other hand need not punch to fix the circuit board plate body, protected the integrality of circuit board; the device has the advantages of simple overall structure, convenient disassembly, convenient installation process and effective improvement on the disassembly and assembly efficiency of workers.
Drawings
Fig. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic structural view of the present invention;
reference numbers in the figures: 1. a circuit board body; 2. a heat dissipation plate; 21. a heat sink; 22. heat dissipation holes; 3. mounting a plate; 31. a shock pad; 4. a mounting member; 41. a connecting portion; 42. a fixed part; 43. a first card slot; 44. A second card slot; 45. a fixing hole; 46. a cushion pad; 47. fastening a pin; 48. and a reinforcing block.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "vertical", "upper", "lower", "horizontal", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
Referring to fig. 1-2, the present invention provides a technical solution: an integrated circuit board mounting structure comprises a circuit board body 1, a heat dissipation plate 2, a mounting plate 3 and a mounting piece 4, wherein the circuit board body 1, the heat dissipation plate 2 and the mounting plate 3 are fixedly connected through the mounting piece 4; the radiating fins 21 are arranged on the upper side of the radiating plate 2, a plurality of radiating fins 21 are arranged side by side, radiating holes 22 are arranged on two sides of each radiating fin 21, and the radiating holes 22 are through holes; the heat dissipation plate 2 is arranged on the upper side of the circuit board body 1, and the mounting plate 3 is arranged on the lower side of the circuit board body 1; the mounting part 4 comprises a connecting part 41 and a fixing part 42, the connecting part 41 is in a structure of a Chinese character 'shan', and is provided with a first clamping groove 43 and a second clamping groove 44, and the heat dissipation plate 2 and the circuit board body 1 are respectively clamped in the first clamping groove 43 and the second clamping groove 44 in a matching manner; the fixing portion 42 is provided with a fixing hole 45, and the fixing hole 45 is fixed to the mounting plate 3 through a screw.
Further, a cushion 46 is provided on the lower side of the first engaging groove 43 and the upper side of the second engaging groove 44, and fastening pins 47 are provided on the upper and lower sides of the connecting portion 41.
Further, the fixing portion 42 is disposed in the middle of the connecting portion 41, a reinforcing block 48 is disposed at the lower side of the joint of the fixing portion 42 and the connecting portion 41, the cross section of the reinforcing block 48 is an isosceles right triangle, and the right-angle sides of the reinforcing block coincide with the connecting portion 41 and the fixing portion 42 respectively.
Further, the mounting panel 3 upside is provided with shock pad 31, shock pad 31 is made by rubber materials, and shock pad 31 is the strip, is provided with many along the mounting panel 3 surface.
Furthermore, the heat dissipation plate 2 and the heat dissipation plate 21 are made of metal aluminum or metal copper, the heat dissipation plate 21 and the heat dissipation plate 2 are mutually inclined, and the included angle between the heat dissipation plate and the heat dissipation plate is 75-80 degrees.
The working principle is as follows: in practical use, the circuit board body 1 and the heat dissipation plate 2 are correspondingly clamped in the second clamping groove 44 and the second clamping groove 43, and the top ends of the fastening pins 41 are abutted against the circuit board body 1 and the heat dissipation plate 2 by screwing the fastening pins 41 on the upper side and the lower side of the connecting part 41; the top end of the fastening pin 41 comprises a rubber sleeve, so that the circuit board body 1 and the heat dissipation plate 2 are prevented from being damaged; after the circuit board body 1, the heat dissipation plate 2 and the mounting piece 4 are fixed, the circuit board body 1 is placed on the mounting plate 1, the bottom of the circuit board body 1 is in contact with the shock pad 31, the mounting piece 4 and the mounting plate 3 are fixed through the fixing hole 45 by using a screw, and the mounting of the circuit board body 1 is completed; when in subsequent use, the mounting plate 3 is directly punched and fixed, the circuit board body 1 cannot be damaged, the integrity of the circuit board body 1 is ensured, and the circuit is prevented from being damaged to influence normal use.
After the circuit board is installed, the lower part of the circuit board is mostly sealed, and heat dissipation needs to be carried out through the upper side; the heat dissipation plate 2 made of aluminum or copper is arranged, heat is conducted to the heat dissipation plate 21 and dissipated, and the heat dissipation hole 22 assists in heat dissipation; the radiating fins 21 arranged obliquely can increase the radiating area of the radiating fins 21 in the effective space, and the final radiating effect is better.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. An integrated circuit board mounting structure characterized in that: the radiating structure comprises a circuit board body (1), a radiating plate (2), a mounting plate (3) and a mounting piece (4), wherein the circuit board body (1), the radiating plate (2) and the mounting plate (3) are fixedly connected through the mounting piece (4); the radiating fins (21) are arranged on the upper side of the radiating plate (2), the radiating fins (21) are provided with a plurality of pieces side by side, radiating holes (22) are formed in two sides of each radiating fin (21), and the radiating holes (22) are through holes; the heat dissipation plate (2) is arranged on the upper side of the circuit board body (1), and the mounting plate (3) is arranged on the lower side of the circuit board body (1); the mounting piece (4) comprises a connecting part (41) and a fixing part (42), the connecting part (41) is of a structure like a Chinese character 'shan', a first clamping groove (43) and a second clamping groove (44) are arranged, and the heat dissipation plate (2) and the circuit board body (1) are respectively matched and clamped in the first clamping groove (43) and the second clamping groove (44); the fixing portion (42) is provided with a fixing hole (45), and the fixing hole (45) is mutually fixed with the mounting plate (3) through a screw.
2. An integrated circuit board mounting structure according to claim 1, wherein: the lower side of the first clamping groove (43) and the upper side of the second clamping groove (44) are respectively provided with a buffer pad (46), and the upper side and the lower side of the connecting part (41) are respectively provided with a fastening pin (47).
3. An integrated circuit board mounting structure according to claim 1, wherein: the fixing part (42) is arranged in the middle of the connecting part (41), a reinforcing block (48) is arranged on the lower side of the joint of the fixing part (42) and the connecting part (41), the cross section of the reinforcing block (48) is an isosceles right triangle, and right-angle sides of the reinforcing block coincide with the connecting part (41) and the fixing part (42) respectively.
4. An integrated circuit board mounting structure according to claim 1, wherein: mounting panel (3) upside is provided with shock pad (31), shock pad (31) are made by rubber materials, and shock pad (31) are the strip, are provided with many along mounting panel (3) surface.
5. An integrated circuit board mounting structure according to claim 1, wherein: the radiating plate (2) and the radiating fins (21) are made of metal aluminum or metal copper, the radiating fins (21) and the radiating plate (2) are arranged in an inclined mode, and the included angle between the radiating fins (21) and the radiating plate (2) is 75-80 degrees.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922303347.4U CN211580446U (en) | 2019-12-19 | 2019-12-19 | Integrated circuit board mounting structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922303347.4U CN211580446U (en) | 2019-12-19 | 2019-12-19 | Integrated circuit board mounting structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211580446U true CN211580446U (en) | 2020-09-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922303347.4U Active CN211580446U (en) | 2019-12-19 | 2019-12-19 | Integrated circuit board mounting structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211580446U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112481563A (en) * | 2020-11-26 | 2021-03-12 | 重庆重铝新材料科技有限公司 | Sizing device and method for aluminum alloy heat treatment |
-
2019
- 2019-12-19 CN CN201922303347.4U patent/CN211580446U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112481563A (en) * | 2020-11-26 | 2021-03-12 | 重庆重铝新材料科技有限公司 | Sizing device and method for aluminum alloy heat treatment |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20230629 Address after: No. 66-28, Xiningli, Taihe District, Jinzhou City, Liaoning Province, 121000 Patentee after: Liaoning Fuhua Environmental Protection Technology Co.,Ltd. Address before: 1716 entrepreneurship workshop, 4 / F, area C, incubation building, science and technology innovation District, Mianyang, Sichuan 621000 Patentee before: Sichuan Howell Information Technology Co.,Ltd. |
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| TR01 | Transfer of patent right |