CN217283789U - Circuit board with buffer structure - Google Patents
Circuit board with buffer structure Download PDFInfo
- Publication number
- CN217283789U CN217283789U CN202123422274.4U CN202123422274U CN217283789U CN 217283789 U CN217283789 U CN 217283789U CN 202123422274 U CN202123422274 U CN 202123422274U CN 217283789 U CN217283789 U CN 217283789U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- hole
- bolt
- rubber
- bottom plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000003139 buffering effect Effects 0.000 abstract description 8
- 230000007423 decrease Effects 0.000 abstract 1
- 230000017525 heat dissipation Effects 0.000 description 7
- 238000012856 packing Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
The utility model relates to a circuit board technical field, concretely relates to circuit board with buffer structure. The circuit board with the buffer structure comprises a circuit board main board, a bottom board and a connecting piece; a plurality of first connecting holes are formed in the circuit board main board; the bottom plate is provided with a second connecting hole; the connecting piece comprises a bolt, a rubber washer, a rubber supporting column and a nut; the bolt comprises a bolt head and a bolt body, and the bolt body penetrates through the first connecting hole and the second connecting hole; the rubber gasket is sleeved on the bolt body, and the bottom of the rubber gasket is abutted against the circuit board mainboard; the rubber support column is arranged between the circuit board main board and the bottom board, the middle part of the rubber support column is provided with a through hole, and the bolt body passes through the through hole; the nut is arranged at the bottom of the bottom plate and is in threaded connection with the bolt body; the top of bottom plate upwards extends a plurality of protection angles, and the outside of circuit board mainboard corner is located to a plurality of protection angles, and the buffering cushion is installed to the inboard at protection angle, and the buffering cushion pastes with the circuit board mainboard and touches. The utility model provides a current circuit board easily fall the problem that decreases.
Description
Technical Field
The utility model relates to a circuit board technical field, concretely relates to circuit board with buffer structure.
Background
The circuit board has the name: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, PCB board, aluminum substrate, high frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, printed (copper etching technology) circuit board, etc. The circuit board enables the circuit to be miniaturized and visualized, and plays an important role in batch production of fixed circuits and optimization of electric appliance layout.
The traditional circuit board has a single structure, and when the circuit board is dropped accidentally, the circuit board is easily damaged due to the impact force of the ground.
Therefore, it is necessary to provide a technical solution to solve the above problems.
SUMMERY OF THE UTILITY MODEL
The utility model provides a circuit board with buffer structure aims at solving traditional circuit board structure comparatively singlely, when the accident dropped, easily leads to the circuit board because of receiving the problem that the impact force of ground takes place to damage.
In order to achieve the above object, the present invention provides a circuit board with a buffer structure, which includes a circuit board main board, a bottom board and a connecting member; wherein:
the periphery of the circuit board main board is provided with a plurality of first connecting holes; the bottom plate is arranged below the circuit board main board, and a second connecting hole is formed in the position, corresponding to the first connecting hole, of the bottom plate; the connecting piece comprises a bolt, a rubber washer, a rubber supporting column and a nut; the bolt comprises a bolt head and a bolt body which are integrally formed, and the bolt body sequentially penetrates through the first connecting hole and the second connecting hole; the rubber gasket is sleeved on the bolt body, the top of the rubber gasket is abutted against the bolt head, and the bottom of the rubber gasket is abutted against the circuit board mainboard; the rubber supporting column is arranged between the circuit board main board and the bottom board, a through hole is formed in the middle of the rubber supporting column, and the bolt body penetrates through the through hole; the nut is arranged at the bottom of the bottom plate and is in threaded connection with the bolt body; the top of bottom plate upwards extends a plurality of protection angles, and a plurality of protection angles are located the outside of circuit board mainboard corner, the buffering cushion is installed to the inboard at protection angle, the buffering cushion with the circuit board mainboard pastes and touches.
More specifically, the bolt body comprises a supporting part and a threaded part, the end part of the supporting part is connected with the bolt head, the outer diameter of the supporting part is larger than that of the threaded part, the supporting part is arranged in the first connecting hole, and the threaded part is arranged in the second connecting hole; the through hole in the rubber support column comprises an upper through hole corresponding to the supporting part and a lower through hole corresponding to the thread part, the supporting part is arranged in the upper through hole, and the thread part is arranged in the lower through hole.
More specifically, the circuit board with be equipped with the radiator between the bottom plate, the radiator includes heat-conducting plate and a plurality of main heat dissipation fin, the heat-conducting plate is installed the bottom of circuit board, and a plurality of main heat dissipation fin is installed the heat-conducting plate bottom to be the array and arrange.
More specifically, two sides of the main heat dissipation fins extend outwards to form a plurality of auxiliary heat dissipation fins.
More specifically, the circuit board mainboard is provided with a signal layer, an intermediate layer and a mechanical layer from top to bottom in sequence.
More specifically, the fool-proof notch is formed in the outer side of the circuit board main board.
More specifically, a plurality of screw holes are formed in the bottom plate.
The utility model relates to a technical effect of circuit board with buffer structure does:
make circuit board mainboard and bottom plate link to each other through the connecting piece in this application, the bottom plate mainly plays the fixed action to the circuit board mainboard, and rubber packing ring and the rubber support column on the connecting piece paste respectively and lean on the top and the bottom at the circuit board mainboard, and then the circuit board drops ground or when meeting the external object collision, rubber packing ring and rubber support column cooperate and play the effect of unloading power buffering to the circuit board mainboard, avoid the damage of circuit board mainboard, and through the design of cushion, make the edge of circuit board mainboard be difficult for wearing and tearing because of assaulting, the fracture, thus, guarantee the integrality of circuit board during producing to storing before using.
Drawings
Fig. 1 is a schematic structural diagram of a circuit board with a buffer structure according to the present invention;
FIG. 2 is an enlarged schematic view of FIG. 1 at A;
fig. 3 is a schematic structural diagram of another view angle of a circuit board with a buffer structure according to the present invention;
fig. 4 is a schematic cross-sectional view of a circuit board with a buffer structure according to the present invention;
FIG. 5 is an enlarged schematic view at B in FIG. 4;
fig. 6 is a schematic structural diagram of a rubber support column in a circuit board with a buffer structure according to the present invention.
The labels in the figure are:
1-a circuit board main board; 2-a bottom plate; 3, connecting pieces; 4-a radiator;
11 — a first connection hole; 12-fool-proof gap;
21-a second connection hole; 22-protective angle; 23-a cushion pad; 24-screw holes;
31-bolt; 311-bolt head; 312-a plug body; 313 — a support; 314-a threaded portion; 32-rubber gasket; 33-rubber support column; 331-a through-hole; 332 — upper via; 333-lower through hole; 34-a nut;
41-heat conducting plate; 42-main heat dissipation fins; 43-auxiliary heat sink fins;
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present; when an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the description of the embodiments of the present invention, it should be understood that the directions or positional relationships indicated by "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like are based on the directions or positional relationships shown in the drawings, and are only for convenience of description and simplification of the embodiments of the present invention, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and thus, should not be construed as limiting the present invention.
In order to more clearly illustrate the technical solution of the present invention, a preferred embodiment is provided below. With particular reference to fig. 1-6. A circuit board with a buffer structure comprises a circuit board main board 1, a bottom board 2 and a connecting piece 3; wherein:
the periphery of the circuit board main board 1 is provided with a plurality of first connecting holes 11; the bottom plate 2 is arranged below the circuit board main board 1, and a second connecting hole 21 is formed in the position, corresponding to the first connecting hole 11, of the bottom plate 2; the connecting piece 3 comprises a bolt 31, a rubber washer 32, a rubber supporting column 33 and a nut 34; the bolt 31 comprises a bolt head 311 and a bolt body 312 which are integrally formed, and the bolt body 312 sequentially penetrates through the first connecting hole 11 and the second connecting hole 21; the rubber gasket 32 is sleeved on the bolt body 312, the top of the rubber gasket abuts against the bolt head 311, and the bottom of the rubber gasket abuts against the circuit board main board 1; the rubber support column 33 is arranged between the circuit board main board 1 and the bottom board 2, a through hole 331 is formed in the middle of the rubber support column, and the bolt body 312 passes through the through hole 331; the nut 34 is arranged at the bottom of the bottom plate 2 and is in threaded connection with the bolt body 312; a plurality of protection angles 22 extend upwards from the top of the bottom plate 2, the protection angles 22 are arranged on the outer sides of the corners of the circuit board main board 1, a buffering cushion 23 is arranged on the inner side of each protection angle 22, and the buffering cushion 23 is attached to and contacted with the circuit board main board 1.
In this embodiment, make circuit board mainboard 1 and bottom plate 2 link to each other through connecting piece 3, bottom plate 2 mainly plays fixed action to circuit board mainboard 1, and rubber packing ring 32 and rubber support post 33 on connecting piece 3 paste respectively and lean on the top and the bottom at circuit board mainboard 1, and then the circuit board drops ground or when meeting the external object collision, rubber packing ring 32 and rubber support post 33 cooperate and play the effect of unloading power buffering to circuit board mainboard 1, avoid the damage of circuit board mainboard 1, and through the design of cushion 23, make the difficult wearing and tearing because of the impact of edge of circuit board mainboard 1, the fracture, thus, guarantee the circuit board and produce the integrality to storing in the period before the use in.
As a preferable scheme of this embodiment, the bolt body 312 includes a supporting portion 313 and a threaded portion 314, an end of the supporting portion 313 is connected to the bolt head 311, an outer diameter of the supporting portion 313 is larger than an outer diameter of the threaded portion 314, the supporting portion 313 is disposed in the first connecting hole 11, and the threaded portion 314 is disposed in the second connecting hole 21; the through hole 331 in the rubber support post 33 includes an upper through hole 332 corresponding to the support portion 313 and a lower through hole 333 corresponding to the threaded portion 314, the support portion 313 is disposed in the upper through hole 332, and the threaded portion 314 is disposed in the lower through hole 333. The design of the bolt 312 divided into the supporting portion 313 and the threaded portion 314 enables the bolt 312 to directly support and abut against the rubber supporting columns 33, so as to avoid the damage of the circuit board main board 1 caused by the excessive pressing of the bolts 31, which causes the excessive pressing of the rubber supporting columns 33 and the rubber gaskets 32 against the circuit board main board 1.
As a preferred solution of this embodiment, a heat sink 4 is disposed between the circuit board and the bottom plate 2, the heat sink 4 includes a heat conducting plate 41 and a plurality of main heat dissipating fins 42, the heat conducting plate 41 is installed at the bottom of the circuit board, and the plurality of main heat dissipating fins 42 are installed at the bottom of the heat conducting plate 41 and are arranged in an array. The design of the radiator 4 improves the heat radiation performance of the circuit board mainboard 1, and is beneficial to enabling the circuit board mainboard 1 to run more stably.
As a preferred solution of this embodiment, two sides of the main heat dissipation fins 42 respectively extend outward to form a plurality of auxiliary heat dissipation fins 43. The design of the auxiliary radiating fins 43 makes the radiator 4 reasonably utilize the space between the circuit board main board 1 and the bottom board 2, increases the contact area between the radiator 4 and the air, and improves the radiating performance.
As a preferable solution of this embodiment, the signal layer, the intermediate layer, and the mechanical layer are sequentially disposed from top to bottom in the circuit board main board 1. The signal layer is used for completing electrical connection, the middle layer is used for establishing a power supply and ground network, and the mechanical layer is used for describing the mechanical structure and the mark of the circuit board main board 1.
As a preferred solution of this embodiment, a fool-proof notch 12 is formed on the outer side of the circuit board main board 1. It should be noted that, the development of the circuit board is rapid, that is, the new circuit board is efficient in production, and the new circuit board usually makes the change of the electrical structure on the old circuit board, and the appearance is basically the same, so when the new circuit board and the old circuit board are produced simultaneously, the worker is easy to confuse the new circuit board and the old circuit board when putting in and putting out, so in this embodiment, the design of setting the fool-proof notch 12 on the circuit board main board 1 is adopted, and the fool-proof notches 12 with different quantities or different shapes can be opened on the new circuit board and the old circuit board, so that the new circuit board and the old circuit board can be quickly and intuitively distinguished, and convenience is provided for the classification putting in and putting out of the worker.
As a preferable scheme of this embodiment, the bottom plate 2 is provided with a plurality of screw holes 24. The bottom plate 2 mounts the circuit board on the corresponding device through the screw holes 24.
The utility model relates to a circuit board with buffer structure through reasonable structure setting, has solved traditional circuit board structure comparatively single, when the accident dropped, easily leads to the circuit board because of receiving the problem that the impact force of ground takes place to damage.
The above description is only for the preferred embodiment of the present invention, and the structure is not limited to the above-mentioned shape, and any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (7)
1. A circuit board with a buffer structure is characterized in that: comprises a circuit board mainboard, a bottom plate and a connecting piece; wherein:
the periphery of the circuit board main board is provided with a plurality of first connecting holes; the bottom plate is arranged below the circuit board main board, and a second connecting hole is formed in the position, corresponding to the first connecting hole, of the bottom plate; the connecting piece comprises a bolt, a rubber washer, a rubber supporting column and a nut; the bolt comprises a bolt head and a bolt body which are integrally formed, and the bolt body sequentially penetrates through the first connecting hole and the second connecting hole; the rubber gasket is sleeved on the bolt body, the top of the rubber gasket is abutted against the bolt head, and the bottom of the rubber gasket is abutted against the circuit board mainboard; the rubber support column is arranged between the circuit board main board and the bottom board, a through hole is formed in the middle of the rubber support column, and the bolt body penetrates through the through hole; the nut is arranged at the bottom of the bottom plate and is in threaded connection with the bolt body; the top of bottom plate upwards extends a plurality of protection angles, and a plurality of protection angles are located the outside at circuit board mainboard corner, cushion pad is installed to the inboard at protection angle, cushion pad with the circuit board mainboard pastes and touches.
2. The circuit board with a buffer structure according to claim 1, wherein: the bolt body comprises a supporting part and a threaded part, the end part of the supporting part is connected with the bolt head, the outer diameter of the supporting part is larger than that of the threaded part, the supporting part is arranged in the first connecting hole, and the threaded part is arranged in the second connecting hole; the through hole in the rubber support column comprises an upper through hole corresponding to the supporting part and a lower through hole corresponding to the thread part, the supporting part is arranged in the upper through hole, and the thread part is arranged in the lower through hole.
3. The circuit board with a buffer structure according to claim 1, wherein: the radiator is arranged between the circuit board and the bottom plate and comprises a heat conducting plate and a plurality of main radiating fins, the heat conducting plate is installed at the bottom of the circuit board, and the main radiating fins are installed at the bottom of the heat conducting plate and are arranged in an array mode.
4. The circuit board with a buffer structure according to claim 3, wherein: and a plurality of auxiliary radiating fins extend outwards from two sides of the main radiating fins respectively.
5. The circuit board with a buffer structure according to claim 1, wherein: the circuit board comprises a signal layer, an intermediate layer and a mechanical layer which are sequentially arranged in the circuit board main board from top to bottom.
6. The circuit board with a buffer structure according to claim 1, wherein: the outer side of the circuit board main board is provided with a fool-proof notch.
7. The circuit board with a buffer structure according to claim 1, wherein: the bottom plate is provided with a plurality of screw holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123422274.4U CN217283789U (en) | 2021-12-31 | 2021-12-31 | Circuit board with buffer structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123422274.4U CN217283789U (en) | 2021-12-31 | 2021-12-31 | Circuit board with buffer structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217283789U true CN217283789U (en) | 2022-08-23 |
Family
ID=82893662
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123422274.4U Active CN217283789U (en) | 2021-12-31 | 2021-12-31 | Circuit board with buffer structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217283789U (en) |
-
2021
- 2021-12-31 CN CN202123422274.4U patent/CN217283789U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR20140136268A (en) | Stacked semiconductor package having heat slug | |
| CN217283789U (en) | Circuit board with buffer structure | |
| CN211150541U (en) | Power device packaging structure and module power supply | |
| CN216488024U (en) | Circuit board assembly and server | |
| US12022605B2 (en) | Stacking system | |
| CN113225934B (en) | Force calculating plate and manufacturing method thereof | |
| CN211240293U (en) | Aluminum base material force calculation board | |
| CN215991334U (en) | Embedded KTV main control board of multiple interface mode | |
| CN113727515A (en) | Metal copper-clad plate | |
| CN208300108U (en) | A kind of accurate printed wiring board | |
| CN220123351U (en) | Optimized power board heat dissipation integrated structure | |
| CN218450682U (en) | Anti short circuit board | |
| CN219107776U (en) | Heat dissipation circuit board | |
| CN216531933U (en) | Composite PCB | |
| CN212587484U (en) | Dual-heat-dissipation semiconductor product and electronic product | |
| CN215871965U (en) | High heat conduction type circuit board | |
| CN218548475U (en) | Light-emitting diode packaging structure | |
| CN213186702U (en) | High temperature resistant circuit board connected with tab | |
| CN217470364U (en) | Circuit board with heat dissipation function | |
| CN221409219U (en) | PCB board for high heat dissipation LED lamp | |
| CN218867099U (en) | Lead frame, integrated chip structure and power module | |
| CN221102066U (en) | Chip structure, power device and electronic equipment | |
| CN210928383U (en) | Plug-in type combined circuit board | |
| CN218243967U (en) | Circuit board structure with auxiliary positioning plate | |
| CN220021104U (en) | Double-side-wing heat dissipation type packaging structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 516000 Huizhou Zhongkai High tech Zone, Huizhou City, Guangdong Province, China Korea Huizhou Industrial Park Start Zone, No. 10 Weigang Road, No.4 Factory Building Patentee after: Guangdong Baiwei Electronic Technology Co.,Ltd. Country or region after: China Address before: 2 / F and 3 / F, 68 gongao 2nd Road, xiniupo village, Dalang Town, Dongguan City, Guangdong Province, 523000 Patentee before: DONGGUAN BESTWAY TECHNOLOGY Co.,Ltd. Country or region before: China |
|
| CP03 | Change of name, title or address |