CN220123351U - Optimized power board heat dissipation integrated structure - Google Patents
Optimized power board heat dissipation integrated structure Download PDFInfo
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- CN220123351U CN220123351U CN202321725224.XU CN202321725224U CN220123351U CN 220123351 U CN220123351 U CN 220123351U CN 202321725224 U CN202321725224 U CN 202321725224U CN 220123351 U CN220123351 U CN 220123351U
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- heat dissipation
- power
- heat
- module
- power board
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 80
- 238000006243 chemical reaction Methods 0.000 claims abstract description 17
- 230000005855 radiation Effects 0.000 claims abstract description 17
- 239000004020 conductor Substances 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 4
- 238000012546 transfer Methods 0.000 claims description 2
- 230000013011 mating Effects 0.000 claims 1
- 230000000191 radiation effect Effects 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Abstract
The utility model provides an optimized power board heat dissipation integrated structure, which comprises a power integrated module and a main heat dissipation protection module, wherein the power integrated module is used for realizing a power conversion function, and the main heat dissipation protection module is used for dissipating heat of all internal functional modules and isolating all internal functional modules from the outside to realize a protection function. The optimized structure of the utility model has the following advantages: the heat generated by the power integrated module is directly transferred to the outside or directly transferred to the main heat radiation protection module by adopting a mode that the heat radiation plate of the power integrated module and the main heat radiation protection module are arranged into a whole, so that a more efficient heat radiation effect is realized; after the optimized heat dissipation structure is adopted, heat of the power conversion module cannot be gathered in the product and influence other internal modules, so that the overall working stability of the product is ensured; the scheme is suitable for various power conversion modules, can be assembled with various products, and has higher universality.
Description
Technical Field
The utility model relates to a heat radiation structure of an electronic circuit, in particular to an optimized integrated heat radiation structure of a power board.
Background
As the application of the power conversion module is more and more widespread, the heat dissipation problem of the power conversion module is also increasingly prominent. Because of the large heat dissipation capacity of power conversion modules, conventional heat dissipation methods have failed to meet the needs, and various manufacturers are striving to improve solutions. Currently, a separate power conversion module typically needs to be equipped with a heat sink back plate for direct heat dissipation, but when it is assembled into the product interior as part of the product, the heat sink development difficulty and design cost are increased. Therefore, how to better solve the heat dissipation problem of the power conversion module becomes an important problem that current manufacturers need to solve.
Disclosure of Invention
In view of the above-mentioned drawbacks of the prior art, an objective of the present utility model is to provide an optimized integrated structure for heat dissipation of a power board, which is used for solving the problem that a conventional power conversion module equipped with a heat dissipation back plate affects other functional modules after heat dissipation inside the product.
To achieve the above and other related objects, the present utility model provides an optimized integrated power board heat dissipation structure, including a power integrated module for implementing a power conversion function and a main heat dissipation protection module for dissipating heat from all internal functional modules while isolating all internal functional modules from the outside to implement a protection function; the power integrated module comprises a power board, pins and a heat dissipation board; the pins are fixedly arranged on the edge of one face of the power board, and the top angle or the edge of the heat dissipation plate is fixedly connected with the top angle or the edge of the power board; the pins and the heat dissipation plate are arranged on the same surface of the power plate; a notch is arranged at the edge of the heat dissipation plate, and the pin passes through the notch and extends to the outer side of the heat dissipation plate; the main heat radiation protection module is provided with a matching hole, the matching hole is matched with the size of the heat radiation plate, and the heat radiation plate can be just arranged in the matching hole; the main heat dissipation protection module is also provided with a pin hole, the pin hole is electrically connected with the power circuit, the diameter of the pin is matched with that of the pin hole, and the pin hole can be just penetrated and electrically connected with the pin hole.
Optionally, high-power components are arranged on the power board, and in the working process, high current flows through the power board and the pins to generate higher heat and dissipate heat through the heat dissipation plate.
Optionally, a heat conducting material is filled between the heat dissipation plate and the power plate.
Optionally, a heat conducting material is filled in a gap between the matching hole and the heat dissipation plate.
Optionally, the pin of the power integrated module and the heat dissipation plate are simultaneously inserted into the pin hole and the matching hole of the main heat dissipation protection module, and the heat dissipation plate is connected with the heat dissipation main body of the main heat dissipation protection module to form a complete heat dissipation surface, so that heat can be transferred to the outside at the same time.
The optimized integrated structure for heat dissipation of the power board has the following advantages:
(1) The heat dissipation effect is more efficient. The heat generated by the power integrated module is directly transferred to the outside or directly transferred to the main heat radiation protection module by adopting a mode that the heat radiation plate of the power integrated module and the main heat radiation protection module are arranged into a whole, so that a more efficient heat radiation effect is realized;
(2) The influence on other functional modules inside the product is smaller. Because the optimized heat dissipation structure is adopted, the heat of the power conversion module cannot be gathered in the product and influence other internal modules, so that the overall working stability of the product is ensured;
(3) The applicability is wider. The scheme is suitable for various power conversion modules, can be assembled with various products, and has higher universality.
Drawings
Fig. 1 is a schematic diagram of an integrated structure of heat dissipation of an optimized power board according to the present utility model.
Fig. 2 shows a schematic diagram of a power integrated module structure of the optimized structure of the present utility model.
Fig. 3 is a schematic diagram of a main heat dissipation protection module with an optimized structure according to the present utility model.
Fig. 4 shows a schematic diagram of an assembled structure of the optimized structure of the present utility model.
Description of the reference numerals:
100. a power integrated module; 110. a power board; 120. pins; 130. a heat dissipation plate; 200. a main heat dissipation protection module; 210. matching holes; 220. pin holes.
Description of the embodiments
Other advantages and effects of the present utility model will become apparent to those skilled in the art from the following disclosure, which describes the embodiments of the present utility model with reference to specific examples. The utility model may be practiced or carried out in other embodiments that depart from the specific details, and the details of the present description may be modified or varied from the spirit and scope of the present utility model. As described in detail in the embodiments of the present utility model, the cross-sectional view of the device structure is not partially enlarged to a general scale for convenience of explanation, and the schematic drawings are only examples, which should not limit the scope of the present utility model. In addition, the three-dimensional dimensions of length, width and depth should be included in actual fabrication.
For ease of description, spatially relative terms such as "under", "below", "beneath", "above", "upper" and the like may be used herein to describe one element or feature's relationship to another element or feature as illustrated in the figures. It will be understood that these spatially relative terms are intended to encompass other orientations of the device in use or operation in addition to the orientation depicted in the figures. Furthermore, when a layer is referred to as being "between" two layers, it can be the only layer between the two layers or one or more intervening layers may also be present.
In the context of the present utility model, a structure described as a first feature being "on" a second feature may include embodiments where the first and second features are formed in direct contact, as well as embodiments where additional features are formed between the first and second features, such that the first and second features may not be in direct contact.
It should be noted that, the illustrations provided in the present embodiment merely illustrate the basic concept of the present utility model by way of illustration, and only the components related to the present utility model are shown in the drawings and are not drawn according to the number, shape and size of the components in actual implementation, and the form, number and proportion of the components in actual implementation may be arbitrarily changed, and the layout of the components may be more complex. In order to make the illustration as concise as possible, not all structures are labeled in the drawings.
Please refer to fig. 1 to 4.
An optimized integrated structure for heat dissipation of a power board, as shown in fig. 1, comprises a power integrated module 100 and a main heat dissipation protection module 200, wherein the power integrated module 100 is used for realizing a power conversion function, and the main heat dissipation protection module 200 is used for dissipating heat of all internal functional modules and isolating all internal functional modules from the outside to realize a protection function.
As shown in fig. 2, the power integrated module 100 includes a power board 110, pins 120, and a heat dissipation board 130; the pins 120 are fixedly arranged on the edge of one surface of the power board 110, and the top angle or edge of the heat dissipation plate 130 is fixedly connected with the top angle or edge of the power board 110; the pins 120 and the heat dissipation plate 130 are both disposed on the same surface of the power board 110; the edge of the heat dissipation plate 130 is provided with a notch, and the lead 120 extends to the outside of the heat dissipation plate 130 through the notch. A heat conducting material, preferably a heat conducting silica gel, is filled between the heat dissipating plate 130 and the power board 110. The power board 110 is provided with high-power components, and in the working process, the power board 110 and the pins 120 have high-current circulation, so that high heat is generated and dissipated through the heat dissipation plate 130.
As shown in fig. 3, the main heat dissipation protection module 200 is provided with a matching hole 210, the size of the matching hole 210 is matched with that of the heat dissipation plate 130, the heat dissipation plate 130 can be just placed in the matching hole 210, and a heat conduction material is filled in a gap between the matching hole 210 and the heat dissipation plate 130, and the heat conduction material is preferably heat conduction silica gel; the main heat dissipation protection module 200 is further provided with a pin hole 220, the pin hole 220 is electrically connected with the power circuit, the diameter of the pin 120 is matched with that of the pin hole 220, and the pin 120 can just pass through the pin hole 220 and be electrically connected with the pin hole 220.
As shown in fig. 4, the pins 120 and the heat dissipation plate 130 of the integrated power module 100 are simultaneously inserted into the pin holes 220 and the matching holes 210 of the main heat dissipation protection module 200, and the heat dissipation plate 130 is connected with the heat dissipation body of the main heat dissipation protection module 200 to form a complete heat dissipation surface, so that heat transfer to the outside can be simultaneously realized.
In summary, the present utility model provides an optimized integrated power board heat dissipation structure, which includes a power integrated module and a main heat dissipation protection module, wherein the power integrated module is used for implementing a power conversion function, and the main heat dissipation protection module is used for dissipating heat from all internal functional modules, and isolating all internal functional modules from the outside to implement a protection function. The optimized structure of the utility model has the following advantages: the heat generated by the power integrated module is directly transferred to the outside or directly transferred to the main heat radiation protection module by adopting a mode that the heat radiation plate of the power integrated module and the main heat radiation protection module are arranged into a whole, so that a more efficient heat radiation effect is realized; after the optimized heat dissipation structure is adopted, heat of the power conversion module cannot be gathered in the product and influence other internal modules, so that the overall working stability of the product is ensured; the scheme is suitable for various power conversion modules, can be assembled with various products, and has higher universality. Therefore, the utility model effectively overcomes various defects in the prior art and has high industrial utilization value.
The above embodiments are merely illustrative of the principles of the present utility model and its effectiveness, and are not intended to limit the utility model. Modifications and variations may be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the utility model. Accordingly, it is intended that all equivalent modifications and variations of the utility model be covered by the claims, which are within the ordinary skill of the art, be within the spirit and scope of the present disclosure.
Claims (5)
1. An optimized power board heat dissipation integrated structure comprises a power integrated module and a main heat dissipation protection module, wherein the power integrated module is used for realizing a power conversion function, and the main heat dissipation protection module is used for dissipating heat of all internal functional modules and isolating all internal functional modules from the outside to realize a protection function; it is characterized in that the method comprises the steps of,
the power integrated module comprises a power board, pins and a heat dissipation board; the pins are fixedly arranged on the edge of one face of the power board, and the top angle or the edge of the heat dissipation plate is fixedly connected with the top angle or the edge of the power board; the pins and the heat dissipation plate are arranged on the same surface of the power plate; a notch is arranged at the edge of the heat dissipation plate, and the pin passes through the notch and extends to the outer side of the heat dissipation plate;
the main heat radiation protection module is provided with a matching hole, the matching hole is matched with the size of the heat radiation plate, and the heat radiation plate can be just arranged in the matching hole; the main heat dissipation protection module is also provided with a pin hole, the pin hole is electrically connected with the power circuit, the diameter of the pin is matched with that of the pin hole, and the pin hole can be just penetrated and electrically connected with the pin hole.
2. The optimized integrated structure for heat dissipation of power board according to claim 1, wherein the power board is arranged with high power components, and the power board and the pins have high current flow during operation, so that high heat is generated and dissipated through the heat dissipation plate.
3. An optimized integrated power board heat dissipation structure as described in claim 1, wherein a thermally conductive material is filled between said heat dissipation plate and said power board.
4. An optimized integrated power board heat dissipation structure as set forth in claim 1, wherein a space between said mating hole and said heat dissipation plate is filled with a thermally conductive material.
5. The optimized integrated power board heat dissipation structure as set forth in claim 1, wherein said pins of said integrated power module and said heat dissipating plate are inserted into said pin holes and said matching holes of said main heat dissipation protection module at the same time, and said heat dissipating plate is connected with said heat dissipating body of said main heat dissipation protection module to form a complete heat dissipating surface for simultaneously realizing heat transfer to the outside.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321725224.XU CN220123351U (en) | 2023-07-04 | 2023-07-04 | Optimized power board heat dissipation integrated structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321725224.XU CN220123351U (en) | 2023-07-04 | 2023-07-04 | Optimized power board heat dissipation integrated structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220123351U true CN220123351U (en) | 2023-12-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321725224.XU Active CN220123351U (en) | 2023-07-04 | 2023-07-04 | Optimized power board heat dissipation integrated structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220123351U (en) |
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2023
- 2023-07-04 CN CN202321725224.XU patent/CN220123351U/en active Active
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