JPH10294580A - Heat transfer component for heat generating body - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a heat transfer component for a heat generating body of simple structure having excellent that conductivity to a heat dissipating plate by a method wherein the circumferential parts of the second heat diffusion sheet and the first heat diffusion sheet are adhered, and metal wool, having different thickness, is enclosed by the heat diffusing sheets. SOLUTION: A heat transfer component is mounted on the position corresponding to the height of the heat generating body 12 of an electronic device in conformity with the thickness of the heat transfer component. A heat dissipating plate 30 is fixed to a printed wiring substrate 10 using a fixing means 32 in such a manner that moderate pressure is applied to the heat transfer component. Consequently, as heat dissipating sheets 41 and 42 are soft, heat conductivity is improved by the increase of contact surface by the compression of the heat dissipating sheets 41 and 42 and metal wool 4a. Cooling action is explained as below mentioned. The heat of the heat generating body 12 of the electronic device is transferred to the metal wool 40 through the heat dissipating sheet 42. As the metal wool 40 is made of metal and has excellent heat transfer property, heat is diffused rapidly to the circumference. Also, the diffused heat is transferred to the heat dissipating plate 30 through the heat dissipating sheet 41.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat transfer component of a heating element used for cooling an electronic device.

[0002]

2. Description of the Related Art First, a description will be given of a temperature environment in which an electronic device, particularly a semiconductor test device, requires a heat transfer component of a heating element to cool the electronic device. 2. Description of the Related Art The electronic circuit of a semiconductor test apparatus is inevitably higher in integration degree due to the complexity of the circuit of the electronic device under test and the demand for a smaller test apparatus.

For example, the degree of integration of LSIs for large-scale integrated circuits and electronic devices such as gate arrays is high, and the temperature rise during operation tends to be large due to the demand for high speed. Examples of the electronic device that generates a large amount of heat include an ECL gate array with a high degree of integration, an LSI such as a general-purpose CMOS, and a power supply module.

Further, as shown in FIG. 6, since a large number of highly integrated semiconductor electronic devices are mounted on a printed wiring board, the amount of heat generated is large.

In general, the life of a semiconductor element which is a component of an LSI or a gate array tends to become shorter as the temperature of the junction (junction temperature Tj) rises. Therefore, the temperature of the joint needs to be cooled to, for example, 80 ° C. or less. For this reason, some LSIs have a built-in diode for temperature detection so that the temperature of the junction can be monitored by a voltage change.

Further, an LSI that generates a large amount of heat is sealed in a ceramic package having good heat dissipation as a heating element. On one side of the package, there are a large number of pin electrodes. For example, in the case of a BGA (Ball Grid Array Package), ball-shaped pins are arranged and mounted on a printed wiring board.

[0007] In these large number of LSIs surface-mounted on a printed wiring board, the height of the heating element from the printed wiring board varies due to the type of electronic device. For example, as shown in FIG. 7, when two types of LSIs are mounted on a printed wiring board, the difference in height is 1 to 5 mm.

Therefore, there is a need for a heat transfer component which is mounted on a large number of printed wiring boards, has a difference in height, and efficiently transfers heat of a heat generating element of an electronic device to a heat radiating plate with a large amount of heat generation.

Next, an example of the prior art will be described with reference to FIGS. 4 and 5. FIG. For example, a conventional method of directly cooling with a refrigerant without using a heat radiating plate will be described. The cooling method shown in FIG.
2, a variable heat transfer body 25, and a metal bellows 23 sealed with a heat transfer plate 24.

The heating element 12 of the electronic device 11 mounted on the printed wiring board 10 is attached to the variable heat transfer element 25.
And a jet of liquid refrigerant from the nozzle 26,
The exhaust refrigerant is discharged through the exhaust means 22. Therefore, the heat generated by the heating element 12 of the electronic device 11 is
Heat is transferred to the heat transfer plate 24 via the variable heat transfer body 25,
It is removed by the liquid refrigerant injected from the nozzle 26.
However, the cooling method using the metal bellows 23 and the refrigerant has difficulty in downsizing and increases the cost.

Further, as shown in FIG. 5, the conventional method of cooling a heat generating element by a heat transfer component comprises a heat radiating plate 30 and a heat transfer spring 60.

Then, the heat transfer spring 60 is brought into contact with the heating element 12 of the electronic device 11 mounted on the printed wiring board 10 to transfer heat to the heat radiation plate 30. The heat transferred to the heat radiating plate 30 is transmitted to the heat radiating plate 3.
The refrigerant is forcibly cooled by passing the refrigerant through the 0 refrigerant vent hole 31.

The heating element 12 and the heat radiating plate 30
Then, in order to reduce the contact thermal resistance with the heat transfer spring 60, heat conduction grease can be applied to the contact surface to enhance the heat dissipation effect. However, the cooling method using the heat transfer spring 60 and the heat radiating plate 30 does not have electrical insulation properties, and furthermore, the heat dissipation grease causes the oil component of the heat conductive grease to evaporate.

[0014]

As described above, the cooling method using the metal bellows 23 and the refrigerant makes it difficult to reduce the size and increases the cost. In addition, the cooling method using the heat transfer spring 60 and the heat radiating plate 30 using the heat transfer components does not have electrical insulation properties, and the heat dissipation effect deteriorates with time because the oil of the heat conductive grease evaporates due to heat generation. Therefore, the present invention has been made in view of such problems, and the purpose is to
An object of the present invention is to provide a heat transfer component of a heat generator having a simple structure and improved heat transfer to a heat radiating plate for heat generators of a plurality of electronic devices having different heights mounted on a printed wiring board. .

[0015]

That is, the present invention, which has been made to achieve the above object, provides a heat transfer component of a heat generating element for transferring heat of a plurality of heat generating elements having different heights to a heat radiating plate. A first heat diffusion sheet having thermal conductivity in contact with the plurality of heating elements, a second heat diffusion sheet having thermal conductivity in contact with the heat dissipation plate, and the second heat diffusion sheet; The invention further provides a heat transfer component of a heating element, comprising: a metal wool that is adhered to a peripheral portion of the first heat diffusion sheet and is included with a difference in thickness.

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described in the following examples.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described with reference to FIGS. As shown in FIG. 1, a heat transfer component of the cooling device of the present invention includes a metal wool 40, heat radiation sheets 41,
And 2. Hereinafter, each component and a processing method will be described.

The metal wool 40 is also called a metal fiber,
Use a material with high thermal conductivity and elasticity. For example, copper or a wool-shaped beryllium copper plated with copper is desirable.

As the material of the heat radiating sheets 41 and 42, a material having electric insulation, relatively good heat conductivity, soft on both sides, and adhesive is used. For example, a thickness of 0.
A 2 mm thin, double-sided adhesive type silicone rubber sheet is used.

Further, as shown in FIG.
In the method of processing the raw materials 1 and 42, the raw material is cut with a size slightly larger than the area range of the heat radiator of the electronic device shown in FIG.

As shown in the sectional view of FIG. 3, the heat-dissipating sheets 41 and 42 formed by cutting the material are adjusted to the thickness of the metal wool 40 by adjusting the amount of the metal wool 40 corresponding to the height of the electronic device. Adhesive part 4 in which peripheral parts are adhered with an adhesive by providing a difference
Enclose with 3.

Next, an example of a method for mounting the heat transfer component of the heating element of the present invention will be described. As shown in FIG. 1, the thickness of the heat transfer component is adjusted to a position corresponding to the height of the heating element 12 of the electronic device. Then, the heat radiating plate 30 is fixed to the printed wiring board 10 by using fixing means 32 so that an appropriate pressure is applied to the heat transfer component. As a result, since the heat radiating sheets 41 and 42 are soft, the contact surfaces increase due to the compression between the heat radiating sheets 41 and 42 and the metal wool 40, and the thermal conductivity is improved.

Hereinafter, the cooling operation of this embodiment will be described.
The heat of the heating element 12 of the electronic device 11 is
The heat is transferred to the metal wool 40 via.

Since the metal wool 40 is made of metal and has good heat conductivity, the metal wool 40 is quickly diffused to the surroundings. Also,
The heat diffused is transferred to the heat dissipation plate 30 through the heat dissipation sheet 41.

Further, since the heat dissipation plate 30 is provided with the coolant vent hole 31, it can be forcibly cooled, for example, by passing water as a coolant.

By the way, in this embodiment, the shape of the heat radiating sheet has been described as an example of a quadrangle with an R-shaped corner, but the heat radiating sheet may be formed in various shapes according to the arrangement and height of the heat radiating member. Further, the same operation can be performed by using carbon fibers having heat conductivity instead of metal wool.

[0027]

The present invention is embodied in the form described above, and has the following effects. That is, since the heat transfer component of the heating element of the present invention spreads heat at a stage close to the heating element, heat can be transferred from the surrounding metal wool portion other than immediately above the heat radiation sheet on the surface of the heating element. Since the number of heat conduction channels increases, the heat of the heating element is easily conducted to the heat dissipation plate, and the heat dissipation effect is large. In addition, the heat dissipation sheet is electrically insulating and has a sealed structure, so that the enclosed metal wool does not protrude to the outside and small pieces do not spill. is there.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view in which a heat transfer component of a heating element of the present invention is mounted.

FIG. 2 is a processing diagram of a heat radiation sheet.

FIG. 3 is a cross-sectional view of a heat transfer component of the heating element of the present invention.

FIG. 4 is a sectional view of a conventional cooling method using a refrigerant.

FIG. 5 is a sectional view of a conventional cooling method using a heat transfer component.

FIG. 6 is a top view of a printed wiring board on which an electronic device is mounted.

FIG. 7 is a side view of a printed wiring board on which an electronic device is mounted.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Printed wiring board 11 Electronic device 12 Heating element 13 Pin 14 Connector 22 Exhaust means 23 Metal bellows 24 Heat transfer plate 25 Variable heat transfer body 26 Nozzle 30 Heat dissipation plate 31 Refrigerant vent 32 Fixing means 40 Metal wool 41, 42 Heat dissipation sheet

Continued on the front page (72) Inventor Katsushi Sugai 1-32-1, Asahicho, Nerima-ku, Tokyo Within Advantest Co., Ltd.

Claims (1)

[Claims] 1. A heat-transfer component for a heat-generating element that transfers heat of a plurality of heat-generating elements having different heights to a heat-dissipating plate, wherein the first heat-diffusion sheet having thermal conductivity is in contact with the plurality of heat-generating elements. A second heat diffusion sheet having thermal conductivity in contact with the heat dissipation plate; and a peripheral portion of the second heat diffusion sheet and the first heat diffusion sheet adhered to each other. And a metal wool encapsulated therein.