JP2022175425A - Electronic apparatus - Google Patents

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JP2022175425A
JP2022175425A JP2021081795A JP2021081795A JP2022175425A JP 2022175425 A JP2022175425 A JP 2022175425A JP 2021081795 A JP2021081795 A JP 2021081795A JP 2021081795 A JP2021081795 A JP 2021081795A JP 2022175425 A JP2022175425 A JP 2022175425A
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heat
heat receiving
receiving body
processor
memories
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JP7212288B2 (en
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利之 柏木
Toshiyuki Kashiwagi
秀明 立川
Hideaki Tachikawa
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Fujitsu Client Computing Ltd
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Abstract

To obtain an electronic apparatus of a novel configuration capable of easily cooling a processor and a memory.SOLUTION: An electronic apparatus includes a substrate, a processor, a memory, a first heat receiving body, a second heat receiving body, a heat pipe, a connection body, and a housing. The substrate has one surface. The processor is mounted on the one surface. The memory is mounted on the one surface. The first heat receiving body is thermally connected to the processor. The second heat receiving body is thermally connected to the memory. The heat pump is thermally connected to the first heat receiving body. The connection body is thermally connected to the second heat receiving body and the heat pump. The housing houses the substrate, the processor, the first heat receiving body, the second heat receiving body, and the connection body.SELECTED DRAWING: Figure 4

Description

本発明は、電子機器に関する。 The present invention relates to electronic equipment.

従来、基板と、基板に実装されたプロセッサと、基板に実装されたメモリと、基板、プロセッサ、およびメモリを収容した筐体と、を備える電子機器が知られている。 2. Description of the Related Art Conventionally, an electronic device is known that includes a substrate, a processor mounted on the substrate, a memory mounted on the substrate, and a housing housing the substrate, the processor, and the memory.

特開２０１８－７２５５１号公報JP 2018-72551 A

この種の電子機器では、例えば、プロセッサとメモリとが冷却されやすい新規な構成が得られれば有益である。 For this type of electronic equipment, it would be beneficial, for example, to have a novel configuration that facilitates cooling of the processor and memory.

そこで、本発明の課題の一つは、プロセッサとメモリとが冷却されやすい新規な構成の電子機器を得ることである。 Accordingly, one of the objects of the present invention is to obtain an electronic device with a novel configuration in which the processor and memory are easily cooled.

本発明の第１態様にかかる電子機器は、一面を有した基板と、前記一面に実装されたプロセッサと、前記一面に実装されたメモリと、前記プロセッサに熱的に接続された第１受熱体と、前記メモリに熱的に接続された第２受熱体と、前記第１受熱体と熱的に接続されたヒートパイプと、前記第２受熱体と前記ヒートパイプとを熱的に接続した接続体と、前記基板、前記プロセッサ、前記第１受熱体、前記第２受熱体、および前記接続体を収容した筐体と、を備える。 An electronic device according to a first aspect of the present invention includes a substrate having one surface, a processor mounted on the one surface, a memory mounted on the one surface, and a first heat receiving body thermally connected to the processor. a second heat receiving body thermally connected to the memory, a heat pipe thermally connected to the first heat receiving body, and a connection thermally connecting the second heat receiving body and the heat pipe and a housing that accommodates the substrate, the processor, the first heat receiving body, the second heat receiving body, and the connecting body.

前記電子機器では、例えば、前記接続体は、前記第２受熱体を前記メモリに押し付ける板バネ部を有する。 In the electronic device, for example, the connecting body has a leaf spring portion that presses the second heat receiving body against the memory.

前記電子機器では、例えば、前記接続体は、前記ヒートパイプに重ねられたベース部と、前記基板に支持され前記ベース部を前記ヒートパイプに押し付ける板バネ部と、を有する。 In the electronic device, for example, the connection body includes a base portion superimposed on the heat pipe, and a plate spring portion supported by the substrate and pressing the base portion against the heat pipe.

前記電子機器では、例えば、前記第１受熱体と前記接続体とは、前記ヒートパイプを挟んでいる。 In the electronic device, for example, the heat pipe is sandwiched between the first heat receiving body and the connector.

前記電子機器では、例えば、前記接続体は、前記ヒートパイプに重ねられたベース部を有し、前記板バネ部は、前記ベース部と接続され、前記ベース部よりも幅が狭い。 In the electronic device, for example, the connection body has a base portion that overlaps the heat pipe, and the leaf spring portion is connected to the base portion and has a narrower width than the base portion.

本発明の上記態様によれば、プロセッサとメモリとが冷却されやすい新規な構成の電子機器を得ることができる。 According to the above aspect of the present invention, it is possible to obtain an electronic device with a novel configuration in which the processor and memory are easily cooled.

図１は、第１実施形態の電子機器の例示的な背面図である。1 is an exemplary rear view of the electronic device of the first embodiment; FIG. 図２は、第１実施形態の電子機器における基板装置を含む部分の例示的な背面図である。FIG. 2 is an exemplary rear view of a portion including a substrate device in the electronic device of the first embodiment; 図３は、第１実施形態の電子機器における基板装置を含む部分の例示的な背面図であって、図２に対して伝熱部材が取り外された状態の図である。FIG. 3 is an exemplary rear view of a portion including a substrate device in the electronic device of the first embodiment, and is a view of a state in which the heat transfer member is removed with respect to FIG. 図４は、図２のIV-IV断面図である。FIG. 4 is a sectional view along IV-IV in FIG. 図５は、第１実施形態の電子機器の熱輸送部の一部の例示的な背面図である。FIG. 5 is an exemplary back view of part of the heat transport section of the electronic device of the first embodiment; 図６は、第１実施形態の電子機器の熱輸送部の一部の例示的な側面図である。FIG. 6 is an exemplary side view of part of the heat transport section of the electronic device of the first embodiment; 図７は、第１実施形態の電子機器の熱輸送部の一部の例示的な底面図である。7 is an exemplary bottom view of part of the heat transport section of the electronic device of the first embodiment; FIG. 図８は、第２実施形態の電子機器における基板装置を含む部分の例示的な背面図である。FIG. 8 is an exemplary rear view of a portion including a board device in the electronic device of the second embodiment. 図９は、図８のIX-IX断面図である。9 is a cross-sectional view taken along line IX-IX of FIG. 8. FIG. 図１０は、第２実施形態の電子機器の熱輸送部の一部の例示的な背面図である。FIG. 10 is an exemplary back view of part of the heat transport section of the electronic device of the second embodiment. 図１１は、第２実施形態の電子機器の熱輸送部の一部の例示的な底面図である。FIG. 11 is an exemplary bottom view of part of the heat transport section of the electronic device of the second embodiment. 図１２は、第３実施形態の電子機器の熱輸送部の一部の例示的な正面図である。FIG. 12 is an exemplary front view of part of the heat transport section of the electronic device of the third embodiment.

以下、本発明の例示的な実施形態が開示される。以下に示される実施形態の構成、ならびに当該構成によってもたらされる作用および効果は、一例である。本発明は、以下の実施形態に開示される構成以外によっても実現可能である。また、本発明によれば、構成によって得られる種々の効果（派生的な効果も含む）のうち少なくとも一つを得ることが可能である。 Illustrative embodiments of the invention are disclosed below. The configurations of the embodiments shown below and the actions and effects brought about by the configurations are examples. The present invention can be realized by configurations other than those disclosed in the following embodiments. Moreover, according to the present invention, at least one of various effects (including derivative effects) obtained by the configuration can be obtained.

以下の複数の実施形態には、同様の構成要素が含まれている。それら同様の構成要素には共通の符号が付与されるとともに、重複する説明が省略される。また、図面は模式的なものであり、各要素の寸法の関係、各要素の比率などは、現実と異なる場合がある。また、図面の相互間においても、互いの寸法の関係や比率が異なる部分が含まれている場合がある。また、本明細書では、序数は、部品や、部材、部位、位置、方向等を区別するためだけに用いられており、順番や優先度を示すものではない。 Several of the following embodiments include similar components. Common reference numerals are given to those similar components, and overlapping descriptions are omitted. In addition, the drawings are schematic, and the dimensional relationship of each element, the ratio of each element, and the like may differ from reality. Moreover, even between the drawings, there are cases where portions having different dimensional relationships and ratios are included. In this specification, ordinal numbers are used only to distinguish parts, members, parts, positions, directions, etc., and do not indicate order or priority.

＜第１実施形態＞
図１は、第１実施形態の電子機器１の例示的な背面図である。電子機器１は、所謂オールインワン型のパーソナルコンピュータとして構成されている。なお、電子機器１は、上記例には限定されず、例えば、デスクトップ型のパーソナルコンピュータや、クラムシェル型（ノートブック型）のパーソナルコンピュータ、映像電子機器、テレビジョン受像機、ゲーム機等であってもよい。 <First embodiment>
FIG. 1 is an exemplary rear view of the electronic device 1 of the first embodiment. The electronic device 1 is configured as a so-called all-in-one personal computer. The electronic device 1 is not limited to the above examples, and may be, for example, a desktop personal computer, a clamshell (notebook) personal computer, a video electronic device, a television receiver, a game machine, or the like. may

電子機器１は、筐体２と、筐体２を支持した支持体４と、を備えている。支持体４は、不図示の机や、棚、台等の載置対象上に載置され、筐体２を支持する。支持体４は、スタンドとも称される。また、筐体２は、基板装置５０や、ファン装置５３，１５３等の収容品を収容している。また、筐体２は、ディスプレイ（不図示）を支持している。基板装置５０は、メインボードとも称される。 An electronic device 1 includes a housing 2 and a support 4 that supports the housing 2 . The support 4 is placed on a placement target such as a desk (not shown), a shelf, a stand, or the like, and supports the housing 2 . The support 4 is also called a stand. Further, the housing 2 accommodates components such as the substrate device 50 and the fan devices 53 and 153 . The housing 2 also supports a display (not shown). The board device 50 is also called a main board.

本実施形態では、便宜上、方向が定義されている。Ｘ方向は、筐体２の幅方向（左右方向、長手方向）に沿う方向である。Ｘ方向は右方、Ｘ方向の反対方向は左方とも称される。Ｙ方向は、筐体２の前後方向（厚さ）の前方と同じである。Ｚ方向は、筐体２の上下方向の上方（高さ方向）と同じである。Ｘ方向、Ｙ方向、およびＺ方向は、互いに直交している。 In this embodiment, directions are defined for convenience. The X direction is a direction along the width direction (horizontal direction, longitudinal direction) of the housing 2 . The X-direction is also called rightward and the opposite direction to X-direction is also called leftward. The Y direction is the same as the front in the front-rear direction (thickness) of the housing 2 . The Z direction is the same as the top (height direction) of the housing 2 in the vertical direction. The X, Y and Z directions are orthogonal to each other.

筐体２には、通気口２ａ，２ｂ，２ｃが設けられている。各通気口２ａ，２ｂ，２ｃは、筐体２の壁を貫通した複数のスリットによって構成されている。通気口２ａ，２ｂは、例えば、筐体２の上壁に設けられている。通気口２ｃは、例えば、筐体２の後壁に設けられている。 The housing 2 is provided with vents 2a, 2b, and 2c. Each vent 2 a , 2 b , 2 c is composed of a plurality of slits penetrating the wall of the housing 2 . The vents 2a and 2b are provided in the upper wall of the housing 2, for example. The vent 2c is provided in the rear wall of the housing 2, for example.

図２は、第１実施形態の電子機器１における基板装置５０を含む部分の例示的な背面図である。図３は、第１実施形態の電子機器１における基板装置５０を含む部分の例示的な背面図であって、図２に対して伝熱部材１６１が取り外された状態の図である。 FIG. 2 is an exemplary rear view of a portion including the board device 50 in the electronic device 1 of the first embodiment. FIG. 3 is an exemplary rear view of a portion including the substrate device 50 in the electronic device 1 of the first embodiment, showing a state in which the heat transfer member 161 is removed from FIG.

図２および図３に示されるように、基板装置５０は、基板５１と、プロセッサ５２（図１）と、プロセッサ５２を冷却するファン装置５３と、熱輸送部５４と、を有する。 As shown in FIGS. 2 and 3, the board device 50 has a board 51, a processor 52 (FIG. 1), a fan device 53 for cooling the processor 52, and a heat transporter .

プロセッサ５２は、基板５１の後面である一面５１ａに実装されている。プロセッサ５２は、例えばＣＰＵ（Central Processing Unit）である。なお、プロセッサ５２は、上記に限定されない。 The processor 52 is mounted on the rear surface 51 a of the substrate 51 . The processor 52 is, for example, a CPU (Central Processing Unit). Note that the processor 52 is not limited to the above.

熱輸送部５４は、プロセッサ５２で発生した熱を一端部で受けて他端部に輸送する。端部は、通気口２ａに面している。 The heat transporter 54 receives heat generated by the processor 52 at one end and transports it to the other end. The end faces the vent 2a.

上記構成では、ファン装置５３の動作によって、通気口２ｃから筐体２内に空気が導入されるとともに、通気口２ａから筐体２外に空気が排出される。このとき、熱輸送部５４の一端部がプロセッサ５２から受けた熱は、熱輸送部５４によって熱輸送部５４の他端部に輸送され、熱輸送部５４から通気口２ａを介して筐体２の外部に放出される。すなわち、プロセッサ５２が冷却される。 In the above configuration, the operation of the fan device 53 introduces air into the housing 2 through the vent 2c and exhausts the air out of the housing 2 through the vent 2a. At this time, the heat received by one end of the heat transporting portion 54 from the processor 52 is transported to the other end of the heat transporting portion 54 by the heat transporting portion 54, and is then transferred from the heat transporting portion 54 to the housing 2 through the ventilation port 2a. released to the outside of the That is, processor 52 is cooled.

また、基板装置５０は、プロセッサ１５２（図１）と、メモリ７１～７４と、ファン装置１５３と、熱輸送部１５４と、を有する。 The board device 50 also has a processor 152 (FIG. 1), memories 71 to 74, a fan device 153, and a heat transporter 154. FIG.

プロセッサ１５２は、基板５１の後面である一面５１ａに実装されている。プロセッサ１５２は、例えばＧＰＵ（Graphics Processing Unit）である。すなわち、プロセッサ１５２は、Ｇｆｘ機能を有する。なお、プロセッサ１５２は、上記に限定されない。 The processor 152 is mounted on the rear surface 51 a of the substrate 51 . The processor 152 is, for example, a GPU (Graphics Processing Unit). That is, the processor 152 has Gfx functionality. Note that the processor 152 is not limited to the above.

メモリ７１～７４は、基板５１の一面５１ａに実装されている。メモリ７１～７４は、例えば、ＶＲＡＭ（Video Random Access Memory）である。メモリ７１，７２は、プロセッサ１５２の下方に配置され、メモリ７３，７４は、プロセッサ１５２の側方に配置されている。なお、メモリ７１～７４は、上記に限定されない。 The memories 71 to 74 are mounted on one surface 51a of the substrate 51. FIG. The memories 71 to 74 are VRAMs (Video Random Access Memories), for example. Memories 71 and 72 are arranged below processor 152 , and memories 73 and 74 are arranged on the side of processor 152 . Note that the memories 71 to 74 are not limited to the above.

図４は、図２のIV-IV断面図である。図５は、第１実施形態の電子機器１の熱輸送部１５４の一部の例示的な背面図である。図６は、第１実施形態の電子機器１の熱輸送部１５４の一部の例示的な側面図である。図７は、第１実施形態の電子機器１の熱輸送部１５４の一部の例示的な底面図である。 FIG. 4 is a sectional view along IV-IV in FIG. FIG. 5 is an exemplary back view of part of the heat transporting section 154 of the electronic device 1 of the first embodiment. FIG. 6 is an exemplary side view of part of the heat transport section 154 of the electronic device 1 of the first embodiment. FIG. 7 is an exemplary bottom view of part of the heat transport section 154 of the electronic device 1 of the first embodiment.

図４～図７に示されるように、熱輸送部１５４は、ヒートパイプ１５５と、第１受熱体１５６と、ヒートシンク１５９と、伝熱部材１６１と、を有する。 As shown in FIGS. 4 to 7, the heat transporter 154 has a heat pipe 155, a first heat receiving body 156, a heat sink 159, and a heat transfer member 161. As shown in FIGS.

第１受熱体１５６は、プロセッサ１５２と熱的に接続され、プロセッサ１５２で発生した熱を受ける。詳細には、第１受熱体１５６は、固定部材１５７によってプロセッサ１５２に押し付けられている。固定部材１５７は、ネジ等の結合具１５８によって基板５１Ｂとともに筐体２に固定されている。第１受熱体１５６は、例えば、銅等の金属材料によって構成されている。 The first heat receiving body 156 is thermally connected to the processor 152 and receives heat generated by the processor 152 . Specifically, the first heat receiving body 156 is pressed against the processor 152 by a fixing member 157 . The fixing member 157 is fixed to the housing 2 together with the substrate 51B by a fastener 158 such as a screw. The first heat receiving body 156 is made of, for example, a metal material such as copper.

ヒートパイプ１５５は、第１受熱体１５６とヒートシンク１５９とに亘って設けられ、第１受熱体１５６とヒートシンク１５９とに熱的に接続されている。ヒートシンク１５９は、筐体２の通気口２ｂに面している。 The heat pipe 155 is provided across the first heat receiving body 156 and the heat sink 159 and is thermally connected to the first heat receiving body 156 and the heat sink 159 . The heat sink 159 faces the air vent 2 b of the housing 2 .

図４～図７に示されるように、伝熱部材１６１は、第２受熱体１６２と、接続体１６３と、を有する。第２受熱体１６２と接続体１６３とは、一体形成されている。伝熱部材１６１は、例えば、金属材料によって構成された板金部材である。 As shown in FIGS. 4 to 7, the heat transfer member 161 has a second heat receiving body 162 and a connector 163. As shown in FIGS. The second heat receiving body 162 and the connecting body 163 are integrally formed. The heat transfer member 161 is, for example, a sheet metal member made of a metal material.

第２受熱体１６２は、メモリ７１，７２に重ねられ、メモリ７１，７２と熱的に接続されている。第２受熱体１６２は、ヒートシンクとも称される。 The second heat receiving body 162 is stacked on the memories 71 and 72 and thermally connected to the memories 71 and 72 . The second heat receiving body 162 is also called a heat sink.

接続体１６３は、第２受熱体１６２とヒートパイプ１５５とを熱的に接続している。詳細には、接続体１６３は、ベース部１６３ａと、二つの板バネ部１６３ｂと、板バネ部１６３ｃと、を有する。 The connecting body 163 thermally connects the second heat receiving body 162 and the heat pipe 155 . Specifically, the connection body 163 has a base portion 163a, two leaf spring portions 163b, and a leaf spring portion 163c.

図４に示されるように、ベース部１６３ａは、ヒートパイプ１５５に重ねられて、ヒートパイプ１５５と熱的に接続されている。ベース部１６３ａは、ヒートパイプ１５５に対して第１受熱体１５６とは反対側に配置されている。すなわち、ベース部１６３ａと接続体１６３とは、ヒートパイプ１５５を挟んでいる。 As shown in FIG. 4 , the base portion 163 a overlaps the heat pipe 155 and is thermally connected to the heat pipe 155 . The base portion 163 a is arranged on the opposite side of the heat pipe 155 to the first heat receiving body 156 . That is, the heat pipe 155 is sandwiched between the base portion 163a and the connector 163. As shown in FIG.

図５に示されるように、二つの板バネ部１６３ｂは、ベース部１６３ａのＸ方向側およびＸ方向の反対方向側に設けられ、ベース部１６３ａと接続されている。二つの板バネ部１６３ｂにおけるベース部１６３ａとは反対側の端部は、ネジ等の結合具１６４によって固定部材１５７に固定されている。すなわち、二つの板バネ部１６３ｂは、固定部材１５７を介して基板５１に支持されている。二つの板バネ部１６３ｂは、弾性力によって、ベース部１６３ａをヒートパイプ１５５に押し付けている。 As shown in FIG. 5, the two plate spring portions 163b are provided on the X-direction side and the opposite side of the X-direction of the base portion 163a, and are connected to the base portion 163a. The ends of the two plate spring portions 163b on the side opposite to the base portion 163a are fixed to the fixing member 157 by a joint 164 such as a screw. That is, the two plate spring portions 163b are supported by the substrate 51 via the fixing member 157. As shown in FIG. The two plate spring portions 163b press the base portion 163a against the heat pipe 155 by elastic force.

図４および図５に示されるように、板バネ部１６３ｃは、ベース部１６３ａからＺ方向の反対方向に延びている。詳細には、板バネ部１６３ｃは、第１部分１６３ｄと第２部分１６３ｅとを有する。第１部分１６３ｄは、ベース部１６３ａの幅方向の中央部からＺ方向の反対方向に延びている。第２部分１６３ｅは、第１部分１６３ｄにおけるベース部１６３ａとは反対方向の端部からＹ方向に延びている。第２部分１６３ｅにおける第１部分１６３ｄとは反対側の端部は、第２受熱体１６２が接続されている。板バネ部１６３ｃは、弾性力によって、第２受熱体１６２をメモリ７１，７２に押し付けている。板バネ部１６３ｃ（第１部分１６３ｄ、第２部分１６３ｅ）の幅（Ｘ方向の幅）は、ベース部１６３ａの幅よりも小さい。 As shown in FIGS. 4 and 5, the plate spring portion 163c extends from the base portion 163a in the direction opposite to the Z direction. Specifically, the leaf spring portion 163c has a first portion 163d and a second portion 163e. The first portion 163d extends in the opposite direction in the Z direction from the center portion in the width direction of the base portion 163a. The second portion 163e extends in the Y direction from the end of the first portion 163d opposite to the base portion 163a. The second heat receiving body 162 is connected to the end of the second portion 163e opposite to the first portion 163d. The plate spring portion 163c presses the second heat receiving body 162 against the memories 71 and 72 with elastic force. The width (width in the X direction) of the leaf spring portion 163c (first portion 163d, second portion 163e) is smaller than the width of the base portion 163a.

上記構成では、ファン装置１５３の動作によって、通気口２ｃから筐体２内に空気が導入されるとともに、通気口２ｂから筐体２外に空気が排出される。ファン装置１５３による送風された空気は、ヒートシンク１５９の表面に沿って流れ、通気口２ｂから排出される。このとき、第１受熱体１５６がプロセッサ１５２から受けた熱は、ヒートパイプ１５５によってヒートシンク１５９に輸送され、ヒートシンク１５９から通気口２ｂを介して筐体２の外部に放出される。すなわち、プロセッサ１５２およびメモリ７１，７２が冷却される。ファン装置１５３は、少なくともプロセッサ１５２およびメモリ７１，７２の冷却用である。第１受熱体１５６は、ヒートシンクとも称され、ヒートシンク１５９は、放熱部材とも称される。 In the above configuration, the operation of the fan device 153 introduces air into the housing 2 through the vent 2c and exhausts the air out of the housing 2 through the vent 2b. The air blown by the fan device 153 flows along the surface of the heat sink 159 and is discharged from the vent 2b. At this time, the heat received by the first heat receiving member 156 from the processor 152 is transported to the heat sink 159 by the heat pipe 155, and released from the heat sink 159 to the outside of the housing 2 through the vent 2b. That is, processor 152 and memories 71 and 72 are cooled. Fan device 153 is for cooling at least processor 152 and memories 71 and 72 . The first heat receiving body 156 is also called a heat sink, and the heat sink 159 is also called a heat dissipation member.

以上のように、本実施形態では、電子機器１は、基板５１と、プロセッサ１５２と、メモリ７１～７４と、第１受熱体１５６と、第２受熱体１６２と、ヒートパイプ１５５と、接続体１６３と、筐体２と、を備える。基板５１は、一面５１ａを有する。プロセッサ１５２は、一面５１ａに実装されている。メモリ７１～７４は、一面５１ａに実装されている。第１受熱体１５６は、プロセッサ１５２に熱的に接続されている。第２受熱体１６２は、メモリ７１，７２に熱的に接続されている。ヒートパイプ１５５は、第１受熱体１５６と熱的に接続されている。接続体１６３は、第２受熱体１６２とヒートパイプ１５５とを熱的に接続している。筐体２は、基板５１、プロセッサ１５２、第１受熱体１５６、第２受熱体１６２、および接続体１６３を収容している。 As described above, in the present embodiment, the electronic device 1 includes the substrate 51, the processor 152, the memories 71 to 74, the first heat receiving body 156, the second heat receiving body 162, the heat pipe 155, the connector 163 and the housing 2 . The substrate 51 has one surface 51a. The processor 152 is mounted on the one surface 51a. The memories 71 to 74 are mounted on one surface 51a. The first heat receiver 156 is thermally connected to the processor 152 . The second heat receiving body 162 is thermally connected to the memories 71 and 72 . The heat pipe 155 is thermally connected to the first heat receiving body 156 . The connecting body 163 thermally connects the second heat receiving body 162 and the heat pipe 155 . The housing 2 accommodates the board 51 , the processor 152 , the first heat receiving body 156 , the second heat receiving body 162 and the connector 163 .

このような構成によれば、プロセッサ１５２の熱が第１受熱体１５６を介してヒートパイプ１５５に伝わるとともに、メモリ７１，７２の熱が第２受熱体１６２および接続体１６３を介してヒートパイプ１５５に伝わる。よって、プロセッサ１５２およびメモリ７１，７２が冷却されやすい。また、一つのヒートパイプ１５５によってプロセッサ１５２およびメモリ７１，７２を冷却するので、プロセッサ１５２およびメモリ７１，７２のそれぞれに対してヒートパイプを一つずつ設けた構成、すなわちプロセッサ１５２およびメモリ７１，７２に対して二つのヒートパイプを設けた構成に比べて、部品点数の削減をし易いとともに、電子機器１の組み立てがしやすい。 According to such a configuration, the heat of the processor 152 is transferred to the heat pipe 155 through the first heat receiving member 156 , and the heat of the memories 71 and 72 is transferred to the heat pipe 155 through the second heat receiving member 162 and the connector 163 . transmitted to Therefore, processor 152 and memories 71 and 72 are easily cooled. In addition, since the processor 152 and the memories 71 and 72 are cooled by the single heat pipe 155, one heat pipe is provided for each of the processor 152 and the memories 71 and 72, that is, the processor 152 and the memories 71 and 72 Compared to a configuration in which two heat pipes are provided for each, it is easy to reduce the number of parts, and it is easy to assemble the electronic device 1 .

また、本実施形態では、接続体１６３は、第２受熱体１６２をメモリ７１，７２に押し付ける板バネ部１６３ｃを有する。 In addition, in this embodiment, the connecting body 163 has a leaf spring portion 163c that presses the second heat receiving body 162 against the memories 71 and 72 .

このような構成によれば、第２受熱体１６２およびメモリ７１，７２の形状誤差や組付け誤差が有っても、第２受熱体１６２とメモリ７１，７２とを熱的に接続することができる。また、高さが異なる複数種類のメモリ７１，７２に対応することができる。 With such a configuration, even if there is a shape error or assembly error in the second heat receiving body 162 and the memories 71 and 72, the second heat receiving body 162 and the memories 71 and 72 can be thermally connected. can. Moreover, it is possible to deal with a plurality of types of memories 71 and 72 having different heights.

また、本実施形態では、接続体１６３は、ヒートパイプ１５５に重ねられたベース部１６３ａと、基板５１に支持されベース部１６３ａをヒートパイプ１５５に押し付ける板バネ部１６３ｂと、を有する。 In addition, in this embodiment, the connection body 163 has a base portion 163 a superimposed on the heat pipe 155 and a leaf spring portion 163 b supported by the substrate 51 and pressing the base portion 163 a against the heat pipe 155 .

このような構成によれば、ベース部１６３ａおよびヒートパイプ１５５の形状誤差や組付け誤差が有っても、ベース部１６３ａとヒートパイプ１５５とを熱的に接続することができる。 With such a configuration, the base portion 163a and the heat pipe 155 can be thermally connected even if there is a shape error or an assembly error between the base portion 163a and the heat pipe 155. FIG.

また、本実施形態では、第１受熱体１５６と接続体１６３とは、ヒートパイプ１５５を挟んでいる。 Further, in this embodiment, the heat pipe 155 is sandwiched between the first heat receiving member 156 and the connecting member 163 .

このような構成によれば、接続体１６３の形状の自由度が大きい。 With such a configuration, the degree of freedom in the shape of the connector 163 is large.

また、本実施形態では、接続体１６３は、ヒートパイプ１５５に重ねられたベース部１６３ａを有する。板バネ部１６３ｃは、ベース部１６３ａと接続され、ベース部１６３ａよりも幅が狭い。 In addition, in this embodiment, the connection body 163 has a base portion 163 a that overlaps the heat pipe 155 . The leaf spring portion 163c is connected to the base portion 163a and has a width narrower than that of the base portion 163a.

このような構成によれば、板バネ部１６３ｃがベース部１６３ａに対して変形しやすい。 With such a configuration, the plate spring portion 163c is easily deformed with respect to the base portion 163a.

＜第２実施形態＞
図８は、第２実施形態の電子機器１における基板装置５０を含む部分の例示的な背面図である。図９は、図８のIX-IX断面図である。図１０は、第２実施形態の電子機器１の熱輸送部１５４の一部の例示的な背面図である。図１１は、第２実施形態の電子機器１の熱輸送部１５４の一部の例示的な底面図である。 <Second embodiment>
FIG. 8 is an exemplary rear view of a portion including the substrate device 50 in the electronic device 1 of the second embodiment. 9 is a cross-sectional view taken along line IX-IX of FIG. 8. FIG. FIG. 10 is an exemplary rear view of part of the heat transport section 154 of the electronic device 1 of the second embodiment. FIG. 11 is an exemplary bottom view of part of the heat transport section 154 of the electronic device 1 of the second embodiment.

図８～図１１に示されるように、本実施形態は、伝熱部材１６１が、第２受熱体１６２および接続体１６３の他に、第２受熱体１７１と、二つの第３バネ部１６３ｆと有する点が、第１実施形態と異なる。 As shown in FIGS. 8 to 11, in this embodiment, the heat transfer member 161 includes a second heat receiving body 171 and two third spring portions 163f in addition to the second heat receiving body 162 and the connecting body 163. It differs from the first embodiment in that it has

第２受熱体１７１は、メモリ７３，７４に重ねられ、メモリ７３，７４と熱的に接続されている。第２受熱体１７１は、ヒートシンクとも称される。 The second heat receiving body 171 is overlaid on the memories 73 and 74 and is thermally connected to the memories 73 and 74 . The second heat receiving body 171 is also called a heat sink.

二つの第３バネ部１６３ｆは、ベース部１６３ａからＸ方向の反対側に延びて第２受熱体１７１と接続されている。二つの第３バネ部１６３ｆは、弾性力によって、第２受熱体１７１をメモリ７３，７４に押し付けている。 The two third spring portions 163 f extend from the base portion 163 a to the opposite side in the X direction and are connected to the second heat receiving body 171 . The two third spring portions 163f press the second heat receiving body 171 against the memories 73 and 74 with elastic force.

以上のように、本実施形態では、伝熱部材１６１は、第２受熱体１７１と、二つの第３バネ部１６３ｆと有する。 As described above, in the present embodiment, the heat transfer member 161 has the second heat receiving body 171 and the two third spring portions 163f.

このような構成によれば、メモリ７３，７４の熱が第２受熱体１７１および接続体１６３を介してヒートパイプ１５５に伝わる。よって、プロセッサ１５２およびメモリ７１，７２とともに、メモリ７３，７４が冷却されやすい。また、一つのヒートパイプ１５５によってプロセッサ１５２、メモリ７１，７２、およびメモリ７３，７４を冷却するので、プロセッサ１５２、メモリ７１，７２、およびメモリ７３，７４のそれぞれに対してヒートパイプを一つずつ設けた構成、すなわちプロセッサ１５２、メモリ７１，７２、およびメモリ７３，７４に対して三つのヒートパイプを設けた構成に比べて、部品点数の削減をし易いとともに、電子機器１の組み立てがしやすい。また、高さが異なる複数種類のメモリ７３，７４に対応することができる。本実施形態では、ファン装置１５３は、少なくともプロセッサ１５２およびメモリ７１～７４の冷却用である。 With such a configuration, the heat of the memories 73 and 74 is transferred to the heat pipe 155 via the second heat receiving body 171 and the connector 163 . Therefore, the memories 73 and 74 are easily cooled together with the processor 152 and the memories 71 and 72 . In addition, since one heat pipe 155 cools the processor 152, the memories 71 and 72, and the memories 73 and 74, one heat pipe is provided for each of the processor 152, the memories 71 and 72, and the memories 73 and 74. Compared to the configuration in which three heat pipes are provided for the processor 152, the memories 71 and 72, and the memories 73 and 74, the number of parts can be reduced and the electronic device 1 can be easily assembled. . Moreover, it is possible to deal with a plurality of types of memories 73 and 74 having different heights. In this embodiment, the fan device 153 is for cooling at least the processor 152 and the memories 71-74.

＜第３実施形態＞
図１２は、第３実施形態の電子機器１の熱輸送部１５４の一部の例示的な正面図である。 <Third Embodiment>
FIG. 12 is an exemplary front view of part of the heat transport section 154 of the electronic device 1 of the third embodiment.

本実施形態は、第２実施形態に対して、伝熱部材１６１に替えて、二つの接続体１８１と、四つの板バネ部１８３，１８４と、が設けられた点が異なる。 This embodiment differs from the second embodiment in that two connecting bodies 181 and four plate spring portions 183 and 184 are provided instead of the heat transfer member 161 .

一方の接続体１８１は、第１受熱体１５６と第２受熱体１６２とに亘って設けれ、第１受熱体１５６と第２受熱体１６２とを熱的に接続している。一方の接続体１８１は、例えば、第１受熱体１５６と第２受熱体１６２とに、接着されている。一方の接続体１８１は、第１受熱体１５６を介して、第２受熱体１６２とヒートパイプ１５５とを熱的に接続している。他方の接続体１８１は、第１受熱体１５６と第２受熱体１７１とに亘って設けれ、第１受熱体１５６と第２受熱体１７１とを熱的に接続している。他方の接続体１８１は、第１受熱体１５６を介して、第２受熱体１７１とヒートパイプ１５５とを熱的に接続している。他方の接続体１８１は、例えば、第１受熱体１５６と第２受熱体１７１とに、接着されている。接続体１８１は、例えばグラファイトシートによって構成されている。 One connecting member 181 is provided across the first heat receiving member 156 and the second heat receiving member 162 and thermally connects the first heat receiving member 156 and the second heat receiving member 162 . One connecting body 181 is adhered to, for example, the first heat receiving body 156 and the second heat receiving body 162 . One connecting member 181 thermally connects the second heat receiving member 162 and the heat pipe 155 via the first heat receiving member 156 . The other connecting member 181 is provided across the first heat receiving member 156 and the second heat receiving member 171 and thermally connects the first heat receiving member 156 and the second heat receiving member 171 . The other connecting member 181 thermally connects the second heat receiving member 171 and the heat pipe 155 via the first heat receiving member 156 . The other connecting member 181 is adhered to, for example, the first heat receiving member 156 and the second heat receiving member 171 . The connector 181 is made of, for example, a graphite sheet.

二つの板バネ部１８３は、第２受熱体１６２と固定部材１５７とに亘って設けられ、第２受熱体１６２をメモリ７１，７２（図３）に押し付けている。二つの板バネ部１８４は、第２受熱体１７１と固定部材１５７とに亘って設けられ、他方の接続体１８１をメモリ７３，７４（図３）に押し付けている。板バネ部１８３，１８４は、例えば、第２受熱体１６２，１７１と固定部材１５７とに、はんだ付けされている。板バネ部１８３，１８４は、リン青銅等の金属材料によって構成されている。 Two leaf spring portions 183 are provided across the second heat receiving body 162 and the fixing member 157 to press the second heat receiving body 162 against the memories 71 and 72 (FIG. 3). Two leaf spring portions 184 are provided across the second heat receiving body 171 and the fixing member 157, and press the other connecting body 181 against the memories 73 and 74 (FIG. 3). The plate spring portions 183 and 184 are soldered to the second heat receiving bodies 162 and 171 and the fixing member 157, for example. The leaf spring portions 183 and 184 are made of a metallic material such as phosphor bronze.

このような構成では、メモリ７１～７４の熱が、接続体１８１および板バネ部１８３，１８４を介して、ヒートパイプ１５５に伝わるので、プロセッサ１５２とともに、メモリ７１～７４が冷却されやすい。 In such a configuration, the heat of the memories 71-74 is transferred to the heat pipe 155 via the connector 181 and the plate spring portions 183, 184, so the memories 71-74 are easily cooled together with the processor 152. FIG.

以上、本発明の実施形態が例示されたが、上記実施形態は一例であって、発明の範囲を限定することは意図していない。上記実施形態は、その他の様々な形態で実施されることが可能であり、発明の要旨を逸脱しない範囲で、種々の省略、置き換え、組み合わせ、変更を行うことができる。また、各構成や、形状、等のスペック（構造や、種類、方向、形式、大きさ、長さ、幅、厚さ、高さ、数、配置、位置、材質等）は、適宜に変更して実施することができる。 Although the embodiment of the present invention has been illustrated above, the above embodiment is an example and is not intended to limit the scope of the invention. The above embodiments can be implemented in various other forms, and various omissions, replacements, combinations, and modifications can be made without departing from the scope of the invention. In addition, specifications such as each configuration and shape (structure, type, direction, format, size, length, width, thickness, height, number, arrangement, position, material, etc.) may be changed as appropriate. can be implemented.

１…電子機器、２…筐体、５１…基板、５１ａ…一面、７１～７４…メモリ、１５２…プロセッサ、１５５…ヒートパイプ、１５６…第１受熱体、１６２，１７１…第２受熱体、１６３，１８１…接続体、１６３ａ…ベース部、１６３ｂ…板バネ部、１６３ｃ…板バネ部。 DESCRIPTION OF SYMBOLS 1... Electronic device 2... Housing 51... Substrate 51a... One surface 71-74... Memory 152... Processor 155... Heat pipe 156... First heat receiving member 162, 171... Second heat receiving member, 163 , 181...connector, 163a...base portion, 163b...plate spring portion, 163c...plate spring portion.

本発明の第１態様にかかる電子機器は、一面を有した基板と、前記一面に実装されたプロセッサと、前記一面の前記プロセッサの下方となる位置に実装された第１メモリと、前記一面の前記プロセッサの側方となる位置に実装された第２メモリと、前記プロセッサに熱的に接続された第１受熱体と、前記第１メモリに熱的に接続された第２受熱体と、前記第２メモリに熱的に接続された第３受熱体と、前記第１受熱体と熱的に接続されたヒートパイプと、前記第１受熱体と前記第２受熱体とに亘って設けられ、前記第１受熱体を介して、前記第２受熱体と前記ヒートパイプとを熱的に接続した一方の接続体と、前記第１受熱体と前記第３受熱体とに亘って設けられ、前記第１受熱体を介して、前記第３受熱体と前記ヒートパイプとを熱的に接続した他方の接続体と、前記基板、前記プロセッサ、前記第１受熱体、前記第２受熱体、前記第３受熱体、前記一方の接続体、および前記他方の接続体を収容した筐体と、前記筐体に前記基板とともに固定され第１受熱体を前記プロセッサに押し付ける固定部材と、を備え、前記一方の接続体は、前記第２受熱体と前記固定部材とに亘って設けられ前記第２受熱体を前記第１メモリに押し付ける第１板バネ部を備え、前記他方の接続体は、前記第３受熱体と前記固定部材とに亘って設けられ該他方の接続体を前記第２メモリに押し付ける第２板バネ部と、を備える。 An electronic device according to a first aspect of the present invention comprises a substrate having one surface, a processor mounted on the surface , a first memory mounted on the surface below the processor, and a second memory mounted at a position to the side of the processor; a first heat receiving body thermally connected to the processor; a second heat receiving body thermally connected to the first memory ; provided across a third heat receiving body thermally connected to a second memory, a heat pipe thermally connected to the first heat receiving body, and the first heat receiving body and the second heat receiving body, provided across one connecting body that thermally connects the second heat receiving body and the heat pipe through the first heat receiving body, and the first heat receiving body and the third heat receiving body, The other connecting body that thermally connects the third heat receiving body and the heat pipe via the first heat receiving body, the substrate, the processor, the first heat receiving body, the second heat receiving body, the second heat receiving body, and 3 a housing that accommodates the heat receiving body, the one connecting body, and the other connecting body; and a fixing member that is fixed to the housing together with the board and presses the first heat receiving body against the processor , is provided across the second heat receiving body and the fixing member and includes a first plate spring portion for pressing the second heat receiving body against the first memory; a second leaf spring portion that is provided across the heat receiving body and the fixing member and presses the other connection body against the second memory .

本発明の上記態様によれば、プロセッサ、第１メモリ及び第２メモリが冷却されやすい新規な構成の電子機器を得ることができる。即ち、第１メモリ及び第２メモリの熱が、一方の接続体、他方の接続体、第１板バネ部、及び第２板バネ部を介して、ヒートパイプに伝わるので、プロセッサとともに、第１メモリ及び第２メモリが冷却されやすい。 According to the above aspect of the present invention, it is possible to obtain an electronic device with a novel configuration in which the processor , the first memory and the second memory are easily cooled. That is, the heat of the first memory and the second memory is transmitted to the heat pipe via the one connection body, the other connection body, the first plate spring portion, and the second plate spring portion, so that the heat of the first memory and the processor is transferred to the heat pipe. The memory and the second memory are easily cooled.

メモリ７１～７４は、基板５１の一面５１ａに実装されている。メモリ７１～７４は、例えば、ＶＲＡＭ（Video Random Access Memory）である。第１メモリであるメモリ７１，７２は、プロセッサ１５２の下方に配置され、第２メモリであるメモリ７３，７４は、プロセッサ１５２の側方に配置されている。なお、メモリ７１～７４は、上記に限定されない。 The memories 71 to 74 are mounted on one surface 51a of the substrate 51. FIG. The memories 71 to 74 are VRAMs (Video Random Access Memories), for example. Memories 71 and 72 as first memories are arranged below the processor 152 , and memories 73 and 74 as second memories are arranged beside the processor 152 . Note that the memories 71 to 74 are not limited to the above.

図８～図１１に示されるように、本実施形態は、伝熱部材１６１が、第２受熱体１６２および接続体１６３の他に、第３受熱体１７１と、二つの第３バネ部１６３ｆと有する点が、第１実施形態と異なる。 As shown in FIGS. 8 to 11, in this embodiment, the heat transfer member 161 includes a second heat receiving body 162 and a connecting body 163, a third heat receiving body 171, and two third spring portions 163f. It differs from the first embodiment in that it has

第３受熱体１７１は、メモリ７３，７４に重ねられ、メモリ７３，７４と熱的に接続されている。第３受熱体１７１は、ヒートシンクとも称される。 The third heat receiving body 171 is overlaid on the memories 73 and 74 and thermally connected to the memories 73 and 74 . The third heat receiving body 171 is also called a heat sink.

二つの第３バネ部１６３ｆは、ベース部１６３ａからＸ方向の反対側に延びて第３受熱体１７１と接続されている。二つの第３バネ部１６３ｆは、弾性力によって、第３受熱体１７１をメモリ７３，７４に押し付けている。 The two third spring portions 163 f extend from the base portion 163 a in the opposite direction in the X direction and are connected to the third heat receiving body 171 . The two third spring portions 163f press the third heat receiving body 171 against the memories 73 and 74 with elastic force.

以上のように、本実施形態では、伝熱部材１６１は、第３受熱体１７１と、二つの第３バネ部１６３ｆと有する。 As described above, in this embodiment, the heat transfer member 161 has the third heat receiving body 171 and the two third spring portions 163f.

このような構成によれば、メモリ７３，７４の熱が第３受熱体１７１および接続体１６３を介してヒートパイプ１５５に伝わる。よって、プロセッサ１５２およびメモリ７１，７２とともに、メモリ７３，７４が冷却されやすい。また、一つのヒートパイプ１５５によってプロセッサ１５２、メモリ７１，７２、およびメモリ７３，７４を冷却するので、プロセッサ１５２、メモリ７１，７２、およびメモリ７３，７４のそれぞれに対してヒートパイプを一つずつ設けた構成、すなわちプロセッサ１５２、メモリ７１，７２、およびメモリ７３，７４に対して三つのヒートパイプを設けた構成に比べて、部品点数の削減をし易いとともに、電子機器１の組み立てがしやすい。また、高さが異なる複数種類のメモリ７３，７４に対応することができる。本実施形態では、ファン装置１５３は、少なくともプロセッサ１５２およびメモリ７１～７４の冷却用である。 With such a configuration, the heat of the memories 73 and 74 is transferred to the heat pipe 155 via the third heat receiving body 171 and the connector 163 . Therefore, the memories 73 and 74 are easily cooled together with the processor 152 and the memories 71 and 72 . In addition, since one heat pipe 155 cools the processor 152, the memories 71 and 72, and the memories 73 and 74, one heat pipe is provided for each of the processor 152, the memories 71 and 72, and the memories 73 and 74. Compared to the configuration in which three heat pipes are provided for the processor 152, the memories 71 and 72, and the memories 73 and 74, the number of parts can be reduced and the electronic device 1 can be easily assembled. . Moreover, it is possible to deal with a plurality of types of memories 73 and 74 having different heights. In this embodiment, the fan device 153 is for cooling at least the processor 152 and the memories 71-74.

本実施形態は、第２実施形態に対して、伝熱部材１６１に替えて、二つの接続体１８１（一方の接続体１８１及び他方の接続体１８１）と、四つの板バネ部１８３（第１板バネ部１８３），板バネ部１８４（第２板バネ部１８４）と、が設けられた点が異なる。 In this embodiment, instead of the heat transfer member 161 in the second embodiment, two connection bodies 181 (one connection body 181 and the other connection body 181) and four leaf spring portions 183 (first The difference is that a plate spring portion 183) and a plate spring portion 184 (second plate spring portion 184 ) are provided.

一方の接続体１８１は、第１受熱体１５６と第２受熱体１６２とに亘って設けられ、第１受熱体１５６と第２受熱体１６２とを熱的に接続している。一方の接続体１８１は、例えば、第１受熱体１５６と第２受熱体１６２とに、接着されている。一方の接続体１８１は、第１受熱体１５６を介して、第２受熱体１６２とヒートパイプ１５５とを熱的に接続している。他方の接続体１８１は、第１受熱体１５６と第３受熱体１７１とに亘って設けられ、第１受熱体１５６と第３受熱体１７１とを熱的に接続している。他方の接続体１８１は、第１受熱体１５６を介して、第３受熱体１７１とヒートパイプ１５５とを熱的に接続している。他方の接続体１８１は、例えば、第１受熱体１５６と第３受熱体１７１とに、接着されている。接続体１８１は、例えばグラファイトシートによって構成されている。 One connecting body 181 is provided across the first heat receiving body 156 and the second heat receiving body 162 and thermally connects the first heat receiving body 156 and the second heat receiving body 162 . One connecting body 181 is adhered to, for example, the first heat receiving body 156 and the second heat receiving body 162 . One connecting member 181 thermally connects the second heat receiving member 162 and the heat pipe 155 via the first heat receiving member 156 . The other connecting member 181 is provided across the first heat receiving member 156 and the third heat receiving member 171 and thermally connects the first heat receiving member 156 and the third heat receiving member 171 . The other connecting member 181 thermally connects the third heat receiving member 171 and the heat pipe 155 via the first heat receiving member 156 . The other connecting member 181 is adhered to, for example, the first heat receiving member 156 and the third heat receiving member 171 . The connector 181 is made of, for example, a graphite sheet.

二つの板バネ部１８３（第１板バネ部１８３）は、第２受熱体１６２と固定部材１５７とに亘って設けられ、第２受熱体１６２をメモリ７１，７２（図３）に押し付けている。二つの板バネ部１８４（第２板バネ部１８４）は、第３受熱体１７１と固定部材１５７とに亘って設けられ、他方の接続体１８１をメモリ７３，７４（図３）に押し付けている。板バネ部１８３（第１板バネ部１８３），板バネ部１８４（第２板バネ部１８４）は、例えば、第２受熱体１６２，及び第３受熱体１７１と固定部材１５７とに、はんだ付けされている板バネ部１８３（第１板バネ部１８３），板バネ部１８４（第２板バネ部１８４）は、リン青銅等の金属材料によって構成されている。 Two plate spring portions 183 (first plate spring portion 183) are provided across the second heat receiving body 162 and the fixing member 157, and press the second heat receiving body 162 against the memories 71 and 72 (FIG. 3). . Two plate spring portions 184 (second plate spring portions 184) are provided across the third heat receiving body 171 and the fixing member 157, and press the other connection body 181 against the memories 73 and 74 (FIG. 3). . The plate spring portion 183 (the first plate spring portion 183) and the plate spring portion 184 (the second plate spring portion 184) are soldered to the second heat receiving body 162 and the third heat receiving body 171 and the fixing member 157, for example. The plate spring portion 183 (first plate spring portion 183) and the plate spring portion 184 (second plate spring portion 184) are made of a metal material such as phosphor bronze.

このような構成では、メモリ７１～７４の熱が、一方の接続体１８１、他方の接続体１８１および板バネ部１８３（第１板バネ部１８３），板バネ部１８４（第２板バネ部１８４）を介して、ヒートパイプ１５５に伝わるので、プロセッサ１５２とともに、メモリ７１～７４が冷却されやすい。 In such a configuration, the heat of the memories 71 to 74 is dissipated from the connection body 181 on one side, the connection body 181 on the other side, the leaf spring section 183 (first leaf spring section 183) and the leaf spring section 184 (second leaf spring section 184 ). ) to the heat pipe 155, the processor 152 and the memories 71 to 74 are easily cooled.

Claims (5)

一面を有した基板と、
前記一面に実装されたプロセッサと、
前記一面に実装されたメモリと、
前記プロセッサに熱的に接続された第１受熱体と、
前記メモリに熱的に接続された第２受熱体と、
前記第１受熱体と熱的に接続されたヒートパイプと、
前記第２受熱体と前記ヒートパイプとを熱的に接続した接続体と、
前記基板、前記プロセッサ、前記第１受熱体、前記第２受熱体、および前記接続体を収容した筐体と、
を備えた電子機器。 a substrate having one surface;
a processor mounted on the surface;
a memory mounted on the one surface;
a first heat receiving element thermally connected to the processor;
a second heat receiving body thermally connected to the memory;
a heat pipe thermally connected to the first heat receiving body;
a connecting body that thermally connects the second heat receiving body and the heat pipe;
a housing accommodating the substrate, the processor, the first heat receiving body, the second heat receiving body, and the connecting body;
electronic equipment with 前記接続体は、前記第２受熱体を前記メモリに押し付ける板バネ部を有した、請求項１に記載の電子機器。 2. The electronic device according to claim 1, wherein said connecting member has a leaf spring portion that presses said second heat receiving member against said memory. 前記接続体は、前記ヒートパイプに重ねられたベース部と、前記基板に支持され前記ベース部を前記ヒートパイプに押し付ける板バネ部と、を有した、請求項１に記載の電子機器。 2. The electronic device according to claim 1, wherein said connection body has a base portion superimposed on said heat pipe, and a leaf spring portion supported by said substrate and pressing said base portion against said heat pipe. 前記第１受熱体と前記接続体とは、前記ヒートパイプを挟んだ、請求項１～３のうちいずれか一つに記載の電子機器。 4. The electronic device according to claim 1, wherein said heat pipe is sandwiched between said first heat receiving member and said connector. 前記接続体は、前記ヒートパイプに重ねられたベース部を有し、
前記板バネ部は、前記ベース部と接続され、前記ベース部よりも幅が狭い、請求項２に記載の電子機器。 The connection body has a base portion superimposed on the heat pipe,
3. The electronic device according to claim 2, wherein said leaf spring portion is connected to said base portion and has a width narrower than said base portion.
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