JP5348331B2 - Printed circuit board support member, printed circuit board unit, and electronic device - Google Patents

Printed circuit board support member, printed circuit board unit, and electronic device Download PDF

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JP5348331B2
JP5348331B2 JP2012533782A JP2012533782A JP5348331B2 JP 5348331 B2 JP5348331 B2 JP 5348331B2 JP 2012533782 A JP2012533782 A JP 2012533782A JP 2012533782 A JP2012533782 A JP 2012533782A JP 5348331 B2 JP5348331 B2 JP 5348331B2
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circuit board
printed circuit
support member
mounting plate
protrusion
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JPWO2012035627A1 (en
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晃正 西川
英之 藤川
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Fujitsu Ltd
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Fujitsu Ltd
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/14Mounting supporting structure in casing or on frame or rack
    • H05K7/1417Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
    • H05K7/142Spacers not being card guides

Description

本発明は、プリント基板の支持部材、プリント基板ユニット、及び電子装置に関する。   The present invention relates to a printed circuit board support member, a printed circuit board unit, and an electronic device.

電子装置に採用されるプリント基板の発熱部品を冷却する技術が知られている。例えば、発熱部品を冷却するために、発熱部品に当接するヒートシンクを設けることが考えられる。ヒートシンクは、保持部材に保持されて、プリント基板の発熱部品が設けられている面側に配置される。また、プリント基板の発熱部品が設けられていない面側には、プリント基板を支持する支持部材が配置される。支持部材は、保持部材に連結され、支持部材と保持部材とでプリント基板を挟むようにして組みつけられる。特許文献1及び2は、基板に部品を取り付ける技術が開示されている。   A technique for cooling a heat generating component of a printed circuit board employed in an electronic device is known. For example, in order to cool the heat generating component, it is conceivable to provide a heat sink that contacts the heat generating component. The heat sink is held by the holding member and is disposed on the surface side of the printed board on which the heat generating component is provided. In addition, a support member that supports the printed circuit board is disposed on the side of the printed circuit board on which the heat generating components are not provided. The support member is coupled to the holding member, and is assembled so that the printed board is sandwiched between the support member and the holding member. Patent Documents 1 and 2 disclose techniques for attaching components to a substrate.

特許第2669412号公報Japanese Patent No. 2666912 特開2003−7380号公報JP 2003-7380 A

このような支持部材に突部を設け、取付板に位置決め用の孔を設けることが考えられる。突部が孔に適切に嵌合していないと、支持部材は取付板に倣わずに、取付板に対して傾斜した姿勢となる恐れがある。この場合、支持部材が所望の姿勢からずれた状態で、プリント基板が取付板に取り付けられる恐れがある。支持部材がこのような状態でプリント基板が取付板に取り付けられると、プリント基板が撓んだ状態で支持される恐れがある。   It is conceivable to provide a protrusion on such a support member and to provide a positioning hole on the mounting plate. If the protrusion is not properly fitted in the hole, the support member may not follow the attachment plate and may be inclined with respect to the attachment plate. In this case, there is a possibility that the printed board is attached to the attachment plate in a state where the support member is deviated from a desired posture. If the printed circuit board is attached to the mounting plate in such a state, the printed circuit board may be supported in a bent state.

本発明は、プリント基板の撓みを抑制するプリント基板の支持部材、それを備えたプリント基板ユニット、及びそれを備えた電子装置を提供することを目的とする。   An object of the present invention is to provide a printed circuit board support member that suppresses bending of the printed circuit board, a printed circuit board unit including the printed circuit board unit, and an electronic device including the printed circuit board unit.

本明細書に開示のプリント基板の支持部材は、発熱部品が実装されたプリント基板の面の裏面と前記プリント基板を取付可能な取付板との間に挟まれて、前記裏面を支持する支持部と、前記発熱部品の熱を受けるヒートシンクを保持する保持部材に連結可能な連結部と、前記取付板の位置決め用の孔に嵌合して前記支持部が位置決めされる突部と、前記突部が設けられ、弾性変形可能な弾性部と、を備え、前記突部と前記孔とが嵌合していない状態で前記支持部が前記取付板に押し付けられることにより、前記弾性部が弾性変形して前記支持部は前記取付板に倣う。   The printed circuit board support member disclosed in the present specification is sandwiched between a back surface of a printed circuit board on which a heat generating component is mounted and a mounting plate to which the printed circuit board can be attached, and supports the back surface. A connecting portion connectable to a holding member that holds a heat sink that receives heat from the heat-generating component, a protrusion that fits into a positioning hole of the mounting plate and positions the support portion, and the protrusion And the elastic portion is elastically deformable, and the elastic portion is elastically deformed by pressing the support portion against the mounting plate in a state where the protrusion and the hole are not fitted. The support portion follows the mounting plate.

本明細書に開示のプリント基板ユニットは、上記のプリント基板の支持部材と、前記ヒートシンクと、前記保持部材と、前記プリント基板と、を備えている。   A printed circuit board unit disclosed in this specification includes the above-described printed circuit board support member, the heat sink, the holding member, and the printed circuit board.

本明細書に開示の電子装置は、上記のプリント基板ユニットと、前記取付板と、を備えている。   An electronic device disclosed in this specification includes the printed circuit board unit and the mounting plate.

プリント基板の撓みを抑制するプリント基板の支持部材、それを備えたプリント基板ユニット、及びそれを備えた電子装置を提供できる。   It is possible to provide a printed circuit board support member that suppresses bending of the printed circuit board, a printed circuit board unit including the printed circuit board unit, and an electronic device including the printed circuit board unit.

図1は、本実施例の電子装置の説明図である。FIG. 1 is an explanatory diagram of an electronic apparatus according to the present embodiment. 図2は、プリント基板ユニットの分解斜視図である。FIG. 2 is an exploded perspective view of the printed circuit board unit. 図3は、支持部材の説明図である。FIG. 3 is an explanatory view of a support member. 図4は、支持部材の説明図である。FIG. 4 is an explanatory diagram of the support member. 図5は、支持部材の説明図である。FIG. 5 is an explanatory diagram of the support member. 図6は、プリント基板ユニットが取付板に組み付けられた状態の説明図である。FIG. 6 is an explanatory diagram of a state in which the printed circuit board unit is assembled to the mounting plate. 図7は、プリント基板ユニットが取付板に組み付けられた状態の説明図である。FIG. 7 is an explanatory diagram of a state in which the printed circuit board unit is assembled to the mounting plate. 図8A〜8Cは、支持部材が取付板に適切に位置決めされていない状態でプリント基板ユニットを取付板に組み付ける場合の説明図である。8A to 8C are explanatory diagrams when the printed circuit board unit is assembled to the mounting plate in a state where the support member is not properly positioned on the mounting plate. 図9は、孔への突部の嵌合の容易性の説明図である。FIG. 9 is an explanatory diagram of the ease of fitting the protrusion into the hole. 図10は、突部の断面の拡大図である。FIG. 10 is an enlarged view of a cross section of the protrusion.

図1は、本実施例の電子装置1の説明図である。電子装置1は、パソコンである。電子装置1は、本体筐体2、本体筐体2を支持する支持台4、を有している。本体筐体2には、画像を表示可能なディスプレイ3が設けられている。本体筐体2内には、パソコンとしての機能を実現するためのハードウェアが内蔵されている。   FIG. 1 is an explanatory diagram of an electronic apparatus 1 according to the present embodiment. The electronic device 1 is a personal computer. The electronic device 1 includes a main body housing 2 and a support base 4 that supports the main body housing 2. The main body housing 2 is provided with a display 3 capable of displaying an image. Hardware for realizing a function as a personal computer is built in the main body housing 2.

図2は、プリント基板ユニットUの分解斜視図である。本体筐体2内には、プリント基板ユニットUが収納されている。プリント基板ユニットUは、プリント基板10、プリント基板10に組み付けられた保持部材40、支持部材50、を含む。プリント基板10は、電子装置1全体の動作を制御するための電子部品が実装されたプリント基板10である。プリント基板10は、マザーボードとして機能する。プリント基板10は、第1面11、第2面12を有し、第1面11には発熱部品15が実装されている。尚、第2面12は、図2には記載されていないが、図7に記載されている。発熱部品15は、電力の供給により発熱する電子部品である。発熱部品15は、例えばCPUであるが、これに限定されず、例えばグラフィックチップであってもよい。尚、プリント基板10の第1面11には、メモリMが実装されている。   FIG. 2 is an exploded perspective view of the printed circuit board unit U. FIG. A printed circuit board unit U is accommodated in the main body housing 2. The printed circuit board unit U includes a printed circuit board 10, a holding member 40 assembled to the printed circuit board 10, and a support member 50. The printed circuit board 10 is a printed circuit board 10 on which electronic components for controlling the operation of the entire electronic device 1 are mounted. The printed circuit board 10 functions as a mother board. The printed circuit board 10 has a first surface 11 and a second surface 12, and a heat generating component 15 is mounted on the first surface 11. The second surface 12 is not shown in FIG. 2, but is shown in FIG. The heat generating component 15 is an electronic component that generates heat when power is supplied. The heat generating component 15 is, for example, a CPU, but is not limited thereto, and may be, for example, a graphic chip. A memory M is mounted on the first surface 11 of the printed circuit board 10.

ヒートシンク30は、銅やアルミニウム合金等の熱伝導性のよい金属製である。ヒートシンク30は、保持部材40により保持されている。保持部材40は、金属製の薄板状である。保持部材40には、ヒートシンク30を送風することにより冷却する不図示のファンが保持される。保持部材40には、ファンへの空気の通過を許容するための孔が形成されている。   The heat sink 30 is made of a metal having good thermal conductivity such as copper or aluminum alloy. The heat sink 30 is held by a holding member 40. The holding member 40 is a metal thin plate shape. The holding member 40 holds a fan (not shown) that is cooled by blowing the heat sink 30. The holding member 40 has a hole for allowing air to pass to the fan.

取付板90は、本体筐体2内に収納される。取付板90は、金属製である。取付板90には、プリント基板10を支持するための複数の支持ピン94が設けられている。プリント基板10と取付板90との間には、支持部材50が配置される。支持部材50は、プリント基板10を挟むようにして保持部材40に連結される。取付板90には、支持部材50を位置決めするための2つの孔96が設けられている。   The mounting plate 90 is accommodated in the main body housing 2. The mounting plate 90 is made of metal. The mounting plate 90 is provided with a plurality of support pins 94 for supporting the printed circuit board 10. A support member 50 is disposed between the printed board 10 and the mounting plate 90. The support member 50 is coupled to the holding member 40 so as to sandwich the printed circuit board 10. The attachment plate 90 is provided with two holes 96 for positioning the support member 50.

図3、図4、図5は、支持部材50の説明図である。尚、図5は、支持部材50の断面図である。支持部材50は、合成樹脂製である。支持部材50は、支持部51、支持部51に設けられた3つの連結孔52、支持部51に連続した板状部54、板状部54に形成された弾性部55、弾性部55に形成された突部56、を含む。支持部51の支持面51sは、プリント基板10の第2面12に当接して支持する。突部56は、取付板90に向けて突出している。突部56が取付板90の孔96に嵌合することにより、支持部材50は取付板90に対して位置決めされる。弾性部55は、切欠部Cにより確定される。弾性部55は、弾性変形可能である。支持部51には、開口OPが設けられている。支持部51は、枠状部分と、枠状部分から外側に延びた3つの延在部とを含む。尚、支持部51の形状はこのような形状に限定されない。   3, 4, and 5 are explanatory views of the support member 50. FIG. 5 is a cross-sectional view of the support member 50. The support member 50 is made of synthetic resin. The support member 50 is formed in a support part 51, three connecting holes 52 provided in the support part 51, a plate-like part 54 continuous to the support part 51, an elastic part 55 formed in the plate-like part 54, and an elastic part 55. Projecting portion 56. The support surface 51 s of the support portion 51 abuts on and supports the second surface 12 of the printed circuit board 10. The protrusion 56 protrudes toward the mounting plate 90. The support member 50 is positioned with respect to the mounting plate 90 by fitting the protrusions 56 into the holes 96 of the mounting plate 90. The elastic portion 55 is determined by the cutout portion C. The elastic part 55 is elastically deformable. The support portion 51 is provided with an opening OP. The support portion 51 includes a frame-shaped portion and three extending portions extending outward from the frame-shaped portion. In addition, the shape of the support part 51 is not limited to such a shape.

図6、図7は、プリント基板ユニットUが取付板90に組み付けられた状態の説明図である。図6においては、一部分を切り欠いて示している。保持部材40のネジ孔42と支持部材50の連結孔52とに共通に嵌合するネジSにより、保持部材40、支持部材50はプリント基板10を挟むようにしてプリント基板10に組み付けられる。ネジSは、図6、図7には示されていないが、図2に示されている。尚、ヒートシンク30が予め取り付けられた保持部材40を、支持部材50によりプリント基板10に組みつけてもよいし、ヒートシンク30が取り付けられていない保持部材40を、支持部材50によりプリント基板10に組付けた後に、保持部材40にヒートシンク30を取り付けてもよい。   6 and 7 are explanatory views showing a state in which the printed circuit board unit U is assembled to the mounting plate 90. FIG. In FIG. 6, a part is notched. The holding member 40 and the supporting member 50 are assembled to the printed circuit board 10 so as to sandwich the printed circuit board 10 by screws S that are fitted in the screw holes 42 of the holding member 40 and the connection holes 52 of the supporting member 50 in common. The screw S is not shown in FIGS. 6 and 7, but is shown in FIG. The holding member 40 to which the heat sink 30 is previously attached may be assembled to the printed circuit board 10 by the support member 50, or the holding member 40 to which the heat sink 30 is not attached is assembled to the printed circuit board 10 by the support member 50. After attaching, the heat sink 30 may be attached to the holding member 40.

このように、支持部材50の連結孔52は、保持部材40と連結可能な連結部として機能する。連結孔52の内部にはネジ溝が形成されている。次に、支持部材50の突部56を取付板90の孔96に嵌合させて、取付板90の支持ピン94とプリント基板10とをネジで固定する。これにより、取付板90にプリント基板10、保持部材40、支持部材50が組み付けられる。尚、ヒートシンク30の下面には受熱板Pが配置されている。受熱板Pを介して発熱部品15の熱がヒートシンク30に伝達される。受熱板Pは熱伝導性の良い金属製である。   Thus, the connection hole 52 of the support member 50 functions as a connection portion that can be connected to the holding member 40. A thread groove is formed inside the connection hole 52. Next, the protrusion 56 of the support member 50 is fitted into the hole 96 of the attachment plate 90, and the support pin 94 of the attachment plate 90 and the printed board 10 are fixed with screws. As a result, the printed board 10, the holding member 40, and the support member 50 are assembled to the mounting plate 90. A heat receiving plate P is disposed on the lower surface of the heat sink 30. Heat of the heat generating component 15 is transmitted to the heat sink 30 through the heat receiving plate P. The heat receiving plate P is made of a metal having good thermal conductivity.

次に、支持部材50について詳細に説明する。支持部材50が取付板90に適切に位置決めされていない状態でプリント基板ユニットUを取付板90に組み付ける場合について説明する。図8A〜8Cは、支持部材50が取付板90に適切に位置決めされていない状態でプリント基板ユニットUを取付板90に組み付ける場合の説明図である。尚、図8A〜8Cにおいては、20は省略してある。尚、詳しくは後述するが、図8A〜8Cは、あくまで突部56が孔96に嵌合していない状態を想定したものであり、常にこのような状態でプリント基板ユニットUが取付板90に組み付けられるわけではない。   Next, the support member 50 will be described in detail. A case where the printed board unit U is assembled to the mounting plate 90 in a state where the support member 50 is not properly positioned on the mounting plate 90 will be described. 8A to 8C are explanatory views when the printed circuit board unit U is assembled to the mounting plate 90 in a state where the support member 50 is not properly positioned on the mounting plate 90. In FIGS. 8A to 8C, 20 is omitted. Although details will be described later, FIGS. 8A to 8C are based on the assumption that the protrusion 56 is not fitted into the hole 96, and the printed circuit board unit U is always attached to the mounting plate 90 in such a state. It cannot be assembled.

図8Aに示すように、2つの突部56の一方が孔96に嵌合していない状態で支持部材50が取付板90上に配置された場合を想定する。この状態では、取付板90に対して支持部51の支持面51sは、取付板90に対して傾斜しており、支持部材50は所望の姿勢からずれた状態となる。この状態で、支持部材50を取付板90に押し付けると、図8B、8Cに示すように、孔96に嵌合していない突部56が設けられている弾性部55が湾曲するように弾性変形する。これにより、支持部材50は取付板90に倣い、支持部材50は所望の姿勢となる。この状態で、支持ピン94とプリント基板10とを連結することにより、プリント基板10は支持部材50により適切に支持される。   As shown in FIG. 8A, it is assumed that the support member 50 is disposed on the mounting plate 90 in a state where one of the two protrusions 56 is not fitted in the hole 96. In this state, the support surface 51 s of the support portion 51 is inclined with respect to the attachment plate 90 with respect to the attachment plate 90, and the support member 50 is shifted from a desired posture. When the support member 50 is pressed against the mounting plate 90 in this state, as shown in FIGS. 8B and 8C, the elastic portion 55 provided with the projection 56 not fitted in the hole 96 is elastically deformed so as to bend. To do. Accordingly, the support member 50 follows the mounting plate 90, and the support member 50 assumes a desired posture. In this state, the printed circuit board 10 is appropriately supported by the support member 50 by connecting the support pins 94 and the printed circuit board 10.

例えば、弾性部55が弾性変形不能の場合、図8Aの状態からプリント基板10を支持ピン94に固定すると、支持部材50が傾いた状態のまま、プリント基板10が取付板90に組み付けられることになる。このため、プリント基板10は傾いた支持部材50により支持されるので、プリント基板10が撓む。これにより、プリント基板10が破損する恐れがある。また、支持部材が破損する恐れもある。   For example, when the elastic part 55 is not elastically deformable, when the printed board 10 is fixed to the support pins 94 from the state of FIG. 8A, the printed board 10 is assembled to the mounting plate 90 while the support member 50 is tilted. Become. For this reason, since the printed circuit board 10 is supported by the inclined support member 50, the printed circuit board 10 bends. As a result, the printed circuit board 10 may be damaged. Further, the support member may be damaged.

しかしながら、本実施例においては、突部56が孔96に嵌合していない場合であっても弾性部55が弾性変形することにより、支持部材50は取付板90に倣う。これにより、支持部材50は所望の姿勢でプリント基板10を支持でき、プリント基板10の撓みや破損を抑制できる。従って、プリント基板ユニットUを取付板90に組み付ける際には、必ずしも支持部材50は取付板90に対して適切に位置決めされている必要はない。よって、取付板90へのプリント基板ユニットUの組み付け作業性が向上する。   However, in this embodiment, even when the protrusion 56 is not fitted in the hole 96, the support member 50 follows the mounting plate 90 due to the elastic deformation of the elastic portion 55. Thereby, the support member 50 can support the printed circuit board 10 in a desired posture, and can suppress the bending and breakage of the printed circuit board 10. Therefore, when the printed circuit board unit U is assembled to the mounting plate 90, the support member 50 does not necessarily have to be properly positioned with respect to the mounting plate 90. Therefore, the workability of assembling the printed circuit board unit U to the mounting plate 90 is improved.

また、プリント基板10、保持部材40、支持部材50間での位置のバラつき等を考慮すれば、プリント基板ユニットUを取付板90に組み付けた際に、突部56が孔96に適切に嵌合できない場合が起こり得る。このような場合であっても、プリント基板10が撓むことを抑制してプリント基板ユニットUを取付板90に組み付けることができる。   Further, when considering the variation in position among the printed circuit board 10, the holding member 40, and the support member 50, when the printed circuit board unit U is assembled to the mounting plate 90, the protrusion 56 fits into the hole 96 appropriately. There are cases where it is impossible. Even in such a case, the printed circuit board unit U can be assembled to the mounting plate 90 while suppressing the printed circuit board 10 from being bent.

また、弾性部55は弾性変形するので、支持部材50が取付板90に位置決めされていない状態でプリント基板ユニットUを取付板90に組み付けた場合に弾性部55が破損することを抑制できる。   Further, since the elastic portion 55 is elastically deformed, it is possible to prevent the elastic portion 55 from being damaged when the printed board unit U is assembled to the mounting plate 90 in a state where the support member 50 is not positioned on the mounting plate 90.

また、支持部材50、取付板90は、直接的に固定されているわけではなく、あくまでプリント基板10が取付板90に固定されることにより、支持部材50は取付板90に押し付けられているだけである。即ち、支持部材50はプリント基板10に組み付けられている。従って、プリント基板ユニットUが取付板90に組み付けられている状態において、プリント基板10、保持部材40、支持部材50を一体として取付板90から分離できる。このため、プリント基板ユニットUを、保守部品として採用できる。例えば、電子装置1が故障した場合の交換用の保守部品として、プリント基板10、保持部材40、支持部材50が一体化されたプリント基板ユニットUを採用できる。例えば、支持部材50が取付板90にネジ止めされていたり係止されている場合には、プリント基板10、保持部材40、支持部材50、取付板90が一体化されていることになる。このような場合には、製造メーカ側は、プリント基板10、保持部材40、支持部材50、取付板90を一体化したユニットを保守部品として保持しておく必要がある。このため、保守部品の大きさが大きくなり、また保守部品の製造コストも大きくなる。しかしながら、本実施例においては、プリント基板10、保持部材40、支持部材50が一体化されているので、保守部品としての大きさを小さくでき、保守部品の製造コストも抑制できる。   Further, the support member 50 and the mounting plate 90 are not directly fixed, and the support member 50 is only pressed against the mounting plate 90 by fixing the printed circuit board 10 to the mounting plate 90 to the last. It is. That is, the support member 50 is assembled to the printed circuit board 10. Therefore, in a state where the printed circuit board unit U is assembled to the mounting plate 90, the printed circuit board 10, the holding member 40, and the support member 50 can be separated from the mounting plate 90 as a unit. For this reason, the printed circuit board unit U can be employed as a maintenance part. For example, a printed circuit board unit U in which the printed circuit board 10, the holding member 40, and the support member 50 are integrated can be adopted as a maintenance part for replacement when the electronic apparatus 1 fails. For example, when the support member 50 is screwed or locked to the mounting plate 90, the printed circuit board 10, the holding member 40, the support member 50, and the mounting plate 90 are integrated. In such a case, the manufacturer needs to hold a unit in which the printed circuit board 10, the holding member 40, the support member 50, and the mounting plate 90 are integrated as a maintenance part. For this reason, the size of the maintenance part increases, and the manufacturing cost of the maintenance part also increases. However, in the present embodiment, since the printed circuit board 10, the holding member 40, and the support member 50 are integrated, the size of the maintenance part can be reduced, and the manufacturing cost of the maintenance part can be suppressed.

尚、2つの突部56の双方がそれぞれ孔96に嵌合していない場合であっても、2つの弾性部55が弾性変形して、支持部材50は取付板90に倣うことができる。   Even if both of the two protrusions 56 are not fitted in the holes 96, the two elastic portions 55 are elastically deformed, and the support member 50 can follow the mounting plate 90.

尚、図3、図4に示したように、弾性部55は、支持部51から取付板90に沿うように延びた片持ち状である。このため弾性部55は、弾性変形が容易である。また、弾性部55は、取付板90に垂直な方向での支持部51の厚みよりも薄い板状部54に切欠されて形成されている。これによっても、弾性部55は弾性変形が容易となる。   As shown in FIGS. 3 and 4, the elastic portion 55 has a cantilever shape extending from the support portion 51 along the mounting plate 90. For this reason, the elastic part 55 is easily elastically deformed. Further, the elastic portion 55 is formed by notching a plate-like portion 54 that is thinner than the thickness of the support portion 51 in the direction perpendicular to the mounting plate 90. This also facilitates elastic deformation of the elastic portion 55.

次に、孔96への突部56の嵌合の容易性について説明する。図9は、孔96への突部56の嵌合の容易性の説明図であり、図10は、突部56の断面の拡大図である。突部56は、取付板90に向けて径が小さくなる略截頭円錐状である。また、突部56は、略截頭円錐状を確定する傾斜面56sを有している。傾斜面56sは、断面視で、突部56の中心を通過して突出方向に延びた軸心に対して、取付板90に向かうほど接近するように傾斜している。   Next, the ease of fitting the protrusion 56 into the hole 96 will be described. FIG. 9 is an explanatory diagram of the ease of fitting of the protrusion 56 into the hole 96, and FIG. 10 is an enlarged view of the cross section of the protrusion 56. The protrusion 56 has a substantially frustoconical shape whose diameter decreases toward the mounting plate 90. The protrusion 56 has an inclined surface 56s that defines a substantially frustoconical shape. The inclined surface 56s is inclined so as to approach the mounting plate 90 with respect to an axial center that passes through the center of the protrusion 56 and extends in the protruding direction in a sectional view.

図9に示すように、取付板90にプリント基板ユニットUを組み付けた際に、突部56の傾斜面56sが孔96の縁に当接する場合が考えられる。このような状態でプリント基板ユニットUが組み付けられた場合に弾性部55は弾性変形する。従って、弾性部55の弾性復元力により突部56は、孔96に正常に嵌合するように押し付けられる。このようにして、突部56が孔96の縁に当接した場合であっても、突部56が孔96に嵌合しやすい。また、突部56に傾斜面56sを設けることにより、弾性部55の弾性変形の度合を抑制できる。   As shown in FIG. 9, when the printed circuit board unit U is assembled to the mounting plate 90, it is conceivable that the inclined surface 56 s of the protrusion 56 contacts the edge of the hole 96. When the printed circuit board unit U is assembled in such a state, the elastic portion 55 is elastically deformed. Accordingly, the protrusion 56 is pressed by the elastic restoring force of the elastic portion 55 so as to normally fit in the hole 96. In this way, even when the protrusion 56 is in contact with the edge of the hole 96, the protrusion 56 is easily fitted into the hole 96. Further, by providing the protrusion 56 with the inclined surface 56s, the degree of elastic deformation of the elastic portion 55 can be suppressed.

プリント基板10に平行な方向での傾斜面56sの長さAは、保持部材40と支持部材50とのガタの前記方向での長さと、プリント基板10と取付板90とのガタの前記方向での長さとの合計よりも大きい。これにより、突部56が孔96に適切に嵌合していない場合であっても、図9に示したように傾斜面56sが孔96の縁に当接する。これにより、孔96への突部56の嵌合を促進でき、弾性部55の弾性変形量を抑制できる。尚、傾斜面56sの長さAは、上記のガタに加えて、支持部材50の大きさのバラつきと、取付板90の大きさのバラつきと、プリント基板10の大きさのバラつきとを合計した長さよりも大きくてもよい。   The length A of the inclined surface 56 s in the direction parallel to the printed circuit board 10 is the length of the play between the holding member 40 and the support member 50 in the above direction and the direction of the play between the printed circuit board 10 and the mounting plate 90. Greater than the sum of the length of As a result, even when the protrusion 56 is not properly fitted in the hole 96, the inclined surface 56 s comes into contact with the edge of the hole 96 as shown in FIG. 9. Thereby, fitting of the protrusion 56 to the hole 96 can be promoted, and the amount of elastic deformation of the elastic portion 55 can be suppressed. The length A of the inclined surface 56s is the sum of the variation in the size of the support member 50, the variation in the size of the mounting plate 90, and the variation in the size of the printed circuit board 10 in addition to the above-described play. It may be larger than the length.

プリント基板10に垂直な方向、換言すれば取付板90に垂直な方向での傾斜面56sの長さBは、傾斜面56sが孔96の縁に当接した際に、弾性部55の弾性復元力により、突部56が適切に孔96に嵌合するように設定してもよい。   The length B of the inclined surface 56 s in the direction perpendicular to the printed circuit board 10, in other words, the direction perpendicular to the mounting plate 90 is the elastic restoration of the elastic portion 55 when the inclined surface 56 s abuts the edge of the hole 96. The projection 56 may be set so as to be properly fitted in the hole 96 by force.

以上本発明の好ましい一実施形態について詳述したが、本発明は係る特定の実施形態に限定されるものではなく、特許請求の範囲に記載された本発明の要旨の範囲内において、種々の変形・変更が可能である。   The preferred embodiment of the present invention has been described in detail above, but the present invention is not limited to the specific embodiment, and various modifications can be made within the scope of the gist of the present invention described in the claims.・ Change is possible.

本実施例においては、電子装置の一例としてパソコンについて説明したがこれに限定されない。電子装置としては、例えば、携帯型の装置、据え置き型の装置であってもよい。携帯型の装置としては、例えば、ノート型パソコン、タブレット型パソコン、携帯ゲーム機、据置型の装置としては、デスクトップ型パソコン、テレビ装置、磁気ディスクを読み出し再生可能な磁気ディスク再生装置、オーディオ装置、などであってもよい。   In this embodiment, a personal computer has been described as an example of an electronic device, but the present invention is not limited to this. The electronic device may be, for example, a portable device or a stationary device. Examples of portable devices include notebook computers, tablet computers, portable game machines, and stationary devices such as desktop computers, television devices, magnetic disk reproducing devices that can read and reproduce magnetic disks, audio devices, It may be.

本実施例において、発熱部品としてCPUを例に説明したが、電力が供給されることにより発熱する部品であればよい。例えば、発熱部品はグラフィックチップであってもよい。   In this embodiment, the CPU is described as an example of the heat generating component. However, any component that generates heat when power is supplied may be used. For example, the heat generating component may be a graphic chip.

上記実施例においては、支持部材50は合成樹脂製であるが、金属製であってもよい。その場合、ヒートシンク30側の支持部材50の面に、絶縁用のシートを貼り付ける。   In the above embodiment, the support member 50 is made of synthetic resin, but may be made of metal. In that case, an insulating sheet is attached to the surface of the support member 50 on the heat sink 30 side.

上記実施例において、突部56は、略半球状、略円錐状、略角錐状、略截頭角錐状であってもよい。   In the above-described embodiment, the protrusion 56 may have a substantially hemispherical shape, a substantially conical shape, a substantially pyramid shape, or a substantially truncated pyramid shape.

1 電子装置
10 プリント基板
15 発熱部品
30 ヒートシンク
40 保持部材
50 支持部材
51 支持部
51s 支持面
52 連結孔
54 板状部
55 弾性部
56 突部
56s 傾斜面
90 取付板
54 板状部
U プリント基板ユニット
DESCRIPTION OF SYMBOLS 1 Electronic device 10 Printed circuit board 15 Heat generating component 30 Heat sink 40 Holding member 50 Support member 51 Support part 51s Support surface 52 Connection hole 54 Plate-like part 55 Elastic part 56 Projection part 56s Inclined surface 90 Mounting plate 54 Plate-like part U Printed circuit board unit

Claims (7)

発熱部品が実装されたプリント基板の面の裏面と前記プリント基板を取付可能な取付板との間に挟まれて、前記裏面を支持する支持部と、
前記発熱部品の熱を受けるヒートシンクを保持する保持部材に連結可能な連結部と、
前記取付板の位置決め用の孔に嵌合して前記支持部が位置決めされる突部と、
前記突部が設けられ、弾性変形可能な弾性部と、を備え、
前記突部と前記孔とが嵌合していない状態で前記支持部が前記取付板に押し付けられることにより、前記弾性部が弾性変形して前記支持部は前記取付板に倣う、プリント基板の支持部材。
Sandwiched between the back surface of the surface of the printed circuit board on which the heat generating component is mounted and a mounting plate to which the printed circuit board can be attached, and a support portion that supports the back surface;
A connecting portion connectable to a holding member that holds a heat sink that receives heat from the heat-generating component;
A protrusion that is fitted into a positioning hole of the mounting plate and the support portion is positioned;
An elastic part provided with the protrusion and elastically deformable,
Supporting the printed circuit board in which the elastic portion is elastically deformed and the support portion follows the attachment plate when the support portion is pressed against the attachment plate in a state where the protrusion and the hole are not fitted. Element.
前記弾性部は、前記支持部から前記取付板に沿うように延びた片持ち状である、請求項1のプリント基板の支持部材。   The printed circuit board support member according to claim 1, wherein the elastic portion has a cantilever shape extending from the support portion along the mounting plate. 前記弾性部は、前記取付板に垂直な方向での前記支持部の厚みよりも薄い板状部に切欠されて形成されている、請求項1又は2のプリント基板の支持部材。   The support member for a printed circuit board according to claim 1 or 2, wherein the elastic portion is formed by notching a plate-like portion that is thinner than a thickness of the support portion in a direction perpendicular to the mounting plate. 前記突部は、前記取付板に向けて径が小さくなるように傾斜した傾斜面を有している、請求項1乃至3の何れかのプリント基板の支持部材。   4. The printed circuit board support member according to claim 1, wherein the protrusion has an inclined surface that is inclined so that the diameter decreases toward the mounting plate. 5. 前記プリント基板に平行な方向での前記傾斜面の長さは、前記保持部材と前記支持部材とのガタの前記方向での長さと、前記プリント基板と前記取付板とのガタの前記方向での長さとの合計よりも大きい、請求項4のプリント基板の支持部材。   The length of the inclined surface in the direction parallel to the printed circuit board is the length of the play between the holding member and the support member in the direction and the play of the play between the printed circuit board and the mounting plate. The printed circuit board support member of claim 4, wherein the printed circuit board support member is larger than a total length. 請求項1乃至5の何れかのプリント基板の支持部材と、
前記ヒートシンクと、
前記保持部材と、
前記プリント基板と、を備えたプリント基板ユニット。
A printed circuit board support member according to any one of claims 1 to 5,
The heat sink;
The holding member;
A printed circuit board unit comprising the printed circuit board.
請求項6のプリント基板ユニットと、
前記取付板と、を備えた電子装置。

A printed circuit board unit according to claim 6;
An electronic device comprising the mounting plate.

JP2012533782A 2010-09-15 2010-09-15 Printed circuit board support member, printed circuit board unit, and electronic device Expired - Fee Related JP5348331B2 (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02251198A (en) * 1989-03-24 1990-10-08 Mitsubishi Electric Corp Fixing device for electronic component
JP2000010665A (en) * 1998-06-25 2000-01-14 Toshiba Corp Electronic equipment
JP2002290073A (en) * 2000-12-28 2002-10-04 Gateway Inc Support of circuit board
JP2009188098A (en) * 2008-02-05 2009-08-20 Sony Corp Electronic apparatus

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02251198A (en) * 1989-03-24 1990-10-08 Mitsubishi Electric Corp Fixing device for electronic component
JP2000010665A (en) * 1998-06-25 2000-01-14 Toshiba Corp Electronic equipment
JP2002290073A (en) * 2000-12-28 2002-10-04 Gateway Inc Support of circuit board
JP2009188098A (en) * 2008-02-05 2009-08-20 Sony Corp Electronic apparatus

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