CN217588972U - High-power lighting module - Google Patents
High-power lighting module Download PDFInfo
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- CN217588972U CN217588972U CN202221127917.4U CN202221127917U CN217588972U CN 217588972 U CN217588972 U CN 217588972U CN 202221127917 U CN202221127917 U CN 202221127917U CN 217588972 U CN217588972 U CN 217588972U
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- metal substrate
- lighting module
- aluminum nitride
- nitride ceramic
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Abstract
The utility model belongs to the technical field of lighting apparatus, especially, relate to a lighting module of high power, include: a metal substrate; the aluminum nitride ceramic plate is attached to the surface of the metal substrate, and a naked metal bonding pad is arranged on the surface of the aluminum nitride ceramic plate, which is far away from the surface of the metal substrate; the LED chip is arranged on the surface of the aluminum nitride ceramic plate, which is far away from the surface of the metal substrate, and the metal bonding pad is electrically connected with the LED chip; the electric plate is fixedly connected to the metal substrate and provided with an opening through which the aluminum nitride ceramic plate passes; the clamping component is used for pressing the aluminum nitride ceramic plate on the metal substrate and comprises a seat body and an electrode clamping piece, the seat body is fixedly connected to the electric plate, one end of the electrode clamping piece is fixedly connected to the seat body, and the other end of the electrode clamping piece is pressed on the metal bonding pad. The lighting module is applied to solve the problems that the heat dissipation capability of the substrate of the existing high-power lighting module is not strong, the substrate is easy to deform and even crack, and the conductive circuit printed on the substrate is broken.
Description
Technical Field
The utility model belongs to the technical field of lighting apparatus, especially, relate to a lighting module of high power.
Background
The LED chip of the high-power lighting module is integrally arranged on the surface of the substrate, and the high-power lighting module is a high-power integrated surface light source. The lighting module has extremely high power and high power density, the LED chip generates heat seriously in the light emitting process, and the heat dissipation capability of the substrate for carrying the LED chip in the existing high-power lighting module is not strong, so that the substrate is easy to deform and even crack, and the damage is caused. Moreover, the LED chip is conducted by the lighting module through the conducting circuit printed on the substrate, and when the substrate is deformed or cracked, the conducting circuit is broken, so that the lighting module cannot normally illuminate.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a lighting module of high power, the base plate heat dissipation ability that aims at solving lighting module of current high power is not strong, leads to the base plate to warp fracture even easily to lead to the fact the cracked problem of conducting wire of printing on the base plate.
In order to achieve the purpose, the utility model adopts the technical proposal that: a high power lighting module comprising:
a metal substrate;
the aluminum nitride ceramic plate is attached to the surface of the metal substrate, and an exposed metal bonding pad is arranged on the surface of the aluminum nitride ceramic plate, which is deviated from the surface of the metal substrate;
the LED chip is arranged on the surface of the aluminum nitride ceramic plate, which is deviated from the surface of the metal substrate, and the metal bonding pad is electrically connected with the LED chip;
the electric plate is fixedly connected to the metal substrate and provided with an opening through which the aluminum nitride ceramic plate passes;
the clamping component is used for pressing the aluminum nitride ceramic plate on the metal substrate and comprises a base body and an electrode clamping piece, the base body is fixedly connected to the electric plate, one end of the electrode clamping piece is fixedly connected to the base body, and the other end of the electrode clamping piece is pressed on the metal bonding pad to enable the LED chip to be conducted with an external power supply.
In one embodiment, one end of the electrode clip is fixedly mounted to the housing by a rivet.
In one embodiment, the housing is an overmolded injection molded part.
In one embodiment, one end of the electrode clip is heat-fused into the seat body.
In one embodiment, the contour of the opening is adapted to the contour of the aluminum nitride ceramic plate.
In one embodiment, the number of the clamping members is multiple, and at least one clamping member is arranged on each of two opposite side edges of the opening.
In one embodiment, the electrical board is fixedly connected to the metal substrate through a first fastener, and the board surface of the electrical board is attached to the surface of the metal substrate.
In one embodiment, a heat conducting medium is arranged between the aluminum nitride ceramic plate and the metal substrate.
In one embodiment, the metal substrate is a copper plate.
In one embodiment, the lighting module further comprises a heat sink, the heat sink is provided with a mounting surface, the metal substrate is locked on the mounting surface through a second fastener, and the metal substrate is attached to the mounting surface away from the surface of the aluminum nitride ceramic plate.
The utility model discloses following beneficial effect has at least:
this lighting module of high power adopts the aluminium nitride ceramic plate that thermal behavior is excellent to come surface mounting LED chip, and aluminium nitride ceramic plate cooperation metal substrate and electric plate form the dielectric layer of multilayer structure form, have good thermal conductivity, can derive the heat that the LED chip during operation produced rapidly, the probability that the dielectric layer that is used for bearing the weight of the LED chip takes place to warp, the fracture is reduced, and, in this lighting module, press aluminium nitride ceramic plate on metal substrate through the clamping member, and, the electrode clamping piece of clamping member supports makes LED chip can switch on with external power supply on the metal pad, thus, on the one hand, the clamping force of electrode clamping piece to aluminium nitride ceramic plate can make aluminium nitride ceramic plate tightly attach in metal substrate, further prevent aluminium nitride ceramic plate relative metal substrate to take place to warp, on the other hand electrode clamping piece also can be in close contact with the metal pad under the effect of clamping force, guarantee that LED chip can well switch on with external power supply all the time, thereby ensure that this lighting module is normal, effectively throw light on.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the embodiments or the prior art descriptions will be briefly described below, it is obvious that the drawings in the following descriptions are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive labor.
Fig. 1 is a schematic view of an assembly structure of a metal substrate, an aluminum nitride ceramic plate, an LED chip, an electrical plate and a clamping member of an illumination module according to an embodiment of the present invention;
FIG. 2 is an exploded view of FIG. 1;
fig. 3 is a schematic structural diagram illustrating an assembly manner of the clamping member in the lighting module according to the embodiment of the present invention;
FIG. 4 is an exploded view of FIG. 3;
fig. 5 is a schematic structural diagram illustrating another assembling manner of the clamping member in the lighting module according to the embodiment of the present invention;
fig. 6 is a schematic view of an assembly structure of the metal substrate, the aluminum nitride ceramic plate, the LED chip, the electric plate, the clamping member and the heat sink of the lighting module according to the embodiment of the present invention.
Wherein, in the figures, the respective reference numerals:
10. a metal substrate;
20. an aluminum nitride ceramic plate; 21. a metal pad;
30. an electric board; 31. an opening; 33. a clamping member; 331. a base body; 332. an electrode clamping piece; 333. riveting; 34. an external terminal;
40. a first fastener; 41. a screw; 42. a nut;
50. a heat sink; 51. a mounting surface;
60. a second fastener;
100. and an LED chip.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention.
In the description of the present invention, it is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are merely for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.
Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those of ordinary skill in the art.
The first embodiment is as follows:
as shown in fig. 1 and 2, a first embodiment of the present invention provides a high power lighting module, which specifically includes a metal substrate 10, an aluminum nitride ceramic plate 20, an LED chip 100, an electrical plate 30, and a clamping member 33. Aluminum nitride ceramic plate 20 in metal substrate 10 surface, aluminum nitride ceramic plate 20 deviates from metal substrate 10 surface is equipped with naked metal pad 21, LED chip 100 by surface mounting in aluminum nitride ceramic plate 20 deviates from metal substrate 10 surface, metal pad 21 with LED chip 100 electric connection, electric plate 30 fixed connection in metal substrate 10, electric plate 30 has seted up the confession opening 31 that aluminum nitride ceramic plate 20 passed, clamping member 33 is used for with aluminum nitride ceramic plate 20 presses on metal substrate 10, clamping member 33 includes pedestal 331 and electrode clamping piece 332, pedestal 331 fixed connection in electric plate 30, the one end fixed connection of electrode clamping piece 332 in pedestal 331, the other end of electrode clamping piece 332 supports and presses on metal pad 21, so that LED chip 100 switches on with external power source.
The high-power illumination module adopts the aluminum nitride ceramic plate 20 with excellent thermal performance to surface mount the LED chip 100, the aluminum nitride ceramic plate 20 is matched with the metal substrate 10 and the electric plate 30 to form a dielectric layer in a multilayer structure form, the high-power illumination module has good thermal conductivity, heat generated when the LED chip 100 works can be rapidly LED out, the probability of deformation and cracking of the dielectric layer for bearing the LED chip 100 is reduced, moreover, in the illumination module, the aluminum nitride ceramic plate 20 is pressed on the metal substrate through the clamping component 33, in addition, the electrode clamping pieces 332 of the clamping component 33 are propped against the metal bonding pads 21, so that the LED chip 100 can be conducted with an external power supply, on one hand, the clamping force of the electrode clamping pieces 332 on the aluminum nitride ceramic plate 20 can enable the aluminum nitride ceramic plate 20 to be tightly attached to the metal substrate 10, the aluminum nitride ceramic plate 20 is further prevented from deforming relative to the metal substrate 10, on the other hand, the electrode clamping pieces 332 can also be tightly contacted with the metal bonding pads 21 under the clamping force, the good conduction of the LED chip 100 with the external power supply all the time is ensured, and the illumination module is normal and effective illumination is ensured.
The utility model discloses a lighting module's total dimension is less than 100mm, the square design pattern of small-size to, this lighting module has the good performance of high power, and concrete data parameter is as follows:
high throughput (High Flux): greater than 120klm;
high power (High power): greater than 1200W;
efficacy (Efficacy): greater than 100lm/w;
power density (Power density): greater than 50W/cm2;
moreover, the lighting module has the characteristics of high light emitting surface occupation ratio (light emitting surface =45mm × 45mm), long service life and the like.
In the first embodiment, the base 331 is an over-molded component, that is, the base 331 of the clamping member 33 is a plastic component, which can reduce the overall weight of the lighting module, so that the lighting module is more portable.
As shown in fig. 2 and 5, one end of the electrode clip 332 is fixedly mounted to the holder body 331 by a rivet 333. Specifically, the electrode clip 332 may be made of iron or copper, preferably copper, so that the electrode clip 332 has good conductivity and good clamping elasticity, and the aluminum nitride ceramic plate 20 is tightly clamped on the metal substrate 10 by the electrode clip 332. The rivet 333 may be a metal rivet or a plastic rivet, and preferably a plastic rivet. In the manufacturing and assembling process, assembling holes for inserting the rivets 333 are reserved on the base body 331 which is formed by injection molding, then the end parts of the electrode clamping pieces 332 are placed on the base body 331, the assembling holes are formed in the two sides of the electrode clamping pieces 332, then the rivets 333 are inserted into the assembling holes and fastened, and therefore the end parts of the electrode clamping pieces 332 are pressed and fixed on the base body 331 through the two rows of rivets 333. Then, the electrode clip 332 is electrically connected to the external terminal 34 on the electrical board 30, and the external terminal 34 is electrically connected to an external power source and conducted, so as to supply power to the LED chip 100.
In the lighting module of the first embodiment, the number of the clamping members 33 is multiple (two or more), and at least one clamping member 33 is disposed on each of two opposite side edges of the opening 31. As shown in fig. 1, the lighting module has two holding members 33, and the two holding members 33 are symmetrically located at both sides of the square aluminum nitride ceramic plate 20, thereby tightly holding the aluminum nitride ceramic plate 20 on the metal substrate 10.
As shown in fig. 2, the outline shape of the opening 31 of the electric plate 30 is matched with the outline shape of the aluminum nitride ceramic plate 20, that is, the outline shape of the opening 31 is also square. In this way, the aluminum nitride ceramic plate 20 can fit through the opening 31 of the electric plate 30, reducing the gap between the edge of the aluminum nitride ceramic plate 20 and the edge of the opening 31, thereby reducing the overall size of the lighting module.
As shown in fig. 1 and fig. 2, the electrical board 30 is fixedly connected to the metal substrate 10 by a first fastening member 40, specifically, the first fastening member 40 includes a screw 41 and a nut 42, the screw 41 sequentially penetrates through the metal substrate 10 and the electrical board 30, and then the nut 42 is screwed on the screw 41, so that the nut 42 presses the electrical board 30 on the metal substrate 10, and the board surface of the electrical board 30 is attached to the surface of the metal substrate 10, which enables the contact surface between the electrical board 30 and the metal substrate 10 to be in full-face contact, thereby mutually transferring heat and improving the heat dissipation efficiency of the lighting module.
In the lighting module, the base body 331 is also fixedly connected to the electrical board 30 by the first fastening member 40, the screw 41 sequentially passes through the metal substrate 10, the electrical board 30 and the base body 331, and then the nut 42 is screwed on the screw 41, so that the nut 42 presses the base body 331, thereby fixedly connecting the base body 331, the electrical board 30 and the metal substrate 10 at the same time.
In the lighting module of the first embodiment, the metal substrate 10 is a copper plate, so that the copper metal substrate 10 has better heat conductivity and heat dissipation performance, and can quickly dissipate heat generated by the LED chip 100 into the air.
Further, a heat conducting medium is disposed between the aluminum nitride ceramic plate 20 and the metal substrate 10, so that, since the aluminum nitride ceramic plate 20 is attached to the surface of the metal substrate 10, and heat is transferred between the aluminum nitride ceramic plate 20 and the metal substrate 10 through the heat conducting medium, heat generated by the operation of the LED chip 100 can be rapidly transferred to the metal substrate 10 after being transferred to the aluminum nitride ceramic plate 20, and the copper metal substrate 10 rapidly dissipates the heat to the air. In assembling, the heat transfer medium is uniformly coated on the surface of the metal substrate 10 corresponding to the opening 31, and then the aluminum nitride ceramic plate 20 is covered on the heat transfer medium, and the aluminum nitride ceramic plate 20 is clamped and fixed by the clamping member 33.
As shown in fig. 6, in the first embodiment, the lighting module further includes a heat sink 50, the heat sink 50 is provided with a mounting surface 51, the metal substrate 10 is locked on the mounting surface 51 by a second fastener 60, and the surface of the metal substrate 10 facing away from the aluminum nitride ceramic plate 20 is attached to the mounting surface 51. In this way, the heat sink 50 absorbs the heat of the metal substrate 10 and then dissipates the heat into the air, thereby further increasing the heat dissipation efficiency. Specifically, the second fastening member 60 is a bolt, and the bolt is screwed and fixed to the mounting surface 51 of the heat sink 50 after passing through the electric plate 30 and the metal base plate 10 in this order.
Further, a heat conducting medium is also disposed between the surface of the metal substrate 10 facing away from the electrical board 30 and the mounting surface 51, so that the metal substrate 10 and the mounting surface 51 are in complete contact, and heat is transferred more efficiently.
Example two:
the lighting module of the second embodiment has the following differences compared with the lighting module of the first embodiment.
As shown in fig. 3 and 4, one end of the electrode clip 332 is heat-fused in the holder body 331. When the electrode clip 332 is made of a metal sheet (such as an iron sheet or a copper sheet), after the base 331 is formed by over-molding, the end of the metal sheet is heated and then is fixed on the base 331 by hot-melt, and then the metal sheet is electrically connected to the external terminal 34 on the electric board 30, and after the external terminal 34 is electrically connected and conducted with an external power source, power can be supplied to the LED chip 100.
Alternatively, the electrode clip 332 includes a plastic sheet main body (not shown) and a metal core (not shown), an end of the plastic sheet main body is thermally fixed to the base 331, the metal core is embedded in the plastic sheet main body, and an end of the metal core facing the metal pad 21 is exposed, so that the end of the metal core can abut against the metal pad 21 when the aluminum nitride ceramic plate 20 is held by the plastic sheet main body, and then the metal core is electrically connected to the external terminal 34 on the electrical plate 30, and after the external terminal 34 is electrically connected to an external power source and is turned on, power can be supplied to the LED chip 100.
The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. A high power lighting module, comprising:
a metal substrate (10);
the aluminum nitride ceramic plate (20) is attached to the surface of the metal substrate (10), and a naked metal pad (21) is arranged on the surface, away from the metal substrate (10), of the aluminum nitride ceramic plate (20);
the LED chip (100) is surface-mounted on the surface, away from the metal substrate (10), of the aluminum nitride ceramic plate (20), and the metal bonding pad (21) is electrically connected with the LED chip (100);
the electric plate (30) is fixedly connected to the metal substrate (10), and an opening (31) for the aluminum nitride ceramic plate (20) to pass through is formed in the electric plate (30);
the clamping component (33) is used for pressing the aluminum nitride ceramic plate (20) on the metal substrate (10), and comprises a base body (331) and an electrode clamping piece (332), wherein the base body (331) is fixedly connected to the electric plate (30), one end of the electrode clamping piece (332) is fixedly connected to the base body (331), and the other end of the electrode clamping piece (332) is pressed on the metal bonding pad (21) so that the LED chip (100) is conducted with an external power supply.
2. The lighting module of claim 1, wherein:
one end of the electrode clamping piece (332) is fixedly assembled on the seat body (331) through a rivet (333).
3. The lighting module of claim 1, wherein:
the base body (331) is a part formed by over-molding and injection molding.
4. The lighting module of claim 3, wherein:
one end of the electrode clip (332) is fixed in the seat body (331) by heat fusion.
5. The lighting module of claim 1, wherein:
the contour shape of the opening (31) is adapted to the contour shape of the aluminum nitride ceramic plate (20).
6. The lighting module of any one of claims 1-5, wherein:
the number of the clamping components (33) is multiple, and at least one clamping component (33) is arranged on the two opposite side edges of the opening (31).
7. The lighting module of any one of claims 1-5, wherein:
the electric board (30) is fixedly connected to the metal substrate (10) through a first fastener (40), and the board surface of the electric board (30) is attached to the surface of the metal substrate (10).
8. The lighting module of any one of claims 1-5, wherein:
and a heat-conducting medium is arranged between the aluminum nitride ceramic plate (20) and the metal substrate (10).
9. The lighting module of claim 8, wherein:
the metal substrate (10) is a copper plate.
10. The lighting module of claim 9, wherein:
the lighting module further comprises a heat sink (50), the heat sink (50) is provided with a mounting surface (51), the metal substrate (10) is locked on the mounting surface (51) through a second fastener (60), and the metal substrate (10) deviates from the aluminum nitride ceramic plate (20) and is attached to the mounting surface (51) in surface mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221127917.4U CN217588972U (en) | 2022-05-11 | 2022-05-11 | High-power lighting module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221127917.4U CN217588972U (en) | 2022-05-11 | 2022-05-11 | High-power lighting module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217588972U true CN217588972U (en) | 2022-10-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221127917.4U Active CN217588972U (en) | 2022-05-11 | 2022-05-11 | High-power lighting module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217588972U (en) |
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2022
- 2022-05-11 CN CN202221127917.4U patent/CN217588972U/en active Active
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