CN210199358U - Heat radiation structure for optical transceiver module - Google Patents
Heat radiation structure for optical transceiver module Download PDFInfo
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- CN210199358U CN210199358U CN201921001181.4U CN201921001181U CN210199358U CN 210199358 U CN210199358 U CN 210199358U CN 201921001181 U CN201921001181 U CN 201921001181U CN 210199358 U CN210199358 U CN 210199358U
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Abstract
The utility model discloses a heat radiation structure for an optical transceiver module, which comprises a first heat conduction plate or/and a second heat conduction plate, wherein the first heat conduction plate is positioned at the lower end of a PCB (printed circuit board) of the module, the second heat conduction plate is positioned at the upper end of the PCB of the module, the surface of a chip on the PCB is contacted with the first heat conduction plate or/and the second heat conduction plate, the first heat conduction plate is contacted with a module base at a first heat radiation position of the optical transceiver module, the second heat conduction plate is contacted with a module upper cover at the first heat radiation position of the optical transceiver module, the first heat conduction plate and the second heat conduction plate both extend to a second heat radiation position of the optical transceiver module, a compression block is positioned at the second heat radiation position of the optical transceiver module, the upper end of the compression block is contacted with the second heat conduction plate, the second heat conduction plate is tightly contacted with the second heat radiation position of the module upper cover, the lower end of the compression block is contacted, the compact heap is equipped with the optic fibre via hole. The heat dissipation device can realize rapid diffusion of heat of a chip heat source, and effectively improves the heat dissipation efficiency of the chip.
Description
Technical Field
The utility model belongs to light transceiver module field, concretely relates to heat radiation structure for light transceiver module, in particular to heat radiation structure for many heat sources, high power consumption module.
Background
Along with urgent needs for data rate of big data, cloud service, high definition video service and the like, the rate of the optical transceiver module is required to be larger and larger, so that the power consumption of the optical transceiver module is higher and higher, and meanwhile, the port density of the optical switch is larger and larger, and higher requirements are provided for the heat dissipation design of the optical transceiver module. In the cost of a data center, the power cost occupies about 20%, and 42% of the cost is used for solving the heat dissipation, so the heat dissipation design of the optical transceiver module is more important.
The heat dissipation of current optical module is mainly through flexible heat conduction material with heat transfer to shell in chip heat production department, when the chip consumption is great, can lead to the heat to concentrate, aggravates the chip and generates heat, reduces life-span.
Disclosure of Invention
The utility model aims at providing a light is heat radiation structure for transceiver module to the not enough that prior art corresponds, can realize diffusing the heat of chip heat source rapidly, effectively improves the radiating efficiency of chip.
The utility model aims at adopting the following scheme to realize: the utility model provides a heat radiation structure for an optical transceiver module, which comprises a first heat conduction plate or/and a second heat conduction plate, wherein the first heat conduction plate is arranged at the lower end of a PCB (printed circuit board) of the module, the second heat conduction plate is arranged at the upper end of the PCB of the module, the surface of a chip on the PCB is contacted with the first heat conduction plate or/and the second heat conduction plate, the first heat conduction plate is contacted with a module base at a first heat radiation position of the optical transceiver module, the second heat conduction plate is contacted with a module upper cover at the first heat radiation position of the optical transceiver module, the first heat conduction plate and the second heat conduction plate both extend to a second heat radiation position of the optical transceiver module, a compression block is arranged in the optical transceiver module, the compression block is arranged at the second heat radiation position of the optical transceiver module, the upper end of the compression block is contacted with the second heat conduction plate, the second heat conduction plate is compressed on the inner wall of the module upper cover, so that the second heat, the lower extreme of compact heap and the contact of first heat-conducting plate compress tightly first heat-conducting plate on the module base inner wall, make the contact of first heat-conducting plate and the second heat dissipation department of module base, the compact heap is equipped with the optic fibre via hole.
Furthermore, the compressing block is limited by a limiting step arranged on the module upper cover or/and the module base.
Furthermore, the second heat-conducting plate is in contact with the second heat-dissipating part of the module upper cover through heat-conducting silicone grease, the first heat-conducting plate is in contact with the second heat-dissipating part of the module base through heat-conducting silicone grease, and the pressing block is in contact with the first heat-conducting plate through heat-conducting silicone grease.
Furthermore, the pressing block is in contact with the second heat conduction plate through a flexible heat conduction material.
Furthermore, the second heat conducting plate is in contact with the first heat dissipation part of the upper cover of the module through a flexible heat conducting material; the first heat conducting plate is in contact with the first heat dissipation part of the module base through a flexible heat conducting material.
Furthermore, the module upper cover is provided with a positioning column, the second heat conducting plate is provided with a positioning hole, and the positioning column arranged on the module upper cover is in clearance fit with the positioning hole of the second heat conducting plate to realize the positioning of the second heat conducting plate.
Furthermore, a positioning column is arranged on the module base, a positioning hole is formed in the first heat conducting plate, and the positioning column arranged on the module base is in clearance fit with the positioning hole of the first heat conducting plate, so that the first heat conducting plate is positioned.
Furthermore, the number of the positioning columns on the module upper cover is at least two. The number of the positioning columns on the module upper cover is at least two.
Furthermore, the first heat conducting plate and the second heat conducting plate are made of planar ultrahigh heat conductivity coefficient materials.
Furthermore, the module upper cover and the module base are provided with heat dissipation protrusions at the second heat dissipation position, so that the heat dissipation area is increased.
The utility model has the advantages that: because the heat dissipation structure for the optical transceiver module of the present invention comprises the first heat conduction plate and the second heat conduction plate which are positioned between the module upper cover and the module base, the first heat conduction plate is positioned at the lower end of the PCB of the module, the second heat conduction plate is positioned at the upper end of the PCB of the module, the chip surface on the PCB is contacted with the first heat conduction plate or/and the second heat conduction plate, the first heat conduction plate is contacted with the first heat dissipation part of the module base, the second heat conduction plate is contacted with the first heat dissipation part of the module upper cover, the first heat conduction plate and the second heat conduction plate both extend to the second heat dissipation part of the optical transceiver module, a compression block is arranged between the first heat conduction plate and the second heat conduction plate, the compression block is positioned at the second heat dissipation part of the optical transceiver module, the upper end of the compression block is contacted with the second heat conduction plate, the second heat conduction plate is compressed on the inner wall of the module upper cover, so that the second heat conduction plate, the lower extreme of compact heap and the contact of first heat-conducting plate compress tightly first heat-conducting plate on the module base inner wall, make the contact of first heat-conducting plate and the second heat dissipation department of module base, the compact heap is equipped with the optic fibre via hole. The first heat conducting plate and the second heat conducting plate are made of planar ultrahigh heat conductivity coefficient materials. The heat source heat of the chip in the light receiving and transmitting module can be transferred to the base and the upper cover of the light receiving and transmitting module by utilizing the planar ultrahigh heat conductivity coefficient material, so that the purpose of reducing the temperature of the heat source chip is achieved, the heat of the first heat dissipation part can be guided to the second heat dissipation part through the first heat conduction plate and the second heat conduction plate, and the heat is dissipated through the second heat dissipation part. The optical transceiver module is provided with an insertion part for inserting the optical switch and an exposure part exposed out of the optical switch, and the second heat dissipation part is positioned on the exposure part of the optical transceiver module. The first heat dissipation part is positioned at the insertion part of the optical transceiver module. When the optical transceiver module is used, the second heat dissipation position of the optical transceiver module is positioned outside the optical switch, and has the function of a fan in a use environment.
One end of the compression block is limited by a limiting step arranged on the module upper cover or/and the module base, and the other end of the compression block is limited by the end face of the PCB; and limiting bosses are respectively arranged on the two sides of the pressing block on the module base and used for limiting the two sides of the pressing block. The module upper cover is provided with a positioning column, the second heat conducting plate is provided with a positioning hole, and the positioning column arranged on the module upper cover is in clearance fit with the positioning hole of the second heat conducting plate to realize the positioning of the second heat conducting plate. The module base is provided with a positioning column, the first heat-conducting plate is provided with a positioning hole, and the positioning column arranged on the module base is in clearance fit with the positioning hole of the first heat-conducting plate to realize the positioning of the first heat-conducting plate. The utility model discloses a heat radiation structure for light transceiver module has advantages such as the radiating efficiency that the assembly is simple, effectively improve the chip.
The present invention will be described in further detail below with reference to the accompanying drawings.
Drawings
Fig. 1 is a schematic view of a heat dissipation structure for an optical transceiver module according to the present invention;
fig. 2 is a schematic view of an installation structure of the first heat conducting plate and the base of the present invention;
fig. 3 is a schematic cross-sectional view of a second heat dissipation portion of the heat dissipation structure for an optical transceiver module according to the present invention.
In the drawing, 10 is a first heat dissipation portion, 20 is a second heat dissipation portion, 100 is a module upper cover, 110 is a heat dissipation protrusion of the module upper cover, 200 is a module base, 210 is a heat dissipation protrusion of the module base, 220 is a positioning column, 230 is a limit boss, 310 is a first heat conduction plate, 320 is a second heat conduction plate, 400 is a pressing block, 410 is an optical fiber via hole, 500 is a flexible heat conduction material, 600 is a chip, 700 is a PCB plate, and 800 is an optical fiber.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.
The terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature; in the description of the present invention, "a plurality" means two or more unless otherwise specified.
Referring to fig. 1 to 3, the present embodiment provides a heat dissipation structure for an optical transceiver module, including a first heat conduction plate 310 and/or a second heat conduction plate 320, the first heat conduction plate 310 is located at a lower end of a PCB 700 of the module, the second heat conduction plate 320 is located at an upper end of the PCB 700 of the module, a surface of a chip 600 on the PCB 700 is in contact with the first heat conduction plate 310 or/and the second heat conduction plate 320, the first heat conduction plate 310 is in contact with an inner wall of a module base 200 of a first heat dissipation portion 10 of the optical transceiver module, the second heat conduction plate 320 is in contact with an inner wall of a module upper cover 100 of the first heat dissipation portion 10 of the optical transceiver module, the first heat conduction plate 310 and the second heat conduction plate 320 both extend toward a second heat dissipation portion 20 of the optical transceiver module, a compression block 400 is disposed in the optical transceiver module, the compression block 400 is located at the second heat dissipation portion 20 of the optical transceiver module, an upper end of the compression block, the second heat-conducting plate 320 is pressed against the inner wall of the module upper cover 100, so that the second heat-conducting plate 320 is in close contact with the second heat-dissipating part 20 of the module upper cover 100, the lower end of the pressing block 400 is in contact with the first heat-conducting plate 310, the first heat-conducting plate 310 is pressed against the inner wall of the module base 200, so that the first heat-conducting plate 310 is in contact with the second heat-dissipating part 20 of the module base 200, and the pressing block 400 is provided with an optical fiber through hole 410 or an optical fiber through hole.
The compression block 400 of the present embodiment is located between the first heat-conducting plate 310 and the second heat-conducting plate 320.
The second heat sink 20 of the optical transceiver module is located at the rear end of the optical transceiver module and is exposed to the outside when the optical transceiver module is in use.
The inner wall of the module upper cover 100 is provided with a downwardly extending boss corresponding to the position of the chip 600 for contacting the second heat conductive plate 320.
Further, the compressing block 400 is limited by a limiting step arranged on the module upper cover 100 or/and the module base 200; the module base 200 is provided with limiting bosses 230 on both sides of the pressing block 400, respectively, for limiting both sides of the pressing block 400, so that the pressing block 400 has a quick mounting structure.
Further, the second heat-conducting plate 320 is in contact with the second heat-dissipating portion 20 of the module upper cover 100 through heat-conducting silicone grease, the first heat-conducting plate 310 is in contact with the second heat-dissipating portion 20 of the module base 200 through heat-conducting silicone grease, and the pressing block 400 is in contact with the first heat-conducting plate 310 through heat-conducting silicone grease. The heat-conducting silicone grease can reduce the thermal resistance of different materials when in contact, and improve the heat-conducting property.
Further, the compression block 400 is in contact with the second heat conduction plate 320 through the flexible heat conduction material 500.
Further, the second heat conducting plate 320 is in contact with the first heat dissipation part 10 of the module upper cover 100 through the flexible heat conducting material 500; the first heat conducting plate 310 is in contact with the first heat dissipation part 10 of the module base 200 through a flexible heat conducting material 500. The flexible thermal conductive material 500 functions to conduct heat while eliminating assembly tolerances by virtue of its compressibility, ensuring adequate contact.
Furthermore, the module upper cover 100 is provided with a positioning column 220, the second heat conducting plate 320 is provided with a positioning hole, and the positioning column 220 provided on the module upper cover 100 is in clearance fit with the positioning hole of the second heat conducting plate 320, so as to realize the positioning of the second heat conducting plate 320.
Further, the module base 200 is provided with a positioning column 220, the first heat conducting plate 310 is provided with a positioning hole, and the positioning column 220 provided on the module base 200 is in clearance fit with the positioning hole of the first heat conducting plate 310 to realize the positioning of the first heat conducting plate 310. By adopting the structure, the first heat-conducting plate 310 and the base as well as the second heat-conducting plate 320 and the upper cover have a quick assembly structure.
Further, at least two positioning posts 220 are provided on the module top cover 100. At least two positioning posts 220 are provided on the module top cover 100. The number of the positioning posts 220 on the module top cover 100 is two in this embodiment. The number of the positioning posts 220 on the module top cover 100 is two in this embodiment.
The first and second heat-conducting plates 310 and 320 may be designed according to the layout of the PCB 700, for example, may be designed in a non-planar shape.
Further, the first heat conduction plate 310 and the second heat conduction plate 320 are made of planar ultrahigh thermal conductivity materials. By using the planar ultrahigh thermal conductivity material, the heat of the chip 600 can be rapidly transferred from the heat generating position to the module base 200 and the upper cover 100. The heat conductivity coefficient of the planar ultrahigh heat conductivity coefficient material is 1800W/m.K; such as a graphite sheet.
Further, the module top cover 100 is provided with a heat dissipation protrusion 110 at the second heat dissipation portion 20, so as to increase the heat dissipation area. The module base 200 is provided with a heat dissipation protrusion 210 at the second heat dissipation portion 20 to increase the heat dissipation area.
The utility model discloses a heat radiation structure for light transceiver module has advantages such as the radiating efficiency that the assembly is simple, effectively improve chip 600. The module comprises a first heat dissipation part 10 and a second heat dissipation part 20 of a heat source, a planar ultrahigh-heat-conductivity-coefficient material, a module upper cover 100, a module base 200, a flexible heat conduction material 500, heat conduction silicone grease and a pressing block 400. By using the planar ultrahigh thermal conductivity material, the heat of the heat source inside the optical transceiver module can be transferred to the optical transceiver module base 200 and the upper cover, thereby achieving the purpose of reducing the temperature of the heat source chip 600.
The above examples are merely illustrative of the present invention and should not be construed as limiting the scope of the invention, which is intended to be covered by the claims and any design similar or equivalent to the scope of the invention.
Claims (10)
1. A heat radiation structure for an optical transceiver module is characterized in that: the heat dissipation device comprises a first heat conduction plate or/and a second heat conduction plate, wherein the first heat conduction plate is positioned at the lower end of a PCB (printed circuit board) of a module, the second heat conduction plate is positioned at the upper end of the PCB of the module, the surface of a chip on the PCB is contacted with the first heat conduction plate or/and the second heat conduction plate, the first heat conduction plate is contacted with a module base at a first heat dissipation position of an optical transceiver module, the second heat conduction plate is contacted with a module upper cover at the first heat dissipation position of the optical transceiver module, the first heat conduction plate and the second heat conduction plate both extend to a second heat dissipation position of the optical transceiver module, a compression block is arranged in the optical transceiver module, the compression block is positioned at the second heat dissipation position of the optical transceiver module, the upper end of the compression block is contacted with the second heat conduction plate, the second heat conduction plate is compressed on the inner wall of the module upper cover, the second heat conduction plate is tightly contacted with the second heat dissipation, and the first heat-conducting plate is pressed on the inner wall of the module base, so that the first heat-conducting plate is contacted with the second heat dissipation part of the module base, and the pressing block is provided with an optical fiber through hole.
2. The heat dissipation structure for an optical transceiver module according to claim 1, characterized in that: the compressing block is limited by a limiting step arranged on the module upper cover or/and the module base.
3. The heat dissipation structure for an optical transceiver module according to claim 1, characterized in that: the optical transceiver module is provided with an insertion part for inserting the optical switch and an exposure part exposed out of the optical switch, and the second heat dissipation part is positioned on the exposure part of the optical transceiver module.
4. The heat dissipation structure for an optical transceiver module according to claim 1, characterized in that: the second heat-conducting plate is in contact with the second heat-radiating part of the upper cover of the module through heat-conducting silicone grease, the first heat-conducting plate is in contact with the second heat-radiating part of the module base through heat-conducting silicone grease, and the pressing block is in contact with the first heat-conducting plate through heat-conducting silicone grease.
5. The heat dissipation structure for an optical transceiver module according to claim 1 or 4, characterized in that: the pressing block is in contact with the second heat conduction plate through a flexible heat conduction material.
6. The heat dissipation structure for an optical transceiver module according to claim 1, characterized in that: the second heat conducting plate is in contact with the first heat dissipation part of the upper cover of the module through a flexible heat conducting material; the first heat conducting plate is in contact with the first heat dissipation part of the module base through a flexible heat conducting material.
7. The heat dissipation structure for an optical transceiver module according to claim 1, characterized in that: the module upper cover is provided with a positioning column, the second heat conducting plate is provided with a positioning hole, and the positioning column arranged on the module upper cover is in clearance fit with the positioning hole of the second heat conducting plate to realize the positioning of the second heat conducting plate.
8. The heat dissipation structure for an optical transceiver module according to claim 1, characterized in that: the module base is provided with a positioning column, the first heat-conducting plate is provided with a positioning hole, and the positioning column arranged on the module base is in clearance fit with the positioning hole of the first heat-conducting plate to realize the positioning of the first heat-conducting plate.
9. The heat dissipation structure for an optical transceiver module according to claim 1, characterized in that: the first heat conducting plate and the second heat conducting plate are made of planar ultrahigh heat conductivity coefficient materials.
10. The heat dissipation structure for an optical transceiver module according to claim 1, characterized in that: and the module upper cover and the module base are provided with heat dissipation bulges at the second heat dissipation position, so that the heat dissipation area is increased.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921001181.4U CN210199358U (en) | 2019-06-28 | 2019-06-28 | Heat radiation structure for optical transceiver module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921001181.4U CN210199358U (en) | 2019-06-28 | 2019-06-28 | Heat radiation structure for optical transceiver module |
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| Publication Number | Publication Date |
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| CN210199358U true CN210199358U (en) | 2020-03-27 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201921001181.4U Active CN210199358U (en) | 2019-06-28 | 2019-06-28 | Heat radiation structure for optical transceiver module |
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| CN (1) | CN210199358U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111638580A (en) * | 2020-07-26 | 2020-09-08 | 武汉永鼎光通科技有限公司 | High-speed radiating optical module tube structure |
-
2019
- 2019-06-28 CN CN201921001181.4U patent/CN210199358U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111638580A (en) * | 2020-07-26 | 2020-09-08 | 武汉永鼎光通科技有限公司 | High-speed radiating optical module tube structure |
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