CN219266589U - Optical module heat radiation structure and optical module - Google Patents
Optical module heat radiation structure and optical module Download PDFInfo
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- CN219266589U CN219266589U CN202320206813.0U CN202320206813U CN219266589U CN 219266589 U CN219266589 U CN 219266589U CN 202320206813 U CN202320206813 U CN 202320206813U CN 219266589 U CN219266589 U CN 219266589U
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Abstract
The utility model discloses an optical module radiating structure and an optical module, wherein the optical module radiating structure comprises a PCB assembly and a heat sink block, the PCB assembly comprises a PCB, and a photoelectric sensor chip is arranged on the PCB; the heat sink block is fixed relative to the PCB, an optical device is attached to the heat sink block, the optical device comprises a plurality of light emitting chips, and each light emitting chip is connected with the corresponding photoelectric sensor chip through signals. The utility model can rapidly transfer the heat of the light emitting chip to the whole heat sink block, realizes the effects of enlarging the heat conducting area and rapidly conducting heat, and is beneficial to prolonging the service life of the light emitting chip and the like.
Description
Technical Field
The present utility model relates to the field of optical modules, and in particular, to an optical module heat dissipation structure and an optical module.
Background
At present, under the condition of large heat dissipation capacity, most of the existing optical modules adopt a mode that power consumption chips on the front side and the back side of a PCB adopt heat conduction silica gel pads or various heat conduction materials such as heat conduction silicone grease are coated, and then an upper shell and a lower shell are tightly attached to the heat conduction materials to perform natural exchange heat dissipation. The disadvantage of this heat conduction method is that the power consumption chip on the PCB is locally hotter on the PCB itself, and the heat is concentrated in one place, namely, under the cross-sectional area of the chip, the heat transfer effect in the PCB is limited, and the heat cannot be rapidly dispersed, meanwhile, the heat conduction area of the chip depends on the length and width dimensions of the chip itself, which has a great heat transfer obstruction for the chip with high heat.
Disclosure of Invention
The utility model aims to provide a light module radiating structure which can enlarge the heat conducting area and conduct heat rapidly.
Another object of the present utility model is to provide an optical module that is capable of enlarging the heat conduction area and conducting heat rapidly.
In order to achieve the above purpose, the utility model provides an optical module heat dissipation structure, which comprises a PCB assembly and a heat sink block, wherein the PCB assembly comprises a PCB board, and a photoelectric sensor chip is arranged on the PCB board; the heat sink block is fixed relative to the PCB, an optical device is attached to the heat sink block, the optical device comprises a plurality of light emitting chips, and each light emitting chip is connected with the corresponding photoelectric sensor chip through signals.
In the utility model, a plurality of light emitting chips originally arranged on a PCB are changed into a plurality of light emitting chips arranged on a specially configured heat sink block. Because the light emitting chip is a device with high power consumption, after being attached to the heat sink block, the heat of the light emitting chip can be quickly transferred to the whole heat sink block, the effects of enlarging the heat conducting area and quickly conducting heat are realized, and the service life of the light emitting chip and the like is prolonged.
Optionally, the optical device attached to the heat sink block further includes a plurality of collimator objectives and a MUX assembly.
Optionally, the heat sink block is fixedly connected with the PCB board.
Optionally, a notch penetrating outwards is formed in the PCB, a partial area of the heat sink block is fixedly connected to the bottom of the PCB, and an area of the heat sink block provided with the optical device is located at the notch.
Optionally, the optical module heat dissipation structure further includes a first shielding case, and the first shielding case is disposed outside the optical device on the heat sink block.
Optionally, the PCB assembly further comprises a processing chip disposed on the PCB; the optical module radiating structure further comprises a second shielding cover which is fixedly arranged on the PCB and can conduct heat, the second shielding cover is arranged on the outer side of the processing chip, and the processing chip conducts heat to the second shielding cover through a first heat conducting material.
Optionally, the heat sink block and the second shielding case are made of tungsten copper.
To achieve the above another object, the present utility model provides an optical module, including a housing and an optical module heat dissipation structure disposed in the housing, where the optical module heat dissipation structure is as described above.
In the utility model, a plurality of light emitting chips originally arranged on a PCB are changed into a plurality of light emitting chips arranged on a specially configured heat sink block. Because the light emitting chip is a device with high power consumption, after being attached to the heat sink block, the heat of the light emitting chip can be quickly transferred to the whole heat sink block, the effects of enlarging the heat conducting area and quickly conducting heat are realized, and the service life of the light emitting chip and the like is prolonged.
Optionally, the heat sink block is attached to the bottom wall of the housing by a second heat conducting material.
Optionally, the PCB assembly further comprises a processing chip disposed on the PCB; the optical module radiating structure further comprises a second shielding cover, wherein the second shielding cover is arranged on the outer side of the processing chip, and the processing chip conducts heat to the second shielding cover through a first heat conducting material; the second shielding cover is attached to the inner side of the top wall of the shell through a third heat conducting material.
Drawings
Fig. 1 is a schematic perspective view of an optical module according to an embodiment of the present utility model.
Fig. 2 is a schematic perspective view of the optical module shown in fig. 1 after a hidden part is constructed.
Fig. 3 is an exploded view of fig. 2.
Fig. 4 is a schematic cross-sectional structure of an optical module according to an embodiment of the present utility model, in which a part of the structure is hidden.
Fig. 5 is a schematic perspective view of a heat sink block and an optical device positioned on the heat sink block according to an embodiment of the present utility model.
Detailed Description
In order to describe the technical content and constructional features of the present utility model in detail, the following description will be made with reference to the embodiments in conjunction with the accompanying drawings.
Example 1
Referring to fig. 1 to 5, the utility model discloses an optical module heat dissipation structure, which comprises a PCB board assembly 1 and a heat sink block 2. The PCB assembly 1 comprises a PCB 10, and a photoelectric sensor chip 11 is arranged on the PCB 10. The heat sink block 2 and the PCB 10 are relatively fixed, an optical device is attached to the heat sink block 2, the optical device comprises a plurality of light emitting chips 3, and each light emitting chip 3 is respectively connected with the photoelectric sensor chip 11 in a signal mode. It should be noted that the heat sink block 2 and the PCB board 10 are relatively fixed, and are not limited to being fixedly connected (including direct connection and indirect connection), for example, the heat sink block 2 may be fixed on the lower housing 82 of the optical module, and the PCB board assembly 10 remains relatively fixed in position after the assembly is completed.
In the utility model, a plurality of light emitting chips 3 originally arranged on a PCB 10 are arranged on a specially configured heat sink block 2 instead. Because the light emitting chip 3 is a device with high power consumption, after being attached to the heat sink block 2, the heat of the light emitting chip 3 can be quickly conducted to the whole heat sink block 2, the effects of enlarging the heat conducting area and quickly conducting heat are realized, and the service life of the light emitting chip 3 and the like is prolonged. In addition, the heat sink block 2 has the advantages of simple processing structure and low cost, can be widely popularized and used, and is suitable for mass production. In addition, the utility model has convenient assembly, can ensure the production efficiency, and is convenient for production, repair and maintenance, etc.
In some embodiments, the optics attached to the heatsink slug 2 further includes multiple pieces of collimator objectives 4 and MUX assemblies 5. The collimating objective lenses 4 are respectively arranged corresponding to the light emitting chips 3, the light rays emitted by the light emitting chips 3 respectively irradiate the corresponding collimating objective lenses 4, and the light rays emitted by the collimating objective lenses 4 enter the MUX component 5. The light emitting chip 3, collimator 4, MUX assembly 5, etc. for the light module are known to the person skilled in the art and are not subject to the modifications of the utility model and will not be described here.
In some embodiments, the heat sink block 2 is fixedly connected with the PCB board 10 for ease of assembly.
Specifically, a notch 12 penetrating outwards is formed in the PCB 10, a partial area of the heat sink block 2 is fixedly connected to the bottom of the PCB 10, and an area of the heat sink block 2 provided with an optical device is located at the notch 12. In a specific example, the light emitting chip 3, the collimator objective 4 and the MUX assembly 5 are located at the notch 12.
In a specific example, the overall shape of the heat sink block 2 is substantially rectangular, and a part of its peripheral area is fixedly connected to the bottom of the PCB board 10. The heat sink block 2 is provided with a step structure, the light emitting chips 3 are arranged on a first plane 24 of the step structure, the collimating objective lenses 4 are arranged on a second plane 25 of the step structure, and the first plane 24 is higher than the second plane 25, so that the light emitting chips 3 and the collimating objective lenses 4 are conveniently arranged. The heat sink block 2 is provided with a recessed area 21, and the mux assembly 5 is positioned in the recessed area 21.
In some embodiments, the optical module heatsink structure further includes a first shield 6, the first shield 6 being disposed outside of the optics on the heatsink module 2. In a specific example, the first shielding case 6 is provided outside the plurality of light emitting chips 3, the plurality of collimator objectives 4, and the MUX assembly 5.
Specifically, the first shield can 6 is fixed on the PCB board 10, but is not limited thereto.
Specifically, the first shield case 6 is made of an aluminum alloy material, but is not limited thereto.
In some embodiments, the heat sink block 2 is made of tungsten copper, and the tungsten copper has excellent heat conduction performance, so that rapid heat conduction can be ensured. But is not limited thereto.
In some embodiments, each light emitting chip 3 is signal-connected to the photosensor chip 11 by wire bonding, but is not limited thereto. The photosensor chip 11 is capable of supplying power to the light emitting chip 3.
In some embodiments, the PCB board assembly 10 further includes a processing chip 13 disposed on the PCB board 10; the optical module heat dissipation structure further comprises a second heat-conductive shielding cover 7 fixedly arranged on the PCB 10, the second shielding cover 7 is arranged outside the processing chip 13, and the processing chip 13 conducts heat to the second shielding cover 7 through a first heat-conducting material (not shown). Because the heat productivity of the processing chip 13 is also relatively large, the heat generated by the processing chip 13 can be quickly conducted to the second shielding cover 7 by arranging the second shielding cover 7 capable of conducting heat and arranging the first heat conducting material between the second shielding cover 7 and the processing chip 13, and the heat conduction area can be effectively enlarged on the sectional area through the second shielding cover 7.
Specifically, the processing chip 13 is connected to an AWG (arrayed waveguide grating) assembly 14 provided on the PCB board 10. The structure of the processing chip 13, AWG assembly 14, etc. of the optical module is known to those skilled in the art and will not be described here.
Specifically, the second shielding case 7 is made of tungsten copper, and the tungsten copper has excellent heat conduction performance, so that rapid heat conduction can be ensured. But is not limited thereto.
Specifically, the second shield case 7 may include other devices requiring electromagnetic shielding in addition to the processing chip 13.
In a specific example, the first thermally conductive material is a thermally conductive silicone grease. But are not limited thereto, and may be, for example, a thermally conductive silicone pad, a thermally conductive silver paste, or the like.
Example two
Referring to fig. 1 to 5, the utility model discloses an optical module, which includes a housing 8 and an optical module heat dissipation structure disposed in the housing 8, wherein the optical module heat dissipation structure is as described in the first embodiment.
In the utility model, a plurality of light emitting chips 3 originally arranged on a PCB 10 are arranged on a specially configured heat sink block 2 instead. Because the light emitting chip 3 is a device with high power consumption, after being attached to the heat sink block 2, the heat of the light emitting chip 3 can be quickly conducted to the whole heat sink block 2, the effects of enlarging the heat conducting area and quickly conducting heat are realized, and the service life of the light emitting chip 3 and the like is prolonged. In addition, the heat sink block 2 has the advantages of simple processing structure and low cost, can be widely popularized and used, and is suitable for mass production. In addition, the utility model has convenient assembly, can ensure the production efficiency, and is convenient for production, repair and maintenance, etc.
In some embodiments, the heat sink block 2 is attached to the bottom wall of the housing 8 by the second heat conducting material 9, so that the heat conducted from the light emitting chip 3 to the heat sink block 2 can be further conducted to the outer surface of the housing 8, thereby realizing natural heat exchange and dissipation.
Specifically, the housing 8 includes an upper case 81 and a lower case 82, and the heat sink block 2 is attached to the lower case 82 through the second heat conductive material 9.
In a specific example, the second heat conductive material 9 is a heat conductive silicone pad, but is not limited thereto.
In some embodiments, the PCB board assembly 10 further includes a processing chip 13 disposed on the PCB board 10; the optical module heat dissipation structure further comprises a second shielding cover 7, the second shielding cover 7 is arranged on the outer side of the processing chip 13, and the processing chip 13 conducts heat to the second shielding cover 7 through the first heat conducting material; the second shielding case 7 is attached to the inner side of the top wall of the housing 8 by a third heat conducting material (not shown), so that the heat conducted from the processing chip 13 to the second shielding case 7 can be further conducted to the outer surface of the housing 8, thereby realizing natural heat exchange and dissipation.
Specifically, the housing 8 includes an upper case 81 and a lower case 82, and the second shield case 7 is attached to the inner wall of the upper case 81 by a third heat conductive material.
In a specific example, the third thermally conductive material is a thermally conductive silicone pad, but is not limited thereto.
The foregoing disclosure is only illustrative of the preferred embodiments of the present utility model and is not to be construed as limiting the scope of the utility model, which is defined by the appended claims. It should be noted that the "attaching" in the present utility model is not limited to direct contact between the heat sink block and the lower case, for example, a heat-conducting silica gel pad may be disposed between the heat sink block and the lower case.
Claims (10)
1. An optical module heat dissipation structure, comprising:
the PCB assembly comprises a PCB, and a photoelectric sensor chip is arranged on the PCB;
the heat sink block is fixed relative to the PCB, an optical device is attached to the heat sink block, the optical device comprises a plurality of light emitting chips, and each light emitting chip is connected with the corresponding photoelectric sensor chip through signals.
2. The light module heat sink structure of claim 1,
the optical device attached to the heat sink block further comprises a plurality of collimating objectives and a MUX assembly.
3. The light module heat sink structure of claim 1,
and the heat sink block is fixedly connected with the PCB.
4. The light module heat sink structure of claim 3,
the PCB is provided with a notch penetrating outwards, a partial area of the heat sink block is fixedly connected to the bottom of the PCB, and the area of the heat sink block provided with the optical device is located at the notch.
5. The optical module heat dissipating structure of any one of claims 1 to 4,
a first shield is also included that is disposed outside of the optics on the heat sink block.
6. The light module heat sink structure of claim 1,
the PCB assembly further comprises a processing chip arranged on the PCB;
the optical module radiating structure further comprises a second shielding cover which is fixedly arranged on the PCB and can conduct heat, the second shielding cover is arranged on the outer side of the processing chip, and the processing chip conducts heat to the second shielding cover through a first heat conducting material.
7. The light module heat dissipation structure as recited in claim 6, wherein,
the heat sink block and the second shielding cover are made of tungsten copper.
8. An optical module comprising a housing and an optical module heat dissipation structure disposed within the housing, the optical module heat dissipation structure as recited in any one of claims 1-5.
9. The optical module of claim 8, wherein the optical module,
the heat sink block is attached to the bottom wall of the shell through a second heat conducting material.
10. The optical module of claim 8, wherein the optical module,
the PCB assembly further comprises a processing chip arranged on the PCB;
the optical module radiating structure further comprises a second shielding cover, wherein the second shielding cover is arranged on the outer side of the processing chip, and the processing chip conducts heat to the second shielding cover through a first heat conducting material;
the second shielding cover is attached to the inner side of the top wall of the shell through a third heat conducting material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320206813.0U CN219266589U (en) | 2023-02-10 | 2023-02-10 | Optical module heat radiation structure and optical module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320206813.0U CN219266589U (en) | 2023-02-10 | 2023-02-10 | Optical module heat radiation structure and optical module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219266589U true CN219266589U (en) | 2023-06-27 |
Family
ID=86856687
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320206813.0U Active CN219266589U (en) | 2023-02-10 | 2023-02-10 | Optical module heat radiation structure and optical module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219266589U (en) |
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2023
- 2023-02-10 CN CN202320206813.0U patent/CN219266589U/en active Active
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