CN212303876U - Phased array antenna heat abstractor and phased array antenna - Google Patents

Abstract

The embodiment of the utility model provides a phased array antenna heat abstractor and phased array antenna relates to antenna technical field, and this phased array antenna heat abstractor includes antenna board, at least one integrated chip, power mother board and heat dissipation tooth, and at least one storage tank has been seted up to a side surface of power mother board, and the integrated chip holding is in the storage tank, and the antenna board pastes the dress and covers the storage tank on the power mother board, and the integrated chip pastes the dress on the antenna board, and the heat dissipation tooth sets up the opposite side surface at the power mother board. Compared with the prior art, the utility model provides a phased array antenna heat abstractor can realize good radiating effect, reduces the temperature around the integrated chip, and the radiating efficiency is high.

Description

Phased array antenna heat abstractor and phased array antenna

Technical Field

The utility model relates to an antenna technology field particularly, relates to a phased array antenna heat abstractor and phased array antenna.

Background

Most of the existing phased-array antennas are 2 × 2 arrays or 4 × 4 arrays spliced with 64 or 256 array surfaces, which belong to small array surface splicing, and most of the phased-array antennas are designed such that the area of a power motherboard is larger than that of an antenna board, so that although pin layout and routing are facilitated, an integrated-type-Metal-Oxide-Semiconductor (CMOS) chip on the antenna board is directly mounted on the power motherboard, and no separate heat dissipation space is provided, so that the heat dissipation efficiency is low. Specifically, current phased array antenna, it is mostly through directly installing the antenna panel on the power mother board, and do not set up solitary heat dissipation space on the power mother board, and simultaneously, current phased array antenna realizes the heat dissipation through natural forced air cooling's form more, heat to conducting to on the power mother board does not additionally take the heat dissipation measure, make the heat gather in the clearance between power mother board and antenna panel easily, the ambient temperature around the CMOS chip has been increased, influence the performance of CMOS chip, and then influence the normal operating of whole phased array antenna.

SUMMERY OF THE UTILITY MODEL

The utility model aims at including, for example, provide a phased array antenna heat abstractor and phased array antenna, it can realize good radiating effect, reduces the temperature around the integrated chip, and the radiating efficiency is high.

The embodiment of the utility model discloses a can realize like this:

in a first aspect, the embodiment of the utility model provides a phased array antenna heat abstractor, including antenna board, at least one integrated chip, power mother board and heat dissipation tooth, at least one storage tank has been seted up to a side surface of power mother board, the integrated chip holding is in the storage tank, the antenna board is pasted the dress and is in on the power mother board and cover the storage tank, the integrated chip is pasted the dress and is in on the antenna board, the heat dissipation tooth sets up the opposite side surface of power mother board.

In an optional embodiment, a heat-conducting silica gel pad is disposed on a surface of the heat-dissipating tooth, which is close to the power motherboard, and the heat-conducting silica gel pad is in contact with the power motherboard or the integrated chip and is used for conducting heat on the power motherboard or the integrated chip to the heat-dissipating tooth for heat dissipation.

In an optional embodiment, a plurality of heat conduction holes are formed in the bottom wall of the accommodating groove, the heat conduction holes are located below the integrated chip and penetrate through the power supply motherboard, and the heat conduction silica gel pad is arranged below the heat conduction holes.

In an alternative embodiment, the heat conducting hole is filled with a heat conducting medium and forms a heat conducting layer, an upper surface of the heat conducting layer is in contact with the integrated chip, and a lower surface of the heat conducting layer is in contact with the heat conducting silicone pad.

In an alternative embodiment, the heat conducting medium comprises silver paste.

In an optional implementation mode, a yielding groove corresponding to the accommodating groove is formed in one side surface, close to the heat dissipation teeth, of the power supply mother board, and a heat conduction boss is arranged on the heat dissipation teeth, assembled in the yielding groove and located below the plurality of heat conduction holes.

In an optional embodiment, the accommodating groove penetrates through the power motherboard, the heat dissipation teeth are provided with heat transfer bosses, the heat transfer bosses extend into the accommodating groove and correspond to the integrated chip, and the heat conduction silica gel pad is arranged between the integrated chip and the heat transfer bosses.

In an alternative embodiment, the integrated chip is soldered to the antenna board by a first solder ball, and the antenna board is soldered to the power motherboard by a second solder ball.

In an optional embodiment, the phased array antenna heat dissipation device further includes a connector, the connector is disposed on a side of the power motherboard close to the heat dissipation teeth, a shape of the power motherboard is the same as a shape of the antenna board, and an area of the antenna board is greater than or equal to an area of the power motherboard.

In an optional embodiment, a connection groove is further disposed on one side of the power motherboard close to the antenna board, a connection pin is disposed in the connection groove, and the connection pin penetrates through the power motherboard and is connected with the connector.

In an optional implementation manner, a first screw hole is formed in the antenna board, a second screw hole corresponding to the first screw hole is formed in the power motherboard, and a connection screw is further formed in the antenna board and sequentially penetrates through the first screw hole and the second screw hole, so that the antenna board and the power motherboard are kept relatively fixed.

In a second aspect, an embodiment of the present invention provides a phased array antenna, including a control board and at least one phased array antenna heat dissipation device as described in any one of the previous embodiments, wherein the control board is connected to the power motherboard.

The utility model discloses beneficial effect includes, for example:

the utility model provides a phased array antenna heat abstractor, through set up the storage tank on the power mother board, integrated chip can the holding in the storage tank, and antenna board pastes the dress and covers the storage tank on the power mother board, make the interior heat dissipation space that forms of storage tank, heat on the antenna board can direct conduction to the power mother board, heat conduction efficiency has been improved, a large amount of gathering of heat around the integrated chip has also been avoided simultaneously, in addition opposite side surface mounting heat dissipation tooth at the power mother board, make the heat of gathering on the power mother board dispel the heat through the heat dissipation tooth, the radiating efficiency is improved by a wide margin. Compared with the prior art, the utility model provides a phased array antenna heat abstractor can realize good radiating effect, reduces the temperature around the integrated chip, and the radiating efficiency is high.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

Fig. 1 is a cross-sectional view of a phased array antenna apparatus according to a first embodiment of the present invention;

fig. 2 is a schematic structural diagram of a phased array antenna apparatus according to a first embodiment of the present invention at a first viewing angle;

fig. 3 is a schematic structural diagram of a phased array antenna apparatus according to a first embodiment of the present invention at a second viewing angle;

FIG. 4 is an enlarged partial view of IV in FIG. 1;

fig. 5 is a schematic structural diagram of a phased array antenna apparatus according to a second embodiment of the present invention at a first viewing angle;

fig. 6 is a schematic structural diagram of a phased array antenna apparatus according to a second embodiment of the present invention at a second viewing angle;

FIG. 7 is a partially enlarged schematic view of VII of FIG. 6;

fig. 8 is a schematic structural diagram of a phased array antenna apparatus according to a third embodiment of the present invention;

FIG. 9 is an enlarged partial view of IX in FIG. 8;

fig. 10 is a schematic structural diagram of a phased array antenna apparatus according to a fourth embodiment of the present invention at a first viewing angle;

fig. 11 is a schematic structural diagram of a phased array antenna apparatus according to a fourth embodiment of the present invention at a second viewing angle;

fig. 12 is a schematic structural diagram of a phased array antenna according to a fifth embodiment of the present invention.

Icon: 100-phased array antenna heat sink; 110-an antenna board; 111 second solder balls; 113-a first screw hole; 115-attachment screws; 130-an integrated chip; 131-first solder balls; 150-power motherboard; 151-a receiving groove; 153-heat conducting silica gel pad; 155-heat conduction hole; 157-a thermally conductive layer; 158-connecting groove; 159-relief groove; 170-heat dissipation teeth; 171-a connecting plate; 173-toothed convex plate; 175-a thermally conductive boss; 177-heat transfer bosses; 190-a connector; 191-connection pins; 200-phased array antennas; 210-a control panel; 211-power supply chip; 213-digital chip.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present invention, it should be noted that, if the terms "upper", "lower", "inner", "outer", etc. indicate the position or positional relationship based on the position or positional relationship shown in the drawings, or the position or positional relationship which is usually placed when the products of the present invention are used, the description is only for convenience of description and simplification, but the indication or suggestion that the indicated device or element must have a specific position, be constructed and operated in a specific orientation, and thus, should not be interpreted as a limitation of the present invention.

Furthermore, the appearances of the terms "first," "second," and the like, if any, are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.

As disclosed in the background art, in the conventional phased array antenna, the integrated chip on the antenna array surface is the most important heat source, and generates a large amount of heat during operation, and during installation, the integrated chip is disposed on the antenna board and directly attached to the surface of the power motherboard, and the antenna board and the power motherboard are spaced apart from each other, so that the integrated chip is directly connected to the power motherboard and the antenna board, and heat transfer is achieved.

In addition, current phased array antenna, because still be provided with on the power mother board such as other chips such as power chip, digital chip, lead to the area of power mother board to be greater than the effective area of antenna board, be difficult to realize the modularization and assemble, when realizing the concatenation of big wavefront, often can only realize through the mode that enlarges the power mother board, this undoubtedly makes its preparation degree of difficulty increase, realizes that the degree of difficulty is higher.

To the above problem, the utility model provides a phased array antenna heat abstractor and phased array antenna will be introduced in detail below.

It should be noted that the features of the embodiments of the present invention may be combined with each other without conflict.

First embodiment

With reference to fig. 1 to 4, the present embodiment provides a phased array antenna heat dissipation apparatus 100, which has high heat dissipation efficiency, can meet arbitrary splicing, solves the problem of splicing large array surfaces of a linear array antenna, and has high product reliability and low processing cost.

The phased-array antenna heat dissipation device 100 provided by the embodiment includes an antenna board 110, at least one integrated chip 130, a power motherboard 150, heat dissipation teeth 170 and a connector 190, wherein at least one accommodating groove 151 is formed in a surface of one side of the power motherboard 150, the integrated chip 130 is accommodated in the accommodating groove 151, the antenna board 110 is attached to the power motherboard 150 and covers the accommodating groove 151, the integrated chip 130 is attached to the antenna board 110, and the heat dissipation teeth 170 are disposed on a surface of the other side of the power motherboard 150. The connector 190 is disposed at the bottom of the power motherboard 150.

In this embodiment, the integrated chip 130 is a CMOS chip, one or more integrated chips 130 can be mounted on the antenna board 110, and the accommodating grooves 151 are formed in corresponding positions on the power motherboard 150, and the number of the accommodating grooves 151 is the same as that of the integrated chips 130, so that the integrated chips 130 can be loaded in the accommodating grooves 151. Specifically, the integrated chip 130 is soldered on the lower side surface of the antenna board 110 by the first solder balls 131 to realize the connection between the integrated chip 130 and the antenna board 110, and simultaneously, the heat generated by the integrated chip 130 is rapidly conducted to the antenna board 110 by the rapid heat conduction capability of the first solder balls 131.

In this embodiment, one or more antenna boards 110 may be mounted on the power motherboard 150, and in this embodiment, one antenna board 110 is taken as an example for description. Specifically, the antenna board 110 is soldered to the upper side surface of the power motherboard 150 by the second solder balls to realize the connection between the antenna board 110 and the power motherboard 150, while conducting the accumulated heat on the antenna board 110 to the power motherboard 150 by the rapid thermal conductivity of the second solder balls.

In this embodiment, the size of the accommodating groove 151 is larger than that of the ic 130, so that the ic 130 is conveniently loaded into the accommodating groove 151, and meanwhile, the bottom wall of the accommodating groove 151 is in clearance fit with the ic 130, so that heat is conducted between the ic 130 and the power motherboard 150 through thermal radiation, and a large amount of heat generated by the ic 130 is conducted to the array surface of the antenna board 110 by the first solder balls 131, and then conducted to the power motherboard 150 by the second solder balls, thereby avoiding the temperature rise in the accommodating groove 151 caused by the large amount of heat accumulation at the bottom side of the ic 130.

It should be noted that the depth of the accommodating groove 151 is equivalent to the thickness of the ic 130, in this embodiment, the diameter of the first solder ball 131 is 0.25mm, and the diameter of the second solder ball is 0.3mm, so that the gap between the bottom wall of the accommodating groove 151 and the ic 130 is 0.05 mm. It is to be understood that the numerical values of the respective dimensions herein are merely illustrative and are not particularly limited.

It should be further noted that, in this embodiment, the width of the containing groove 151 is greater than the width of the ic 130 by 0.2-0.5mm, specifically, the containing groove 151 is rectangular, the ic 130 is also rectangular, the width of the long side of the containing groove 151 is greater than the width of the long side of the ic 130 by 0.5mm, and the width of the short side of the containing groove 151 is greater than the width of the short side of the ic 130 by 0.2 mm. It is to be understood that the numerical values of the respective dimensions herein are merely illustrative and are not particularly limited.

In this embodiment, a heat conductive silicone pad 153 is disposed on a side surface of the heat dissipation teeth 170 close to the power motherboard 150, and the heat conductive silicone pad 153 contacts the power motherboard 150 for conducting heat on the power motherboard 150 or the ic 130 to the heat dissipation teeth 170 for heat dissipation. Specifically, the thickness of the heat conductive silicone pad 153 is 0.1mm, the power motherboard 150 and the heat dissipation teeth 170 are attached together through the heat conductive silicone pad 153, heat on the power motherboard 150 is quickly conducted to the heat dissipation teeth 170 through the heat conductive silicone pad 153 to dissipate heat, the heat dissipation teeth 170 can carry one or more power motherboards 150, and a single power motherboard 150 is taken as an example in this embodiment for description.

The heat dissipation teeth 170 include an integrally formed connection plate 171 and a plurality of tooth-shaped protruding plates 173, the plurality of tooth-shaped protruding plates 173 are arranged on the connection plate 171 at intervals, the connection plate 171 is attached to the power motherboard 150 through the heat-conducting silicone pad 153, so that heat transfer is achieved, and the plurality of tooth-shaped protruding plates 173 extend downward, so that efficient heat dissipation is achieved. Specifically, the heat dissipation teeth 170 are made of a high-efficiency heat dissipation material, such as copper, aluminum, or other alloy material with good thermal conductivity, and are not limited herein.

In this embodiment, a plurality of heat conduction holes 155 are formed in the bottom wall of the accommodating groove 151, the plurality of heat conduction holes 155 are located below the ic 130 and penetrate through the power motherboard 150, and the heat conduction silicone pad 153 is disposed below the plurality of heat conduction holes 155. Specifically, the heat conduction holes 155 are uniformly arranged in a rectangular frame with a size smaller than that of the ic 130, and 32 heat conduction holes 155 are divided into 4 rows and 8 columns, so that heat generated by the ic 130 is conducted to the power motherboard 150 and the heat conduction holes 155 through heat radiation, and then the power motherboard 150 and the heat conduction holes 155 are conducted to the heat dissipation teeth 170 through the heat conduction silica gel pads 153 to dissipate heat, thereby solving the problem of heat dissipation. Of course, the number and arrangement of the heat conduction holes 155 are only illustrated here, and are not particularly limited.

It should be noted that, in this embodiment, the heat conduction hole 155 is a through hole structure, and extends to the heat conduction silicone pad 153 through the power motherboard 150, and by providing the heat conduction hole 155, on the one hand, the heat of the heat radiation can be led to the heat conduction silicone pad 153 in time, and is conducted to the heat dissipation teeth 170 through the heat conduction silicone pad 153, on the other hand, the heat collected in the accommodating groove 151 can be conducted quickly, and the heat collected in the accommodating groove 151 is avoided from being increased in temperature.

In the present embodiment, the diameter of the heat conduction hole 155 is 0.2mm, which can conduct heat to the heat conduction silicone pad 153 in time and is arranged reasonably. Of course, the diameter of the heat conduction hole 155 is merely illustrative and not limited.

In the present embodiment, the connector 190 is disposed on a side of the power motherboard 150 close to the heat dissipation teeth 170, the shape of the power motherboard 150 is the same as that of the antenna board 110, and the area of the antenna board 110 is greater than or equal to that of the power motherboard 150. Specifically, power motherboard 150 and antenna board 110 are the rectangle, connector 190 includes radio frequency connector and low frequency connector, put radio frequency and low frequency interface in power motherboard 150 back and externally connect from heat dissipation tooth 170 direction in unison, radio frequency connector and low frequency connector all set up the back at power motherboard 150 for power motherboard 150 can be the same with antenna board 110's size, be less than the area of antenna board 110 even, thereby with the product modularization, can splice a plurality of devices together, realize big wavefront concatenation. Preferably, the size of the power motherboard 150 is the same as the size of the antenna board 110 in this embodiment.

In this embodiment, a connection groove 158 is further disposed on a side of the power motherboard 150 close to the antenna board 110, a connection pin 191 is disposed in the connection groove 158, and the connection pin 191 penetrates through the power motherboard 150 and is connected with the connector 190. Through the perforation connection mode, the connection reliability of the connector 190 is improved, a groove is dug on the front surface (the side close to the antenna board 110) of the power motherboard 150, and the pins of the connector 190 are placed into the connecting grooves 158, so that the pins are lower than the surface of the power motherboard 150, and the pins are prevented from interfering the mounting of the antenna board 110.

In this embodiment, the antenna board 110 is provided with a first screw hole 113, the power motherboard 150 is provided with a second screw hole corresponding to the first screw hole 113, the antenna board 110 is further provided with a connection screw 115, and the connection screw 115 sequentially passes through the first screw hole 113 and the second screw hole, so that the antenna board 110 and the power motherboard 150 are kept relatively fixed. Specifically, the first screw hole 113 is formed in the center of the antenna board 110, the second screw hole is formed in the center of the power motherboard 150, and the power motherboard 150 and the antenna board 110 are fixed together by the connecting screw 115, so that the reliability of the whole device is improved.

In this embodiment, the connection screw 115 passes through the power motherboard 150 and then is connected to the heat dissipation tooth 170, so that the heat dissipation tooth 170, the power motherboard 150 and the antenna board 110 are connected into a whole, and the reliability of the product during large-wavefront splicing is further improved.

In summary, the present embodiment provides a phased array antenna heat dissipation apparatus 100, wherein the power motherboard 150 is provided with the accommodating groove 151, and the bottom wall of the accommodating groove 151 is provided with the heat conduction hole 155, so as to improve the heat conduction efficiency, avoid a large amount of heat accumulation around the integrated chip 130, and dissipate heat by using the heat dissipation teeth 170 below, so that the heat accumulated on the power motherboard 150 can be dissipated by the heat dissipation teeth 170, thereby greatly improving the heat dissipation efficiency. Meanwhile, the connector 190 is arranged below the power motherboard 150, and the power motherboard 150 is arranged to be as large as the antenna board 110, so that a modular structure is formed, large-array-face splicing is facilitated, and the processing difficulty and the processing cost of the power motherboard 150 are reduced. Meanwhile, the heat dissipation teeth 170, the power motherboard 150 and the antenna board 110 are fixed into a whole through the connecting screws 115, so that the overall reliability of the device is improved.

Second embodiment

With reference to fig. 5 to 7, the present embodiment provides a heat dissipation apparatus 100 for a phased array antenna, which has the same basic structure and principle as the first embodiment, and the same technical effects as the first embodiment, and for the sake of brief description, reference may be made to corresponding contents in the first embodiment for parts not mentioned in the present embodiment.

In this embodiment, the heat dissipation device 100 for a phased array antenna includes an antenna board 110, at least one integrated chip 130, a power motherboard 150, heat dissipation teeth 170 and a connector 190, wherein at least one accommodating groove 151 is formed on a surface of one side of the power motherboard 150, the integrated chip 130 is accommodated in the accommodating groove 151, the antenna board 110 is attached to the power motherboard 150 and covers the accommodating groove 151, the integrated chip 130 is attached to the antenna board 110, and the heat dissipation teeth 170 are disposed on a surface of the other side of the power motherboard 150. The connector 190 is disposed at the bottom of the power motherboard 150.

The heat-conducting silica gel pad 153 is disposed on the surface of the heat-dissipating tooth 170 close to the power motherboard 150, and the heat-conducting silica gel pad 153 contacts the power motherboard 150 and is used for conducting heat on the power motherboard 150 or the integrated chip 130 to the heat-dissipating tooth 170 for heat dissipation.

A plurality of heat conduction holes 155 are formed in the bottom wall of the accommodating groove 151, the plurality of heat conduction holes 155 are located below the integrated chip 130 and penetrate through the power motherboard 150, and the heat conduction silicone pads 153 are disposed below the plurality of heat conduction holes 155.

In the present embodiment, the heat conduction hole 155 is filled with a heat conduction medium, and forms a heat conduction layer 157, an upper surface of the heat conduction layer 157 contacts with the ic 130, and a lower surface of the heat conduction layer 157 contacts with the heat conduction silicone pad 153. I.e., the thermal conductive medium is in contact with the integrated chip 130 and the thermal conductive silicone pad 153, respectively. Specifically, heat-conducting medium includes the silver thick liquid, and heat-conducting layer 157 includes silver thick liquid layer and silver thick liquid post, and the silver thick liquid is filled in heat-conducting hole 155 to the deposit forms the silver thick liquid layer on the diapire of storage tank 151, and the silver thick liquid layer fills up the clearance between the diapire of storage tank 151 and integrated chip 130, makes silver thick liquid and integrated chip 130 contact, and the silver thick liquid deposit forms the silver thick liquid post in heat-conducting hole 155, conducts the heat on the integrated chip 130 to the heat conduction silica gel pad 153 of below rapidly. Of course, the heat conducting medium may be made of other materials with good heat conducting performance, such as copper, and the copper pillar is formed in the heat conducting hole 155, and the copper layer is formed on the bottom wall of the accommodating groove 151, which also enables rapid heat conduction. Or the heat conducting glue is filled, and the heat can be rapidly conducted by filling the heat conducting glue, and the specific material of the heat conducting medium is not particularly limited.

This embodiment is through filling heat-conducting medium for the heat that integrated chip 130 produced can conduct to heat conduction silica gel pad 153 rapidly, has further promoted the radiating efficiency, contacts through structure and integrated chip 130 with after the heat-conducting medium shaping simultaneously, has played the effect of supporting, spacing integrated chip 130, has guaranteed the stability of structure.

Third embodiment

Referring to fig. 8 and 9, the present embodiment provides a heat dissipation apparatus 100 for a phased array antenna, which has the same basic structure and principle as the first embodiment or the second embodiment, and for the sake of brevity, reference may be made to the corresponding contents in the first embodiment or the second embodiment without reference to the parts of the present embodiment.

In this embodiment, the heat dissipation device 100 for a phased array antenna includes an antenna board 110, at least one integrated chip 130, a power motherboard 150, heat dissipation teeth 170 and a connector 190, wherein at least one accommodating groove 151 is formed on a surface of one side of the power motherboard 150, the integrated chip 130 is accommodated in the accommodating groove 151, the antenna board 110 is attached to the power motherboard 150 and covers the accommodating groove 151, the integrated chip 130 is attached to the antenna board 110, and the heat dissipation teeth 170 are disposed on a surface of the other side of the power motherboard 150. The connector 190 is disposed at the bottom of the power motherboard 150. The heat-conducting silica gel pad 153 is disposed on the surface of the heat-dissipating tooth 170 close to the power motherboard 150, and the heat-conducting silica gel pad 153 contacts with the power motherboard 150 or the integrated chip 130, so as to conduct heat on the power motherboard 150 or the integrated chip 130 to the heat-dissipating tooth 170 for heat dissipation.

In the present embodiment, a recess 159 corresponding to the receiving groove 151 is formed on a side surface of the power motherboard 150 near the heat dissipation tooth 170, a heat conduction boss 175 is disposed on the heat dissipation tooth 170, and the heat conduction boss 175 is assembled in the recess 159 and located below the plurality of heat conduction holes 155. Specifically, an interlayer is formed between the bottom wall of the yielding groove 159 and the bottom wall of the accommodating groove 151, the heat conducting hole 155 is formed in the bottom wall of the accommodating groove 151 and penetrates through the bottom wall of the yielding groove 159, the height of the heat conducting boss 175 on the heat radiating teeth 170 is the same as the depth of the yielding groove 159, and the heat conducting boss 175 and the yielding groove 159 are matched in shape and size, so that the heat conducting boss 175 can be assembled in the yielding groove 159, and the heat radiating effect is improved.

The phased array antenna heat dissipation device 100 provided by the embodiment can rapidly transfer heat generated by the integrated chip 130 to the heat dissipation teeth 170 by arranging the receding groove 159 and the heat conduction boss 175, thereby improving heat dissipation efficiency. Meanwhile, the heat conducting boss 175 is arranged, so that the positioning effect can be achieved during installation, and the heat radiating teeth 170 can be fixedly installed in place. Meanwhile, the accommodating groove 151 does not penetrate through the power motherboard 150, thereby structurally enhancing the strength of the power motherboard 150 and preventing the power motherboard 150 from deforming.

Fourth embodiment

Referring to fig. 10 and 11, the present embodiment provides a heat dissipation apparatus 100 for a phased array antenna, which has the same basic structure and principle as the first embodiment, and the same technical effects as the first embodiment, and for the sake of brief description, reference may be made to the corresponding contents in the first embodiment for the parts of the present embodiment that are not mentioned.

The phased array antenna heat dissipation device 100 provided in this embodiment includes an antenna board 110, at least one integrated chip 130, a power motherboard 150, heat dissipation teeth 170, and a connector 190, wherein at least one accommodation groove 151 is formed on a surface of one side of the power motherboard 150, the integrated chip 130 is accommodated in the accommodation groove 151, the antenna board 110 is attached to the power motherboard 150 and covers the accommodation groove 151, the integrated chip 130 is attached to the antenna board 110, and the heat dissipation teeth 170 are disposed on a surface of the other side of the power motherboard 150. The connector 190 is disposed at the bottom of the power motherboard 150. The heat-conducting silicone pad 153 is disposed on a surface of the heat-dissipating tooth 170 close to the power motherboard 150, and the heat-conducting silicone pad 153 is in contact with the integrated chip 130, and is configured to conduct heat on the power motherboard 150 or the integrated chip 130 to the heat-dissipating tooth 170 for heat dissipation.

In the embodiment, the accommodating groove 151 penetrates through the power motherboard 150, the heat dissipation teeth 170 are provided with heat transfer bosses 177, the heat transfer bosses 177 extend into the accommodating groove 151 and correspond to the ic 130, and the heat conductive silicone pads 153 are disposed between the ic 130 and the heat transfer bosses 177. Specifically, the heat-conducting silicone pad 153 is pressed between the ic 130 and the heat-transferring boss 177 for directly conducting heat generated by the ic 130 to the heat-dissipating teeth 170 for heat dissipation, thereby avoiding transition between the power motherboard 150 and further improving heat-dissipating efficiency.

Fifth embodiment

Referring to fig. 12, the present embodiment provides a phased array antenna 200, which includes a control board 210 and at least one phased array antenna heat sink 100, wherein the basic structure and principle of the phased array antenna heat sink 100 and the technical effects thereof are the same as those of the first embodiment, the second embodiment, or the third embodiment, and for the sake of brevity, reference may be made to the corresponding contents of the first embodiment, the second embodiment, or the third embodiment where not mentioned in part.

In this embodiment, the heat dissipation device 100 for a phased array antenna includes an antenna board 110, at least one integrated chip 130, a power motherboard 150, heat dissipation teeth 170 and a connector 190, wherein at least one accommodating groove 151 is formed on a surface of one side of the power motherboard 150, the integrated chip 130 is accommodated in the accommodating groove 151, the antenna board 110 is attached to the power motherboard 150 and covers the accommodating groove 151, the integrated chip 130 is attached to the antenna board 110, and the heat dissipation teeth 170 are disposed on a surface of the other side of the power motherboard 150. The connector 190 is disposed at the bottom of the power motherboard 150.

In this embodiment, the phased array antenna heat dissipation device 100 is multiple, the multiple phased array antenna heat dissipation devices 100 form a large-array-surface splicing structure, the phased array antenna 200 further includes a power chip 211 and a digital chip 213, the power chip 211 and the digital chip 213 are both disposed on the control board 210, and the control board 210 is connected to the power motherboard 150.

In the phased array antenna 200 provided in this embodiment, the original digital chip 213 and the original rf chip are all placed in the control board 210, and the rest of the single modules are connected to the control board 210 through the rf connector and the low frequency connector, thereby implementing a scheme of arbitrarily splicing the modules. In addition, the design of separating the digital chip 213 and the power chip 211 from the integrated chip 130 is beneficial to heat dissipation of the integrated chip 130.

The above description is only for the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention should be covered by the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims (10)

1. The utility model provides a phased array antenna heat abstractor, its characterized in that, includes antenna board, power mother board, heat dissipation tooth and at least one integrated chip, at least one storage tank has been seted up to a side surface of power mother board, the integrated chip holding is in the storage tank, the antenna board pastes the dress and covers on the power mother board the storage tank, the integrated chip pastes the dress on the antenna board, the heat dissipation tooth sets up the opposite side surface of power mother board.

2. The phased-array antenna heat dissipation device according to claim 1, wherein a heat-conducting silica gel pad is disposed on a side surface of the heat dissipation tooth close to the power motherboard, and the heat-conducting silica gel pad is in contact with the power motherboard or the integrated chip and is used for conducting heat on the power motherboard or the integrated chip to the heat dissipation tooth for heat dissipation.

3. The phased-array antenna heat dissipation device according to claim 2, wherein a plurality of heat conduction holes are formed in the bottom wall of the accommodating groove, the plurality of heat conduction holes are located below the integrated chip and penetrate through the power motherboard, and the heat conduction silicone pad is disposed below the plurality of heat conduction holes.

4. The phased-array antenna heat sink according to claim 3, wherein the heat conducting holes are filled with a heat conducting medium and form a heat conducting layer, an upper surface of the heat conducting layer is in contact with the integrated chip, and a lower surface of the heat conducting layer is in contact with the heat conducting silicone pad.

5. The phased-array antenna heat dissipation device according to claim 3, wherein a recess corresponding to the receiving groove is formed in a surface of one side of the power motherboard, the surface being close to the heat dissipation teeth, and a heat conduction boss is disposed on the heat dissipation teeth, and the heat conduction boss is assembled in the recess and located below the plurality of heat conduction holes.

6. The phased-array antenna heat dissipation device according to claim 2, wherein the receiving groove penetrates through the power motherboard, a heat transfer boss is disposed on the heat dissipation tooth, the heat transfer boss extends into the receiving groove and corresponds to the integrated chip, and the heat conductive silicone pad is disposed between the integrated chip and the heat transfer boss.

7. The phased array antenna heat sink according to any of claims 1-6, further comprising a connector disposed on a side of the power motherboard near the heat sink teeth, wherein the power motherboard has a shape that is the same as the antenna board, and wherein the area of the antenna board is greater than or equal to the area of the power motherboard.

8. The phased array antenna heat sink according to claim 7, wherein a connection groove is further formed on a side of the power motherboard close to the antenna board, and a connection pin is disposed in the connection groove, and the connection pin passes through the power motherboard and is connected with the connector.

9. The phased-array antenna heat dissipation device according to claim 8, wherein the antenna board is provided with a first screw hole, the power motherboard is provided with a second screw hole corresponding to the first screw hole, the antenna board is further provided with a connection screw, and the connection screw sequentially penetrates through the first screw hole and the second screw hole so that the antenna board and the power motherboard are kept relatively fixed.

10. A phased array antenna comprising a control board and at least one phased array antenna heat sink as claimed in any of claims 1 to 9, said control board being connected to said power motherboard.

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