CN212660210U - Camera module and electronic equipment - Google Patents

Abstract

The application discloses camera module and electronic equipment, including circuit board, radiator unit, transmitting element and receiving element. The circuit board comprises a first bearing part, a winding part and a second bearing part, an electronic element is arranged on the first bearing part, the radiating assembly comprises a radiating substrate and a radiating support, the radiating support is arranged on the first bearing part and provided with an accommodating space, the electronic element is located in the accommodating space, the radiating substrate is arranged on one side of the radiating support, which is deviated from the first bearing part, the second bearing part is arranged between the radiating substrate and the radiating support through the winding part, the transmitting unit is arranged on one side of the radiating substrate, which is deviated from the radiating support, and is electrically connected with the second bearing part, and the receiving unit is arranged on the first bearing part and is spaced from the transmitting unit. The camera module can effectively dissipate heat generated by the transmitting unit in time, and has good heat dissipation performance, thereby ensuring that the optical performance of the receiving unit is not influenced.

Description

Camera module and electronic equipment

Technical Field

The application relates to the technical field of image acquisition, in particular to a camera module and electronic equipment.

Background

A TOF (Time of Flight) or structured light equal depth camera generally includes a transmitting unit for transmitting light to a target object and a receiving unit for receiving light reflected by the target object.

In the prior art, the transmitting unit and the receiving unit are arranged on the same substrate, and the transmitting unit is directly communicated with the circuit board, so that the radiating capacity is poor, a large amount of heat generated by the transmitting unit during working cannot be dissipated in time and is conducted to the receiving unit, and the lens of the receiving unit is deformed due to heating to directly influence the optical performance of the receiving unit.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides a camera module and electronic equipment, which can effectively dissipate heat generated by a transmitting unit in time, and have good heat dissipation performance, thereby ensuring that the optical performance of a receiving unit is not influenced.

In a first aspect, an embodiment of the present application provides a camera module; the camera module includes: the circuit board comprises a first bearing part, a winding part and a second bearing part which are sequentially connected, wherein the first bearing part is provided with an electronic element, a radiating assembly comprises a radiating substrate and a radiating support, the radiating support is arranged on the first bearing part, an accommodating space is formed between the radiating support and the first bearing part, the electronic element is positioned in the accommodating space, the radiating substrate is arranged on one side of the radiating support, which is deviated from the first bearing part, the second bearing part is wound and folded by winding to be positioned between the radiating substrate and the radiating support, a transmitting unit is arranged on one side of the radiating substrate, which is deviated from the radiating support, and is electrically connected with the second bearing part, and a receiving unit is arranged on the first bearing part and is spaced from the transmitting unit.

Based on the camera module of the embodiment of the application, through the design of the heat dissipation substrate and the heat dissipation bracket, the heat dissipation substrate has good heat conductivity, and can transmit the heat emitted by the heat source (such as a light source) of the emission unit to the second bearing part of the circuit board downwards through the heat dissipation substrate, and because the circuit board is internally distributed with a plurality of metal circuits, the metal also has good thermal conductivity, the heat can be continuously transmitted to the heat dissipation support downwards through the metal circuits, and the heat dissipation support also has good thermal conductivity, so the heat can be continuously transmitted to the first bearing part of the circuit board downwards after passing through the heat dissipation support, and the first bearing part of the circuit board is directly or indirectly contacted with other parts (such as a middle frame of a mobile phone), so the heat can be immediately radiated, the influence of the heat radiated by the transmitting unit on the receiving unit is effectively prevented, and the good optical performance of the receiving unit is ensured. Meanwhile, the heat dissipation support is provided with an accommodating space, the electronic element on the first bearing part of the circuit board is positioned in the accommodating space, the overall space occupancy rate of the camera module can be reduced, and the advantage of miniaturization design is achieved.

In some embodiments, the emitting unit includes a light source disposed on a side of the heat dissipation substrate away from the heat dissipation bracket, and a first heat conduction layer is disposed between the light source and the heat dissipation substrate.

Based on the above embodiment, the light source is used as the main heat generating source of the emitting unit, the temperature of the light source is higher than the temperature of the surrounding components, so that a temperature difference is generated between the light source and the surrounding components, the heat generated by the light source can be spontaneously transferred from the high-temperature region to the low-temperature region due to the temperature difference, the heat can be rapidly transferred to the heat dissipation substrate due to the diversity of the heat transfer directions, so that the heat can be rapidly transferred to the heat dissipation substrate, the first heat conduction layer is arranged between the light source and the heat dissipation substrate, the first heat conduction layer can guide the heat to be transferred towards the direction close to the heat dissipation substrate, most or almost all of the heat can be transferred to the heat dissipation substrate in a downward transfer manner, and a small part or almost no heat can be transferred to the periphery of the light source in a radiation manner.

In some embodiments, a surface of the heat dissipation substrate facing away from the light source is provided with a conductive body, a surface of the heat dissipation substrate facing away from the light source is provided with at least one first connection end, the heat dissipation substrate has at least one first via hole, a heat conductor electrically connected to the first connection end and the conductive body is disposed in the first via hole, a surface of the conductive body facing away from the heat dissipation substrate is provided with a second connection end, and the light source and the second bearing portion are electrically connected through the first connection end and the second connection end.

Based on the above embodiment, the heat is transferred to the heat dissipation substrate through the first heat conduction layer, the heat dissipation substrate has good heat conductivity and can continuously guide the heat to be transferred to the second bearing portion of the circuit board, because the heat dissipation substrate is disposed between the light source and the second bearing portion of the circuit board and has no electrical conductivity, the electrical connection between the light source and the second bearing portion of the circuit board can be achieved by disposing the conductive body on the surface of the heat dissipation substrate away from the light source, disposing the first connection end on the surface of the heat dissipation substrate close to the light source, and disposing the second connection end on the surface of the conductive body away from the heat dissipation substrate, and by designing the conductive body, the first connection end and the second connection end, the heat dissipation substrate is provided with the first via hole along the thickness direction of the heat dissipation substrate, for example, the first via hole can be filled with a heat conductor (e.g., the heat conductor is used as a part of wire, the line pin of the light source is connected with one end of the heat conductor in the through hole through the first connecting end, the other end of the heat conductor is connected with the second connecting end, and the second connecting end is connected with the line pin on the second bearing part of the circuit board, so that the transmission of electric signals between the light source and the circuit board is realized.

In some embodiments, a cross section of the light source in a direction perpendicular to a thickness of the heat dissipation substrate is a first cross section, and a cross section of the second connection end in the direction perpendicular to the thickness of the heat dissipation substrate is a second cross section, and an area of the second cross section is larger than an area of the first cross section.

Based on the above embodiment, heat is transmitted to the second connecting end after passing through the heat dissipation substrate, the second connecting end can perform an electric connection between the light source and the first point bearing part of the circuit board, and the second connecting end is made of a metal material (such as copper) with electric conductivity, so that the second connecting end can transmit heat similarly, and when heat is continuously transmitted to the second connecting end downwards, the second connecting end can almost receive all heat after passing through the heat dissipation substrate in the thickness direction of the heat dissipation substrate and is larger than the area of the first section of the light source.

In some embodiments, a surface of the conductive body facing away from the heat dissipation substrate is further provided with a first adhesive layer, and the conductive body is connected with the second bearing part through the first adhesive layer.

Based on the above embodiment, since the conductive body and the second connection end are disposed between the heat dissipating substrate and the second supporting portion of the circuit board, and the second connection end is disposed on the surface of the conductive body facing away from the heat dissipating substrate, an air gap exists between the conductive body and the second supporting portion of the circuit board, that is, along the thickness direction of the heat dissipating substrate, the width dimension of the air gap can be regarded as the thickness dimension of the second connection end, and the heat conducting property of air is poor, and after the heat is transferred to the second connection end through the heat dissipating substrate, there may exist a small portion of heat that diffuses toward the periphery of the second connection end in a radiation manner, so that by disposing the first adhesive layer between the conductive body and the second supporting portion of the circuit board, the effect of transferring the small portion of heat in the first adhesive layer is better than the effect of transferring in the air gap, the effectiveness of transferring heat is further improved, and the first adhesive layer can structurally connect the conductive body and the second supporting portion of the circuit board, the connection stability between the heat dissipation body and the circuit board is enhanced.

In some of these embodiments, the heat dissipation bracket includes: the heat dissipation top plate comprises a top wall surface and a bottom wall surface which are arranged oppositely, the heat dissipation base plate is arranged on the top wall surface, the heat dissipation side plate is arranged on the bottom wall surface, one end of the heat dissipation side plate is connected with the bottom wall surface, the other end of the heat dissipation side plate is connected with the first bearing portion, and the heat dissipation top plate and the heat dissipation side plate jointly enclose a containing space which is used for containing the electronic element.

Based on the above embodiment, heat transmits the second supporting part for the circuit board after passing through the second connecting end, because there are many metal lines in the second supporting part for the circuit board, the metal lines have good thermal conductivity, can guide heat to continue to transmit downwards to the metal support, the heat dissipation roof is as the first supporting part for the heat dissipation base plate and the emission unit, the heat dissipation roof is supported by the heat dissipation side plate, on one hand, the heat dissipation support composed of the heat dissipation roof and the heat dissipation side plate has good thermal conductivity, on the other hand, the heat dissipation roof and the heat dissipation side plate jointly enclose to form an accommodating space, the electronic component is located in the accommodating space, the overall space occupancy rate of the camera module can be reduced, and the advantage of miniaturization design is achieved.

In some embodiments, a second heat conduction layer is disposed between the heat dissipation top plate and the second bearing portion, second adhesive layers are disposed on two sides of the second heat conduction layer, the second bearing portion and the second heat conduction layer are connected through the second adhesive layers, and the heat dissipation top plate and the second heat conduction layer are connected through the second adhesive layers.

Based on the above embodiment, heat continues to be transferred through the second bearing portion of the circuit board, and since a small portion of heat may continue to scatter toward the periphery in a radiation manner, in order to further improve effectiveness of heat transfer, a second heat conduction layer may be disposed between the second bearing portion of the circuit board and the heat dissipation top plate, the second heat conduction layer may guide heat to be transferred downward as much as possible to improve effectiveness of heat transfer, and similarly, by disposing a second adhesive layer between the second bearing portion of the circuit board and the second heat conduction layer and disposing a second adhesive layer between the second heat conduction layer and the heat dissipation top plate, the second adhesive layer may structurally enhance stability of connection between the second heat conduction layer and the second bearing portion of the circuit board and between the second heat conduction layer and the heat dissipation substrate, thereby enhancing structural stability between the circuit board and the heat dissipation bracket.

In some embodiments, the heat dissipation assembly further includes a reinforcing plate disposed on a surface of the first carrier portion facing away from the heat dissipation bracket.

Based on the above embodiment, along the thickness direction of the heat dissipation substrate, the thickness dimension of the circuit board is small, and the carrying capacity of the circuit board to other components (such as the transmitting unit, the receiving unit, the heat dissipation bracket and the like) is limited, in the camera module, the circuit board is used as the carrying body of other components, and the possibility of failure (such as breakage) due to overlarge stress exists, the structural strength of the circuit board can be further enhanced by arranging the reinforcing plate on the surface of the first carrying part of the circuit board, which is away from the heat dissipation bracket, meanwhile, the material of the reinforcing plate can be a metal material, and the reinforcing plate is connected with other components (such as a middle frame of a mobile phone), so that heat can be still continuously and effectively transferred to other components after being transferred to the reinforcing plate through the first carrying part of the circuit.

In some embodiments, the first carrier portion has at least one second through hole, each second through hole is filled with a heat conductor, one end of the heat conductor is connected to the electronic component, and the other end of the heat conductor is connected to the reinforcing plate.

Based on the above embodiment, because the electronic component that sets up in accommodating space also can give out heat at the during operation, and probably direct contact also probably interval setting between the first bearing part of electronic component and circuit board, for further conduct away the heat that the electronic component gived off effectively, the event can be seted up the second via hole on the first bearing part of circuit board, fill the heat conductor in the second via hole, heat conductor one end is connected with electronic component, the other end stiffening plate of heat conductor is connected, the effective transmission of electronic component's heat has been realized.

In a second aspect, an embodiment of the present application provides an electronic device, including: a housing having an accommodating space; the camera module is arranged in the accommodating space.

Based on the electronic equipment in this application embodiment, the electronic equipment that has above-mentioned camera module can in time and distribute away high-efficiently the produced heat of the light source of emission unit to the influence that the optical property of having avoided the heat to receive the unit to cause has effectively been avoided.

Based on the camera module and the electronic device of the embodiment of the application, through the design of the heat dissipation substrate and the heat dissipation bracket, the heat dissipation substrate has good heat conductivity, and can transmit the heat dissipated by the heat source (such as a light source) of the emission unit to the second bearing part of the circuit board downwards through the heat dissipation substrate, and because the circuit board is internally distributed with a plurality of metal circuits, the metal also has good thermal conductivity, the heat can be continuously transmitted to the heat dissipation support downwards through the metal circuits, and the heat dissipation support also has good thermal conductivity, so the heat can be continuously transmitted to the first bearing part of the circuit board downwards after passing through the heat dissipation support, and the first bearing part of the circuit board is directly or indirectly contacted with other parts (such as a middle frame of a mobile phone), so the heat can be immediately radiated, the influence of the heat radiated by the transmitting unit on the receiving unit is effectively prevented, and the good optical performance of the receiving unit is ensured. Meanwhile, the heat dissipation support is provided with an accommodating space, the electronic element on the first bearing part of the circuit board is positioned in the accommodating space, the overall space occupancy rate of the camera module can be reduced, and the advantage of miniaturization design is achieved.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.

FIG. 1 is a schematic diagram of a camera module according to the prior art;

FIG. 2 is a schematic view illustrating a structure of a camera module according to an embodiment of the present disclosure;

FIG. 3 is an exploded schematic view of a camera module according to an embodiment of the present disclosure;

FIG. 4 is an exploded schematic view of a camera module according to an embodiment of the present disclosure;

FIG. 5 is a front view of a camera module according to an embodiment of the present disclosure;

FIG. 6 is a schematic cross-sectional view illustrating a camera module according to an embodiment of the present disclosure;

fig. 7 is a schematic structural diagram of an emitting unit of a camera module according to an embodiment of the present disclosure;

fig. 8 is an enlarged schematic view at a in fig. 7.

Reference numerals: 10. a camera module; 101. a transmitting unit; 102. a receiving unit; 103. a circuit board; 104. an electronic component; 100. a camera module; 110. a transmitting unit; 111. a light source; 112. an emission substrate; 113. a support frame; 1131. a light through hole; 114. an optical element; 120. a receiving unit; 210. a circuit board; 211. a first bearing part; 212. a winding portion; 213. a second bearing part; 310. a heat dissipating component; 311. a heat-dissipating substrate; 312. a heat dissipation bracket; 3121. a heat dissipation top plate; 31211. a top wall surface; 31212. a bottom wall surface; 3122. a heat dissipation side plate; 3123. an accommodating space; 3124. an electronic component; 410. a first thermally conductive layer; 420. a second thermally conductive layer; 430. a first adhesive layer; 440. a second adhesive layer; 450a, a first via; 450b, a second via hole; 451. a heat conductor; 452. a conductive body; 460. a first connection end; 461. a second connection end; 470. a reinforcing plate; 480. and a fixing mechanism.

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

Referring to fig. 1, a depth camera such as a Time of Flight (TOF) or structured light generally includes a transmitting unit 101 and a receiving unit 102, wherein the transmitting unit 101 is configured to transmit light to a target object, and the receiving unit 102 is configured to receive light reflected by the target object.

In the prior art, the transmitting unit 101 and the receiving unit 102 are disposed on the same substrate, and the transmitting unit 101 is directly communicated with the circuit board, which results in poor heat dissipation capability, and a large amount of heat generated by the transmitting unit 101 during operation cannot be dissipated in time and is conducted to the receiving unit 102, thereby causing the optical performance of the receiving unit 102 to be directly affected by the deformation of the lens of the receiving unit 102 due to heating, and the electronic element 104 is disposed on the circuit board 103 and located on a side of the transmitting unit 101 away from the receiving unit 102, i.e., the transmitting unit 101, the receiving unit 102 and the electronic element 104 are disposed substantially in parallel on the same side of the circuit board 103, resulting in a large overall space occupancy rate of the camera module 10.

In order to solve the above technical problems, referring to fig. 2 to 8, a first aspect of the present application provides a camera module 100, where the camera module 100 includes a circuit board 210, a heat dissipation assembly 310, a transmitting unit 110, and a receiving unit 120. The camera module 100 can effectively dissipate heat generated by the transmitting unit 110 in time, and has good heat dissipation performance, thereby ensuring that the optical performance of the receiving unit 120 is not affected.

Referring to fig. 2-4, the Circuit board 210 serves as a carrier for other components such as the transmitting unit 110 and the receiving unit 120, and serves as a carrier for electrical connection between other components such as the transmitting unit 110 and the receiving unit 120, and the Circuit board 210 may be a Flexible Printed Circuit (FPC) 210, a rigid Circuit board 210 or a rigid-Flexible Circuit board 210, in this embodiment, the Circuit board 210 is a rigid-Flexible Circuit board 210.

Specifically, as shown in fig. 5 to 6, the circuit board 210 includes a first supporting portion 211, a winding portion 212, and a second supporting portion 213, wherein the first supporting portion 211 of the circuit board 210 is a rigid circuit board 210, the winding portion 212 of the circuit board 210 is a flexible circuit board 210, the second supporting portion 213 of the circuit board 210 is a rigid circuit board 210, one end of the first supporting portion 211 is connected to the winding portion 212, one end of the winding portion 212 away from the first supporting portion 211 is connected to the second supporting portion 213, and an electronic component 3124 is installed on the first supporting portion 211, wherein the electronic component 3124 includes at least one of a resistor, a capacitor, an inductor, a thermistor, and a memory, and the electronic component 3124 required by the camera module 100 can be set according to specific functional requirements, for example, the capacitor can be set when the storage of electric quantity is required, or the thermistor can be set when the operating temperature of the camera module 100 is required to be detected, and will not be described in detail herein.

Referring to fig. 7-8, the heat dissipation assembly 310, serving as a main heat conduction component, includes a heat dissipation substrate 311 and a heat dissipation bracket 312.

The heat dissipation substrate 311 may be a metal substrate or a ceramic substrate. The ceramic substrate is made of a ceramic material, and the ceramic material comprises any one of an aluminum nitride (AlN) single-layer board, an aluminum nitride (AlN) multilayer co-fired circuit board, an aluminum oxide (Al2O3) single-layer board, an aluminum oxide (Al2O3) multilayer co-fired circuit board and a low-temperature co-fired ceramic multilayer circuit board. The thermal conductivity of the aluminum nitride (AlN) single-layer board is as high as 170W/m · K (W/(m · K)), and is higher than that of the conventional flexible circuit board 210 (< ═ 0.38W/(m · K)), so that the thermal conductivity of the aluminum nitride (AlN) single-layer board is high, the heat dissipation efficiency is high due to the high thermal conductivity, and the single-layer circuit board has a simple process and low cost; the thermal conductivity of the aluminum nitride (AlN) multilayer co-fired circuit board is as high as 170W/(m · K), which is higher than that of the conventional flexible circuit board 210 (& lt 0.38W/(m · K)), and the high thermal conductivity of the aluminum nitride (AlN) multilayer co-fired circuit board enables the heat dissipation efficiency to be high, and multiple layers of circuits can be wired; the thermal conductivity of the single-layer aluminum oxide (Al2O3) board is high, which reaches 24W/(m · K), and compared with the thermal conductivity of the traditional flexible circuit board 210 (which is 0.38W/(m · K)), the thermal conductivity of the single-layer aluminum oxide (Al2O3) board is high, and the high thermal conductivity enables the heat dissipation efficiency to be high, and the single-layer circuit board has simple process and low cost; the thermal conductivity of the aluminum oxide (Al2O3) multilayer co-fired circuit board is high, and reaches 24W/(m.K), and compared with that of the traditional flexible circuit board (0.38W/(m.K)), the aluminum oxide (Al2O3) multilayer co-fired circuit board has high thermal conductivity, and the high thermal conductivity enables the heat dissipation efficiency to be high, and the multilayer circuit can be carried, and the number of wires is large; the low-temperature co-fired ceramic multilayer circuit board has good thermal conductivity coefficient which reaches 2.5W/(m.K), simple process, low cost and high heat dissipation efficiency. The metal substrate is made of a metal material, and the metal material includes any one of a copper alloy metal substrate, an aluminum alloy metal substrate, and a stainless steel metal substrate. The thermal conductivity of the copper alloy metal substrate is as high as 385W/(m.K), and compared with that of the traditional flexible circuit board (0.38W/(m.K)), the thermal conductivity of the copper alloy metal substrate is higher, the heat dissipation efficiency is high due to the high thermal conductivity, a single-layer circuit can be used, and the process is simple. The thermal conductivity of the aluminum alloy metal substrate is as high as 201W/(m.K), and compared with that of the traditional flexible circuit board (0.38W/(m.K)), the aluminum alloy metal substrate has higher thermal conductivity, the high thermal conductivity enables the heat dissipation efficiency to be high, and a plurality of layers of circuits can be run, and the number of wires is large; the stainless steel alloy metal substrate has high thermal conductivity which reaches 17W/(m.K), and compared with the thermal conductivity of the traditional flexible circuit board (which is less than 0.38W/(m.K)), the stainless steel alloy metal substrate has high thermal conductivity, high heat dissipation efficiency and low cost and simple process, and a single-layer circuit can be run. It should be noted that the thermal conductivity of the heat dissipation substrate 311 is not directly related to the shape of the heat dissipation substrate 311, for example, when the heat dissipation substrate 311 is an aluminum alloy metal substrate, the shape of the heat dissipation substrate 311 may be rectangular or circular. In this embodiment, the heat dissipation substrate 311 is an aluminum nitride (AlN) ceramic substrate, and the heat dissipation substrate 311 has a rectangular shape.

The heat dissipation support 312 includes a heat dissipation top plate 3121 and a heat dissipation side plate 3122, the heat dissipation top plate 3121 includes a top wall surface 31211 and a bottom wall surface 31212 that are arranged relatively, the heat dissipation base plate 311 is disposed at a side close to the top wall surface 31211 of the heat dissipation top plate 3121, the heat dissipation side plate 3122 can be disposed at both sides of the heat dissipation top plate 3121 and forms a similar door-shaped structure with the heat dissipation top plate 3121 to support the heat dissipation base plate 311, in this embodiment, the heat dissipation side plate 3122 is disposed along the periphery of the bottom wall surface 31212 of the heat dissipation top plate 3121, the heat dissipation top plate 3121 and the heat dissipation side plate 3122 enclose together to form an internal hollow box structure, in order to reduce the processing difficulty of the heat dissipation support 312, the heat dissipation top. The hollow portion of the box structure formed by enclosing the heat dissipation top plate 3121 and the heat dissipation side plate 3122 together forms a housing space 3123 for accommodating the electronic component 3124, in other words, after the heat dissipation bracket 312 is covered on the first bearing portion 211 of the circuit board 210, the electronic component 3124 on the first bearing portion 211 of the circuit board 210 is located in the hollow portion of the heat dissipation bracket 312. An end of the heat dissipation side plate 3122 facing away from the heat dissipation top plate 3121 is connected to the first bearing portion 211 of the circuit board 210, for example, the heat dissipation support 312 and the circuit board 210 may be fixedly connected by a threaded connection between the heat dissipation side plate 3122 and the first bearing portion 211 of the circuit board 210. In order to reduce the processing difficulty, in this embodiment, the heat dissipation support 312 is fixedly connected to the circuit board 210 by gluing the heat dissipation side plate 3122 to the first supporting portion 211 of the circuit board 210.

Referring to fig. 5-8, the emitting unit 110 is used for emitting light to a target object, and the emitting unit 110 includes a light source 111, an emitting substrate 112, a supporting frame 113 and an optical element 114.

The light source 111 is used as a main generating component of heat in the Emitting unit 110, and in this embodiment, the light source 111 is a Laser, which may be a Vertical Cavity Surface Emitting Laser (VCSEL). The laser includes a semiconductor substrate and a light emitting element provided on the substrate, and a single light emitting element may be provided on the substrate, or an array laser composed of a plurality of light emitting elements may be provided, and specifically, to realize TOF imaging, the plurality of light emitting elements may be arranged on the substrate in a regular shape, for example, a circle or a rectangle.

The emission substrate 112 serves as a first carrier of the light source 111, and the emission substrate 112 may be a metal substrate or a ceramic substrate. Since the ceramic material itself has no conductivity, in order to facilitate the electrical connection between the light source 111 and the circuit board 210, the emission substrate 112 includes a first surface and a second surface that are disposed opposite to each other, the first surface and the second surface of the emission substrate 112 are both provided with the conductive body 452, the conductive body 452a on the first surface is electrically connected to the conductive body 452b on the second surface, specifically, along the thickness direction of the emission substrate 112, a plurality of via holes (not shown in the figure) are formed on the emission substrate 112, the via holes may be covered with a conductive layer (not shown in the figure), the via holes may also be filled with a heat conductor (not shown in the figure, such as copper, tungsten, etc.), and the conductive body 452a on the first surface is electrically connected to the conductive body 452b on the second surface through the conductive layer or the heat conductor.

The supporting frame 113 covers the side of the heat dissipating substrate 311 away from the heat dissipating support 312, the supporting frame 113 may be made of a non-metal material (e.g., plastic), the support has a light passing hole 1131, and the position of the light passing hole 1131 corresponds to the position of the light source 111.

The optical element 114 is disposed on the supporting frame 113 and closes the light-passing hole 1131, when the camera module 100 is a TOF camera module 100, the optical element 114 may be a diffuser (e.g., a light homogenizing sheet) for diffusing the light emitted by the light source 111, and when the camera module 100 is a structured light camera module 100, the optical element 114 may be a diffractive optical element 114 for expanding the light emitted by the light source 111 into a laser pattern.

The receiving unit 120 is configured to receive light reflected by a target object, the receiving unit 120 is disposed on the first bearing portion 211 of the circuit board 210 and spaced from the transmitting unit 110, and because a certain space exists between the transmitting unit 110 and the receiving unit 120, a small portion of heat diffused to the surroundings in a radiation form in the heat emitted by the light source 111 exchanges heat with air in a transfer process, so that the temperature of the small portion of heat finally reaching the receiving unit 120 is not too high, and therefore, the influence of heat on the optical performance of the receiving unit 120 can be reduced. Certainly, the spacing distance between the transmitting unit 110 and the receiving unit 120 should be designed according to the design requirements of the actual camera module 100, for example, an excessively large spacing between the transmitting unit 110 and the receiving unit 120 can reduce the influence of heat on the receiving unit 120 but the overall size of the camera module 100 is excessively large, whereas an excessively small spacing between the receiving unit 120 and the transmitting unit 110 can reduce the size of the camera module 100 but the heat can affect the imaging performance of the receiving unit 120.

In this embodiment, the heat dissipating bracket 312 is disposed on the first supporting portion 211 of the circuit board 210, the winding portion 212 of the circuit board 210 has flexibility, and the second supporting portion 213 of the circuit board 210 is sandwiched between the heat dissipating top plate 3121 and the heat dissipating substrate 311 after passing through the winding portion 212 of the winding circuit board 210, and the light source 111 is disposed on a side of the heat dissipating substrate 311 away from the heat dissipating bracket 312 through the conductive body 452 and electrically connected to the second supporting portion 213 of the circuit board 210.

Through the design of the heat dissipation substrate 311 and the heat dissipation bracket 312, the heat dissipation substrate 311 has good thermal conductivity, and can transfer the heat emitted by the heat generating source (e.g., the light source 111) of the emitting unit 110 downward onto the second carrier part 213 of the circuit board 210 through the heat dissipation substrate 311, and because the circuit board 210 is internally distributed with a plurality of metal lines, the metal also has good thermal conductivity, the heat can be continuously transmitted to the heat dissipation support 312 through the metal lines, and the heat dissipation support 312 also has good thermal conductivity, so the heat can be continuously transmitted to the first bearing part 211 of the circuit board 210 after passing through the heat dissipation support 312, and the first bearing part 211 of the circuit board 210 directly or indirectly contacts with other components (such as a middle frame of a mobile phone), so the heat can be immediately radiated, the influence of the heat radiated by the transmitting unit 110 on the receiving unit 120 is effectively prevented, and the good optical performance of the receiving unit 120 is ensured. Meanwhile, the heat dissipation bracket 312 has the accommodation space 3123, the electronic component 3124 on the first bearing portion 211 of the circuit board 210 is located in the accommodation space 3123, the overall space occupancy rate of the camera module 100 can be reduced, and the advantage of the miniaturized design is achieved, and because the winding portion 212 of the circuit board 210 has flexibility, the second bearing portion 213 of the circuit board 210 is disposed between the heat dissipation substrate 311 and the heat dissipation bracket 312 through the winding design of the circuit board 210, the overall space occupancy rate of the camera module 100 can be further reduced, and the advantage of the miniaturized design is achieved.

Referring to fig. 7-8, the light source 111 is used as a main heat generating source of the emitting unit 110, and the temperature of the light source 111 is higher than the temperature of its surrounding components during normal operation, so that a temperature difference is generated between the light source 111 and its surrounding components, and the heat generated by the light source 111 is spontaneously transferred from a high temperature region to a low temperature region due to the temperature difference. It is understood that, due to the variety of heat transfer directions, heat may be diffused in a radiation manner toward the periphery of the light source 111, heat may also be diffused in a vertically downward manner, in order to enable heat to be rapidly transferred to the heat dissipation substrate 311 in a vertically downward manner as much as possible, in this embodiment, the first heat conduction layer 410 is disposed between the light source 111 and the heat dissipation substrate 311, specifically, the first heat conduction layer 410 is disposed between the conductive body 452b on the second surface of the emission substrate 112 and the heat dissipation substrate 311, in order to further improve the heat conduction efficiency of the first heat conduction layer 410, the first heat conduction layer 410 may completely cover the surface of the conductive body 452, the first heat conduction layer 410 may be a silver paste layer, the silver paste layer has good heat conductivity, and is capable of guiding most or almost all of the heat emitted by the light source 111 to the heat dissipation substrate 311, the remaining small portion or little heat is transferred in the form of radiation to the surroundings of the light source 111, so the effectiveness of the heat transfer is improved by providing the first heat conducting layer 410 between the light source 111 and the heat dissipating substrate 311.

Referring to fig. 7-8, the heat emitted from the light source 111 is transferred to the surface of the heat dissipating substrate 311 through the first heat conducting layer 410, and the heat dissipating substrate 311 is an aluminum nitride (AlN) ceramic plate with good thermal conductivity, which can continuously guide the heat to be transferred downward to the second supporting portion 213 of the circuit board 210. It can be understood that, since the heat dissipating substrate 311 is disposed between the light source 111 and the second supporting portion 213 of the circuit board 210 and has no electrical conductivity, that is, the heat dissipating substrate 311 breaks the electrical connection between the light source 111 and the second supporting portion 213 of the circuit board 210, in order to ensure a good electrical connection between the light source 111 and the second supporting portion 213 of the circuit board 210, in the present embodiment, a conductive body 452 is disposed on a surface of the heat dissipating substrate 311 away from the light source 111, at least one first connecting end 460 is disposed on a surface of the heat dissipating substrate 311 close to the light source 111, a second connecting end 461 is disposed on a surface of the conductive body 452 away from the heat dissipating substrate 311, and the light source 111 is electrically connected to the second supporting portion 213 through the first connecting end 460 and the second connecting end 461. Specifically, the surface of the heat dissipation substrate 311 close to the light source 111 is provided with a plurality of (two or more) first connection ends 460, each first connection end 460 is distributed in a projection area of the light source 111 on the surface of the heat dissipation substrate 311 along the thickness direction of the heat dissipation substrate 311, and each first connection end 460 may be randomly distributed on the surface of the heat dissipation substrate 311 or may be regularly distributed on the surface of the heat dissipation substrate 311, for example, arranged in a rectangular array. A surface of the heat dissipation substrate 311 facing away from the light source 111 is provided with a conductive body 452, and a surface of the conductive body 452 facing away from the heat dissipation substrate 311 is provided with a second connection terminal 461. Along the thickness direction of the heat dissipation substrate 311, the heat dissipation substrate 311 is provided with a plurality of first via holes 450a, the number of the first via holes 450a may be the same as or different from the number of the first connection ends 460 on the heat dissipation substrate 311, one first via hole 450a at most corresponds to one first connection end 460, one end of the first via hole 450a is connected to the first connection end 460 of the heat dissipation substrate 311, the other end of the first via hole 450a is connected to the second connection end 461 of the heat dissipation substrate 311, and each first via hole 450a is provided with a heat conductor 451 therein. The circuit pins of the light source 111 are connected to the first connection end 460 of the heat dissipation substrate 311, the circuit pins of the second carrying portion 213 of the circuit board 210 are connected to the second connection end 461 of the heat dissipation substrate 311, and the current passes through the first connection end 460, the heat conductor 451, and the second connection end 461 sequentially from the circuit pins of the light source 111 and then is finally communicated with the circuit pins of the second carrying portion 213 of the circuit board 210, so as to electrically connect the light source 111 and the circuit board 210. Through the design of the conductive body 452, the first connection end 460, the second connection end 461, the first via 450a, and the heat conductor 451, the electrical connection between the light source 111 and the second bearing portion 213 of the circuit board 210 can be achieved, so that the transmission of the electrical signal between the light source 111 and the circuit board 210 is achieved.

Furthermore, heat is transferred to the second connection terminal 461 through the heat dissipation substrate 311, the second connection terminal 461 can perform an electrical connection between the light source 111 and the second carrying portion 213 of the circuit board 210, and the second connection terminal 461 is made of a conductive metal material (e.g. copper), so that the second connection terminal 461 can also transfer heat. By setting the area of the second cross section of the second connection terminal 461 to be larger than the area of the first cross section of the light source 111, when the heat is continuously transferred downward to the second connection terminal 461, the second connection terminal 461 can receive almost all the heat after passing through the heat dissipation substrate 311, thereby further improving the effectiveness of heat transfer.

It can be understood that, as shown in fig. 7-8, since the conductive body 452 and the second connection terminal 461 are disposed between the heat dissipation substrate 311 and the second carrying portion 213 of the circuit board 210, and the second connection terminal 461 is disposed on a surface of the conductive body 452 facing away from the heat dissipation substrate 311, an air gap exists between the conductive body 452 and the second carrying portion 213 of the circuit board 210, and the transfer efficiency of heat in air is low, and after the heat is transferred to the second connection terminal 461 through the heat dissipation substrate 311, a small portion of the heat may diffuse toward the periphery of the second connection terminal 461 in a radiation manner. Through setting up first adhesive linkage 430 between electrically conductive body 452 and the second portion 213 that bears of circuit board 210, the effect that the transmission of some heat is superior to the transmission effect in the air gap in first adhesive linkage 430, further promotes heat transfer's validity, and first adhesive linkage 430 can also structurally connect electrically conductive body 452 and the second portion 213 that bears of circuit board 210, has strengthened the stability of being connected between heat dissipation body and circuit board 210.

It can be understood that, referring to fig. 7-8, heat continues to be transferred after passing through the second supporting portion 213 of the circuit board 210, and since there may be a small portion of heat spreading out in a radiation manner toward the periphery, in order to further improve the effectiveness of heat transfer, in this embodiment, a second heat conducting layer 420 is disposed between the heat dissipation top plate 3121 and the second supporting portion 213, the second heat conducting layer 420 may be graphite and copper foil, the second heat conducting layer 420 may partially cover the surface of the second supporting portion 213 of the circuit board 210, and in order to further enhance the heat conductivity, the second heat conducting layer 420 completely covers the surface of the second supporting portion 213 of the circuit board 210. The second adhesive layer 440 is disposed on both sides of the second heat conducting layer 420, the second adhesive layer 440 may be a double-sided tape, the second adhesive layer 440 may partially cover the surface of the second heat conducting layer 420, in order to further enhance the connection stability between the second supporting portion 213 of the circuit board 210 and the heat dissipating bracket 312, the second adhesive layer 440 completely covers the surface of the second heat conducting layer 420, the second supporting portion 213 and the second heat conducting layer 420 are connected by the second adhesive layer 440, i.e. the second adhesive layer 440 is attached between the surface of the second carrier part 213 close to the heat dissipation bracket 312 and the surface of the second heat conducting layer 420 facing away from the heat dissipation bracket 312, the heat dissipation top plate 3121 is connected to the second heat conducting layer 420 by means of the second adhesive layer 440, that is, the second adhesive layer 440 is adhered between the surface of the heat dissipation top plate 3121 adjacent to the second carrier part 213 and the surface of the second heat conduction layer 420 adjacent to the heat dissipation bracket 312. The second heat conduction layer 420 can guide heat to be transferred downwards as much as possible to improve the effectiveness of heat transfer, and similarly, by disposing the second adhesive layer 440 between the second bearing part 213 of the circuit board 210 and the second heat conduction layer 420 and disposing the second adhesive layer 440 between the second heat conduction layer 420 and the heat dissipation top plate 3121, the second adhesive layer 440 can structurally enhance the connection stability between the second heat conduction layer 420 and the second bearing part 213 of the circuit board 210 and between the second heat conduction layer 420 and the heat dissipation substrate 311, thereby enhancing the structural stability between the circuit board 210 and the heat dissipation bracket 312.

It can be understood that, referring to fig. 7-8, the thickness of the circuit board 210 along the thickness direction of the heat dissipating substrate 311 is small, and the carrying capacity of the circuit board 210 to other components (such as the emitting unit 110, the receiving unit 120, and the heat dissipating bracket 312) is limited, in the camera module 100, the circuit board 210 serving as a carrying body of other components may fail (such as break) due to an excessive force, in this embodiment, the heat dissipating assembly 310 further includes a reinforcing plate 470, the reinforcing plate 470 is disposed on a surface of the first carrying portion 211 facing away from the heat dissipating bracket 312, the reinforcing plate 470 may be made of a non-metal material, such as rubber, so that heat can be quickly conducted out even after reaching the reinforcing plate 470, and the reinforcing plate 470 is made of a metal material, such as a copper alloy. The reinforcing plate 470 is disposed on the surface of the first bearing portion 211 of the circuit board 210 away from the heat dissipation bracket 312, so that the structural strength of the circuit board 210 can be further enhanced, meanwhile, the material of the reinforcing plate 470 is a metal material, and the reinforcing plate 470 is connected with other components (e.g., a middle frame of a mobile phone), so that heat can be transmitted to the reinforcing plate 470 after passing through the first bearing portion 211 of the circuit board 210, and can be continuously and effectively transmitted to other components, thereby dissipating the heat.

It can be understood that, as shown in fig. 7-8, since the electronic component 3124 disposed in the accommodating space 3123 also emits heat during operation, and the electronic component 3124 may be in direct contact with or spaced apart from the first supporting portion 211 of the circuit board 210, in order to further effectively transfer the heat emitted from the electronic component 3124, in the present embodiment, the first supporting portion 211 of the circuit board 210 has at least one second through hole 450b, each second through hole 450b is filled with a heat conductor 451, the heat conductor 451 may be copper, one end of the heat conductor 451 is connected to the electronic component 3124, the other end of the heat conductor 451 is connected to the reinforcing plate 470, specifically, in order to reduce the processing difficulty, the first supporting portion 211 of the circuit board 210 is opened with at least one second through hole 450b, and the reinforcing plate 470 is attached to the first supporting portion 211 of the circuit board 210 along the thickness direction of the reinforcing plate 470, the projection of the electronic component 3124 in the receiving space 3123 on the first bearing portion 211 of the circuit board 210 at most coincides with at least a portion of one second through hole 450b, a heat conductor 451 is filled in each second through hole 450b, one end of the heat conductor 451 is connected to the electronic component 3124 (not the wire pin portion of the electronic component 3124), and the other end of the heat conductor 451 is connected to the reinforcing plate 470, so that the effective transfer of heat of the electronic component 3124 is realized.

It can be understood that, referring to fig. 2-4, after the circuit board 210 is bent, the second bearing portion 213 of the circuit board 210 is located between the heat dissipation bracket 312 and the heat dissipation substrate 311, and since the second bearing portion 213 of the circuit board 210 has a certain rigidity strength, the second bearing portion 213 of the circuit board 210 may tilt up and may become loose from the heat dissipation bracket 312, in order to enhance the connection stability between the second bearing portion 213 of the circuit board 210 and the heat dissipation bracket 312, the second bearing portion 213 of the circuit board 210 may be fixed to the heat dissipation bracket 312 in a threaded manner, in this embodiment, two opposite sides of the surface of the heat dissipation top plate 3121 away from the heat dissipation side plate 3122 are both fixedly connected with a fixing mechanism 480, the cross section of the fixing mechanism 480 is "L-shaped", one end of the fixing mechanism is fixedly connected to the heat dissipation top plate 3121, the other end of the fixing mechanism 480 is spaced from the heat dissipation top plate 3121, the second supporting portion 213 of the circuit board 210 is embedded in the fixing mechanism 480, and the setting of the fixing mechanism 480 can enhance the connection stability between the second supporting portion 213 of the circuit board 210 and the heat dissipation top plate 3121 to avoid the tilting of the second supporting portion 213 of the circuit board 210, and reduce the processing difficulty.

A second aspect of the present application proposes an electronic device, including: the housing has an accommodating space, and the camera module 100 is disposed in the accommodating space. For example, the electronic device may be a mobile phone, a tablet computer, a camera, or other devices having a shooting function. The electronic device having the camera module 100 can dissipate heat generated by the light source 111 of the emitting unit 110 in time and efficiently, thereby effectively avoiding the influence of heat on the optical performance of the receiving unit 120.

The same or similar reference numerals in the drawings of the present embodiment correspond to the same or similar components; in the description of the present application, it is to be understood that if there is an orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", etc. based on the orientation or positional relationship shown in the drawings, it is only for convenience of description and simplification of description, but it is not intended to indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and therefore, the terms describing the positional relationship in the drawings are only for illustrative purposes and are not to be construed as limitations of the present patent, and specific meanings of the above terms may be understood by those skilled in the art according to specific situations.

The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims (10)

1. A camera module, comprising:

the circuit board comprises a first bearing part, a winding part and a second bearing part which are sequentially connected, wherein the first bearing part is provided with an electronic element;

the heat dissipation assembly comprises a heat dissipation substrate and a heat dissipation support, the heat dissipation support is arranged on the first bearing part, an accommodating space is formed between the heat dissipation support and the first bearing part, the electronic element is positioned in the accommodating space, the heat dissipation substrate is arranged on one side of the heat dissipation support, which is far away from the first bearing part, and the second bearing part is positioned between the heat dissipation substrate and the heat dissipation support by winding and folding the winding and folding part;

the emitting unit is arranged on one side of the radiating substrate, which is far away from the radiating support, and is electrically connected with the second bearing part;

and the receiving unit is arranged on the first bearing part and is spaced from the transmitting unit.

2. The camera module of claim 1,

the transmitting unit comprises a light source, the light source is arranged on one side, deviating from the heat dissipation support, of the heat dissipation substrate, and a first heat conduction layer is arranged between the light source and the heat dissipation substrate.

3. The camera module of claim 2,

the surface of the heat dissipation substrate, which is far away from the light source, is provided with a conductive body, the surface of the heat dissipation substrate, which is close to the light source, is provided with at least one first connecting end, the heat dissipation substrate is provided with at least one first via hole, a heat conductor which is electrically connected with the first connecting end and the conductive body is arranged in the first via hole, the surface of the conductive body, which is far away from the heat dissipation substrate, is provided with a second connecting end, and the light source and the second bearing part are electrically connected through the first connecting end and the second connecting end.

4. The camera module of claim 3,

the cross section of the light source in the thickness direction perpendicular to the heat dissipation substrate is a first cross section, the cross section of the second connecting end in the thickness direction perpendicular to the heat dissipation substrate is a second cross section, and the area of the second cross section is larger than that of the first cross section.

5. The camera module of claim 3,

the surface of the conductive body, which is far away from the heat dissipation substrate, is also provided with a first bonding layer, and the conductive body is connected with the second bearing part through the first bonding layer.

6. The camera module of claim 1, wherein the heat dissipation mount comprises:

the heat dissipation top plate comprises a top wall surface and a bottom wall surface which are oppositely arranged, and the heat dissipation substrate is arranged on the top wall surface;

one end of the heat dissipation side plate is connected with the bottom wall surface, and the other end of the heat dissipation side plate is connected with the first bearing part;

the heat dissipation top plate and the heat dissipation side plates jointly enclose the accommodating space for accommodating the electronic element.

7. The camera module of claim 6,

the heat dissipation top plate is connected with the second heat conduction layer through the second bonding layer.

8. The camera module of claim 1,

the heat dissipation assembly further comprises a reinforcing plate, and the reinforcing plate is arranged on the surface, deviating from the heat dissipation support, of the first bearing portion.

9. The camera module of claim 8,

the first bearing part is provided with at least one second through hole, a heat conductor is filled in each second through hole, one end of the heat conductor is connected with the electronic element, and the other end of the heat conductor is connected with the reinforcing plate.

10. An electronic device, comprising:

a housing having an accommodating space;

the camera module of any of claims 1-9, disposed within the receiving space.

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