JP2001177023A - Mounting structure of chip device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable heat released from a chip device to be dissipated outside so as to prevent it from rising in temperature. SOLUTION: A heat conduction member 21 is provided inside a resin housing 7, a solid-state image pick-up device 6 is mounted on the inner surface of the member 21 exposed in the housing 7, and the part of the member 21 exposed to the outside on the backside of the resin housing 7 is brought into contact with a metal plate 2. Therefore, heat released from the solid-state image pickup device is conducted to the backside of the resin housing 7 through the heat conduction member 21, so that heat released from the image pick-up device can be dissipated outside of the resin housing 7, and the rear of the heat conduction member 21 is brought into contact with a metal plate 2, so that the heat of the heat conduction member 21 can be dissipated through the metal plate 2. Therefore, heat released from the image pick-up device 6 can be efficiently dissipated outside, and the device 6 can be restrained from rising in temperature.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting structure for a chip device such as a solid-state image pickup device.

[0002]

2. Description of the Related Art For example, in an electronic camera, a CCD is used.
A solid-state imaging device such as is provided in a lens housing, an image of a subject is formed on the solid-state imaging device by a lens in the lens housing, and the formed image of the subject is captured as an electric signal by the solid-state imaging device. It is configured. FIG.
FIG. 2 is a diagram showing an example of a mounting structure of a solid-state imaging device in the electronic camera. In this electronic camera, a metal plate 2 for fixing is attached to the image surface side (the right end side in the figure) of the lens housing 1 with screws 3, and the inner surface of the metal plate 2 located inside the lens housing 1 (the same). The imaging device 4 is provided on the optical axis O on the left side in the figure).
Are electrically connected to a wiring board 5 disposed on the outer surface on the back surface side of the metal plate 2 (the right side surface in the figure).

The image pickup device 4 protects the solid state image pickup device 6 such as a CCD which is a chip element, a resin housing 7 for accommodating the solid state image pickup device 6, and the solid state image pickup device 6 accommodated in the resin housing 7. A plurality of electrode terminals 1 to which a protective glass 8 and a plurality of bump electrodes (not shown) of the solid-state imaging device 6 are connected by bonding wires 9 respectively.
0. In this imaging device 4, a resin housing 7 is attached to the inner surface of the metal plate 2 with an adhesive (not shown), and in this state, a tip extending to the outside of the electrode terminal 10 has a through hole formed in the metal plate 2. 2a and the wiring board 5 through the through hole 5a provided in the wiring board 5.
And the protruding portion is attached to the wiring board 5 by the solder 11.

In this case, the solid-state image pickup device 6 is a semiconductor device such as a CCD for converting received light into an electric signal and outputting the electric signal.
Is adhered to the inner surface. The resin housing 7 is formed in a concave shape in which the subject side (the left side in the figure) is open, and a protective glass 8 is attached to a peripheral end on the open side. One end of each of the plurality of electrode terminals 10 is arranged on the inner surface of the resin housing 7, the other end is extended outside the resin housing 7, and the extended tip is bent toward the wiring board 5 side. In this state, it is provided in the resin housing 7 by insert molding. In addition,
Each electrode terminal 10 includes a metal plate 2 and its through hole 2.
a, and is joined to the wiring board 5 by the solder 11 without contacting a.

[0005]

Incidentally, in such an electronic camera, in order to obtain a clear captured image with the solid-state imaging device 6, it is required to increase the number of pixels of the solid-state imaging device 6 and increase the density of the pixels. Accordingly, the heat generation temperature of the solid-state imaging device 6 also increases. For this reason, in the mounting structure of the solid-state imaging device 6 described above, the solid-state imaging device 6 is housed in the resin housing 7 having low thermal conductivity. It is difficult to radiate heat to the outside, and the temperature of the solid-state imaging device 6 rises due to heat generation,
As a result, there arises a problem that the imaging characteristics are degraded or noise is affected by heat generation.

[0006] In order to solve such a problem,
As shown in FIG. 13, a structure in which an oval heat radiation hole 13 is provided in the metal plate 2 at a location corresponding to the center portion on the back surface of the solid-state imaging device 6 of the imaging device 4 has been considered. However, in such a structure, the central portion of the solid-state imaging device 6 tends to be heated to a high temperature, and the area of the metal plate 2 corresponding to the heated portion is reduced by the heat radiating holes 13, so that a sufficient heat radiating effect is obtained. Therefore, there is a problem that the temperature rise of the solid-state imaging device 6 cannot be sufficiently suppressed.

An object of the present invention is to release heat generated in a chip device such as a solid-state image pickup device to the outside to suppress a rise in the temperature of the chip device.

[0008]

According to a first aspect of the present invention, there is provided a chip element mounting structure, comprising: a chip element; a resin member for accommodating the chip element; And a heat conducting member exposed to the outside of the resin member. According to the present invention, when the chip element generates heat, the heat is conducted to the outside of the resin member by the heat conducting member, so that the heat generated in the chip element can be reliably released to the outside of the resin member, The temperature rise of the chip element can be suppressed.

In this case, as described in claim 2, if the heat conductive member is provided with a metal portion on which the resin member is mounted in a state where the portion exposed to the outside of the resin member is in contact with the heat conductive member,
The heat conducted from the chip element to the heat conducting member is conducted to the metal part, and the conducted heat can be radiated by the metal part, whereby the heat of the chip element can be efficiently released to the outside. In addition, as described in claim 3, the heat conductive member is provided on substantially the entire area excluding the electrode terminal to which the chip element is connected on the inner surface of the resin member facing the back surface of the chip element, and is provided on a part thereof. If the foot extended to the outside of the resin member is provided, the heat capacity of the heat conductive member can be increased, and thereby the heat of the chip element can be sufficiently taken in by the heat conductive member and the heat can be efficiently transmitted from the foot. Can escape to the outside. Further, as set forth in claim 4, a metal part on which the resin member is mounted on one surface and a wiring board disposed on the other surface of the metal part are provided, and the foot of the heat conductive member contacts the wiring board. If the heat-dissipating copper foil is provided, the heat of the chip element can be conducted to the copper foil of the wiring board through the foot of the heat-conducting member. And the heat of the chip element can be efficiently released to the outside.

According to a fifth aspect of the present invention, there is provided a chip element mounting structure, comprising: a chip element; a resin member accommodating the chip element; and a metal part on which the resin member accommodating the chip element is mounted. Wherein the metal portion is provided with a heat radiating hole radially extending from a portion corresponding to a central portion on the back surface of the chip element toward an outer peripheral side thereof. According to the present invention, since the heat radiation holes are formed radially extending from the central portion of the chip element toward the outer periphery thereof,
The area of the heat radiating hole corresponding to the central portion where the heat tends to be high can be reduced, whereby the area of the metal portion of the portion corresponding to the high heat portion of the chip element can be increased, and the heat radiating hole has an outer periphery. By being formed radially toward the side, the heat generated in the chip element can be efficiently radiated by the metal portion, and thereby the temperature rise of the chip element can be suppressed.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS First Embodiment A first embodiment in which a chip element mounting structure of the present invention is applied to a solid-state imaging device of an electronic camera will be described below with reference to FIG. The same parts as those in the conventional example shown in FIG. This attachment structure is
With a heat conductive member 21 provided in the resin housing 7 of
Otherwise, the structure is the same as that of the conventional example. That is,
The heat conductive member 21 is made of a metal having high heat conductivity such as copper, brass, and aluminum, and is embedded by insert molding in the resin housing 7 located on the back surface side of the solid-state imaging device 6. The inner surface (left side in FIG. 1) of the heat conductive member 21 is exposed in the resin housing 7, the solid-state imaging device 6 is attached to the exposed inner surface by the adhesive 12, and the outer surface (right side in FIG. 1). Is exposed to the outside on the back surface side of the resin housing 7, and the exposed outer surface is in contact with the metal plate 2 which is a metal portion. The metal plate 2 is made of a metal having a high thermal conductivity such as aluminum.

In such a mounting structure of the solid-state imaging device 6, when the solid-state imaging device 6 generates heat, the heat is transmitted to the back surface of the resin housing 7 by the heat conducting member 21 located on the back surface side of the solid-state imaging device 6. Therefore, the heat of the solid-state imaging device 6 can be reliably released to the outside of the resin housing 7. In addition, since the back surface of the heat conductive member 21 is in contact with the metal plate 2 having a high thermal conductivity attached to the lens housing 1, the heat of the heat conductive member 21 is transmitted to the metal plate 2, and the heat is transmitted. The heat can be radiated by the metal plate 2. Therefore, the heat generated in the solid-state imaging device 6 can be efficiently released to the outside, and the temperature rise of the solid-state imaging device 6 can be reliably suppressed.

[Second Embodiment] Next, a second embodiment in which the chip element mounting structure of the present invention is applied to a solid-state imaging device of an electronic camera will be described with reference to FIGS. Also in this case, the same parts as those of the conventional example shown in FIG. In this mounting structure, a heat conductive member 26 is provided in the resin housing 7 of the imaging device 25,
The structure is the same as that of the conventional example except that the heat dissipation copper foil 27 is provided on the wiring board 5. That is, the heat conductive member 26 is made of a metal plate having a high heat conductivity such as copper, brass, or aluminum, and as shown in FIGS. 2 to 4, the inner surface of the resin housing 7 located on the back surface side of the solid-state imaging device 6. 1, the solid-state imaging device 6 is provided in almost the entire region except for the plurality of electrode terminals 10 connected by the bonding wires 9, and the solid-state imaging device 6 is attached to the inner surface thereof with an adhesive 12. Also, this heat conductive member 26
The portions located at the four corners of the resin housing 7 are extended to the outside of the resin housing 7, and the extended feet 28 are bent toward the wiring board 5, and in this state, integrated with the resin housing 7 by insert molding. It is provided in.

As shown in FIG. 2, the wiring board 5 is disposed on the outer surface on the back side (the right side in FIG. 2) of the metal plate 2 attached to the lens housing 1 with screws 3. In the wiring board 5, each electrode terminal 10 of the imaging device 25 and each foot 28 of the heat conductive member 26 disposed on the inner surface of the metal plate 2 are provided with through holes 2 a and 2 b of the metal plate 2 and through the wiring board 5. The wiring board 5 protrudes through the holes 5a and 5b toward the back side (the right side in the figure) of the wiring board 5, and the protruding portion is attached by the solder 11. In this case, as shown in FIG.
The heat-dissipating copper foil 2 to which each of the feet 28 of the heat conducting member 26 is connected over substantially the entire area excluding these wirings 29 is formed.
7 are formed.

In such a mounting structure of the solid-state imaging device 6, when the solid-state imaging device 6 generates heat, the heat is transmitted to the heat conduction member 26 located on the back surface of the solid-state imaging device 6, and the foot of the heat conduction member 26 Since the heat is transmitted from the portion 28 to the outside of the resin housing 7, the heat of the solid-state imaging device 6 can be released to the outside of the resin housing 7. In this case, in particular, the heat conductive member 26 is provided on substantially the entire region except for the plurality of electrode terminals 10 to which the solid-state imaging device 6 is connected, on the inner surface of the resin housing 7 located on the back surface of the solid-state imaging device 6. As a result, the heat capacity of the heat conducting member 26 can be increased, whereby the heat of the solid-state imaging device 6 can be sufficiently taken in, and the taken-in heat can be reliably released from the foot 28 to the outside of the resin housing 7. be able to. Moreover, the foot 28 of the heat conductive member 26 is soldered to the copper foil 27 for heat dissipation of the wiring board 5 disposed on the outer surface of the metal plate 2.
The heat of the heat conductive member 26 is conducted to the copper foil 27 of the wiring board 5 through the foot 28 by
This conducted heat can be radiated to the outside by the copper foil 27. Thereby, the heat generated in the solid-state imaging device 6 can be efficiently released to the outside, and the temperature rise of the solid-state imaging device 6 can be reliably suppressed.

[Third Embodiment] Next, a third embodiment in which the chip element mounting structure of the present invention is applied to a solid-state imaging device of an electronic camera will be described with reference to FIGS. Also in this case, the same parts as those of the conventional example shown in FIG. This mounting structure has a structure in which a heat conductive member 31 is provided on the resin housing 7 of the imaging device 30 and a copper foil 32 for heat dissipation is provided on the wiring board 5, and is otherwise substantially the same as the conventional example. . In this case, as shown in FIG. 7, the imaging device 30 includes, on the inner surface of the resin housing 7 located on the back surface side of the solid-state imaging device 6, the respective electrodes to which the solid-state imaging device 6 is connected on the upper side and lower side, respectively. A plurality of terminals 10 are arranged.

The heat conductive member 31 is made of a metal plate having a high heat conductivity such as copper, brass, aluminum or the like. As shown in FIGS. On the inner surface, it is provided in a region located between the electrode terminals 10 arranged on the upper side and the lower side, respectively, and the solid-state imaging element 6 is attached to the inner surface with an adhesive 12. Also, the heat conduction member 31
The portions of the resin housing 7 located on the left and right sides in FIG. 7 are directly extended to the outside of the resin housing 7,
The extended foot portion 33 is bent toward the wiring board 5 side, and each end thereof is further bent in parallel with the wiring board 5, and in this state, provided integrally with the resin housing 7 by insert molding. I have. In this case, each foot 33
7 is formed to have a width substantially equal to the width W of a region located between the electrode terminals 10 arranged on the upper side and the lower side on the inner surface of the resin housing 7 in FIG.

The wiring board 5 is disposed on the outer surface on the back side of the metal plate 2, and an electrode terminal 10 is provided on the inner surface thereof, that is, the inner surface facing the metal plate 2 (the left side surface in FIG. 6). A copper foil 32 for heat radiation is formed in almost the entire area except for the through hole 5a to be inserted. This heat dissipation copper foil 32
Is in close contact with the outer surface on the back side of the metal plate 2. The foot 33 of the heat conducting member 31 is inserted into the insertion hole 34 formed in the metal plate 2 and joined to the copper foil 32 by the solder 11. In this case, the foot 33 may not be in contact with the metal plate 2 and the insertion hole 34 thereof, and may be in contact with the metal plate 2 and the insertion hole 34 thereof. Further, it is formed of a metal having high thermal conductivity such as aluminum.

In such a mounting structure of the solid-state imaging device 6, when the solid-state imaging device 6 generates heat, the heat is transmitted to the heat conduction member 31 located on the back surface of the solid-state imaging device 6, and the foot of the heat conduction member 31 Since the heat is transmitted from the portion 33 to the outside of the resin housing 7, the heat of the solid-state imaging device 6 can be released to the outside of the resin housing 7. In this case, the heat conductive members 31 are provided in regions located between the electrode terminals 10 arranged on the upper side and the lower side, respectively, on the inner surface of the resin housing 7, and on both left and right sides of the resin housing 7 in FIG. 7. Resin housing 7 is located as it is
, The heat capacity of the heat conducting member 31 can be increased, and the foot 33 can be formed with a large area, so that the heat of the solid-state imaging device 6 can be transferred to the heat conducting member 31. And the heat taken in can be sufficiently released from the foot portion 33 to the outside of the resin housing 7.

In this mounting structure, the heat conducting member 31
Are bonded to the copper foil 32 for heat dissipation of the wiring board 5 disposed on the outer surface of the metal plate 2 by the solder 11, so that the heat of the heat conductive member 31 is transferred to the copper foil 32 of the wiring board 5. Can conduct. In this case, the heat conducting member 3
1 is a foot portion 33 extended to the outside of the resin housing 7.
Has the same width W as the width of the region located between the electrode terminals 10 and is bent toward the wiring board 5, and each end thereof is further bent in parallel with the wiring board 5. 11 can be enlarged, whereby the heat of the heat conducting member 31 can be sufficiently conducted from the foot portion 33 to the copper foil 32 of the wiring board 5, whereby the heat radiation effect can be enhanced. . Moreover, since the copper foil 32 of the wiring board 5 is in close contact with the outer surface of the metal plate 2,
The heat conducted to the copper foil 32 can also be conducted to the metal plate 2, and the conducted heat can be radiated by the metal plate 2.

As described above, in this mounting structure, the heat generated in the solid-state imaging device 6 is efficiently radiated to the outside by the heat conductive member 31, its feet 33, the copper foil 32 of the wiring board 5, and the metal plate 2. Accordingly, the temperature rise of the solid-state imaging device 6 can be reliably suppressed. Also,
In such an attachment structure, the heat-dissipating copper foil 32 is formed on the inner surface of the wiring board 5, that is, the inner surface on which the wiring 29 shown in FIG. 5 is not formed. Since the copper foil 32 can be formed in a wider area than that, the heat radiation effect can also be enhanced, and the wiring 29 is formed on an outer surface different from the heat radiation copper foil 32.
Is not restricted by the copper foil 32 for heat dissipation, so that the wiring 29 can be easily routed.

[Fourth Embodiment] Next, referring to FIG.
A fourth embodiment in which the chip element mounting structure of the present invention is applied to a solid-state imaging device of an electronic camera will be described. Also in this case, the same parts as those of the conventional example shown in FIG. This mounting structure is used for the imaging device 35.
With a heat conductive member 36 provided in the resin housing 7 of
Other than this, the structure is almost the same as the conventional example. That is, the heat conductive member 36 is made of a metal plate having a high thermal conductivity such as copper, brass, and aluminum, and as shown in FIG. The solid-state imaging device 6 is provided in the entire region except for the plurality of electrode terminals 10 to which the solid-state imaging device 6 is connected, and the solid-state imaging device 6 is attached to the inner surface thereof. The heat conducting member 36 extends outside from the outer periphery of the resin housing 7 except for the portion where the electrode terminals 10 are provided, and the extended foot portion 37 has approximately the same size as the outer shape of the metal plate 2. In this state, it is provided integrally with the resin housing 7 by insert molding. In addition, a mounting hole 38 for the screw 3 is provided at a predetermined position of the foot portion 37 extending outside from the resin housing 7.

In such a mounting structure of the solid-state imaging device 6, the heat conductive member 36 is provided on almost the entire area except for the plurality of electrode terminals 10 on the inner surface of the resin housing 7,
In addition, since the foot portion 37 extending from the resin housing 7 to the outside is formed to have substantially the same size as the outer shape of the metal plate 2, the heat capacity of the heat conducting member 36 is larger than that of the second and third embodiments. Therefore, the heat generated in the solid-state imaging device 6 can be sufficiently taken in, and the taken-in heat can be reliably radiated to the outside of the resin housing 7 by the feet 37. Therefore, the heat generated in the solid-state imaging device 6 is transferred to the resin housing 7.
Of the solid-state imaging device 6 can be reliably suppressed. In this case, since the feet 37 of the heat conducting member 36 are formed to have substantially the same dimensions as the outer shape of the metal plate 2, the feet 37 of the heat conducting member 36 are attached to the lens housing 1 without using the metal plate 2. Since the metal plate 2 can be attached, the metal plate 2 becomes unnecessary, the number of parts and cost can be reduced, and the thickness of the entire mounting structure can be reduced, so that the entire mounting structure can be made compact.

[Fifth Embodiment] Next, FIGS.
A fifth embodiment in which the chip element mounting structure of the present invention is applied to a solid-state imaging device of an electronic camera will be described with reference to FIG. Also in this case, the same parts as those of the conventional example shown in FIGS. This mounting structure has a structure in which a radial heat radiating hole 40 is provided in the metal plate 2, and is otherwise substantially the same as the conventional example. That is, the metal plate 2 includes the solid-state image sensor 6
A radiating hole 40 extending radially from a position corresponding to the center portion on the back surface toward the outer peripheral side is provided in a cross shape.

In such a mounting structure of the solid-state imaging device 6, since the heat radiation holes 40 are formed in a radial shape extending from the central portion of the solid-state imaging device 6 to the outer peripheral side, the back surface of the solid-state imaging device 6 has high heat radiation. It is possible to reduce the area of the heat radiation hole 40 at a position corresponding to the central portion that is likely to cause the problem, whereby it is possible to increase the area of the metal plate 2 at a position corresponding to the central portion on the back surface of the fixed imaging element 6, In addition, since the heat radiating holes 40 are formed in a cross shape extending radially toward the outer peripheral side, the heat generated in the solid-state imaging device 6 can be efficiently radiated by the metal plate 2. Temperature rise can be suppressed. When the resin housing 7 of the imaging device 4 is bonded to the metal plate 2 with an adhesive (not shown), the adhesive radially spreads along the radial heat radiation holes 40 formed in the metal plate 2. Strength can also be increased.

In the fifth embodiment, the heat radiating holes 40 are formed in the metal plate 2 in a cross shape. However, the present invention is not limited to this. For example, the heat radiating holes 40 may be formed in an X shape as shown in FIG. It may be formed in a * shape, that is, any shape as long as it is a radial shape. In addition, the fifth
In the embodiment, the case where the imaging device 4 having the conventional structure is used has been described. However, the invention is not limited thereto, and the imaging devices 20, 25, 30, and 35 according to the first to fourth embodiments may be used. With this configuration, heat can be more efficiently released. In the first to fifth embodiments, the mounting structure of the solid-state imaging element 6 of the electronic camera has been described. However, the present invention is not limited to this, and may be applied to the mounting structure of a chip element such as a semiconductor element used in other electronic devices. Can be applied.

[0027]

As described above, according to the mounting structure of the chip element according to the first aspect of the present invention, the chip element has:
Since the chip element is provided with a resin member accommodating the chip element and a heat conductive member exposed in the resin member, the chip element is attached to the exposed portion, and exposed to the outside of the resin member, When heat is generated, the heat can be conducted to the outside of the resin member by the heat conducting member, so that the heat generated in the chip element can be reliably released to the outside, thereby suppressing a rise in the temperature of the chip element. it can.

In this case, if a metal portion on which the resin member is mounted in a state where the portion of the heat conductive member exposed to the outside of the resin member is in contact is provided, the heat conducted from the chip element to the heat conductive member is transferred to the metal. The heat can be radiated by the metal part, and the heat of the chip element can be efficiently released to the outside. In addition, the heat conductive member is provided on substantially the entire area except for the electrode terminals to which the chip element is connected on the inner surface of the resin member facing the back surface of the chip element, and partially extends outside the resin member. If the foot portion is provided, the heat capacity of the heat conducting member can be increased, whereby the heat of the chip element can be sufficiently taken in by the heat conducting member and can be efficiently released from the foot portion to the outside. Further, there is provided a metal part on which the resin member is mounted on one surface, and a wiring board disposed on the other surface of the metal part, and a heat-dissipating copper to which the foot part of the heat conductive member is attached by contact with the wiring board. If the foil is provided, the heat of the chip element can be conducted to the copper foil of the wiring board through the foot of the heat conducting member, and the conducted heat can be radiated by the copper foil. Therefore, the heat of the chip element can be efficiently released to the outside.

According to a fifth aspect of the present invention, there is provided a chip element mounting structure comprising: a chip element; a resin member accommodating the chip element; and a metal portion on which the resin member is mounted. Since the heat radiation holes extending radially from the portion corresponding to the central portion on the back surface of the chip element toward the outer peripheral side thereof are provided in the portion, the heat radiation holes at the portion corresponding to the central portion where high heat is likely to be generated on the back surface of the chip element are provided. The area can be reduced, the area of the metal part corresponding to the central part on the back surface of the chip element can be increased, and the radiation holes are formed radially toward the outer periphery. In addition, the heat of the chip element can be efficiently dissipated by the metal portion, thereby suppressing the temperature rise of the chip element.

[Brief description of the drawings]

FIG. 1 is an enlarged sectional view of a main part showing a first embodiment in which a chip element mounting structure of the present invention is applied to a solid-state imaging device of an electronic camera.

FIG. 2 is an enlarged sectional view of a main part showing a second embodiment in which the chip element mounting structure of the present invention is applied to a solid-state imaging device of an electronic camera.

FIG. 3 is a cross-sectional view illustrating the imaging device of FIG. 2;

FIG. 4 is a transverse sectional view taken along the line AA of FIG. 3;

FIG. 5 is an enlarged view showing the back surface side of the wiring board of FIG. 2;

FIG. 6 is an enlarged sectional view of a main part showing a third embodiment in which the chip element mounting structure of the present invention is applied to a solid-state imaging device of an electronic camera.

FIG. 7 is a cross-sectional view of the imaging device as viewed in the direction of arrows BB in FIG. 6;

FIG. 8 is a cross-sectional view showing an imaging device according to a fourth embodiment in which the chip element mounting structure of the present invention is applied to a solid-state imaging device of an electronic camera.

FIG. 9 is an enlarged sectional view of a main part showing a fifth embodiment in which the mounting structure of the chip element of the present invention is applied to a solid-state imaging device of an electronic camera.

FIG. 10 is a view of the metal plate of FIG. 9 as viewed from the back side.

FIG. 11 is a view of a metal plate showing a modification of the fifth embodiment of the present invention as viewed from the back surface side.

FIG. 12 is an enlarged sectional view of a main part showing a mounting structure of a conventional solid-state imaging device used for an electronic camera.

FIG. 13 is a view of a metal plate to which an imaging device according to another conventional example is attached, viewed from the back surface side.

[Explanation of symbols]

 2 Metal plate 4, 20, 25, 30, 35, 40 Imaging device 5 Wiring board 6 Solid-state imaging device 7 Resin housing 10 Electrode terminal 21, 26, 31, 36 Thermal conductive member 27, 32 Copper foil 28, 33, 37 Feet Part 40 Heat radiation hole

Claims (5)

[Claims] A chip element; a resin member accommodating the chip element; and a heat conduction exposed in the resin member, the chip element attached to the exposed portion, and exposed to the outside of the resin member. And a member for mounting the chip element. 2. The chip element according to claim 1, further comprising a metal portion on which the resin member is mounted in a state where a portion of the heat conductive member exposed to the outside of the resin member is in contact with the metal member. Mounting structure. 3. The heat conductive member is provided on substantially the entire area except for an electrode terminal to which the chip element is connected, on the inner surface of the resin member facing the back surface of the chip element, and the heat conductive member is partially provided. The mounting structure for a chip element according to claim 1, wherein a foot portion extending outside the resin member is provided. 4. A metal part on which the resin member is mounted on one surface, and a wiring board disposed on the other surface of the metal part, wherein the foot of the heat conductive member contacts the wiring board. 4. The mounting structure for a chip element according to claim 3, wherein a heat-dissipating copper foil is provided. 5. A semiconductor device comprising: a chip element; a resin member accommodating the chip element; and a metal part on which the resin member accommodating the chip element is mounted. A mounting structure for a chip element, wherein a radiating hole extending radially from a portion corresponding to a central portion toward an outer peripheral side thereof is provided.