CN209979847U - Laser emitter, camera device and electronic device - Google Patents
Laser emitter, camera device and electronic device Download PDFInfo
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- CN209979847U CN209979847U CN201920377547.1U CN201920377547U CN209979847U CN 209979847 U CN209979847 U CN 209979847U CN 201920377547 U CN201920377547 U CN 201920377547U CN 209979847 U CN209979847 U CN 209979847U
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Abstract
The utility model provides a laser emitter, camera device and electron device, laser emitter is including leading connecing circuit board, emission chip, heat dissipation base plate and metal support, the metal support includes the holding surface, lead to connect the circuit board set up in on the holding surface, the heat dissipation base plate range upon range of in lead to connect on the circuit board and be connected rather than the electricity, the heat dissipation base plate includes the loading end, be equipped with the conducting layer on the holding surface, the emission chip is fixed in the conducting layer passes through the conducting layer with lead to connect the circuit board electricity and connect, the heat warp of emission chip the heat dissipation base plate, lead to connect the circuit board with the metal support dispels the heat. The heat of the transmitting chip is dissipated through multiple times of heat transfer, a better heat dissipation effect is achieved, and the problem that the performance of a product is influenced when the heat dissipation of the laser transmitter is not timely is avoided.
Description
Technical Field
The utility model relates to an electron and optical components make field, in particular to laser emitter, camera device and electron device.
Background
The laser transmitter in the time of flight (TOF) depth camera works continuously, the heat productivity is very large when the TOF depth camera works, and especially in digital electronics such as mobile phones, the too large heat productivity can cause the problems of high working temperature of the whole machine, infrared laser band offset and the like, and the product performance is directly influenced.
SUMMERY OF THE UTILITY MODEL
The utility model provides a laser emitter structure avoids laser emitter heat dissipation not too late often to influence the problem of producing the performance.
The utility model also provides a camera device and an electron device.
The utility model provides a laser emitter, laser emitter is including leading connecing circuit board, transmission chip, heat dissipation base plate and metal support, the metal support includes the holding surface, lead to connect the circuit board set up in on the holding surface, the heat dissipation base plate range upon range of in lead to connect on the circuit board and rather than the electricity be connected, the heat dissipation base plate includes the loading end, be equipped with the conducting layer on the holding surface, the transmission chip is fixed in the conducting layer passes through the conducting layer with lead to connect circuit board electricity and connect, the heat warp of transmission chip the heat dissipation base plate, lead to connect the circuit board with the metal support dispels the heat. The heat dissipation substrate is an aluminum nitride ceramic substrate and has a good heat dissipation effect. The emitting chip emits partial heat through the radiating substrate so as to prevent excessive heat from being transferred to the guide connection circuit board to cause overheating of the guide connection circuit board to influence the performance of the guide connection circuit board, one part of the heat transferred to the radiating substrate by the emitting chip is dissipated through the radiating substrate, one part of the heat is transferred to the guide connection circuit board through the radiating substrate, and the other part of the heat is transferred to the metal support through the guide connection circuit board and finally dissipated through the metal support. Meanwhile, the heat of the conductive connection circuit board can be transmitted out through the metal support, the heat of the transmitting chip is radiated through multiple times of transmission, a better radiating effect is achieved, and the problem that the performance of a product is influenced due to the fact that the laser transmitter radiates untimely is avoided.
The transmitting chip is fixedly connected with the conducting layer through a first conducting connecting layer. The first conductive connecting layer can fix the transmitting chip on the conductive layer, and has a good heat conduction effect, so that heat generated by the transmitting chip can be quickly transferred to the heat dissipation substrate.
And the surface of the radiating substrate, which is back to the conductive layer, is convexly provided with an auxiliary conductive layer, and the auxiliary conductive layer is electrically connected with the conductive circuit board. The auxiliary conducting layer and the conducting layer are conducting surfaces, the problems that the connection of the conducting wires is broken possibly, the space occupied by the conducting wires influences the layout of a product and the like are solved, and the circuits are connected more stably through the conducting surfaces.
And a second conductive connecting layer is arranged between the auxiliary conductive layer and the conductive circuit board and is used for connecting the auxiliary conductive layer and the conductive circuit board. The second conductive connecting layer can fix the radiating substrate on the conductive circuit board, and has a good heat conduction effect, the heat of the radiating substrate can be quickly transferred to the conductive circuit board by the transmitting chip, and then the heat can be transferred out by the conductive circuit board.
And a heat-conducting adhesive layer is arranged between the conductive connection circuit board and the supporting surface. On the one hand, the heat-conducting adhesive layer is connected with the metal support and the guide connection circuit board, so that the metal support and the guide connection circuit board are more stably connected, and on the other hand, the heat-conducting adhesive layer also has a good heat-conducting effect and can quickly transfer heat on the guide connection circuit board to the metal support so as to achieve a better heat dissipation effect.
The heat dissipation substrate is provided with a plurality of through holes penetrating through the conductive layer and the auxiliary conductive layer, each through hole is plated with a copper layer, and the copper layers are electrically connected with the conductive layer and the auxiliary conductive layer. The conducting layer is connected with the auxiliary conducting layer through the copper-plated through hole, so that the electric connection is more stable and reliable, the circuit problems of looseness or instability and the like of connection possibly occurring through wire connection are avoided, the problem of guide wiring is avoided, the structure is simpler, and the space and the production cost are saved.
The metal support is back to one side of the supporting surface is concavely provided with a heat dissipation groove, the heat dissipation groove is arranged to increase the heat dissipation area, a better heat dissipation effect is achieved, and heat can be dissipated more quickly.
The utility model discloses still protect a camera device, include module, circuit board and as above laser emitter of making a video recording, make a video recording the module with metal support adorn in on the circuit board, make a video recording the module with lead and connect the circuit board to pass through circuit board electric connection. The laser transmitter of the camera device has a good heat dissipation effect by optimizing the structural layout, so that the performance of the camera device is not affected.
The utility model discloses still need protect an electron device, including the casing with adorn in the casing as above camera device. The electronic device can be a mobile phone, a camera, a tablet, a watch and other electronic devices.
The metal support is connected with the shell of the electronic device, so that heat on the metal support can be transferred to the shell for heat dissipation, a better heat dissipation effect is achieved, and product performance is guaranteed.
The utility model provides a laser emitter, including leading and connect circuit board, transmission chip, heat dissipation base plate and metal support, through with the transmission chip the heat dissipation base plate lead connect the circuit board range upon range of in proper order in on the metal support, thereby will the heat transfer that the transmission chip sent gives the heat dissipation base plate lead and connect the circuit board and reach the metal support, through the fine radiating effect of heat dissipation arrival many times, avoided laser emitter heat dissipation not in time influence the problem of producing the performance, improved laser emitter's electrical property.
Drawings
In order to more clearly illustrate the technical solution of the present invention, the drawings required for the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a laser transmitter provided by the present invention;
fig. 2 is a schematic cross-sectional structure diagram of a laser transmitter provided by the present invention;
fig. 3 is a schematic structural diagram of the image pickup apparatus provided by the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
Referring to fig. 1, the present invention provides a laser transmitter 100, the laser transmitter 100 includes a conductive circuit board 10, a transmitting chip 20 (as shown in fig. 2), a heat dissipating substrate 30 and a metal support 40, the metal support 40 includes a supporting surface 41, the conductive circuit board 10 is disposed on the supporting surface 41, the heat dissipating substrate 30 is stacked on the conductive circuit board 10 and electrically connected thereto, the heat dissipating substrate 30 includes a carrying surface 31, a conductive layer 311 (as shown in fig. 2) is disposed on the carrying surface 31, the transmitting chip 20 is fixed on the conductive layer 311 and electrically connected to the conductive circuit board 10 through the conductive layer 311, and heat of the transmitting chip 20 is dissipated through the heat dissipating substrate 30, the conductive circuit board 10 and the metal support 40. In this embodiment, the heat dissipation substrate 30 is an aluminum nitride ceramic substrate, which has a good heat dissipation effect and can quickly dissipate the heat of the emission chip 20. The emitting chip 20 emits partial heat through the heat dissipating substrate 30, so as to prevent excessive heat from being transferred to the connecting circuit board 10 to cause overheating of the connecting circuit board 10 and affect the performance of the connecting circuit board 10, a part of the heat transmitted to the heat dissipating substrate 30 by the emitting chip 20 is dissipated through the heat dissipating substrate 30, a part of the heat is transmitted to the connecting circuit board 10 through the heat dissipating substrate 30, and is then transmitted to the metal bracket 40 through the connecting circuit board 10, and is finally dissipated through the metal bracket 40. Meanwhile, the heat of the conductive circuit board 10 can be transmitted out through the metal bracket 40, and the heat of the transmitting chip 20 is radiated through multiple times of transmission, so that a better radiating effect is achieved, and the problem that the performance of the product is affected when the laser transmitter 100 is not radiated in time is avoided. In other embodiments, the heat dissipation substrate 30 may also be a metal substrate, and the specific electrical connection manner may be designed according to actual situations.
Referring to fig. 2, the heat dissipating substrate 30 in this embodiment is a rectangular plate, an auxiliary conductive layer 321 is protruded on a surface 32 of the heat dissipating substrate 30 opposite to the conductive layer 311, the carrying surface 31 is disposed opposite to the surface 32, and the auxiliary conductive layer 321 is electrically connected to the conductive circuit board 10. The auxiliary conducting layer 321 is electrically connected with the conducting layer 311, the auxiliary conducting layer 321 and the conducting layer 311 are both conducting surfaces, so that the problems that the conducting layer 311 is disconnected with the conducting circuit board 10 through a conducting wire, the conducting layer 311 is connected with the emitting chip 20 through the conducting wire, the product layout is affected due to the fact that the conducting wire occupies space, and the like are solved, and the circuits are connected more stably through the conducting surfaces. In other embodiments, the heat dissipation substrate 30 may also be a plate body with other shapes.
Further, a plurality of via holes (not shown) penetrating through the conductive layer 311 and the sub-conductive layer 321 are formed on the heat dissipation substrate 30, the via holes are circular holes, each via hole is plated with a copper layer, the copper layers are formed on hole walls of the via holes, and the copper layers are electrically connected to the conductive layer 311 and the sub-conductive layer 321. The conducting layer 311 is connected with the auxiliary conducting layer 321 through the copper-plated through hole, so that the electric connection is more stable and reliable, the circuit problems of looseness or instability and the like of connection which possibly occurs through wire connection are avoided, the problem of guiding and wiring is avoided, the structure is simpler, and the space and the production cost are saved. In some embodiments, the via may be further filled with a conductive metal material, through which the conductive layer 311 is electrically connected to the secondary conductive layer 321, and the via may have another shape. The conductive layer 311 and the secondary conductive layer 321 may also be electrically connected by a wire or in other manners, and the conductive layer 311 and the secondary conductive layer 321 may also be replaced by other electrical connection carriers.
In this embodiment metal support 40 is the cuboid support body, metal support 40 dorsad one side of holding surface 41 is concave to be equipped with radiating groove 42, through setting up radiating groove 42 has increased heat radiating area, reaches better radiating effect, and the heat can be more quick dispels the heat away. The heat dissipation groove 42 in this embodiment is 1 rectangular groove. In other embodiments, the heat dissipation groove 42 may be a plurality of heat dissipation grooves 42, and the shape may also be other shapes, so as to make the heat dissipation area larger and the heat dissipation effect better. The metal bracket 40 may be a bracket body having other shapes. The metal bracket 40 may not have the heat dissipation groove 42 when the heat dissipation condition is satisfied.
The metal bracket 40 further includes a blocking wall 43, the conductive circuit board 10 is disposed in an area surrounded by the blocking wall 43 and adapted to the shape of the conductive circuit board 10, and the conductive circuit board 10 is surrounded by the blocking wall 43, so that the conductive circuit board 10 is not easily displaced and can be stably fixed on the supporting surface 41. In this embodiment, the conductive circuit board 10 is a flexible circuit board, and the blocking wall 43 surrounds three sides of the conductive circuit board 10, so that the conductive circuit board 10 can be connected to other devices. In other embodiments, the blocking wall 43 may be disposed according to actual requirements. The docking circuit board 10 may also be a rigid circuit board.
Further, the emitting chip 20 includes an emitting surface (not shown) and a connection surface (not shown) disposed opposite to each other, and the connection surface and the conductive layer 311 are fixedly connected through a first conductive connection layer 50 a. The first conductive connection layer 50a can fix the emitting chip 20 on the conductive layer 311, and on the other hand, the first conductive connection layer 50a further has a conductive function, the emitting chip 20 is electrically connected to the conductive layer 311 through the first conductive connection layer 50a, and the first conductive connection layer 50a further has a good heat conduction effect, and can quickly transfer heat generated by the emitting chip 20 to the heat dissipation substrate 30. In this embodiment, the transmitting chip 20 is a vertical laser transmitter, and the first conductive connecting layer 50a is silver paste. Of course, the emitting chip 20 may also be another emitting device with a large heat generation amount, and the first conductive connection layer 50a may also be another adhesive body having good conductive and heat-conductive properties.
Further, a second conductive connecting layer 50b is disposed between the secondary conductive layer 321 and the conductive circuit board 10, and is used for connecting the secondary conductive layer 321 and the conductive circuit board 10. Specifically, the conductive circuit board 10 is a rectangular board, and the conductive circuit board 10 includes a top surface (not shown) and a bottom surface (not shown) opposite to the top surface, and the top surface is connected to the secondary conductive layer 321 through the second conductive connection layer 50 b. The second conductive connection layer 50b can fix the heat dissipation substrate 30 on the conductive connection circuit board 10, and the second conductive connection layer 50b has a conductive function, the secondary conductive layer 321 is electrically connected to the conductive connection circuit board 10 through the second conductive connection layer 50b, and the second conductive connection layer 50 has a good heat conduction effect, and can quickly transfer the heat transferred from the emission chip 20 to the heat dissipation substrate 30 to the conductive connection circuit board 10, and then transfer the heat out through the conductive connection circuit board 10. In this embodiment, the second conductive connecting layer 50b is solder paste. Of course, the second conductive connecting layer 50b may also be another adhesive having good conductive and heat-conductive properties.
Further, a heat conductive adhesive layer 60 is disposed between the conductive circuit board 10 and the supporting surface 41. Specifically, lead the bottom surface that connects circuit board 10 with holding surface 41 passes through heat-conducting adhesive layer 60 connects, heat-conducting adhesive layer 60 will be connected on the one hand metal support 40 with lead and connect circuit board 10, make metal support 40 with it connects circuit board 10 to connect more firmly, on the other hand heat-conducting adhesive layer 60 still has fine heat conduction effect, can with lead and connect the heat on the circuit board 10 and give fast for metal support 40 to reach better radiating effect. In this embodiment, the thermal conductive adhesive layer 60 is a double-sided adhesive tape, and of course, the thermal conductive adhesive layer 60 may also be another colloid with a good heat dissipation effect.
Referring to fig. 1-2, the laser transmitter 100 further includes a package structure 70, and the package structure 70 encapsulates the transmitting chip 20 on the heat dissipating substrate 30. Specifically, the package structure 70 includes a support frame 71 and an optical diffuser 72, the support frame 71 is a rectangular frame with a through hole, the support frame 71 includes a connection end 711 and a support end 712 opposite to the connection end 711, an end of the inner wall of the support frame 71 away from the connection end 711 is convexly disposed to form the support end 712, the optical diffuser 72 is fixed to the support end 712, the connection end 711 is fixed to the carrying surface 31, the optical diffuser 72 and the emission chip 20 are oppositely disposed at an interval, the emission surface faces the optical diffuser 72, the laser emitted by the emission chip 20 passes through the through hole and then is emitted through the optical diffuser 72, and a space for accommodating the emission chip 20 is defined by the package structure 70 and the heat dissipation substrate 30.
Referring to fig. 3, the present invention also provides a camera device 200, which includes a camera module 201, a circuit board 202 and the laser emitter 100 according to any of the above embodiments, wherein the camera module 201 and the metal bracket 40 are mounted on the same surface of the circuit board 202 in parallel, specifically, the surface of the metal bracket 40 opposite to the supporting surface 41 is mounted on the circuit board 202, and the camera module 201 is electrically connected to the conductive circuit board 10 through the circuit board 202. The laser transmitter 100 of the camera device 200 has a good heat dissipation effect by optimizing the structural layout, thereby ensuring that the performance of the camera device 200 is not affected. In this embodiment, the circuit board 202 and the connecting circuit board 10 are both flexible circuit boards, and the circuit board 202 and the connecting circuit board 10 are integrally formed circuit boards. In other embodiments, the circuit board 202 may be a rigid circuit board, and the circuit board 202 and the docking circuit board 10 are electrically connected by a wire or other means.
The present invention also provides an electronic device (not shown) comprising a housing and the camera device 200 of any of the above embodiments installed in the housing. In this embodiment, the electronic device is a depth camera, and the metal bracket 40 is connected to the housing of the electronic device, so that heat on the metal bracket 40 can be transferred to the housing for heat dissipation, thereby achieving a better heat dissipation effect and ensuring product performance. In other embodiments, the electronic device may also be a mobile phone, a camera, a tablet, a watch, or other electronic devices.
The utility model provides a laser emitter 100, including leading connect circuit board 10, transmission chip 20, heat dissipation base plate 30 and metal support 40, through with transmission chip 20 heat dissipation base plate 30 lead connect circuit board 10 range upon range of in proper order in on the metal support 40, thereby will the heat transfer that transmission chip 20 sent gives heat dissipation base plate 30 lead connect circuit board 10 reaches metal support 40 reachs fine radiating effect through dispelling the heat many times, has avoided laser emitter 100 to dispel the heat not in time to influence the problem of producing the performance, has improved laser emitter 100's electrical property.
The embodiments of the present invention have been described in detail, and the principles and embodiments of the present invention have been explained herein using specific embodiments, and the above description of the embodiments is only used to help understand the method and the core idea of the present invention; meanwhile, for the general technical personnel in the field, according to the idea of the present invention, there are changes in the specific implementation and application scope, to sum up, the content of the present specification should not be understood as the limitation of the present invention.
Claims (10)
1. The utility model provides a laser emitter, its characterized in that, laser emitter is including leading connecing circuit board, emission chip, heat dissipation base plate and metal support, the metal support includes the holding surface, lead to connect the circuit board set up in on the holding surface, the heat dissipation base plate range upon range of in lead to connect on the circuit board and rather than the electricity be connected, the heat dissipation base plate includes the loading end, be equipped with the conducting layer on the holding surface, the emission chip is fixed in the conducting layer passes through the conducting layer with lead to connect the circuit board electricity and connect, the heat warp of emission chip the heat dissipation base plate, lead to connect the circuit board and the metal support dispels the heat.
2. The laser transmitter of claim 1, wherein the transmitting chip is secured to the conductive layer by a first conductive connection layer.
3. The laser transmitter of claim 2, wherein a sub-conductive layer is protruded on a surface of the heat dissipation substrate facing away from the conductive layer, and the sub-conductive layer is electrically connected to the conductive circuit board.
4. The laser transmitter of claim 3, wherein a second conductive connecting layer is disposed between the secondary conductive layer and the docking circuit board to connect the secondary conductive layer and the docking circuit board.
5. The laser transmitter of any one of claims 1-4, wherein a layer of thermally conductive adhesive is disposed between the bond circuit board and the support surface.
6. The laser transmitter of claim 3, wherein said heat sink substrate is provided with a plurality of vias extending through said conductive layer and said secondary conductive layer, each of said vias being plated with a copper layer, said copper layer electrically connecting said conductive layer and said secondary conductive layer.
7. The laser transmitter of any one of claims 1-4, wherein a side of the metal support facing away from the supporting surface is recessed with heat sink grooves.
8. A camera device, comprising a camera module, a circuit board and the laser transmitter according to any one of claims 1 to 7, wherein the camera module and the metal bracket are mounted on the circuit board, and the camera module and the conductive circuit board are electrically connected through the circuit board.
9. An electronic device comprising a housing and the imaging device of claim 8 mounted in the housing.
10. The electronic device of claim 9, wherein the metal bracket is coupled to a housing of the electronic device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920377547.1U CN209979847U (en) | 2019-03-22 | 2019-03-22 | Laser emitter, camera device and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920377547.1U CN209979847U (en) | 2019-03-22 | 2019-03-22 | Laser emitter, camera device and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209979847U true CN209979847U (en) | 2020-01-21 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920377547.1U Active CN209979847U (en) | 2019-03-22 | 2019-03-22 | Laser emitter, camera device and electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209979847U (en) |
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2019
- 2019-03-22 CN CN201920377547.1U patent/CN209979847U/en active Active
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee after: Jiangxi OMS Microelectronics Co.,Ltd. Address before: 330000 east of Xueyuan 6th Road, south of Tianxiang Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee before: OFilm Microelectronics Technology Co.,Ltd. Address after: 330000 east of Xueyuan 6th Road, south of Tianxiang Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee after: OFilm Microelectronics Technology Co.,Ltd. Address before: 330029 No. 1189 Jingdong Avenue, Nanchang high tech Zone, Jiangxi Patentee before: NANCHANG OFILM BIO-IDENTIFICATION TECHNOLOGY Co.,Ltd. |
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| CP03 | Change of name, title or address |