JP4214749B2 - Lighting device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an illumination device, and more particularly to an illumination device configured using a light source such as a light emitting diode.
[0002]
[Prior art]
Conventionally, in a reflective illumination device that reflects light from a light source disposed opposite to a reflective surface and extracts the light in the front direction, a light source such as a light emitting diode is disposed in the front direction of the illumination device and supplies power to the light emitting diode. It is directly mounted on the lead electrode to be supplied.
[Patent Document 1]
JP-A-1-230274.
[0003]
[Problems to be solved by the invention]
However, since the conventional reflective illumination device does not particularly have a means for radiating the heat generated from the light emitting diodes to the outside, it has been difficult to make the illumination device capable of high-power irradiation.
[0004]
Therefore, an object of the present invention is to provide an illumination device capable of high-power irradiation using a light emitting diode.
[0005]
[Means for Solving the Problems]
In order to achieve the above object, an illuminating device according to the present invention includes a light source and a reflection unit that faces the light source and reflects the irradiated light, wherein the light source generates heat generated during lighting. It is mounted on a heat pipe that radiates heat directly or via a heat conductive substrate , the heat pipe is bent below the lighting device, and a mounting surface or a heat radiation unit on which the lighting device is mounted, a terminal Can be touched .
Moreover, the illuminating device according to the present invention is an illuminating device including a light source and a reflection unit that opposes the light source and reflects the irradiated light. The light source is a heat pipe that radiates heat generated during lighting. It is mounted directly or via a thermally conductive substrate and protrudes from the reflection surface of the reflection unit.
[0006]
If comprised in this way, it can be set as the illuminating device which can improve heat dissipation and can perform high output irradiation.
[0007]
The front Kinetsu transfer unit includes a light source mounting portion for mounting the light source, a support portion connected to the light source mounting portion, the thickness of the support portion is thinner than the light source placing portion Can
[0008]
If comprised in this way, it can suppress as much as possible that irradiation light is interrupted | blocked by the heat transfer unit which crosses the front of a reflection unit.
[0009]
The front Symbol light source, in height from each other in the heat transfer unit or heat conductive substrate can be placed on different mounting surfaces.
[0010]
If comprised in this way, the light extraction efficiency of an illuminating device can be improved.
[00011]
The end portion of the front Kinetsu transmission unit can be connected to the heat dissipation unit or terminal.
[0012]
If comprised in this way, since it can thermally radiate directly to a thermal radiation unit or a terminal via a heat transfer unit, the heat dissipation of an illuminating device can further be improved.
[00013]
The front Kinetsu transfer unit may comprise a conductive substrate.
[0014]
If comprised in this way, it can prevent that irradiated light is interrupted | blocked by the wiring cord etc. which supply electric power to a light source.
[00015]
Moreover, the said illuminating device can have a translucent member in the light irradiation direction.
[0016]
If comprised in this way, it can prevent that dust etc. adhere to the reflective surface of an illuminating device, and can maintain the reliability of an illuminating device.
[00017]
The front KiToruhikari member may have a lens shape.
[0018]
If comprised in this way, it can be set as the illuminating device which has a desired optical characteristic.
[00019]
The front Symbol light source may be a light emitting diode.
[0020]
If comprised in this way, the illuminating device which can perform high output irradiation using a light emitting diode can be formed.
[0021]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings. However, the embodiment described below exemplifies an illumination device for embodying the technical idea of the present invention, and the present invention does not limit the illumination device to the following. Further, the size and positional relationship of the members shown in the drawings are exaggerated for clarity of explanation.
[0022]
The illuminating device according to the present invention has a light source such as a light emitting diode, a light bulb, and a fluorescent lamp, and the light source is mounted directly or via a heat conductive substrate to transfer heat from the light source to a heat radiating unit or the like. The unit includes a reflection unit that is disposed to face the light source and has a reflection surface that irradiates light from the light source in the front direction of the illumination device. The light source is supplied with electric power from an external electrode through a conductive substrate, a conductive pattern, or the like disposed on the heat transfer unit. Moreover, the heat transfer unit is processed into a shape that does not block as much as possible the light emitted from the reflection unit in the front direction.
[0023]
Hereafter, each structure of embodiment of this invention is explained in full detail.
(light source)
The light source in the present embodiment is a light emitter such as a light emitting diode, a light bulb, or a fluorescent lamp. The light source in the present embodiment is mounted directly on the heat transfer unit or via a heat conductive substrate. When mounted via a thermally conductive substrate, for example, as shown in FIGS. 13 and 14, an LED chip 901 is mounted on a thermally conductive substrate 905 and is used for electrical connection with a light source. The conductive board 904 having the metal bumps 903 can be electrically connected. Note that the metal bumps 903 can be disposed below the conductive substrate 904 as shown in FIG. 13, or can be disposed above the conductive substrate 904 as shown in FIG. 10 to 12, when the light source is mounted on the heat transfer unit or the heat conductive substrate, it is preferable to provide an inclination with respect to the side wall surface in the side surface direction of the light source. By using the inclined surface, light from the light source can be reflected by the side wall, and light can be efficiently irradiated in the direction of the reflecting surface of the reflecting unit. Further, when a plurality of light sources are mounted as shown in FIGS. 11 and 12, a plurality of recesses or projections having a plurality of steps in a step shape are formed, and when the light sources are placed, light is emitted from adjacent light sources. The light source placement portion can be processed into a shape that does not obstruct.
(Heat transfer unit)
In this embodiment, a heat pipe that can be used as a heat transfer unit is, for example, a metal pipe made of a metal material such as copper or aluminum, for heat transport such as water, chlorofluorocarbon, alternative chlorofluorocarbon, and florinate. The hydraulic fluid is sealed, and the hydraulic fluid is heated at the heat input part (high temperature part) to become vapor, and the vapor moves to the heat radiating part (low temperature side) and liquefies to dissipate and liquefy. It is a heat transfer member that realizes extremely high thermal conductivity by repeating the operation of returning the hydraulic fluid to the heat input portion by capillary action.
[0024]
In the present embodiment, the shape of the heat transfer unit can be various shapes. In other words, the light source placement portion on which the light source is placed has a minimum size on which the light source can be placed so as not to block light reflected from the reflection unit in the front direction of the lighting device as much as possible. The support portion that is continuously connected to the light source placement portion and supports the light source placement portion can be processed as thin as possible than the light source placement portion. For example, as shown in FIG. 6, when the illumination device according to the present invention is viewed from above, the support portion 503 is thinner than the light source placement portion 502. Further, as shown in FIGS. 1 to 9, the heat transfer unit 302 can be bent and the end 105 of the heat transfer unit 302 can be connected to the heat dissipation unit 504 or the terminal 104. Here, the terminal 104 has a function of fixing the lighting device to a mounting surface such as a heat sink and radiating heat transmitted from the heat transfer unit 302 to the mounting surface side. Furthermore, as shown in FIG. 3 or FIG. 8, when the through hole is provided in the lowest part of the reflection surface of the reflection unit 103 and the heat transfer unit 802 protrudes from the bottom of the concave shape, It can be processed into a shape. By processing in this way, the contact area between the heat transfer unit and the heat dissipation unit can be increased and the heat dissipation effect can be improved. Moreover, when it is set as the structure which provides the board | substrate which provided the conductive pattern on the heat transfer unit, it can be set as the positional relationship which can take the connection of a conductive pattern and an external electrode easily.
(Heat dissipation unit)
The heat sink 504 that can be used as a heat dissipation unit in this embodiment has a function of radiating heat released from the light source through the heat transfer unit to the outside of the lighting device from the back surface of the lighting device.
[0025]
The heat sink 504 can be formed in various sizes in consideration of heat dissipation, light source output, and the like. That is, the higher the output of the light source, the larger the heat sink. The heat radiating unit is preferably connected to the end of the heat transfer unit and has good thermal conductivity in order to efficiently dissipate the heat released from the light source to the outside. Specific heat conductivity of such a heat dissipation unit, 0.01cal / (s) (cm 2) (℃ / cm) or more, more preferably ^{0.5cal / (s) (cm 2} ) (℃ / Cm) or more.
[0026]
As a material for the heat dissipation unit, a material obtained by subjecting the surface of copper, aluminum, or phosphor bronze plate to metal plating such as silver, palladium, silver, or gold, or solder plating, is preferably used. Such silver plating is preferable because the reflectance of the light emitted from the light source is increased and the light extraction efficiency of the lighting device is improved.
(Thermal conductive substrate)
The heat conductive substrate in the present embodiment can be mounted with a light source and has a function of transmitting heat generated from the light source to the heat transfer unit. The heat conductive substrate can be formed in various sizes in consideration of heat dissipation, light source output, and the like. The heat conductive substrate is preferably connected to a heat transfer unit and has good heat conductivity in order to efficiently dissipate heat released from the light source to the heat transfer unit side. Specific heat conductivity, preferably ^{0.01cal / (s) (cm 2} ) (℃ / cm) or higher, more preferably at ^{0.5cal / (s) (cm 2} ) (℃ / cm) or higher .
[0027]
As a material for such a heat conductive substrate, a material in which the surface of copper, aluminum or phosphor bronze plate is subjected to metal plating such as silver, palladium, silver or gold or solder plating is preferably used. Such silver plating is preferable because the reflectance of the light emitted from the light source is increased and the light extraction efficiency of the lighting device is improved.
[0028]
Moreover, it is possible to provide a conductive pattern for supplying power to the light source via an insulating member on the thermally conductive substrate.
(Reflection unit 103)
The reflection unit in the present embodiment is provided to face the light source, and has a reflection surface that reflects light emitted from the reflection unit in the front direction of the lighting device. Therefore, it is preferable that the reflecting surface of the reflecting unit that reflects the irradiated light is processed into a concave shape and the surface is subjected to metal plating such as silver plating. The light reflectance can be improved by applying silver plating.
(Conductive substrate)
The heat transfer unit can be provided with a conductive substrate provided with a conductive pattern for supplying power to the light source. The conductive substrate in the present embodiment is mounted so as to follow the surface of the heat transfer unit processed into various shapes. In addition, the size of the conductive substrate is the minimum that the conductive pattern can be arranged, and does not block the irradiation light, that is, when the illuminating device is viewed from the front, it is not affected by the heat transfer unit. So that the conductive substrate cannot be seen.
[0029]
In this embodiment, a conductive substrate is used. However, in another embodiment, power is supplied to the light source by directly printing a conductive pattern on the heat transfer unit via an insulating member. It can be.
[0030]
【Example】
Examples according to the present invention will be described in detail below. Needless to say, the present invention is not limited to the following examples.
Example 1
FIG. 1 is a perspective view of the lighting device according to the present embodiment, and FIG. 2 is a cross-sectional view of the lighting device according to the present embodiment.
[0031]
In the lighting device 101 according to the present embodiment, the heat pipe 102 on which the light emitting diode is mounted on the back surface is disposed so as to cross the front of the reflection unit 103, and the heat pipe 102 is bent so as to follow the outer wall of the lighting device. The end portion 105 is in a state in which it can come into contact with the mounting surface on which the present lighting device is mounted. A terminal 104 having a through-hole is provided at the bottom of the lighting device 101. The terminal 104 is used for fixing, and the heat pipe is directly connected to the end 104 of the heat pipe to connect the heat pipe. A function of radiating heat from 102 directly to the mounting surface can be provided. The reflection surface of the reflection unit 103 is processed into a concave shape with silver plating, and the curvature is adjusted so that the light from the light emitting diode is reflected and parallel light is obtained in the front direction of the illumination device 101. Yes.
[0032]
By adopting the configuration of this embodiment, heat dissipation is improved as compared with the prior art, and thus it is possible to form a lighting device capable of high power irradiation using a light emitting diode.
(Example 2)
FIG. 3 is a perspective view of the lighting device according to the present embodiment, and FIG. 4 is a cross-sectional view of the lighting device according to the present embodiment.
[0033]
In the illuminating device 301 according to the present embodiment, the end of the heat transfer unit 302 on the side where the light source is placed is projected from the bottom surface of the reflecting unit 103 having a concave curved surface. Further, the heat transfer unit 302 is bent in an S shape so that a part thereof follows the outer wall of the lighting device, and one end 105 of the heat transfer unit 302 is in contact with an external member such as a heat sink. . Further, when the conductive pattern is arranged on the surface of the heat transfer unit 302 by bending in an S shape in this way, the connection between the conductive pattern and the external electrode can be facilitated.
[0034]
With the configuration of this embodiment, it is possible to form a lighting device capable of high-power irradiation using a light emitting diode. In addition, the area where light is blocked by the heat pipe can be made smaller than in the case of the first embodiment.
(Example 3)
5, 6 and 7 show a perspective view, a top view and a cross-sectional view of the lighting apparatus according to the present embodiment.
[0035]
In the illumination device 501 according to the present embodiment, the heat pipe 102 includes a light source mounting part 502 that mounts a light emitting diode on the back surface, and a support part 503 that is continuously provided on the light source mounting part 502. The thickness of the support portion 503 is processed to be thinner than that of the light source placement portion 502. When processed in this way, the light emitted from the reflection surface of the reflection unit 103 increases in the front direction of the lighting device without being shaded by the heat pipe. It is possible to improve. Moreover, the illuminating device 501 concerning a present Example has the heat sink 504 as a thermal radiation unit below the illuminating device, and the edge part 105 of the heat pipe is connected to the heat sink 504. Thus, it is possible to further improve the heat dissipation of the lighting device by connecting the heat transfer unit to the heat dissipation unit.
[0036]
With the configuration of this embodiment, it is possible to form a lighting device capable of high-power irradiation using a light emitting diode.
(Example 4)
FIG. 8 is a perspective view of the lighting device according to the present embodiment, and FIG. 9 is a cross-sectional view of the lighting device according to the present embodiment.
[0037]
In the illumination device 801 according to the present embodiment, the heat pipe 802 is projected from the bottom of the reflection surface of the reflection unit 103 having a concave curved surface. As shown in FIG. 9, the heat pipe 802 is bent into an L shape and connected to a heat sink 504 attached below the lighting device 801. By adopting such a shape of the heat pipe 802, it is possible to increase the contact area between the heat pipe 802 and the heat sink 504 and further improve the heat dissipation.
[0038]
With the configuration of this embodiment, it is possible to form a lighting device capable of high-power irradiation using a light emitting diode. Further, the area that blocks the light reflected on the reflecting surface can be made smaller than in the case of the third embodiment.
(Example 5)
FIG. 10 shows the shape of the portion where the light source is mounted in the illumination device according to this example. The LED chip 901 used as a light source is placed on the bottom surface of a recess provided in the light pipe placement portion 902 of the heat pipe or the heat conductive substrate, and is opposed to the reflection surface of the reflection unit. Further, the inner wall surface of the recess is processed into a shape in which the inner diameter increases in the opening direction, and is subjected to silver plating. A lighting device was formed in the same manner as in the other examples except that the shape of the light source mounting portion 902 on which the LED chip 901 was mounted was processed as shown in FIG.
[0039]
By adopting the configuration of this embodiment, it is possible to improve the light extraction efficiency and form a lighting device capable of high power irradiation using a light emitting diode.
(Example 6)
FIG. 11 shows a shape in the case where a plurality of LED chips are mounted on a heat pipe or a heat conductive substrate in the lighting apparatus according to the present embodiment. A stepped concave portion having a plurality of steps is formed on the surface of the heat transfer unit on which the LED chip 901 is placed or the light source placement portion 902 of the heat conductive substrate, and the LED chips adjacent to the emitted light are adjacent to each other. Avoid shadows from each other. The side surfaces of the recesses are inclined surfaces that are angled so that light emitted from the LED chip side surfaces is reflected in the direction of the reflection unit, and silver plating with high reflectivity is applied to the surface of the recesses. In the present embodiment, the LED chip placed at the center portion has a shape located deeper. Except for processing the shape of the mounting surface of the LED chip as shown in FIG. 11, the light extraction efficiency was improved, and an illumination device was formed in the same manner as in the other examples.
[0040]
With the configuration of this embodiment, it is possible to form a lighting device capable of high-power irradiation using a light emitting diode.
(Example 7)
FIG. 12 shows a shape in the case where a plurality of LED chips are mounted on a heat pipe or a heat conductive substrate in the lighting apparatus according to the present embodiment. In the present embodiment, a stepped step is provided so that the LED chip 901 mounted at the center portion is mounted at a higher position from the mounting surface. Except for processing the shape of the mounting surface of the LED chip 901 as shown in FIG. 12, an illumination device was formed in the same manner as in the other examples.
[0041]
With the configuration of this embodiment, it is possible to form a lighting device capable of high-power irradiation using a light emitting diode.
(Example 8)
FIG. 15 shows a state in which the conductive substrate 904 is mounted on the heat pipe 102 in the lighting apparatus according to the present embodiment. The conductive substrate 904 according to the present embodiment is formed by pattern-printing a conductive material on an insulating substrate via an insulating member, and is processed into a shape that follows the surface of the heat pipe 102. The size of the conductive substrate 904 is the minimum that can arrange the conductive pattern and does not block the irradiation light, that is, the shadow of the heat transfer unit 102 when the illumination device is viewed from the front. So that the conductive substrate 904 cannot be seen. The end portion of the conductive substrate 904 is bent into a shape that can be easily electrically connected to the external electrode. The surface of the conductive substrate 904 is preferably silver-plated. In this way, light from the LED chip 901 can be reflected on the surface of the conductive substrate 904 in the direction of the reflection unit.
[0042]
By mounting the conductive substrate as in this embodiment on the heat transfer unit, it is possible to supply power to the light source without using a wiring cord or the like that blocks the irradiation light.
Example 9
FIG. 16: shows the typical perspective view which arrange | positions the translucent member 906 in the light irradiation direction of the illuminating device concerning this invention. The translucent member 906 is formed in accordance with the shape or size of the lighting device 101 by injection molding using a thermosetting resin or the like as a material. By changing the shape of the molding die, the light condensing property of the lighting device is increased. A lens shape can be provided in the front direction for the purpose of improvement.
[0043]
By disposing such a translucent member 906, a lighting device having a dustproof effect on the reflection surface of the reflection unit 103 can be obtained. Furthermore, it can be set as the illuminating device which has a desired optical characteristic.
[0044]
【The invention's effect】
According to the present invention, it is possible to form a lighting device capable of high-power irradiation using a light emitting diode by using a reflective lighting device including a heat transfer unit.
[0045]
[Brief description of the drawings]
FIG. 1 is a schematic perspective view showing an embodiment of an illuminating device according to the present invention.
FIG. 2 is a schematic cross-sectional view showing an embodiment of a lighting device according to the present invention.
FIG. 3 is a schematic perspective view showing an embodiment of a lighting device according to the present invention.
FIG. 4 is a schematic cross-sectional view showing an embodiment of an illuminating device according to the present invention.
FIG. 5 is a schematic perspective view showing an embodiment of a lighting device according to the present invention.
FIG. 6 is a schematic top view showing an embodiment of a lighting device according to the present invention.
FIG. 7 is a schematic cross-sectional view showing an embodiment of an illuminating device according to the present invention.
FIG. 8 is a schematic perspective view showing an embodiment of a lighting device according to the present invention.
FIG. 9 is a schematic cross-sectional view showing an embodiment of a lighting device according to the present invention.
FIG. 10 is a schematic perspective view showing an embodiment of a light source mounting portion of the illumination device according to the present invention.
FIG. 11 is a schematic perspective view showing an embodiment of a light source mounting portion of the illumination device according to the present invention.
FIG. 12 is a schematic perspective view showing an embodiment of a light source mounting portion of the illumination device according to the present invention.
FIG. 13 is a schematic perspective view showing an example of the vicinity of the light source mounting portion of the illumination apparatus according to the present invention.
FIG. 14 is a schematic perspective view showing an embodiment around the light source mounting portion of the illumination device according to the present invention.
FIG. 15 is a schematic perspective view showing an embodiment of a heat transfer unit including a conductive substrate according to the present invention.
FIG. 16 is a schematic perspective view showing an embodiment of a lighting device according to the present invention.
[Explanation of symbols]
101, 301, 501, 801 ... Illumination devices 102, 302, 802 ... Heat pipe 103 ... Reflection unit 104 ... Terminal 105 ... Heat pipe end 502, 902 ... Light source mounted Placement part 503 ... Supporting part 901 ... LED chip 903 ... Metal bump 904 ... Conductive substrate 905 ... Thermal conductive substrate 906 ... Translucent member

Claims (6)

In an illuminating device comprising a light source and a reflection unit that faces the light source and reflects the irradiated light,
The light source is mounted directly or via a heat conductive substrate on a heat pipe that dissipates heat generated during lighting ,
The said heat pipe is bent below the said illuminating device, It is a state which can be in contact with the mounting surface in which the said illuminating device is mounted, a thermal radiation unit, and a terminal .   In an illuminating device comprising a light source and a reflection unit that faces the light source and reflects the irradiated light,
  The illuminating device, wherein the light source is mounted directly or via a heat conductive substrate on a heat pipe that dissipates heat generated during lighting, and protrudes from a reflection surface of the reflection unit.   The lighting device according to claim 2, wherein the heat pipe is in a state in which the heat pipe is in contact with a mounting surface, a heat dissipation unit, or a terminal on which the lighting device is mounted. The lighting device according to claim 1, wherein the heat pipe is a metal tube in which a working fluid is sealed. The heat pipe has a light source placement part for mounting the light source, and a support part connected to the light source placement part,
The lighting device according to claim 1, wherein a thickness of the support portion is thinner than that of the light source placement portion.   The lighting device according to claim 1, wherein the light sources are mounted on mounting surfaces having different heights on the heat pipe or the heat conductive substrate.

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