CN211297517U

CN211297517U - Heat radiation structure

Info

Publication number: CN211297517U
Application number: CN202020071953.8U
Authority: CN
Inventors: 王捷
Original assignee: Shenzhen Ezpro Electro Optic Technology Co ltd
Current assignee: Shenzhen Ezpro Electro Optic Technology Co ltd
Priority date: 2020-01-14
Filing date: 2020-01-14
Publication date: 2020-08-18
Anticipated expiration: 2030-01-14

Abstract

The utility model discloses a heat radiation structure, include the casing and locate circuit board in the casing, the casing with still be equipped with at least one heat conductor of making by heat conduction macromolecular material between the circuit board, the heat conductor hug closely respectively in the internal surface of casing with the circuit board. The utility model discloses an adopt the heat conductor of being made by heat conduction macromolecular material as heat radiation material, install between electronic device and casing, when electronic device installs to the casing on, this heat conductor can be fixed in between electronic device and the casing to with electronic device and casing in close contact with, can directly conduct the heat of electronic device to the casing, and spread the heat in the environment through the casing. The heat dissipation structure is simple to install, does not need to customize, process and manufacture a radiator, does not need to use a metal heat conductor, can reduce resource consumption, is energy-saving and environment-friendly, is low in cost, and is suitable for various electronic equipment with medium and small power dissipation.

Description

Heat radiation structure

Technical Field

The utility model relates to an electron device field especially relates to a heat radiation structure.

Background

In order to ensure the working reliability of the electronic device and prolong the service life of the electronic device, a heat dissipation device is necessary to be added to a part of transistors with large power consumption, integrated circuits, electronic device combined modules and the like, a heat transfer channel with low thermal resistance is provided, the heat generated by the devices in a centralized manner is transferred and dispersed to a working environment, and the temperature rise of the electronic device body is reduced.

The conventional heat dissipation device is generally made of a metal heat conductor material, and is attached to an electronic device in use, and the heat dissipation device attached to the electronic device conducts or radiates heat to a working environment through air convection, and a heat dissipation fan is also used for forcing the air convection to rapidly disperse the heat to the environment. In order to meet the requirements of devices with different specifications and heat dissipation capacity, metal heat conductor materials need to be customized and processed into heat dissipation devices with various shapes so as to be convenient to mount, fixed space and mechanisms need to be reserved on a circuit board or a structure so as to ensure that the heat dissipation devices can be stably mounted, and the tight contact surfaces of a heat radiator and an electronic device need to be flat and smooth so that heat conduction resistance can be reduced and heat conduction can be carried out sufficiently. The existing heat dissipation structure is relatively complex or large in size, high in manufacturing cost and not suitable for electronic equipment with medium and small power dissipation.

SUMMERY OF THE UTILITY MODEL

The to-be-solved technical problem of the utility model lies in, to prior art's defect, a heat radiation structure of electronic equipment who is fit for medium and small power dissipation is provided.

The utility model provides a technical scheme that its technical problem adopted is:

a heat dissipation structure comprises a machine shell and a circuit board arranged in the machine shell, wherein at least two heat conductors made of heat-conducting high polymer materials are arranged between the machine shell and the circuit board, each heat conductor comprises a first heat conductor and a second heat conductor which are vertically arranged, and the first heat conductor and the second heat conductor are connected to the inner surface of the machine shell through heat-conducting glue and tightly attached to the circuit board.

Preferably, the casing comprises a bottom cover and a top cover which are detachably connected, and the first heat conductor is arranged between the circuit board and the bottom cover and clings to the surface of the circuit board facing to one side of the bottom cover and the inner surface of the bottom cover respectively; the second heat conductor is arranged between the circuit board and the top cover, and the second heat conductor is respectively clung to the surface of the circuit board facing to one side of the top cover and the inner surface of the top cover.

Preferably, the circuit board is further provided with an electronic component electrically connected with the circuit board, and the second heat conductor is arranged between the electronic component and the top cover.

Preferably, the first heat conductor and the second heat conductor are respectively positioned on the bottom cover and the top cover through positioning components and are respectively fixedly connected with the bottom cover and the top cover through heat conducting glue.

Preferably, grid-shaped folds for increasing the heat dissipation area are arranged on one side of the first heat conductor connected with the bottom cover and one side of the second heat conductor connected with the top cover.

Preferably, the positioning assembly includes a first positioning member for positioning the first heat conductor and the bottom cover, and a second positioning member for positioning the second heat conductor and the top cover;

the first positioning piece comprises a first guide pillar arranged on the bottom cover and a first guide groove correspondingly arranged on the first heat conductor; the second positioning piece comprises a second guide pillar arranged on the top cover and a second guide groove correspondingly arranged on the second heat conductor, and the second positioning piece further comprises a clamping groove arranged on the top cover.

Preferably, the bottom cover and the top cover are respectively provided with at least two opposite side walls, heat dissipation holes for dissipating heat are further formed in the side walls, the bottom cover and the top cover are buckled to form a hollow casing with the periphery closed, and the circuit board is detachably connected with the casing.

Preferably, the bottom cover and the top cover are connected into a whole through detachable connecting structures such as bolt connection, pin connection and buckle connection.

Preferably, the heat conductor is a heat-resistant silica gel heat conductor.

Preferably, the casing is an aluminum alloy casing, a titanium alloy casing or other metal casing.

The utility model discloses following beneficial effect has: the heat conductor made of the heat-conducting high polymer material is used as a heat dissipation material and is arranged between the electronic device and the shell, when the electronic device is arranged on the shell, the heat conductor can be fixed between the electronic device and the shell and is in close contact with the electronic device and the shell, the heat of the electronic device can be directly conducted to the shell, and the heat is dispersed to the environment through the shell. The heat dissipation structure is simple to install, does not need to customize, process and manufacture a radiator, does not need to use a metal heat conductor, can reduce resource consumption, is energy-saving and environment-friendly, is low in cost, and is suitable for various electronic equipment with medium and small power dissipation.

Drawings

The invention will be further explained with reference to the drawings and examples, wherein:

fig. 1 is an exploded view of a forward structure of an embodiment of the present invention;

fig. 2 is a schematic cross-sectional view of an embodiment of the present invention;

fig. 3 is an exploded view of a reversing structure according to an embodiment of the present invention.

Detailed Description

In order to clearly understand the technical features, objects, and effects of the present invention, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

The utility model provides a heat radiation structure for in the electronic equipment of medium and small power dissipation, as shown in fig. 1, this heat radiation structure includes casing 1 and locates circuit board 2 in the casing 1, still be equipped with two at least heat conductors 3 of being made by heat conduction macromolecular material between casing 1 and the circuit board 2, heat conductor 3 is including the first heat conductor 31 and the second heat conductor 32 of arranging from top to bottom, first heat conductor 31 and second heat conductor 32 all connect in the internal surface of casing 1 through the thermal conductive adhesive, and hug closely in circuit board 2. In some embodiments, the thermal conductor 3 is preferably a thermally conductive silicone.

The casing 1 is a metal casing, and includes a bottom cover 11 and a top cover 12 that are detachably connected, and in some embodiments, the metal casing is preferably an aluminum alloy or titanium alloy casing with good heat dissipation performance. The bottom cover 11 and the top cover 12 are respectively provided with at least two opposite side walls, in some embodiments, the bottom cover 11 and the top cover 12 are preferably rectangular with the same shape, wherein the bottom cover 11 is provided with a first side wall extending upwards on a short side of the rectangle, the top cover 12 is provided with a second side wall extending downwards on a long side of the rectangle, wherein the first side wall and the second side wall have the same height, and when the bottom cover 11 and the top cover 12 are buckled, the first side wall and the second side wall respectively abut against the top cover 12 and the bottom cover 11 to form a hollow casing with a closed periphery. Wherein, the surface of second lateral wall still is equipped with a plurality of unevenness's bars form fold for the heat radiating area of this metal casing of increase plays increase frictional force, skid-proof effect when taking this casing 1 simultaneously. In some embodiments, the first sidewall is further provided with heat dissipation holes for dissipating heat, and the shape and size of the heat dissipation holes are different, i.e. any change of the shape and size of the heat dissipation holes can be considered as being within the protection scope of the present invention. The bottom cover 11 and the top cover 12 are detachable connection structures, including bolt connection, snap connection, pin connection, and the like, and in some embodiments, preferably, the bolt connection is performed, a boss for mounting a screw is protruded on the second side wall, and the bottom cover 11 is provided with a screw hole corresponding to the position of the boss.

The circuit board 2 is provided with an electronic component 21 electrically connected to the circuit board 2, and in some embodiments, an electronic component with small power dissipation, such as an SOC chip, is preferable. The circuit board 2 is further provided with a plurality of connection holes, preferably threaded holes, for fixing the circuit board 2 in the housing 1. In some embodiments, the circuit board is further provided with a slot for avoiding the boss on the second side wall.

The heat conductor 3 transfers heat generated from the circuit board 2 to the case 1 by being in close contact with the circuit board 2 and the case 1, and dissipates the heat through the case 1. The heat conductor 3 comprises a first heat conductor 31 arranged between the circuit board 2 and the bottom cover 11, and a second heat conductor 32 arranged between the circuit board 2 and the top cover 12. The first heat conductor 31 is closely attached to the surface of the circuit board 2 facing the bottom cover 11 and the inner surface of the bottom cover 11, respectively, and has a thickness equal to or slightly greater than the distance between the circuit board 2 and the bottom cover 11, so as to ensure that two sides of the first heat conductor 31 can be in close contact with the circuit board 2 and the bottom cover 11 when the first heat conductor 31 is placed between the circuit board 2 and the bottom cover 11; the second thermal conductor 32 is closely attached to the surface of the circuit board 2 facing the top cover 12 and the inner surface of the top cover 12, and in some embodiments, the second thermal conductor 32 is directly disposed on the electronic component 21 to better conduct the heat generated by the electronic component 21, and the second thermal conductor 32 is closely attached to the electronic component 21 and the inner surface of the top cover 12, and the thickness of the second thermal conductor 32 is equal to or slightly greater than the distance between the electronic component 21 and the top cover 12, so that when the second thermal conductor 32 is disposed between the electronic component 21 and the top cover 12, two sides of the second thermal conductor 32 can be closely contacted with the electronic component 21 and the top cover 12, respectively. The first heat conductor 31 and the second heat conductor 32 may be square heat-conducting silica gel pads, or circular or other heat-conducting silica gel. In some embodiments, the first heat conductor 31 and the second heat conductor 32 are both composed of one heat conductive silicone, and in other embodiments, the first heat conductor 31 and the second heat conductor 32 may both be composed of a plurality of heat conductive silicone laminated together, and the plurality of heat conductive silicone is preferably bonded together by the heat conductive silicone.

As shown in fig. 2 to 3, the first thermal conductor 31 and the second thermal conductor 32 are respectively positioned on the bottom cover 11 and the top cover 12 by the positioning component 4, and are fixedly connected with the bottom cover 11 and the top cover 12 by the thermal conductive adhesive. The positioning assembly 4 includes a first positioning member 41 for positioning the first heat conductor 31 and the bottom cover 11, and a second positioning member 42 for positioning the second heat conductor 32 and the top cover 12; wherein, the heat-conducting glue is preferably heat-conducting silicone grease.

In some embodiments, the first positioning element 41 includes a first guide post 411 disposed on the bottom cover 11 and a first guide slot 412 correspondingly disposed on the first heat conductor 31, and the first heat conductor 31 is inserted into the inner surface of the bottom cover 11 by the cooperation of the first guide slot 412 and the first guide post 411; the second positioning element 42 includes a second guide pillar 421 disposed on the top cover 12 and a second guide groove 422 correspondingly disposed on the second heat conductor 32, and the second heat conductor 32 is inserted into the inner surface of the top cover 12 through the cooperation of the second guide groove 422 and the second guide pillar 421; in some embodiments, the second positioning element 42 further includes a clamping groove 423 disposed on the top cover 12, the clamping groove 423 is formed by enclosing a plurality of bosses, and an inner diameter of the clamping groove 423 is the same as a size of the second heat conductor 32, so that the second heat conductor 32 can be clamped in the clamping groove 423, and the heat conducting glue can also be coated in the clamping groove 423, thereby facilitating adhesion with the second heat conductor 32.

In some embodiments, the surface of the first heat conductor 31 contacting the bottom cover 11 and the surface of the second heat conductor 32 contacting the top cover 12 are both provided with rugged grid-shaped folds for increasing the heat dissipation area thereof, and meanwhile, the grid-shaped folds can increase the contact area between the heat conductor 3 and the heat conductive adhesive, so that the bonding is firmer and is not easy to fall off.

The utility model discloses a both sides all set up the structure of heat conductor 3 about circuit board 2, strengthen the heat-sinking capability of this structure, this heat radiation structure easily assembles, with low costs, is particularly useful for the electronic equipment of well miniwatt dissipation simultaneously.

The above examples only represent some embodiments of the present invention, and the description thereof is more specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. The heat dissipation structure comprises a machine shell (1) and a circuit board (2) arranged in the machine shell, and is characterized in that at least two heat conductors (3) made of heat-conducting high polymer materials are further arranged between the machine shell (1) and the circuit board (2), each heat conductor (3) comprises a first heat conductor (31) and a second heat conductor (32) which are vertically arranged, and the first heat conductors (31) and the second heat conductors (32) are connected to the inner surface of the machine shell (1) through heat-conducting glue and tightly attached to the circuit board (2).

2. The heat dissipation structure of claim 1, wherein the housing (1) comprises a bottom cover (11) and a top cover (12) which are detachably connected, the first heat conductor (31) is disposed between the circuit board (2) and the bottom cover (11), and the first heat conductor (31) is closely attached to a surface of the circuit board (2) facing the bottom cover (11) and an inner surface of the bottom cover (11), respectively; the second heat conductor (32) is arranged between the circuit board (2) and the top cover (12), and the second heat conductor (32) is respectively tightly attached to the surface of one side, facing the top cover (12), of the circuit board (2) and the inner surface of the top cover (12).

3. The heat dissipation structure of claim 2, wherein the circuit board (2) is further provided with an electronic component (21) electrically connected to the circuit board (2), and the second heat conductor (32) is provided between the electronic component (21) and the top cover (12).

4. The heat dissipation structure according to claim 2, wherein the first heat conductor (31) and the second heat conductor (32) are positioned on the bottom cover (11) and the top cover (12), respectively, by a positioning assembly (4), and are fixedly connected to the bottom cover (11) and the top cover (12), respectively, by a thermally conductive adhesive.

5. The heat dissipation structure according to claim 2, wherein a side of the first heat conductor (31) connected to the bottom cover (11) and a side of the second heat conductor (32) connected to the top cover (12) are each provided with a grid-like corrugation for increasing a heat dissipation area.

6. The heat dissipation structure according to claim 4, wherein the positioning assembly (4) includes a first positioning member (41) for positioning the first heat conductor (31) and the bottom cover (11), and a second positioning member (42) for positioning the second heat conductor (32) and the top cover (12);

the first positioning piece (41) comprises a first guide pillar (411) arranged on the bottom cover (11) and a first guide groove (412) correspondingly arranged on the first heat conductor (31); the second positioning part (42) comprises a second guide post (421) arranged on the top cover (12) and a second guide groove (422) correspondingly arranged on the second heat conductor, and the second positioning part (42) further comprises a clamping groove (423) arranged on the top cover (12).

7. The heat dissipation structure of claim 2, wherein the bottom cover (11) and the top cover (12) are respectively provided with at least two opposite side walls, the side walls are further provided with heat dissipation holes for dissipating heat, the bottom cover (11) and the top cover (12) are fastened to form a hollow enclosure with a closed periphery, and the circuit board (2) is detachably connected with the enclosure (1).

8. The heat dissipating structure of claim 2, wherein the bottom cover (11) and the top cover (12) are integrally connected by a detachable connection structure such as a bolt connection, a pin connection, a snap connection, etc.

9. The heat dissipation structure according to claim 1, wherein the heat conductor (3) is a heat-resistant silicone heat conductor.

10. The heat dissipation structure of claim 1, wherein the case (1) is an aluminum alloy case, a titanium alloy case.