CN216057989U

CN216057989U - Heat dissipation type power adapter

Info

Publication number: CN216057989U
Application number: CN202121751227.1U
Authority: CN
Inventors: 杨道兵
Original assignee: Huizhou Luhe Industrial Co ltd
Current assignee: Huizhou Luhe Industrial Co ltd
Priority date: 2021-07-29
Filing date: 2021-07-29
Publication date: 2022-03-15
Anticipated expiration: 2031-07-29

Abstract

The utility model belongs to the technical field of power adapters, and particularly relates to a heat dissipation type power adapter which comprises a shell and a circuit main board, wherein the circuit main board is arranged in the shell, and the shell comprises an upper shell and a lower shell; the upper shell and the lower shell are detachably connected; the upper shell is provided with an upper mounting cavity with a downward opening, the lower shell is provided with a lower mounting cavity with an upward opening, and the circuit main board is detachably connected with the lower shell through the heat conduction column; the bottom of the circuit mainboard is provided with a heat dissipation assembly; the lower shell is provided with a position avoiding groove for the heat dissipation assembly to penetrate through so that the heat dissipation assembly is contacted with the outside air; wherein, the heat generated by the circuit main board is transferred to the outside air through the heat dissipation component. Therefore, the heat dissipation performance is greatly improved, and the service life of the power adapter is prolonged.

Description

Heat dissipation type power adapter

Technical Field

The utility model belongs to the technical field of power adapters, and particularly relates to a heat dissipation type power adapter.

Background

The power adapter is a power supply conversion device of small-sized portable electronic equipment and electronic appliances, generally comprises components such as a shell, a transformer, an inductor, a capacitor, a control IC (integrated circuit), a PCB (printed circuit board) and the like, has the working principle that alternating current input is converted into direct current output, can be divided into a wall-plugging type and a desktop type according to a connection mode, and is widely matched with equipment such as a security camera, a set top box, a router, a light bar, a massager and the like. The power adapter is easy to generate heat after being used for a long time, and if the heat is not dissipated in time, the service life of the power adapter is influenced. However, most of the existing power adapters adopt an integral closed structure, so that heat is accumulated in the power adapter, and the service life of the power adapter is greatly reduced.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a heat dissipation type power adapter, and aims to solve the technical problem that the heat dissipation performance of the power adapter in the prior art is poor.

In order to achieve the above object, an embodiment of the present invention provides a heat dissipation type power adapter, which includes a housing and a circuit board, where the circuit board is installed in the housing, and the housing includes an upper housing and a lower housing; the upper shell and the lower shell are detachably connected; the upper shell is provided with an upper mounting cavity with a downward opening, the lower shell is provided with a lower mounting cavity with an upward opening, and the circuit main board is detachably connected with the lower shell through a heat conduction column; the bottom of the circuit main board is provided with a heat dissipation assembly; the lower shell is provided with a position avoiding groove for the heat dissipation assembly to penetrate through so that the heat dissipation assembly is contacted with the outside air; wherein the heat generated by the circuit main board is transferred to the outside air through the heat dissipation assembly.

Optionally, the heat dissipation assembly includes a heat dissipation main body and a plurality of heat dissipation plates; the heat dissipation main body is arranged at the bottom of the circuit main board; the plurality of heat dissipation plates are fixedly arranged at the bottom of the heat dissipation main body and are arranged at intervals along a preset direction; and the plurality of heat dissipation plates are completely positioned outside the lower shell.

Optionally, the heat dissipation assembly further comprises a heat conductive silicone sheet; the top of heat dissipation main part has seted up the mounting groove, heat conduction silica gel piece sets up in the mounting groove.

Optionally, the top surface of the heat conducting silica gel sheet is 0.1mm to 0.3mm higher than the top surface of the heat dissipation main body.

Optionally, the upper housing and/or the lower housing are provided with a plurality of heat dissipation holes.

Optionally, an air cooling assembly is arranged in the lower shell; the air cooling assembly comprises a fan and a driving motor; the driving motor is arranged on the lower shell through a mounting seat; the driving motor is provided with a rotatable output shaft, and the output shaft of the driving motor is fixedly connected with the fan; the driving motor is electrically connected with the circuit main board.

Optionally, a positioning protrusion is fixedly disposed at the top of the lower casing, and a positioning groove used in cooperation with the positioning protrusion is disposed at the bottom of the upper casing.

Optionally, a plurality of reinforcing ribs are fixedly arranged on the inner wall surfaces of the upper shell and the lower shell.

Optionally, a hanging portion is provided on the upper casing or the lower casing, so that the heat dissipation type power adapter is hung on other external objects.

Optionally, the bottom of the lower housing is provided with at least two suckers, and the two suckers are symmetrically arranged, so that the heat dissipation type power adapter is adsorbed on the surface of other foreign objects.

One or more technical solutions in the heat dissipation type power adapter provided by the embodiment of the present invention have at least one of the following technical effects: the heat conduction post is provided with four, and is the rectangle and arranges, and circuit board installs the lower installation intracavity of casing under through four heat conduction posts, and four heat conduction posts all are located the bottom of this circuit board. One end of the heat dissipation assembly is installed at the bottom of the circuit main board to absorb heat, and the other end of the heat dissipation assembly protrudes out of the lower shell to be in contact with the outside air so as to dissipate the absorbed heat. When the heat dissipation assembly is used, the circuit main board works and generates heat, and at the moment, part of the heat is transferred to the heat dissipation assembly and finally transferred to the outside air. In addition, the heat generated by the circuit main board can be transferred to the lower shell through the heat conducting columns and exchanges heat with the external air. Therefore, the heat dissipation performance is greatly improved, and the service life of the power adapter is prolonged.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.

Fig. 1 is an exploded view of a heat dissipation type power adapter according to an embodiment of the present invention.

Fig. 2 is a schematic structural diagram of a heat dissipation type power adapter according to an embodiment of the present invention.

Fig. 3 is a schematic structural diagram of a heat dissipation assembly according to an embodiment of the present invention.

Fig. 4 is a bottom view of the housing according to the embodiment of the present invention.

Wherein, in the figures, the respective reference numerals:

10-shell 20-circuit mainboard 30-radiating component

11-upper shell 12-lower shell 13-radiating hole

14-reinforcing rib 15-hanging part 121-avoiding groove

122-fan 123-driving motor 124-mounting seat

125-suction cup 151-hook 152-connecting part

31-radiating main body 32-radiating plate 33-heat conducting silica gel sheet

40-heat conduction column.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be illustrative of the embodiments of the present invention, and should not be construed as limiting the utility model.

In the description of the embodiments of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the embodiments of the present invention and simplifying the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of the present invention, "a plurality" means two or more unless specifically limited otherwise.

In the embodiments of the present invention, unless otherwise explicitly specified or limited, the terms "mounted," "connected," "fixed," and the like are to be construed broadly, e.g., as being fixedly connected, detachably connected, or integrated; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. Specific meanings of the above terms in the embodiments of the present invention can be understood by those of ordinary skill in the art according to specific situations.

In an embodiment of the present invention, as shown in fig. 1, there is provided a heat dissipation type power adapter, including a housing 10 and a circuit board 20, where the circuit board 20 is installed in the housing 10, and the housing 10 includes an upper housing 11 and a lower housing 12; the upper shell 11 and the lower shell 12 are detachably connected; the upper shell 11 is provided with an upper mounting cavity with a downward opening, the lower shell 12 is provided with a lower mounting cavity with an upward opening, and the circuit main board 20 is detachably connected with the lower shell 12 through a heat conduction column 40; the bottom of the circuit main board 20 is provided with a heat dissipation assembly 30; the lower casing 12 is provided with a position-avoiding groove 121 for the heat dissipation assembly 30 to penetrate through, so that the heat dissipation assembly 30 contacts with the outside air; wherein the heat generated from the circuit board 20 is transferred to the outside air through the heat sink assembly 30.

Specifically, the circuit board 20 of the heat dissipation type power adapter of the present invention is provided with a plurality of electrical components, the upper housing 11 is provided with an upper socket card slot and an upper wiring card slot, and correspondingly, the lower housing 12 is provided with a lower socket card slot and a lower wiring card slot. The upper socket clamping groove and the lower socket clamping groove are clamped with a socket together, and the socket is used for inserting an input line. The upper wiring clamping groove and the lower wiring clamping groove clamp an output line together. The socket and the output line are electrically connected to the circuit board 20. The heat conduction posts 40 are provided with four and arranged in a rectangular shape, the circuit board 20 is installed in the lower installation cavity of the lower shell 12 through the four heat conduction posts 40, and the four heat conduction posts 40 are all located at the bottom of the circuit board 20. One end of the heat sink 30 is mounted on the bottom of the circuit board 20 to absorb heat, and the other end thereof protrudes out of the lower case 12 to contact with the outside air to dissipate the absorbed heat. The upper case 11 and the lower case 12 are assembled to form a case 10 to house the circuit board 20. In use, the circuit board 20 operates and generates heat, at which time a portion of the heat is transferred to the heat sink assembly 30 and ultimately to the ambient air. In addition, heat generated from the circuit board 20 is transferred to the lower case 12 through the heat conductive posts 40 and exchanges heat with the external air. Therefore, the heat dissipation performance is greatly improved, and the service life of the power adapter is prolonged.

In another embodiment of the present invention, as shown in fig. 3, the heat dissipation assembly 30 includes a heat dissipation body 31 and a plurality of heat dissipation plates 32; the heat dissipation main body 31 is mounted at the bottom of the circuit main board 20; the plurality of heat dissipation plates 32 are fixedly arranged at the bottom of the heat dissipation body 31 and are arranged at intervals along a predetermined direction; a plurality of the heat dissipation plates 32 are entirely located outside the lower case 12.

Specifically, heat dissipation main part 31 and heating panel 32 all adopt the higher and comparatively cheap aluminium metal of coefficient of heat conductivity to make, and a plurality of heating panels 32 are arranged along the width direction of heat dissipation main part 31 equidistance, just heating panel 32 all is located the outside of casing 12 down, so, have increased the area of contact of heating panel 32 with the air to the radiating efficiency has been improved. When in use, heat is sequentially transferred to the heat dissipation body 31 and the plurality of heat dissipation plates 32, and exchanges heat with the external air, thereby realizing heat dissipation.

In another embodiment of the present invention, as shown in fig. 3, the heat dissipation assembly 30 further includes a heat conductive silicone sheet 33; an installation groove is formed in the top of the heat dissipation main body 31, and the heat conduction silica gel sheet 33 is arranged in the installation groove. Specifically, the bottom of the circuit board 20 is uneven, and when the heat dissipation body 31 is directly mounted on the bottom of the circuit board 20, a gap is generated between the two, so that the efficiency of heat transfer is reduced, and the heat dissipation performance is reduced. A layer of heat conductive silicone sheet 33 is disposed between the heat dissipating body 31 and the circuit board 20 to fill the gap therebetween. Thus, the heat dissipation performance is greatly improved.

Further, the top surface of the heat conducting silica gel sheet 33 is 0.1mm to 0.3mm higher than the top surface of the heat dissipating main body 31. The heat-conducting silica gel sheet 33 is soft and has good compression performance. The heat dissipation main body 31 presses against the heat-conducting silicone sheet 33 and is detachably connected with the circuit main board 20, so that the upper end face and the lower end face of the heat-conducting silicone sheet 33 are respectively in close contact with the circuit main board 20 and the heat dissipation main body 31, and heat transfer is facilitated.

In another embodiment of the present invention, as shown in fig. 1, a plurality of heat dissipation holes 13 are formed on the upper housing 11 and/or the lower housing 12. Specifically, in this embodiment, heat dissipation holes 13 have been all seted up on upper housing 11 and lower housing 12, and the upper mounting cavity and the lower mounting cavity are all communicated with the outside through heat dissipation holes 13 to make the hot gas flow that is located casing 10 toward the outside, thereby realize the heat dissipation, and then improve heat dissipation performance.

In another embodiment of the present invention, as shown in fig. 1, an air cooling module is installed inside the lower casing 12; the air cooling assembly includes a fan 122 and a driving motor 123; the driving motor 123 is mounted on the lower housing 12 through a mounting seat 124; the driving motor 123 has a rotatable output shaft, and the output shaft of the driving motor 123 is fixedly connected with the fan 122; the driving motor 123 is electrically connected to the circuit board 20.

Specifically, a mounting seat 124 is detachably mounted on the inner cavity of the lower housing 12 through screws, a driving motor 123 is mounted on the mounting seat 124, and the fan 122 is fixedly sleeved on an output shaft of the driving motor 123. In use, the driving motor 123 operates, and the output shaft thereof rotates to drive the fan 122 to operate. The hot air in the housing 10 is discharged to the outside through the plurality of heat discharging holes 13 by the blowing of the fan 122, so that the heat discharging performance is greatly improved.

In another embodiment of the present invention, a positioning protrusion is fixedly disposed on the top of the lower case 12, and a positioning groove used in cooperation with the positioning protrusion is disposed on the bottom of the upper case 11. Specifically, the positioning protrusion is fixedly disposed at the inner edge of the top of the lower housing 12, and correspondingly, the positioning groove is disposed at the inner edge of the bottom of the upper housing 11 and corresponds to the positioning protrusion. During assembly, the positioning protrusions are inserted into the positioning grooves, the upper shell 11 is covered on the lower shell 12 under the positioning action of the positioning protrusions and the lower shell 12, and then the upper shell 11 is assembled on the lower shell 12 through screws. In this way, the accuracy of mounting the upper case 11 and the lower case 12 is improved, and the heat dissipation type power adapter is more beautiful. In addition, the detachable connection of the upper shell 11 and the lower shell 12 is realized in a threaded connection mode, so that the overall strength is improved, and the upper shell 11 is prevented from being separated from the lower shell 12 easily.

In another embodiment of the present invention, as shown in fig. 1, a plurality of ribs 14 are fixedly disposed on the inner wall surfaces of the upper casing 11 and the lower casing 12. Specifically, reinforcing ribs 14 are fixedly arranged between each inner wall surface of the upper casing 11 and the upper wall surface of the upper casing 11, so as to improve the strength of the upper casing 11 and prevent the upper casing 11 from being easily deformed due to stress. Similarly, reinforcing ribs 14 are fixedly arranged between each inner wall surface of the lower shell 12 and the lower wall surface of the lower shell 12. The upper housing 11 and the lower housing 12 are both integrally injection molded.

In another embodiment of the present invention, as shown in fig. 1 and 4, a hanging portion 15 is provided on the upper case 11 or the lower case 12 to hang the heat dissipation type power adapter on other objects. Specifically, in the present embodiment, the hanging portion 15 is mounted on the side surface of the upper case 11. The hanging portion 15 includes a connecting portion 152 and a hook 151, the hook 151 is fixedly disposed on the connecting portion 152, an external thread is disposed on the connecting portion 152, and correspondingly, a threaded hole adapted to be connected to the external thread is disposed on a side surface of the upper housing 11. The hook 151 is detachably connected to the upper case 11 through an external thread of the connection portion 152 and a threaded hole of the upper case 11. The hook 151 can be hung on other foreign objects, so that the heat dissipation type power adapter can be hung on other foreign objects through the hook 151, the occupied area on a horizontal plane such as a workbench and a desktop is reduced, and the flexibility is greatly improved.

In another embodiment of the present invention, as shown in fig. 4, at least two suction cups 125 are disposed at the bottom of the lower casing 12, and the two suction cups 125 are symmetrically disposed, so that the heat dissipation type power adapter can be attached to other external surface. Specifically, in the present embodiment, the suction cups 125 are provided in four, and are arranged in a rectangular shape. The heat dissipation type power adapter can be adsorbed on the surface of other foreign objects through the sucking disc 125, so that the heat dissipation type power adapter can be fixed to avoid disorder; and secondly, the heat dissipation type power adapter can be lifted to be away from the horizontal plane, so that the heat dissipation type power adapter is prevented from being contacted with water, and the safety performance is greatly improved.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the utility model, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.

Claims

1. The utility model provides a heat dissipation type power adapter, includes casing and circuit board, circuit board installs in the casing, its characterized in that: the shell comprises an upper shell and a lower shell; the upper shell and the lower shell are detachably connected; the upper shell is provided with an upper mounting cavity with a downward opening, the lower shell is provided with a lower mounting cavity with an upward opening, and the circuit main board is detachably connected with the lower shell through a heat conduction column; the bottom of the circuit main board is provided with a heat dissipation assembly; the lower shell is provided with a position avoiding groove for the heat dissipation assembly to penetrate through so that the heat dissipation assembly is contacted with the outside air; wherein the heat generated by the circuit main board is transferred to the outside air through the heat dissipation assembly.

2. The heat dissipating power adapter as claimed in claim 1, wherein: the heat dissipation assembly comprises a heat dissipation main body and a plurality of heat dissipation plates; the heat dissipation main body is arranged at the bottom of the circuit main board; the plurality of heat dissipation plates are fixedly arranged at the bottom of the heat dissipation main body and are arranged at intervals along a preset direction; and the plurality of heat dissipation plates are completely positioned outside the lower shell.

3. The heat dissipating power adapter as claimed in claim 2, wherein: the heat dissipation assembly further comprises a heat conduction silica gel sheet; the top of heat dissipation main part has seted up the mounting groove, heat conduction silica gel piece sets up in the mounting groove.

4. The heat dissipating power adapter as recited in claim 3 wherein: the top surface of the heat-conducting silica gel sheet is 0.1 mm-0.3 mm higher than the top surface of the heat-radiating main body.

5. The heat dissipating power adapter as claimed in claim 1, wherein: and the upper shell and/or the lower shell are/is provided with a plurality of heat dissipation holes.

6. The heat dissipating power adapter as recited in claim 5, wherein: the lower shell is internally provided with an air cooling assembly; the air cooling assembly comprises a fan and a driving motor; the driving motor is arranged on the lower shell through a mounting seat; the driving motor is provided with a rotatable output shaft, and the output shaft of the driving motor is fixedly connected with the fan; the driving motor is electrically connected with the circuit main board.

7. The heat dissipating power adapter as claimed in claim 1, wherein: the top of lower casing sets firmly has the location arch, go up the bottom of casing and seted up with the constant head tank that the protruding cooperation of location was used.

8. The heat dissipating power adapter as claimed in claim 1, wherein: and a plurality of reinforcing ribs are fixedly arranged on the inner wall surfaces of the upper shell and the lower shell.

9. The heat dissipating power adapter as claimed in claim 1, wherein: and the upper shell or the lower shell is provided with a hanging part so that the heat dissipation type power adapter can be hung on other objects.

10. The heat dissipating power adapter as claimed in claim 1, wherein: the bottom of casing is provided with two at least sucking discs down, two the sucking disc symmetry sets up to make heat dissipation type power adapter adsorbs on other foreign object surfaces.