CN215187836U

CN215187836U - Power supply with insulating effect

Info

Publication number: CN215187836U
Application number: CN202121478278.1U
Authority: CN
Inventors: 陈艳妮
Original assignee: Huizhou Hongan Electronic Technology Co ltd
Current assignee: Huizhou Hongan Electronic Technology Co ltd
Priority date: 2021-06-30
Filing date: 2021-06-30
Publication date: 2021-12-14
Anticipated expiration: 2031-06-30

Abstract

The utility model discloses a power supply with insulating effect, including metal soleplate and metal epitheca, the metal epitheca with metal soleplate fixed connection, power supply still includes the mounting panel, be fixed with electrical component on the mounting panel, the mounting panel is located the metal epitheca with the casing that the metal soleplate formed is connected, the both ends of mounting panel respectively through the plastic part with the interior wall connection of metal epitheca, not with the metal epitheca with metal soleplate electrical contact realizes the insulating connection of electrical component and shell prevents to take place the electric shock.

Description

Power supply with insulating effect

Technical Field

The utility model relates to a power supply technical field especially relates to a power supply with insulating effect.

Background

The power supply unit is also called a power supply, and is an electric energy conversion type power supply of the computer, and is responsible for converting standard alternating current into low-voltage stable direct current for other components in the computer. The shell of the existing power supply is generally made of metal materials, and when the power supply leaks electricity, the shell cannot achieve the insulating effect.

SUMMERY OF THE UTILITY MODEL

In view of this, the utility model discloses a power supply with insulating effect, when the electric leakage, can place the user and electrocute.

The utility model discloses a power supply with insulating effect, including metal soleplate and metal epitheca, the metal epitheca with metal soleplate fixed connection, power supply still includes the mounting panel, the mounting panel is located the metal epitheca with the metal soleplate connects the casing that forms, the both ends of mounting panel respectively through the plastic part with the interior wall connection of metal epitheca, be fixed with electrical property subassembly on the mounting panel.

Further, two plastic parts are symmetrically distributed, the plastic parts are provided with mounting grooves, and two ends of the mounting plate are respectively connected with the plastic parts in a sliding mode through the mounting grooves.

Further, the plastic part pass through plastic stopper post with metal epitheca fixed connection, the metal epitheca is provided with first fixed orifices, be provided with the second fixed orifices on the plastic part, the one end of plastic stopper post is passed first fixed orifices and second fixed orifices with the plastic part joint.

Further, the mounting panel includes the installation department, the cardboard is connected through the connecting plate respectively to the both sides of installation department, the cardboard with mounting groove sliding connection, the electrical property subassembly is fixed on the installation department.

Further, the connecting plate with the installation department is certain contained angle setting, and the installation department is located and is close to on the position of bottom plate.

Furthermore, the metal bottom plate comprises a heat dissipation part, two ends of the heat dissipation part respectively extend outwards to form fixing parts, the metal upper shell is fixedly connected with the heat dissipation part, and a heat dissipation plate is arranged on the outer side of the heat dissipation part.

Furthermore, the heat dissipation part is connected with the semiconductor refrigeration piece, the semiconductor refrigeration piece is located in the shell formed by connecting the metal upper shell and the metal bottom plate, the refrigeration surface of the semiconductor refrigeration piece is close to the mounting plate, and the heating surface of the semiconductor refrigeration piece is attached to the heat dissipation part.

The technical scheme of the utility model, compared with the prior art, beneficial effect is:

the installation the mounting panel of electrical component pass through the plastic part with the metal epitheca is connected, not with the metal epitheca with metal bottom plate electrical contact realizes the insulating connection of electrical component and shell prevents to take place to electrocute.

Drawings

FIG. 1 is a schematic diagram of a power supply;

FIG. 2 is an exploded view of the power supply;

FIG. 3 is a cross-sectional view of a power supply;

FIG. 4 is a schematic structural view of a plastic part disposed on a metal upper case via a plastic plunger;

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it should be noted that when one component is considered to be "connected" to another component, it may be directly connected to the other component or intervening components may exist. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It should also be noted that, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly and can include, for example, fixed connections, removable connections, or integral connections; either mechanically or electrically, and may be internal to both elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

It should be further noted that in the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, but does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

As shown in fig. 1 and 2, the utility model discloses a power supply 100 with insulating effect, including shell 10, mounting panel 20 and electrical component 30, electrical component 30 passes through mounting panel 20 sets up in the shell 10, be provided with on the shell 10 with electrical component complex wiring portion 13, the electric wire accessible wiring portion 13 passes the lateral wall of shell 10 with electrical component 30 is connected.

The shell 10 is made by metal material, the shell 10 includes metal epitheca 11 and metal soleplate 12, metal epitheca 11 is bottom open-ended metal casing, the bottom of metal epitheca 11 with metal soleplate 12 fixed connection, electrical component 30 passes through mounting panel 20 sets up in metal epitheca 11 with metal soleplate 12 connects the casing that forms in, mounting panel 20 with metal epitheca 11 is connected. The mounting plate 20 is an aluminum profile.

As shown in fig. 2 and 3, the mounting plate 20 further includes a mounting portion 21, two ends of the mounting portion 21 are respectively connected to two clamping plates 23 through connecting plates 22, the two clamping plates 23 are symmetrically distributed, the two clamping plates 23 are connected to an inner wall of the metal upper shell 11 through plastic parts 40, and the two plastic parts 40 are symmetrically distributed on two opposite inner walls of the metal upper shell 11. The electrical component 30 is fixed on the mounting portion 21.

With reference to fig. 4, an installation groove 41 is formed on the plastic part 40, and the clamping plate 23 is slidably connected to the plastic part 40 through the installation groove 41, so as to achieve the sliding connection between the mounting plate 20 and the metal upper shell 11.

The plastic part 23 is connected to the metal upper case 11 through a plastic plug 50. Metal epitheca 11 is provided with first fixed orifices 111, be provided with second fixed orifices 42 on the plastic part 40, the first end of plastic stopper post 50 is provided with buckle 51 and breach groove 52, the first end of plastic stopper post 50 passes first fixed orifices 111 and second fixed orifices 42 and with plastic part 40 joint, breach groove 52 plays elastic buffer's effect. Each plastic part 40 is connected with the metal upper shell 11 through two plastic plugs 50, so that the plastic parts 40 are fixed.

As shown in fig. 3, the connecting plate 22 and the mounting portion 21 have an included angle therebetween, so that the mounting portion 21 is located close to the metal base plate 12. The metal base plate 12 is provided with a heat dissipation plate 123, and heat generated by the electrical component 30 during operation can be transferred to the metal base plate 12 and dissipated through the heat dissipation plate 123.

The metal base plate 12 includes a heat dissipation portion 121, both ends of the heat dissipation portion 121 respectively extend outward to form fixing portions 122, the metal upper case 11 is fixedly connected to the heat dissipation portion 121, and a heat dissipation plate 123 is disposed outside the heat dissipation portion 121. The metal base plate 12 is fixedly mounted on a corresponding device through the fixing portion 122, so as to connect the power supply. The heat dissipation part 121 is located near the mounting part 21, and heat generated by the electrical component 30 during operation can be transferred to the heat dissipation part 121 and then dissipated through the heat dissipation plate 123.

In another embodiment, the heat dissipating part 121 is provided with a semiconductor refrigeration sheet 60, the semiconductor refrigeration sheet 60 is located in a casing formed by connecting the metal upper casing 11 and the metal bottom plate 12, a refrigeration surface of the semiconductor refrigeration sheet 60 is close to the mounting plate 20 to cool the inside of the casing 10, so as to prevent the temperature inside the casing 10 from being too high, a heating surface of the semiconductor refrigeration sheet 60 is attached to the heat dissipating part 121, and heat generated by the semiconductor refrigeration sheet 60 during operation can be dissipated through the heat dissipating fin 123. The heat dissipation of the power supply is realized through the structure, the heat dissipation holes are not needed, and the falling shell 10 can be killed and has a dustproof function.

The present invention can be designed in various embodiments and modifications without departing from the spirit and scope of the present invention in its broadest sense, and the above-described embodiments are intended to illustrate the present invention, but not to limit the scope of the present invention.

Claims

1. The utility model provides a power supply with insulating effect, includes metal bottom plate and metal epitheca, the metal epitheca with metal bottom plate fixed connection, its characterized in that, power supply still includes the mounting panel, the mounting panel is located the metal epitheca with the casing that the metal bottom plate connects the formation, the both ends of mounting panel respectively through the plastic part with the interior wall connection of metal epitheca, be fixed with electrical property subassembly on the mounting panel.

2. The power supply unit as claimed in claim 1, wherein two plastic members are symmetrically disposed, each plastic member has a mounting slot, and two ends of the mounting plate are slidably connected to the plastic members through the mounting slots.

3. The power supply with insulating effect as claimed in claim 2, wherein the plastic part is fixedly connected to the metal upper casing through a plastic plug, the metal upper casing is provided with a first fixing hole, the plastic part is provided with a second fixing hole, and one end of the plastic plug passes through the first fixing hole and the second fixing hole and is clamped to the plastic part.

4. The power supply with insulating effect as claimed in claim 2, wherein the mounting plate includes a mounting portion, two sides of the mounting portion are respectively connected to a clip board through a connecting plate, the clip board is slidably connected to the mounting groove, and the electrical component is fixed on the mounting portion.

5. The power supply with insulation effect as claimed in claim 4, wherein the connecting plate is disposed at an angle to the mounting portion, and the mounting portion is located near the bottom plate.

6. The power supply with insulation effect as claimed in claim 5, wherein the metal base plate includes a heat dissipation portion, two ends of the heat dissipation portion respectively extend outwards to form fixing portions, the metal upper shell is fixedly connected with the heat dissipation portion, and a heat dissipation plate is disposed outside the heat dissipation portion.

7. The power supply device with insulation effect as claimed in claim 6, wherein the heat dissipation portion is connected to a semiconductor refrigeration sheet, the semiconductor refrigeration sheet is located in a housing formed by connecting the metal upper shell and the metal bottom plate, the refrigeration surface of the semiconductor refrigeration sheet is close to the mounting plate, and the heating surface of the semiconductor refrigeration sheet is attached to the heat dissipation portion.