CN212463056U - Switch power supply - Google Patents
Switch power supply Download PDFInfo
- Publication number
- CN212463056U CN212463056U CN202021641497.2U CN202021641497U CN212463056U CN 212463056 U CN212463056 U CN 212463056U CN 202021641497 U CN202021641497 U CN 202021641497U CN 212463056 U CN212463056 U CN 212463056U
- Authority
- CN
- China
- Prior art keywords
- shell
- heat
- power supply
- fixedly arranged
- switching power
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 230000017525 heat dissipation Effects 0.000 claims description 16
- 238000007789 sealing Methods 0.000 claims description 12
- 229920001296 polysiloxane Polymers 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 239000000741 silica gel Substances 0.000 claims description 6
- 229910002027 silica gel Inorganic materials 0.000 claims description 6
- 239000004519 grease Substances 0.000 claims description 5
- 238000001816 cooling Methods 0.000 claims 2
- 239000011810 insulating material Substances 0.000 abstract 1
- YKKYCYQDUUXNLN-UHFFFAOYSA-N 2,4-dichloro-1-(2-chlorophenyl)benzene Chemical compound ClC1=CC(Cl)=CC=C1C1=CC=CC=C1Cl YKKYCYQDUUXNLN-UHFFFAOYSA-N 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 239000006185 dispersion Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a switching power supply, its technical scheme main points are: the utility model discloses a heat-insulating material, including the shell, the fixed first buffer spring that is provided with on the lower extreme inner wall of shell, the fixed second buffer spring that is provided with on the upper end inner wall of shell, the fixed plate that is provided with in upper end of first buffer spring, the upper end of fixed plate can be dismantled and be connected with the PCB board, the fixed electronic component that is provided with of up end of PCB board, the upper end of PCB board is provided with the heat-conducting plate, the shape hole has been seted up on the heat-conducting plate, shape hole and electronic component one-to-one, the fixed first fin that is provided with in upper end of heat-conducting plate, the fixed setting of upper end and second buffer spring's lower extreme of first fin, the fixed radiator that is provided with on the left side inner wall of shell, the fixed slide rail that is provided with.
Description
Technical Field
The utility model relates to a switching power supply technical field specifically is a switching power supply.
Background
The switching power supply is a power supply which utilizes the modern power electronic technology to control the on-off time ratio of a switching tube and maintain stable output voltage, and the switching power supply technology is continuously innovated along with the development and innovation of the power electronic technology.
The existing switching power supply has poor anti-falling performance, and when the switching power supply accidentally slips, internal electronic elements are easily damaged; meanwhile, the conventional switching power supply is generally provided with heat dissipation holes on the shell, and the heat dissipation holes are simply utilized for heat dissipation, so that the heat dissipation effect is poor.
SUMMERY OF THE UTILITY MODEL
To the problem of mentioning in the background art, the utility model provides a switching power supply solves to mention the problem that current switching power supply prevents that the performance is not good and the radiating effect is not good of falling in the background art.
The above technical purpose of the present invention can be achieved by the following technical solutions:
a switching power supply comprises a shell, wherein a first buffer spring is fixedly arranged on the inner wall of the lower end of the shell, a second buffer spring is fixedly arranged on the inner wall of the upper end of the shell, a fixed plate is fixedly arranged on the upper end of the first buffer spring, a PCB is detachably connected to the upper end of the fixed plate, an electronic element is fixedly arranged on the upper end face of the PCB, a heat conducting plate is arranged on the upper end of the PCB, imitation holes are formed in the heat conducting plate and correspond to the electronic element one by one, a first radiating fin is fixedly arranged on the upper end of the heat conducting plate, a radiator is fixedly arranged on the inner wall of the left side of the shell, a sliding rail is fixedly arranged in the shell, a sliding block is connected to the sliding rail in a sliding manner, and a connecting terminal is fixedly arranged at the upper right end of the sliding block, the wiring terminal is electrically connected with the electronic element through a wire, and the right end of the wiring terminal is fixedly arranged with the sealing door.
Furthermore, insulating heat-conducting silicone grease is filled between the profiling hole and the electronic element.
Through the technical scheme, the insulating heat-conducting silicone grease has high heat conductivity, excellent heat conductivity, good electrical insulation, wider use temperature, good use stability, lower consistency and good construction performance, is an ideal gap-filling heat-conducting medium for electronic elements, and can fill gaps between the profiling holes and the electronic elements due to the existence of the insulating heat-conducting silicone grease.
Furthermore, a plurality of heat dissipation holes are formed in the shell, and second heat dissipation fins are fixedly arranged at the upper end of the shell.
Through above-mentioned technical scheme, can promote the heat dispersion of shell.
Furthermore, a plurality of first positioning holes are formed in the PCB, a fixing column is arranged at the position, corresponding to the first positioning holes, of the upper end of the fixing plate, a first threaded hole is formed in the fixing column, a first screw is installed in the first threaded hole, and the PCB and the fixing plate are detachably connected through the first positioning holes, the first threaded hole and the first screw.
Through above-mentioned technical scheme, the setting up of fixed post makes and forms the clearance between PCB board and the fixed plate, can promote the heat dispersion of PCB board lower extreme, and PCB board and fixed plate can dismantle the connection through first locating hole, first screw hole and first screw, can be convenient for take off the PCB board, and then are convenient for overhaul the PCB board.
Furthermore, a second positioning hole is formed in the sealing door in the left-right direction, a second threaded hole is formed in the position, corresponding to the second positioning hole, of the right end of the shell, a second screw is installed in the second threaded hole, and the sealing door and the shell are detachably connected through the second positioning hole, the second threaded hole and the second screw.
Through above-mentioned technical scheme, take off the second screw, when pulling sealing door right, can pull out the casing together with binding post, the person of being convenient for puts through the circuit.
Furthermore, the heat sink is electrically connected with the electronic element through a lead.
Through above-mentioned technical scheme, but the air current that the radiator blew off is right the utility model discloses an inside dispels the heat.
Furthermore, a buffer pad is fixedly arranged on the outer side of the shell.
Through above-mentioned technical scheme, setting up of buffer memory pad promotes the utility model discloses a prevent falling the performance.
Further, the heat conducting plate is made of a heat conducting silica gel sheet.
Through above-mentioned technical scheme, the heat-conducting plate that heat conduction silica gel piece was made has good heat conductivility, and heat conduction silica gel piece has soft characteristic simultaneously, can play the guard action to electronic component, further promotes the utility model discloses a prevent falling the performance.
The utility model has the advantages that:
one, the utility model discloses in, through setting up first buffer spring, second buffer spring, blotter and heat-conducting plate, make the utility model discloses a prevent falling the effect better, when the unexpected landing of switching power supply, can play fine guard action to inside electronic component.
Two, the utility model discloses in, through setting up radiator, the first fin of heat-conducting plate, second fin, louvre and fixed column, during the use, the air current that the accessible radiator blew off is right the utility model discloses inside dispels the heat, and the existence of first fin can promote the heat radiating area of PCB board, and the second fin can promote the heat radiating area of shell, makes the utility model discloses a radiating effect is better.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 is a schematic mechanism diagram of an embodiment of the present invention;
fig. 2 is a front view of an embodiment of the present invention;
fig. 3 is a bottom view of the heat conducting plate in the embodiment of the present invention.
In the figure: 1. a housing; 2. a first buffer spring; 3. a second buffer spring; 4. a fixing plate; 5. a heat conducting plate; 501. profiling a hole; 6. a first heat sink; 7. a heat sink; 8. a slide rail; 9. a slider; 10. a wiring terminal; 11. a sealing door; 12. heat dissipation holes; 13. a second heat sink; 14. a first screw; 15. a second screw; 16. a cushion pad; 17. and (7) a PCB board.
Detailed Description
In order to make the objects and technical solutions of the present invention clear and fully described, and the advantages thereof more clearly understood, the embodiments of the present invention are described in further detail below with reference to the accompanying drawings.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "inner", "outer", "top", "bottom", "side", "vertical", "horizontal", and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," "fourth," "fifth," and "sixth" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Example 1
Referring to fig. 1 to 3, a switching power supply includes a housing 1, a first buffer spring 2 is fixedly disposed on an inner wall of a lower end of the housing 1, a second buffer spring 3 is fixedly disposed on an inner wall of an upper end of the housing 1, a fixing plate 4 is fixedly disposed on an upper end of the first buffer spring 2, a PCB 17 is detachably connected to an upper end of the fixing plate 4, an electronic component is fixedly disposed on an upper end surface of the PCB 17, a heat conducting plate 5 is disposed on an upper end of the PCB 17, a profiling hole 501 is formed in the heat conducting plate 5, the profiling hole 501 corresponds to the electronic component one by one, a first heat sink 6 is fixedly disposed on an upper end of the heat conducting plate 5, an upper end of the first heat sink 6 is fixedly disposed with a lower end of the second buffer spring 3, a heat sink 7 is fixedly disposed on an inner wall of a left side of the housing 1, a slide rail 8 is fixedly disposed inside, the wiring terminal 10 is electrically connected with the electronic component through a wire, and the right end of the wiring terminal 10 is fixedly arranged with the sealing door 11. in the utility model, the shell 1, the fixing plate 4, the slide rail 8, the slide block 9 and the sealing door 11 are made of aluminum alloy, the first buffer spring 2 and the second buffer spring 3 are made of stainless steel, and the number of the first buffer spring 2 and the second buffer spring 3 is four.
Referring to fig. 2 and 3, insulating and heat conducting silicone grease is filled between the conformal holes 501 and the electronic component.
Referring to fig. 1 and 2, a plurality of heat dissipation holes 12 are formed in the housing 1, and a second heat dissipation plate 13 is fixedly disposed at the upper end of the housing 1, in the present invention, a circular through hole is formed at a position of the second heat dissipation plate 13 corresponding to the heat dissipation holes 12, so as to prevent the second heat dissipation plate 13 from blocking the heat dissipation holes 12.
Referring to fig. 2, a plurality of first positioning holes are formed in the PCB 17, a fixing column is disposed at a position, corresponding to the first positioning holes, of the upper end of the fixing plate 4, a first threaded hole is formed in the fixing column, a first screw 14 is installed in the first threaded hole, and the PCB 17 and the fixing plate 4 are detachably connected through the first positioning holes, the first threaded hole and the first screw 14.
Referring to fig. 2, the sealing door 11 is provided with a second positioning hole along the left-right direction, a second threaded hole is provided at a position corresponding to the second positioning hole at the right end of the housing 1, a second screw 15 is installed in the second threaded hole, and the sealing door 11 and the housing 1 are detachably connected through the second positioning hole, the second threaded hole and the second screw 15.
Referring to fig. 2, the heat sink 7 is electrically connected to the electronic component through a wire.
Referring to fig. 1 and 2, the outside of the housing 1 is fixedly provided with a cushion pad 16, in the present invention, the thickness of the cushion pad 16 is 5mm, and the cushion pad 16 is made of a heat conductive silicone sheet.
Referring to fig. 2, the heat conducting plate 5 is made of a heat conducting silicone sheet, in the present invention, the thickness of the heat conducting plate 5 is 10 mm.
The working principle is as follows: when the utility model discloses unexpected landing, first buffer spring 2 and second buffer spring 3 can play the effect of buffering, prevent that the electronic component on PCB board 17 from damaging, and heat-conducting plate 5 that heat conduction silica gel piece was made has good heat conductivility, and heat conduction silica gel piece has soft characteristic simultaneously, can play the guard action to electronic component, and blotter 16 sets up the further promotion the utility model discloses a prevent falling the performance; simultaneously, the air current that the accessible radiator 7 blew off is right the utility model discloses inside dispels the heat, and the existence of first fin 6 can promote the heat radiating area of PCB board 17, and second fin 13 can promote the heat radiating area of shell 1, and louvre 12 can further promote the utility model discloses a heat dispersion.
The above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.
Claims (8)
1. A switching power supply comprising a housing (1), characterized in that: the heat dissipation device is characterized in that a first buffer spring (2) is fixedly arranged on the inner wall of the lower end of the shell (1), a second buffer spring (3) is fixedly arranged on the inner wall of the upper end of the shell (1), a fixing plate (4) is fixedly arranged on the upper end of the first buffer spring (2), a PCB (17) is detachably connected to the upper end of the fixing plate (4), an electronic element is fixedly arranged on the upper end face of the PCB (17), a heat conduction plate (5) is arranged on the upper end of the PCB (17), an imitated hole (501) is formed in the heat conduction plate (5), the imitated hole (501) corresponds to the electronic element one by one, a first cooling fin (6) is fixedly arranged on the upper end of the heat conduction plate (5), the upper end of the first cooling fin (6) is fixedly arranged with the lower end of the second buffer spring (3), and a radiator (7) is fixedly arranged on the inner, the fixed slide rail (8) that is provided with in inside of shell (1), sliding connection has slider (9) on slide rail (8), the fixed binding post (10) that is provided with in upper right end of slider (9), binding post (10) pass through the wire with electronic component electric connection, the right-hand member and sealing door (11) of binding post (10) are fixed to be set up.
2. A switching power supply according to claim 1, characterized in that: insulating heat-conducting silicone grease is filled between the profiling hole (501) and the electronic element.
3. A switching power supply according to claim 1, characterized in that: a plurality of heat dissipation holes (12) are formed in the shell (1), and second heat dissipation fins (13) are fixedly arranged at the upper end of the shell (1).
4. A switching power supply according to claim 1, characterized in that: the PCB is characterized in that a plurality of first positioning holes are formed in the PCB (17), fixing columns are arranged at the positions, corresponding to the first positioning holes, of the upper ends of the fixing plates (4), first threaded holes are formed in the fixing columns, first screws (14) are installed in the first threaded holes, and the PCB (17) and the fixing plates (4) are detachably connected through the first positioning holes, the first threaded holes and the first screws (14).
5. A switching power supply according to claim 1, characterized in that: the sealing door (11) is provided with a second positioning hole along the left-right direction, a second threaded hole is formed in the position, corresponding to the second positioning hole, of the right end of the shell (1), a second screw (15) is installed in the second threaded hole, and the sealing door (11) and the shell (1) are detachably connected through the second positioning hole, the second threaded hole and the second screw (15).
6. A switching power supply according to claim 1, characterized in that: the radiator (7) is electrically connected with the electronic element through a lead.
7. A switching power supply according to claim 1, characterized in that: a buffer pad (16) is fixedly arranged on the outer side of the shell (1).
8. A switching power supply according to claim 1, characterized in that: the heat conducting plate (5) is made of a heat conducting silica gel sheet.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202021641497.2U CN212463056U (en) | 2020-08-10 | 2020-08-10 | Switch power supply |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202021641497.2U CN212463056U (en) | 2020-08-10 | 2020-08-10 | Switch power supply |
Publications (1)
Publication Number | Publication Date |
---|---|
CN212463056U true CN212463056U (en) | 2021-02-02 |
Family
ID=74475707
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202021641497.2U Expired - Fee Related CN212463056U (en) | 2020-08-10 | 2020-08-10 | Switch power supply |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN212463056U (en) |
-
2020
- 2020-08-10 CN CN202021641497.2U patent/CN212463056U/en not_active Expired - Fee Related
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210202 |