CN218998367U

CN218998367U - Aluminum-based circuit board

Info

Publication number: CN218998367U
Application number: CN202223070725.7U
Authority: CN
Inventors: 唐芬娟
Original assignee: Zhejiang Kaida Technology Co ltd
Current assignee: Zhejiang Kaida Technology Co ltd
Priority date: 2022-11-18
Filing date: 2022-11-18
Publication date: 2023-05-09
Anticipated expiration: 2032-11-18

Abstract

The utility model relates to the technical field of circuit boards, in particular to an aluminum-based circuit board, wherein the heat conduction area can be increased through an inner heat dissipation cavity of an insulating heat dissipation layer, heat generated by an upper circuit layer can be further promoted to be quickly transferred through a heat dissipation structure on the insulating heat dissipation layer, other heat can be transferred to a lower metal base layer for heat dissipation through heat transfer, the contact space and area between the aluminum-based circuit board and air can be increased, the heat dissipation speed can be improved, the heat dissipation can be carried out by combining the heat conduction effect, and the heat dissipation efficiency of the circuit board can be further improved.

Description

Aluminum-based circuit board

Technical Field

The utility model relates to the technical field of circuit boards, in particular to an aluminum-based circuit board.

Background

The circuit board is called a circuit board, and the circuit board is various in variety and comprises an aluminum-based circuit board; the circuit board enables the circuit to be miniaturized and visualized, and plays an important role in mass production of fixed circuits and optimization of the layout of electrical appliances.

The circuit board can produce heat in long-time use, and under the higher service environment of long-term temperature, the circuit board is liable to take place ageing, directly influences the life of circuit board, so need improve the thermal diffusivity of circuit board.

The aluminum-based circuit board is a unique metal copper-clad plate, has good heat conduction, electrical insulation and machining performance, and consists of three layers of structures, wherein the three layers of structures respectively comprise a circuit layer, an insulating layer and a metal base layer, and the working principle of the aluminum-based circuit board is as follows: the surface of the power device is attached to the circuit layer, heat generated during operation of the device is quickly conducted to the metal base layer through the insulating layer, and then the heat is transferred out through the metal base layer, so that the heat dissipation of the device is realized, but the heat dissipation performance of the current aluminum-based circuit board is still poor, the efficiency of conducting the heat to the metal base layer through the insulating layer is low, the quick heat dissipation of the circuit board is not facilitated, and the heat dissipation capacity of the aluminum-based circuit board is further improved. In view of this, we propose an aluminum-based circuit board.

Disclosure of Invention

In order to overcome the defects, the utility model provides an aluminum-based circuit board.

The technical scheme of the utility model is as follows:

the aluminum-based circuit board comprises a circuit layer and a metal base layer capable of transmitting heat, and further comprises:

the insulating heat dissipation layer is positioned between the circuit layer and the metal base layer and is used for heat dissipation and insulation protection;

the waterproof layer is positioned on the outer surface of the circuit layer and can play a role in waterproof protection.

Preferably, a plurality of heat conducting blocks capable of promoting heat conducting and transferring speed are fixedly connected below the circuit layer.

Preferably, the insulating heat dissipation layer comprises an insulating seat, a heat dissipation cavity capable of installing the transition heat conduction plate is arranged in the insulating seat, and a plurality of heat dissipation structures capable of improving heat dissipation efficiency are arranged around the heat dissipation cavity.

Preferably, a contact surface capable of increasing the contact area with the transition heat-conducting plate is arranged at the bottom of the heat dissipation cavity.

Preferably, a plurality of limiting rings are arranged above the transition heat conducting plate, the heat conducting blocks are inserted and installed in the limiting rings in a one-to-one correspondence mode, and a plurality of heat conducting holes which are beneficial to heat conduction are formed in each limiting ring.

Preferably, an insulating layer fixedly connected with the circuit layer is arranged above the transition heat conducting plate, and a plurality of plug holes corresponding to the heat conducting blocks one by one are arranged on the insulating layer.

Preferably, the inserting holes are not larger than limit rings corresponding to the lower parts one by one, and a heat conduction part is formed between the transition heat conduction plate and the insulating layer.

Preferably, the metal base layer is made of an aluminum base material heat conducting material.

Compared with the prior art, the utility model has the beneficial effects that:

this aluminium base circuit board can increase heat conduction area through the inside heat dissipation chamber of insulating heat dissipation layer that is equipped with to the heat that the heat conduction position that is equipped with can further promote the circuit layer of top and produce obtains the quick transfer, and can dispel the heat through the heat radiation structure on the insulating heat dissipation layer, and other heat can be dispel the heat on the below metal basic unit through heat transfer conduction, and this aluminium base circuit board can increase the contact space and the area with the air, promotes the radiating rate, and combines the heat conduction effect to dispel the heat, is favorable to further improving this circuit board radiating efficiency.

Drawings

FIG. 1 is a front view of the overall structure of the present utility model;

FIG. 2 is an exploded front view of the overall structure of the present utility model;

fig. 3 is an exploded view of the heat dissipation insulating layer of the present utility model.

The meaning of each reference numeral in the figures is:

1. a circuit layer; 11. a heat conduction block;

2. an insulating heat dissipation layer; 21. an insulating base; 211. a heat dissipation cavity; 212. a heat radiation hole; 22. a transition heat-conducting plate; 221. a limiting ring; 2211. a heat conduction hole; 23. an insulating layer; 231. a plug hole;

3. a metal base layer; 4. and a waterproof layer.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.

Referring to fig. 1-3, the present utility model is described in detail by the following embodiments:

an aluminum-based circuit board, which comprises a circuit layer 1 and a metal base layer 3 capable of transferring heat, and further comprises:

the insulating heat dissipation layer 2 is positioned between the circuit layer 1 and the metal base layer 3 and used for heat dissipation and insulation protection;

waterproof layer 4, waterproof layer 4 is located circuit layer 1 surface and can play waterproof protection's effect, and this embodiment adopts the epoxy material as waterproof material.

A plurality of heat conduction blocks 11 capable of promoting heat conduction transfer speed are fixedly connected below the circuit layer 1.

The insulating heat dissipation layer 2 includes an insulating base 21, a heat dissipation cavity 211 capable of mounting the transition heat conduction plate 22 is arranged inside the insulating base 21, a plurality of heat dissipation structures capable of improving heat dissipation efficiency are arranged around the heat dissipation cavity 211, and the heat dissipation structures in this embodiment are heat dissipation holes 212.

The bottom of the heat dissipation cavity 211 is provided with a contact surface capable of increasing the contact area with the transition heat conduction plate 22, and the embodiment adopts a wave-shaped structure, so that the contact area is increased, and the heat transfer speed is promoted.

The transition heat-conducting plate 22 top is equipped with a plurality of spacing rings 221, and the grafting of heat-conducting piece 11 one-to-one installs in spacing rings 221, be equipped with a plurality of conductive holes 2211 that are favorable to deriving heat on every spacing ring 221, the spliced eye 231 is not greater than spacing rings 221 of below one-to-one, can make between transition heat-conducting plate 22 and the insulating layer 23 form the heat conduction position, the heat conduction position of this embodiment is filled with the graphite material that heat conduction effect is good, when the heat that circuit layer 1 produced can conduct through heat-conducting piece 11, and conductive holes 2211 are favorable to the heat transfer and absorbed by graphite material, the graphite material that absorbs the heat can dispel the heat fast through the louvre 212, and transfer a part of heat downwards to the metal basic unit 3 of aluminium basic unit, metal basic unit 3 adopts aluminium basic unit conductive material, aluminium basic unit has the good performance of radiating effect, the heat that can produce the circuit layer 1 to heat and transfer away fast and dispel, can improve the radiating efficiency.

An insulating layer 23 fixedly connected with the circuit layer 1 is arranged above the transition heat conducting plate 22, a plurality of plug holes 231 corresponding to the heat conducting blocks 11 one by one are arranged on the insulating layer 23, and the insulating layer 23 plays a role in protection and insulation.

The aluminum-based circuit board of this embodiment, when using, circuit layer 1 produces heat and the insulating heat dissipation layer 2 conduction heat of connection of downward release, and the heat conduction area that is equipped with makes heat can be conducted to the below and absorbed by the effectual graphite material of heat conduction, this moment heat can outwards give off through heat conduction hole 2211, be favorable to absorbing heat fast through the graphite material, wherein a part of heat can continue on the metal basic unit 3 of heat conduction to the below, metal basic unit 3 adopts aluminum substrate heat conduction material, aluminum substrate has the effectual performance of radiating, so when this aluminum-based circuit board during operation, the heat that produces can be timely conduction to on insulating heat dissipation layer 2 of below and the metal basic unit 3, and the heat absorption material and the heat conduction hole 2211 of insulating heat dissipation layer 2 intussuseption are favorable to promoting the efficiency of absorbing circuit layer 1 heat, and can in time give off the heat, heat conduction and radiating efficiency have been improved respectively, then improve heat conduction hole 2211 cooling heat dissipation capacity.

The foregoing has shown and described the basic principles, principal features and advantages of the utility model. It will be understood by those skilled in the art that the present utility model is not limited to the above-described embodiments, and that the above-described embodiments and descriptions are only preferred embodiments of the present utility model, and are not intended to limit the utility model, and that various changes and modifications may be made therein without departing from the spirit and scope of the utility model as claimed. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims

1. The aluminum-based circuit board comprises a circuit layer (1) and a metal base layer (3) capable of transmitting heat, and is characterized in that: the method also comprises the following steps:

the insulating heat dissipation layer (2) is positioned between the circuit layer (1) and the metal base layer (3) and is used for heat dissipation and insulation protection;

the waterproof layer (4), waterproof layer (4) are located circuit layer (1) surface and can play waterproof protection's effect.

2. The aluminum-based circuit board of claim 1, wherein: a plurality of heat conduction blocks (11) capable of promoting heat conduction and transmission speed are fixedly connected below the circuit layer (1).

3. The aluminum-based circuit board of claim 2, wherein: the insulating heat dissipation layer (2) comprises an insulating seat (21), a heat dissipation cavity (211) capable of being provided with a transition heat conduction plate (22) is formed in the insulating seat (21), and a plurality of heat dissipation structures capable of improving heat dissipation efficiency are arranged around the heat dissipation cavity (211).

4. The aluminum-based circuit board of claim 3, wherein: the bottom of the heat dissipation cavity (211) is provided with a contact surface which can enlarge the contact area with the transition heat conduction plate (22).

5. The aluminum-based circuit board of claim 3, wherein: a plurality of limiting rings (221) are arranged above the transition heat conducting plate (22), the heat conducting blocks (11) are inserted and installed in the limiting rings (221) in a one-to-one correspondence mode, and a plurality of heat conducting holes (2211) which are beneficial to heat conduction are formed in each limiting ring (221).

6. The aluminum-based circuit board of claim 5, wherein: an insulating layer (23) fixedly connected with the circuit layer (1) is arranged above the transition heat conducting plate (22), and a plurality of plug holes (231) which are in one-to-one correspondence with the heat conducting blocks (11) are arranged on the insulating layer (23).

7. The aluminum-based circuit board of claim 6, wherein: the inserting holes (231) are not larger than limit rings (221) corresponding to the lower parts one by one, and heat conduction parts are formed between the transition heat conduction plates (22) and the insulating layers (23).

8. The aluminum-based circuit board of claim 1, wherein: the metal base layer (3) is made of aluminum base material heat conducting materials.