CN211040865U - Side-emitting L ED patch - Google Patents
Side-emitting L ED patch Download PDFInfo
- Publication number
- CN211040865U CN211040865U CN201922092829.XU CN201922092829U CN211040865U CN 211040865 U CN211040865 U CN 211040865U CN 201922092829 U CN201922092829 U CN 201922092829U CN 211040865 U CN211040865 U CN 211040865U
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- heat
- light
- patch
- emitting component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000017525 heat dissipation Effects 0.000 claims abstract description 58
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 34
- 229910052802 copper Inorganic materials 0.000 claims abstract description 34
- 239000010949 copper Substances 0.000 claims abstract description 34
- 239000002184 metal Substances 0.000 claims abstract description 31
- 229910052751 metal Inorganic materials 0.000 claims abstract description 31
- 239000000758 substrate Substances 0.000 claims description 19
- 238000009423 ventilation Methods 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 abstract description 13
- 230000000694 effects Effects 0.000 abstract description 4
- 238000011065 in-situ storage Methods 0.000 abstract description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Images
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Planar Illumination Modules (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The utility model discloses a luminous L ED paster of side, including L ED paster main part, the inside light-emitting component that is equipped with of L ED paster main part, the light-emitting component top is equipped with the light guide plate, light-emitting component's below is equipped with metal heating panel, metal heating panel's below is equipped with the heat-conducting part, the heat-conducting part below is equipped with heat dissipation copper base plate, metal heating panel fixed connection is between light-emitting component and heat-conducting part, the inside intermediate position of L ED paster is fixed to heat dissipation copper base plate, heat dissipation copper base plate below is equipped with the heat dissipation layer, the utility model discloses an actively the effect, this L ED paster pass through metal heating panel, the heat that heat-conducting part and heat dissipation copper base plate produced light-emitting component collects on the great heat dissipation copper base plate of surface area to heat dissipation copper base plate is located the heat dissipation in situ, can take away the heat on the heat dissipation copper.
Description
Technical Field
The utility model belongs to the technical field of L ED lamp technique and specifically relates to a luminous L ED paster of side is related to.
Background
Most of the existing L ED patches have very small volume and high power, and due to the problem of low electric energy conversion rate, other electric energy is converted into heat energy to be released, so that the existing L ED patches are easily overheated, the overheated L ED patches can reduce the electric energy conversion rate and damage L ED patches.
SUMMERY OF THE UTILITY MODEL
The utility model discloses an it is not enough to overcome above-mentioned condition, aims at providing the technical scheme that can solve above-mentioned problem.
The utility model provides a lateral lighting L ED paster, includes L ED paster main part, L ED paster main part inside is equipped with light emitting component, the light emitting component top is equipped with the light guide plate, light emitting component's below is equipped with metal heating panel, metal heating panel's below is equipped with the heat-conducting part, the heat-conducting part below is equipped with heat dissipation copper base plate, metal heating panel fixed connection is between light emitting component and heat-conducting part, heat dissipation copper base plate fixes the inside intermediate position of L ED paster, heat dissipation copper base plate below is equipped with the heat dissipation layer.
Furthermore, the two sides of the light-emitting component are provided with insulating blocks, grooves are formed in the insulating blocks, the light-emitting component is located on the grooves of the insulating blocks, and the bottom of each insulating block is fixed on the heat dissipation copper substrate.
Furthermore, the metal heat dissipation plate is located below the light emitting assembly, a heat conduction portion is arranged below the metal heat dissipation plate, two ends of the heat conduction portion are connected to the metal heat dissipation plate and the heat dissipation copper substrate, and the metal heat dissipation plate and the heat conduction portion are located in the groove of the insulating block.
Furthermore, a plurality of leads are arranged between the light-emitting component and the outer wall of the L ED patch, one end of each lead penetrates through the insulating block to be connected to the light-emitting component, and the other end of each lead penetrates through the outer part of the L ED patch to be connected with a guide sheet on the outer part of the L ED patch.
Further, the heat dissipation layer be the one deck cavity layer, the heat dissipation layer is located the below of heat dissipation copper base plate, the both sides on heat dissipation layer are equipped with a plurality of ventilation hole.
Compared with the prior art, the beneficial effects of the utility model are that this L ED paster collects the heat that light-emitting component produced on the great heat dissipation copper base plate of surface area through metal heating panel, heat-conduction portion and heat dissipation copper base plate to heat dissipation copper base plate is located the heat dissipation in situ, can take away the heat on the copper base plate that dispels the heat through the intraformational air flow of heat dissipation, and then realizes letting the effect of light-emitting component cooling, radiating effect is also great promotion.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.
Fig. 1 is a schematic sectional structure of the present invention.
Fig. 2 is a schematic top view of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely below, and it should be understood that the described embodiments are only some embodiments of the present invention, but not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Please refer to fig. 1-2, in the embodiment of the present invention, a side-emitting L ED patch, including L ED patch main body, L ED patch main body is inside to be equipped with light emitting component 2, light emitting component 2 top is equipped with light guide plate 1, light emitting component 2's below is equipped with metal heating panel 3, metal heating panel 3's below is equipped with conducting part 4, conducting part 4 below is equipped with heat dissipation copper substrate 5, metal heating panel 3 fixed connection is between light emitting component 2 and conducting part 4, heat dissipation copper substrate 5 fixes the inside intermediate position of L ED patch, heat dissipation copper substrate 5 below is equipped with heat dissipation layer 7, light emitting component 2 can produce the heat at the during operation, the heat transfer is on metal heating panel 3 of light emitting component 2 below, then transmit to conducting part 4 from metal heating panel 3, transmit to heat dissipation copper substrate 5 from conducting part 4 again, then heat dissipation copper substrate 5 is the heat on heat dissipation copper substrate 5 is taken away in heat dissipation layer 7 air flow, thereby.
As shown in fig. 1, two sides of the light emitting device 2 are provided with the insulating blocks 8, the insulating blocks 8 are provided with grooves, the light emitting device 2 is located on the grooves of the insulating blocks 8, the bottom of the insulating blocks 8 is fixed on the heat dissipation copper substrate 5, the insulating blocks 8 are used for fixing the light emitting device 2, and the insulating material is used for preventing the insulating blocks 8 from generating excessive heat due to power-on.
As shown in fig. 1, the metal heat sink 3 is located below the light emitting assembly 2, the heat conducting portion 4 is located below the metal heat sink 3, two ends of the heat conducting portion 4 are connected to the metal heat sink 3 and the heat radiating copper substrate 5, and the metal heat sink 3 and the heat conducting portion 4 are located in the groove of the insulating block 8, the insulating block 8 wraps the metal heat sink 3 and the heat conducting portion 4, so that heat transfer is more effective, most of heat generated by the light emitting assembly 2 can be transferred to the heat radiating copper substrate 5 from the metal heat sink 3 and the heat conducting portion 4, and heat release is performed.
As shown in fig. 1, a plurality of leads 10 are disposed between the light emitting module 2 and the outer wall of the L ED patch, one end of each of the plurality of leads 10 passes through the insulating block 8 and is connected to the light emitting module 2, the other end of each of the plurality of leads passes through the L ED patch and is connected to the lead 9 outside the L ED patch, the leads 10 are connected to the light emitting module 2 through the insulating block 8, so that the leads 10 are not connected to other metal parts, and therefore the leads are powered on and generate heat, unnecessary heat is generated, and the heat dissipation function is reduced, and the leads 10 are connected to the external lead for providing power for the light emitting module 2.
As shown in fig. 1, the heat dissipation layer 7 is a hollow layer, the heat dissipation layer 7 is located below the heat dissipation copper substrate 5, the two sides of the heat dissipation layer 7 are provided with a plurality of ventilation holes 6, the heat dissipation layer 7 is a hollow layer, air can flow in the heat dissipation layer 7, the heat dissipation copper substrate 5 is also located in the heat dissipation layer 7, and the air flow of the heat dissipation layer 7 can take away heat on the heat dissipation copper substrate 5, so that a rapid heat dissipation effect is achieved.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Claims (5)
1. A side-lighting L ED patch is characterized by comprising a L ED patch main body, wherein a light-emitting component is arranged inside a L ED patch main body, a light guide plate is arranged above the light-emitting component, a metal heat dissipation plate is arranged below the light-emitting component, a heat conduction part is arranged below the metal heat dissipation plate, a heat dissipation copper substrate is arranged below the heat conduction part, the metal heat dissipation plate is fixedly connected between the light-emitting component and the heat conduction part, the heat dissipation copper substrate is fixed in the middle of the inside of the L ED patch, and a heat dissipation layer is arranged below the.
2. The side-emitting L ED patch as claimed in claim 1, wherein the light-emitting component has two sides provided with insulating blocks, the insulating blocks are provided with grooves, the light-emitting component is disposed in the grooves, and the bottom of the insulating block is fixed on the heat-dissipating copper substrate.
3. The side-emitting L ED patch as claimed in claim 1, wherein the metal heat spreader is located under the light-emitting module, the heat conducting portion is located under the metal heat spreader, two ends of the heat conducting portion are connected to the metal heat spreader and the copper substrate, and the metal heat spreader and the heat conducting portion are located in the groove of the insulating block.
4. A side-emitting L ED patch as claimed in claim 1, wherein a plurality of leads are provided between the light module and the outer wall of the L ED patch, one end of the plurality of leads passing through the insulating block and connected to the light module, and the other end of the plurality of leads passing through the exterior of the L ED patch and connected to the leads on the exterior of the L ED patch.
5. The side-emitting L ED patch as claimed in claim 1, wherein the heat dissipation layer is a hollow layer, the heat dissipation layer is located under a copper substrate, and a plurality of ventilation holes are formed on two sides of the heat dissipation layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922092829.XU CN211040865U (en) | 2019-11-28 | 2019-11-28 | Side-emitting L ED patch |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922092829.XU CN211040865U (en) | 2019-11-28 | 2019-11-28 | Side-emitting L ED patch |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211040865U true CN211040865U (en) | 2020-07-17 |
Family
ID=71537241
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922092829.XU Expired - Fee Related CN211040865U (en) | 2019-11-28 | 2019-11-28 | Side-emitting L ED patch |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211040865U (en) |
-
2019
- 2019-11-28 CN CN201922092829.XU patent/CN211040865U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200717 |