CN210951229U

CN210951229U - Heat radiation structure of LED chip

Info

Publication number: CN210951229U
Application number: CN201922029219.5U
Authority: CN
Inventors: 钟胜萍
Original assignee: Shenzhen Xinke Photoelectric Technology Co ltd
Current assignee: Shenzhen Xinke Photoelectric Technology Co ltd
Priority date: 2019-11-21
Filing date: 2019-11-21
Publication date: 2020-07-07
Anticipated expiration: 2029-11-21

Abstract

The utility model discloses a heat dissipation structure of a LED chip, relating to the technical field of LED; the LED chip comprises an LED chip, an LED base, a solder mask layer, a copper clad layer, an aluminum plate, a heat conduction copper pipe and a heat dissipation base; the LED chip is fixed on the LED base, the solder mask is arranged on the upper surface of the copper clad layer, an electrode of the LED chip is electrically connected with the solder mask, an insulating layer is arranged between the copper clad layer and the aluminum plate, and a groove is formed in the upper surface of the aluminum plate; one end of the heat conduction copper pipe is a flat end, the flat end is provided with an upper plane and a lower plane, a plurality of jacks for accommodating the flat end of the heat conduction copper pipe are arranged in the groove of the aluminum plate, so that the upper plane of the flat end is in contact with the lower surface of the LED base, and the lower plane of the flat end is in contact with the aluminum plate; the heat dissipation base is fixed below the aluminum plate, and the other end of the heat conduction copper pipe is inserted into the side wall of the heat dissipation base; the utility model has the advantages that: the thermal resistance can be reduced, and the heat conduction speed is improved, so that the heat dissipation efficiency is improved, and the service life of the LED lamp is prolonged.

Description

Heat radiation structure of LED chip

Technical Field

The utility model relates to a LED technical field, more specifically the utility model relates to a heat radiation structure of LED chip.

Background

The core part of the LED is a PN junction, injected electrons directly convert electric energy into light energy when the PN junction is compounded, but not all converted light energy can be emitted to the outside of the LED, the converted light energy can be converted into heat energy by an absorption sheet in the PN junction epoxy resin/silica gel, the heat energy has huge side effect on a lamp, if the heat can not be effectively radiated, the internal temperature of the LED can be increased, the temperature is higher, the luminous efficiency of the LED is lower, the service life of the LED is shorter, and the LED wafer can be caused to lose efficacy immediately under serious conditions, so that the heat radiation realizes the huge obstacle of the application of the high-power LED.

SUMMERY OF THE UTILITY MODEL

In order to overcome the defects of the prior art, the utility model provides a heat radiation structure of LED chip, this heat radiation structure of LED chip can reduce the thermal resistance, improves heat conduction speed to promote the radiating efficiency, improved the life of LED lamps and lanterns.

The utility model provides a technical scheme that its technical problem adopted is: the improvement of a heat radiation structure of an LED chip is that: the LED chip comprises an LED chip, an LED base, a solder mask layer, a copper clad layer, an aluminum plate, a heat conduction copper pipe and a heat dissipation base;

the LED chip is fixed on the LED base, the solder mask is arranged on the upper surface of the copper clad layer, an electrode of the LED chip is electrically connected with the solder mask, an insulating layer is arranged between the copper clad layer and the aluminum plate, and a groove for accommodating the LED base is formed in the upper surface of the aluminum plate;

one end of the heat conduction copper pipe is a flat end, the flat end is provided with an upper plane and a lower plane, a plurality of jacks for accommodating the flat end of the heat conduction copper pipe are arranged in the groove of the aluminum plate, so that the upper plane of the flat end is in contact with the lower surface of the LED base, and the lower plane of the flat end is in contact with the aluminum plate; the heat dissipation base is fixed below the aluminum plate, and the other end of the heat conduction copper pipe is inserted into the side wall of the heat dissipation base.

In the structure, the heat-conducting silicone grease is filled between the aluminum plate and the heat dissipation base.

In the structure, the LED base is provided with the welding feet, the electrodes of the LED chip are connected with the welding feet through gold wires, and the welding feet are welded on the solder mask layer.

In the above structure, the lower surface of the heat dissipation base has a plurality of heat dissipation fins arranged side by side.

In the above structure, the side wall of the heat dissipation base is provided with a through hole, and the other end of the heat conduction copper pipe is inserted into the through hole.

The utility model has the advantages that: the LED lamp has the advantages that the influence of the insulating layer on the heat dissipation of the LED chip can be avoided, the thermal resistance is reduced, the heat conduction speed is improved, the heat of the LED chip can be rapidly transmitted to the heat dissipation base to be dissipated, the heat dissipation efficiency of the LED chip is effectively improved, and the stability and the service life of the LED lamp are improved.

Drawings

Fig. 1 is a schematic side view of a heat dissipation structure of an LED chip according to the present invention.

Fig. 2 is a schematic perspective view of a heat dissipation structure of an LED chip according to the present invention.

Detailed Description

The present invention will be further explained with reference to the drawings and examples.

The conception, the specific structure, and the technical effects produced by the present invention will be clearly and completely described below in conjunction with the embodiments and the accompanying drawings to fully understand the objects, the features, and the effects of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and other embodiments obtained by those skilled in the art without inventive labor based on the embodiments of the present invention all belong to the protection scope of the present invention. In addition, all the connection/connection relations referred to in the patent do not mean that the components are directly connected, but mean that a better connection structure can be formed by adding or reducing connection auxiliary components according to specific implementation conditions. The utility model discloses each technical feature in the creation can the interactive combination under the prerequisite that does not contradict conflict each other.

Referring to fig. 1 and 2, the present invention discloses a heat dissipation structure of an LED chip, specifically, the heat dissipation structure includes an LED chip 10, an LED base 20, a solder mask 30, a copper clad layer 40, an aluminum plate 50, a heat conducting copper pipe 60 and a heat dissipation base 70; the LED chip 10 is fixed on the LED base 20, the solder mask layer 30 is arranged on the upper surface of the copper-clad layer 40, the electrode of the LED chip 10 is electrically connected with the solder mask layer 30, in the embodiment, a welding pin is arranged on the LED base 20, the electrode of the LED chip 10 is connected with the welding pin through a gold thread, and the welding pin is welded on the solder mask layer 30; in addition, the LED chip 10 is encapsulated in the encapsulant, which belongs to the content of the prior art, and is not described in detail in this embodiment.

Further, an insulating layer 401 is arranged between the copper clad layer 40 and the aluminum plate 50, a groove for accommodating the LED base 20 is arranged on the upper surface of the aluminum plate 50, and the longitudinal section of the LED base 20 is stepped, so that a larger bottom plane is provided to increase the contact area between the LED base 20 and the aluminum plate 50 and improve the heat dissipation efficiency; referring to fig. 1 and 2, one end of the heat conducting copper pipe 60 is a flat end 601, the flat end 601 has an upper plane and a lower plane, a plurality of insertion holes 501 for accommodating the flat end 601 of the heat conducting copper pipe 60 are disposed in the groove of the aluminum plate 50, so that the upper plane of the flat end 601 contacts with the lower surface of the LED base 20, and the lower plane of the flat end 601 contacts with the aluminum plate 50; due to the structural design of the flat end, the contact area between the heat conducting copper pipe 60 and the aluminum plate 50 and the LED base 20 is increased, so that heat on the LED base 20 is transferred to the heat dissipation base 70; the heat dissipation base is fixed below the aluminum plate 50, and the other end of the heat conduction copper pipe 60 is inserted into the side wall of the heat dissipation base 70; in this embodiment, the thermal grease 502 is filled between the aluminum plate 50 and the heat dissipation base 70.

In addition, a through hole is formed in the side wall of the heat dissipation base 70, and the other end of the heat conducting copper pipe 60 is inserted into the through hole; the lower surface of the heat sink base 70 has a plurality of heat sink fins 701 arranged side by side.

Through this kind of structure, the heat that LED chip 10 produced, on the one hand through LED base 20 and aluminum plate 50's transmission, give off to the air through the heat radiation fin on the heat radiation base 70, on the other hand, the heat on the LED base 20 still passes through the heat conduction copper pipe, directly transmit to on the heat radiation base 70, consequently, can avoid insulating layer 401 to produce the influence to the heat dissipation of LED chip 10, the thermal resistance has been reduced, heat conduction speed has been improved, make the heat transmission that LED chip 10's heat can be quick give off to on the heat radiation base 70, thereby effectively improve LED chip 10's radiating efficiency, the stability and the life-span of LED lamps and lanterns have been improved.

While the preferred embodiments of the present invention have been described, the present invention is not limited to the above embodiments, and those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present invention, and such equivalent modifications or substitutions are intended to be included within the scope of the present invention as defined by the appended claims.

Claims

1. The utility model provides a heat radiation structure of LED chip which characterized in that: the LED chip comprises an LED chip, an LED base, a solder mask layer, a copper clad layer, an aluminum plate, a heat conduction copper pipe and a heat dissipation base;

2. The heat dissipation structure of an LED chip according to claim 1, wherein: and heat-conducting silicone grease is filled between the aluminum plate and the heat dissipation base.

3. The heat dissipation structure of an LED chip according to claim 1, wherein: the LED base on be provided with the leg, be connected through the gold thread between the electrode of LED chip and the leg, the leg welding on the solder mask.

4. The heat dissipation structure of an LED chip according to claim 1, wherein: the lower surface of the heat dissipation base is provided with a plurality of heat dissipation fins which are arranged side by side.

5. The heat dissipation structure of an LED chip according to claim 1, wherein: the side wall of the heat dissipation base is provided with a through hole, and the other end of the heat conduction copper pipe is inserted into the through hole.