CN218409587U

CN218409587U - Semiconductor LED lighting module with high heat dissipation rate

Info

Publication number: CN218409587U
Application number: CN202221487331.9U
Authority: CN
Inventors: 朱文明
Original assignee: Jiangsu Xiandai Lighting Group Co ltd
Current assignee: Jiangsu Xiandai Lighting Group Co ltd
Priority date: 2022-06-13
Filing date: 2022-06-13
Publication date: 2023-01-31
Anticipated expiration: 2032-06-13

Abstract

The utility model discloses a semiconductor LED lighting module of high heat dissipation rate belongs to semiconductor lighting technology field. Including aluminium base board, the inside of shell body is equipped with a plurality of passageways, the inside of passageway is fixed with LED lamp pearl, the bottom of LED lamp pearl is fixed with the pin, the pin passes aluminium base board and extends the lower surface of aluminium base board, be equipped with the sealing washer between pin and the aluminium base board of aluminium base board, the inside of shell body still is equipped with the heat conduction chamber, the heat conduction piece is fixed at the outer wall of passageway and is set up in the inside in heat conduction chamber, the inside packing in heat conduction chamber has the heat conduction to pack, the last fixed surface of shell body has a plurality of refrigeration pieces. The utility model discloses set up the heat conduction chamber around the lamp pearl at aluminium base board, the heat that the heat conduction chamber distributes LED lamp pearl transmits to the shell body to utilize the refrigeration piece in time to dispel the heat, promoted the heat dissipation rate of illumination module greatly; the heat conduction cavity is internally provided with the heat conduction fins and filled with the heat conduction filler, so that the heat conduction coefficient between the aluminum substrate and the shell is improved, and the heat dissipation efficiency is increased.

Description

Semiconductor LED lighting module with high heat dissipation rate

Technical Field

The utility model relates to a semiconductor lighting technology field specifically is semiconductor LED lighting module of high heat dissipation rate.

Background

Along with the development of urbanization construction, semiconductor LED lighting module has obtained more and more extensive application, for the LED semiconductor, the heat dissipation is especially important, the miniaturized also more and more favoured of heat dissipation LED base plate high power, in order to solve LED base plate heat conduction heat dissipation problem, select metal substrate (aluminium base board) that heat conduction radiating effect is good for use as the heating panel usually, nevertheless because the existence of the little this bottleneck of insulating layer coefficient of heat conductivity between circuit layer and the metal sheet, make metal substrate's heat conduction heat dispersion also have certain limitation, lead to semiconductor LED lighting module's whole radiating rate to hang down.

SUMMERY OF THE UTILITY MODEL

In order to solve the problem, the utility model provides a semiconductor LED lighting module of high heat dissipation rate.

The utility model discloses a realize through following technical scheme:

the utility model provides a semiconductor LED lighting module of high heat dissipation rate, includes aluminium base board, the last fixed surface of aluminium base board has the shell body, the inside of shell body is equipped with a plurality of passageways, the inside of passageway is fixed with LED lamp pearl, the bottom of LED lamp pearl is fixed with the pin, the pin passes aluminium base board and extends the lower surface of aluminium base board, be equipped with the sealing washer between pin and the aluminium base board of aluminium base board, the inside of shell body still is equipped with heat conduction chamber, heat conduction chamber is located between the passageway, the conducting strip is fixed at the outer wall of passageway and is set up in the inside in heat conduction chamber, heat conduction chamber's inside packing has the heat conduction filler, the last fixed surface of shell body has a plurality of refrigeration pieces.

And wire grooves are formed in two sides of the outer shell.

The heat conducting fins are horizontally fixed on the outer wall of the channel.

The heat-conducting filler is alumina powder.

Compared with the prior art, the beneficial effects of the utility model are that:

the utility model discloses set up the shell body on the upper surface of aluminium base board to fix LED lamp pearl inside the shell body, set up the heat conduction chamber around the lamp pearl, the heat conduction chamber transmits the heat that LED lamp pearl distributes to the shell body, and utilize the refrigeration piece in time to dispel the heat, promoted the heat dissipation rate of lighting module greatly; the heat conduction intracavity sets up the conducting strip to it has the heat conduction filler to fill, has promoted the coefficient of heat conductivity between aluminium base board and the shell body, has increased the radiating efficiency.

Drawings

Fig. 1 is a schematic structural diagram of the present invention.

In the figure: 1. an outer housing; 2. an aluminum substrate; 3. an LED lamp bead; 4. a channel; 5. a seal ring; 6. a pin; 7. a heat conductive sheet; 8. a heat conducting cavity; 9. a wire guide groove; 10. a refrigeration sheet.

Detailed Description

The present invention will be further explained with reference to the accompanying drawings:

as shown in the attached drawing fig. 1 of the specification, a semiconductor LED lighting module with high heat dissipation rate comprises an aluminum substrate 2, an outer shell 1 is fixed on the upper surface of the aluminum substrate 2, a plurality of channels 4 are arranged inside the outer shell 1, LED beads 3 are fixed inside the channels 4, pins 6 are fixed at the bottoms of the LED beads 3, the pins 6 penetrate through the aluminum substrate 2 and extend to the lower surface of the aluminum substrate 2, sealing rings 5 are arranged between the pins 6 and the aluminum substrate 2, a heat conduction cavity 8 is further arranged inside the outer shell 1, the heat conduction cavity 8 is located between the channels 4, heat conduction fins 7 are fixed on the outer wall of the channels 4 and are arranged inside the heat conduction cavity 8, heat conduction fillers are filled inside the heat conduction cavity 8, and a plurality of refrigeration fins 10 are fixed on the upper surface of the outer shell 1.

And both sides of the outer shell 1 are provided with wire grooves 9.

The heat conducting fins 7 are horizontally fixed on the outer wall of the channel 4.

The heat-conducting filler is alumina powder.

Example 1

The utility model provides a semiconductor LED lighting module of high heat dissipation rate, including aluminium base board 2, the last fixed surface of aluminium base board 2 has shell body 1, the inside of shell body 1 is equipped with a plurality of passageways 4, passageway 4's inside is fixed with LED lamp pearl 3, the bottom of LED lamp pearl 3 is fixed with pin 6, pin 6 passes aluminium base board 2 and extends the lower surface of aluminium base board 2, be equipped with sealing washer 5 between pin 6 and the aluminium base board 2 of aluminium base board, the inside of shell body 1 still is equipped with heat conduction chamber 8, heat conduction chamber 8 is located between passageway 4, heat conduction piece 7 is fixed at the outer wall of passageway 4 and is set up in the inside of heat conduction chamber 8, the inside packing of heat conduction chamber 8 has heat conduction filler, the last fixed surface of shell body 1 has a plurality of refrigeration pieces 10, heat conduction piece 7 level is fixed at the outer wall of passageway 4, heat conduction filler is alumina powder

In the embodiment, a plurality of channels are arranged inside the shell, the LED lamp beads 3 are arranged inside the channels, the pins 6 below the LED lamp beads 3 penetrate through the aluminum substrate 2 and extend to the lower portion of the aluminum substrate, in operation, the LED lamp beads generate heat, the heat emitted by the LED lamp beads is transmitted to the shell body 1 through the heat conducting cavity 8, the refrigeration fins 10 are utilized to dissipate heat in time, the heat conducting fins 7 and the heat conducting filler inside the heat conducting cavity 8 increase the heat conductivity coefficient between the aluminum substrate and the shell body, and the heat dissipation rate of the semiconductor LED lighting module is greatly improved.

Example 2

The utility model provides a semiconductor LED lighting module of high heat dissipation rate, including aluminium base board 2, the last fixed surface of aluminium base board 2 has shell body 1, the inside of shell body 1 is equipped with a plurality of passageways 4, passageway 4's inside is fixed with LED lamp pearl 3, the bottom of LED lamp pearl 3 is fixed with pin 6, pin 6 passes aluminium base board 2 and extends the lower surface of aluminium base board 2, be equipped with sealing washer 5 between pin 6 and the aluminium base board 2 of aluminium base board, the inside of shell body 1 still is equipped with heat conduction chamber 8, heat conduction chamber 8 is located between the passageway 4, heat conduction piece 7 is fixed at passageway 4's outer wall and is set up the inside at heat conduction chamber 8, the inside packing in heat conduction chamber 8 has the heat conduction filler, the last fixed surface of shell body 1 has a plurality of refrigeration pieces 10.

The both sides of shell body 1 are equipped with metallic channel 9, and the wire that refrigeration piece 10 is connected can pass metallic channel 9 and accomodate, and the heat of metallic channel also can dispel to heat conduction chamber 8 to carry out timely heat dissipation through refrigeration piece 10.

In summary, the present invention is only a preferred embodiment, and is not intended to limit the scope of the present invention, and all equivalent changes and modifications of the shapes, structures, features and spirit described in the claims of the present invention should be included in the scope of the present invention.

Claims

1. The utility model provides a semiconductor LED lighting module of high heat dissipation rate which characterized in that: including aluminium base board (2), the last fixed surface of aluminium base board (2) has shell body (1), the inside of shell body (1) is equipped with a plurality of passageways (4), the inside of passageway (4) is fixed with LED lamp pearl (3), the bottom of LED lamp pearl (3) is fixed with pin (6), pin (6) pass aluminium base board (2) and extend the lower surface of aluminium base board (2), be equipped with sealing washer (5) between pin (6) and the aluminium base board (2) of aluminium base board, the inside of shell body (1) still is equipped with heat conduction chamber (8), heat conduction chamber (8) are located between passageway (4), and heat conduction piece (7) are fixed at the outer wall of passageway (4) and are set up in the inside of heat conduction chamber (8), the inside packing of heat conduction chamber (8) has the heat conduction filler, the last fixed surface of shell body (1) has a plurality of refrigeration pieces (10).

2. The high heat dissipation rate semiconductor LED lighting module of claim 1, wherein: and wire grooves (9) are arranged on two sides of the outer shell (1).

3. The high heat dissipation rate semiconductor LED lighting module of claim 1, wherein: the heat conducting fins (7) are horizontally fixed on the outer wall of the channel (4).

4. The high heat dissipation rate semiconductor LED lighting module of claim 1, wherein: the heat-conducting filler is alumina powder.