CN212010965U

CN212010965U - LED drive IC packaging structure with light emitting function

Info

Publication number: CN212010965U
Application number: CN202020919495.9U
Authority: CN
Inventors: 邹猛
Original assignee: Shenzhen Xinshengan Technology Co ltd
Current assignee: Shenzhen Xinshengan Technology Co ltd
Priority date: 2020-05-27
Filing date: 2020-05-27
Publication date: 2020-11-24
Anticipated expiration: 2030-05-27

Abstract

The utility model belongs to the technical field of the LED driver IC technique and specifically relates to a LED driver IC packaging structure with luminous function, including LED driver IC, LED driver IC fixes and is equipped with the aluminum sheet, aluminum sheet and the fixed insulating packaging body that is equipped with of LED driver IC, the fixed a plurality of pins that is equipped with of LED driver IC symmetry, the fixed insulating heat insulating board that is equipped with of insulating packaging body, the fixed U-shaped conducting strip that is equipped with of insulating heat insulating board, the fixed LED unit that is equipped with of U-shaped conducting strip, the fixed a plurality of square fin that is equipped with of U-shaped conducting strip symmetry, the aluminum sheet is fixed and is equipped with a plurality of microscler fin, the insulating packaging body equidistance is equipped with a plurality ofly and microscler through. The utility model discloses on ordinary LED drive IC packaging structure's basis, set up heat abstractor, improved radiating effect and life, have wide market prospect, be fit for promoting.

Description

LED drive IC packaging structure with light emitting function

Technical Field

The utility model relates to a LED driver IC technical field especially relates to a LED driver IC packaging structure with luminous function.

Background

Along with the continuous development of science and technology, more and more IC design manufacturers add LED design teams, however, most LED drive ICs appearing in the market at present need to be separately insulated and packaged due to the fact that the LED drive ICs and the LED units are separately and independently arranged, the production cost is high, meanwhile, the existing LED drive ICs generally have the defect of poor heat dissipation effect, the service life of the LED drive ICs is short, and aiming at the defects, an LED drive IC packaging structure with the light emitting function is provided to replace the old packaging structure, and the life requirements of people are met.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the shortcoming that the radiating effect is not ideal enough in the prior art, and the LED driver IC packaging structure who provides a luminous function.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the LED drive IC packaging structure with the light-emitting function comprises an LED drive IC, the LED drive IC comprises a circuit board assembly, a drive IC chip is fixedly arranged on one side of the upper surface of the circuit board assembly, a plurality of LED chips are fixedly arranged on one side, far away from the drive IC chip, of the upper surface of the circuit board assembly, an aluminum sheet is fixedly arranged on the lower surface of the LED drive IC, an insulating packaging body is fixedly arranged on the surfaces of the aluminum sheet and the LED drive IC, a plurality of pins are fixedly arranged at equal intervals on two sides of the LED drive IC, one side, far away from the LED drive IC, of each pin penetrates through one side of the insulating packaging body and extends to one side of the insulating packaging body, an insulating heat-insulating plate is fixedly arranged on one side of the inner wall of the insulating packaging body, a U-shaped heat-conducting sheet is fixedly arranged on the upper surface of the insulating packaging body, an LED unit is fixedly arranged in the middle of the upper surface of the U The heat radiator comprises a U-shaped heat conducting fin, wherein a plurality of long radiating grooves are symmetrically arranged on two sides of the U-shaped heat conducting fin at equal intervals, a plurality of long radiating fins are fixedly arranged on the lower surface of an aluminum sheet at equal intervals, one side, far away from the aluminum sheet, of each long radiating fin penetrates through the insulating packaging body and extends to one side of the insulating packaging body, and a plurality of long penetrating grooves corresponding to the long radiating fins are arranged on the lower surface of the insulating packaging body at equal intervals.

Preferably, the plurality of LED chips are a red LED chip, a green LED chip, and a blue LED chip, respectively.

Preferably, the plurality of pins are a red LED driving output pin, a green LED driving output pin, a blue LED driving output pin, a ground output pin, an output pin, a data input pin, and a power supply pin, respectively.

Preferably, the side length of the square radiating fins is the same as the width of the long radiating fins, and the plurality of square radiating fins are not in contact with the long radiating fins.

Preferably, a lamp strip is fixedly arranged on the surface of the insulating packaging body.

Preferably, the LED driving IC, the insulating thermal board, the U-shaped heat conductive sheet, and the LED unit are all located inside the insulating package.

The utility model provides a pair of LED driver IC packaging structure with luminous function, beneficial effect lies in: the utility model discloses compact structure, the volume is less, has saved independent encapsulation LED unit, has reduced manufacturing cost, mutually supports simultaneously with the lamp area and is convenient for arrange, and is more pleasing to the eye, through setting up square fin, microscler radiating groove and microscler fin, can be effectively right the utility model discloses a carry out the work of dispelling the heat, prolong the utility model discloses a life is through setting up insulating heat insulating board and square fin and all not contact with microscler fin, can effectually avoid influencing each other between the heat that drive IC and LED unit produced.

Drawings

Fig. 1 is a front view of an LED driver IC package structure with a light emitting function according to the present invention;

fig. 2 is a split view of an LED driver IC package structure with light emitting function according to the present invention;

fig. 3 is a cross-sectional view of an LED driver IC package structure with a light emitting function according to the present invention.

In the figure: the LED light source comprises a drive IC1, a long through groove 2, a lamp strip 3, an aluminum sheet 4, an insulating packaging body 5, pins 6, an insulating thermal baffle 7, a U-shaped heat conducting sheet 8, an LED unit 9, a square heat radiating fin 10, a long heat radiating groove 11, a long heat radiating fin 12, a circuit board assembly 101, a drive IC chip 102 and an LED chip 103.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

Referring to fig. 1-3, an LED driver IC package structure with a light emitting function includes an LED driver IC1, the LED driver IC1 includes a circuit board assembly 101, a driver IC chip 102 is fixedly disposed on one side of the upper surface of the circuit board assembly 101, a plurality of LED chips 103 are fixedly disposed on one side of the upper surface of the circuit board assembly 101 away from the driver IC chip 102, an aluminum sheet 4 is fixedly disposed on the lower surface of the LED driver IC1, an insulating package 5 is fixedly disposed on the surfaces of the aluminum sheet 4 and the LED driver IC1, a plurality of pins 6 are symmetrically and equidistantly disposed on two sides of the LED driver IC1, one sides of the pins 6 away from the LED driver IC1 extend to one side of the insulating package 5 through the insulating package 5, an insulating thermal insulating board 7 is fixedly disposed on one side of the inner wall of the insulating package 5, a U-shaped thermal conductive sheet 8 is fixedly disposed on the upper surface of the insulating thermal board 7, an LED unit 9 is fixedly disposed in the middle of the upper, one side of the inner wall of the U-shaped heat conducting fin 8 penetrates through the insulating packaging body (5) and is symmetrically and equidistantly fixedly provided with a plurality of square radiating fins 10, two sides of the U-shaped heat conducting fin 8 are symmetrically and equidistantly provided with a plurality of long radiating grooves 11, the lower surface of the aluminum sheet 4 is equidistantly and fixedly provided with a plurality of long radiating fins 12, one side, far away from the aluminum sheet 4, of each long radiating fin 12 penetrates through the insulating packaging body 5 and extends to one side of the insulating packaging body 5, and a plurality of long penetrating grooves 2 corresponding to the long radiating fins 12 are equidistantly arranged on the lower surface of the insulating packaging body 5.

Referring to fig. 1 to 3, in an LED driver IC package structure with a light emitting function, a plurality of LED chips 103 are respectively a red LED chip, a green LED chip, and a blue LED chip, a plurality of pins 6 are respectively a red LED driver output pin, a green LED driver output pin, a blue LED driver output pin, a ground output pin, an output pin, a data input pin, and a power supply pin, a side length of the square heat sink 10 is the same as a width of the long heat sink 12, the plurality of square heat sinks 10 are not in contact with the long heat sink 12, and a light strip 3 is fixed on a surface of the insulating package 5.

The utility model provides a LED driver IC packaging structure with light-emitting function, when using, after data input pin accepts the data that come from transmitting in the follow controller, send to driver IC chip 102 through handling, then the data that the unnecessary data was transmitted to next data input pin driver IC chip 102 through data output pin after enlargiing is handled and is transmitted to red LED chip, green LED chip or blue LED chip with the way of electric signal, then from red LED driver output pin, green LED driver output pin or blue LED driver output pin output control LED unit 9 work again, the heat that driver IC1 produced passes through aluminum sheet 4 and transmits to microscler fin 12, the heat that LED unit 9 during operation produced passes through U-shaped conducting strip 8 and transmits to square fin 10, because square fin 10 and microscler fin 12 all are located insulating packaging body 5 outsidely, the heat of the square heat sink 10 and the long heat sink 12 is directly transferred to the outside through the long heat sink 11, thereby accelerating the heat dissipation.

The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims

1. The LED driving IC packaging structure with the light emitting function comprises an LED driving IC (1) and is characterized in that the LED driving IC (1) comprises a circuit board assembly (101), a driving IC chip (102) is fixedly arranged on one side of the upper surface of the circuit board assembly (101), a plurality of LED chips (103) are fixedly arranged on one side, away from the driving IC chip (102), of the upper surface of the circuit board assembly (101), an aluminum sheet (4) is fixedly arranged on the lower surface of the LED driving IC (1), insulating packaging bodies (5) are fixedly arranged on the surfaces of the aluminum sheet (4) and the LED driving IC (1), a plurality of pins (6) are fixedly arranged on two sides of the LED driving IC (1) symmetrically at equal intervals, one side, away from the LED driving IC (1), of each pin (6) extends to one side of each insulating packaging body (5) through each insulating packaging body (5), and an insulating heat insulation board (7) is fixedly arranged on one side of the inner wall of each insulating packaging body (, the upper surface of insulating and heat insulating board (7) is fixed and is equipped with U-shaped conducting strip (8), the fixed LED unit (9) that is equipped with in the middle of U-shaped conducting strip (8) upper surface, one side of U-shaped conducting strip (8) inner wall is run through insulating packaging body (5) and the fixed a plurality of square fin (10) that are equipped with of symmetry equidistance, the bilateral symmetry equidistance of U-shaped conducting strip (8) is equipped with a plurality of microscler radiating grooves (11), the lower surface equidistance of aluminum sheet (4) is fixed and is equipped with a plurality of microscler radiating fins (12), one side that aluminium sheet (4) were kept away from in microscler radiating fin (12) all runs through insulating packaging body (5) and extends to one side of insulating packaging body (5), the lower surface equidistance of insulating packaging body (5) is equipped with a plurality of microscler.

2. The LED driver IC package structure with light emitting function according to claim 1, wherein the plurality of LED chips (103) are red LED chips, green LED chips and blue LED chips, respectively.

3. The LED driver IC package structure with light emitting function according to claim 1, wherein the plurality of pins (6) are a red LED driver output pin, a green LED driver output pin, a blue LED driver output pin, a ground output pin, an output pin, a data input pin, and a power supply pin, respectively.

4. The LED driver IC package structure with light emitting function according to claim 1, wherein the side length of the square heat sink (10) is the same as the width of the long heat sink (12), and none of the square heat sinks (10) is in contact with the long heat sink (12).

5. The LED driver IC package structure with the light emitting function according to claim 1, wherein a light strip (3) is fixed on the surface of the insulating package (5).

6. The LED driver IC package structure with light emitting function according to claim 1, wherein the LED driver IC (1), the insulating board (7), the U-shaped heat conducting fin (8) and the LED unit (9) are all located inside the insulating package (5).