CN201416868Y - A LED high efficiency heat-yielding and heat-conducting mechanism - Google Patents
A LED high efficiency heat-yielding and heat-conducting mechanism Download PDFInfo
- Publication number
- CN201416868Y CN201416868Y CN2009201383053U CN200920138305U CN201416868Y CN 201416868 Y CN201416868 Y CN 201416868Y CN 2009201383053 U CN2009201383053 U CN 2009201383053U CN 200920138305 U CN200920138305 U CN 200920138305U CN 201416868 Y CN201416868 Y CN 201416868Y
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- heat
- led
- high efficiency
- conducting mechanism
- annular metal
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
Abstract
The utility model relates to a LED high efficiency heat-yielding and heat-conducting mechanism, which comprises an annular metal heat-conducting barrel, wherein lower surface of the annular metal heat-conducting barrel is scattered with grooves; each groove is provided with a LED chip inside. Compared with prior art, heat generated by the LED chip in the utility model is yielded through the annular metal heat-conducting barrel directly, which makes temperature of the LED greatly reduced when working, and extends service life of the LED, achieving purpose of high efficiency and energy saving.
Description
Technical field
The utility model relates to a kind of LED heat-conducting mechanism.
Background technology
LED illumination is the new industry of semiconductor and the combination of traditional lighting industry, is one of new high-tech industry of tool development prospect.Semiconductor lighting has advantages such as long-life, energy-conservation, environmental protection, rich color, no stroboscopic, no infrared and ultraviolet radiation as new and effective solid light source, will become the leap again after incandescent lamp, fluorescent lamp on the human history.
Yet LED will develop at lighting field, enters special lighting market, and strides forward to general lighting market, and key will be with its luminous efficiency, and luminous flux is increased to the grade of existing lighting source, promptly needs to study great power LED.
Large power white light LED mainly obtains white light according to light compositing colour mixture principle at present, uses INGaN (blue light) chip to send blue light and excites yellow YAG (fluorescent material) to be mixed into white light.The great power LED solid state light emitter that this scheme is produced, light efficiency can reach 40～100lm/w, and single-chip power can be produced 1W, 3W, 5W, and multicore sheet power can be accomplished hectowatt grade.Because improving constantly of led chip input power, under powerful situation, product has generated heat into main problem, athermic originally " cold light source ", but become the solid state light emitter of " heating ", the result of heating must influence photoelectric transformation efficiency and life of product.LED solid-state illumination light source need solve the heat dissipation problem of following several links: chip is tied epitaxial loayer; Epitaxial loayer is to base plate for packaging; Base plate for packaging is to cooling device, and these three links constitute the heat conducting passage of solid-state illumination light source, but in fact, heat conduction through these three links, radiating efficiency is very low, in great power LED, certainly will influence photoelectric transformation efficiency and life of product greatly.
CN2906933Y discloses a kind of " white light LED package radiating structure ", the heat that sends during its work, be dissipated on the pin frame by promptly leading with the heat radiation glue-line of its bonding, lead through the foot of pin frame again and shed, the operating temperature of LED is controlled at below 65 ℃, and then has prolonged the service life of LED.But its radiating rate is slow, does not reach real high efficiency and heat radiation.
CN201062783 discloses a kind of " LED light heat radiation board ", is connected with heat pipe and is constituted by substrate, dispels the heat by the heat conduction of substrate and heat pipe, need carry out heat transmission by substrate between led chip and the heat pipe, and its radiating effect is not good.
CN201093439 discloses a kind of " LED heat-radiating substrate ", comprise a printed circuit board (PCB), one folded heat-radiating substrate or the heat conduction Copper Foil that is located under the printed circuit board (PCB) bottom surface, an and LED who is located on the printed circuit board top surface and electrically connects with the printed circuit board surface copper-foil conducting electricity, printed circuit board (PCB) has a perforation that runs through, the first copper radiating block of tight embedding one and the welding of LED bottom surface in this perforation, and the bottom surface of this first copper radiating block and aluminium matter or copper heat-radiating substrate or heat conduction Copper Foil are directly led and are touched, via radiating block, heat-radiating substrate dispels the heat, radiating effect is not good yet, is difficult to satisfy the radiating requirements of great power LED.
The utility model content
Main purpose of the present utility model is to overcome the shortcoming of prior art, and a kind of LED high efficiency and heat radiation heat-conducting mechanism simple in structure is provided.
The utility model adopts following technical scheme:
A kind of LED high efficiency and heat radiation heat-conducting mechanism comprises a metal heat sink, and this metal heat sink is provided with at least one groove, and a led chip is installed in each groove.
According to a better embodiment of the present utility model, described metal heat sink is the annular metal heat-dissipating cylinder, and the lower surface of this annular metal heat-dissipating cylinder disperses to be provided with groove, and a led chip is installed in each groove.
According to a better embodiment of the present utility model, described annular metal heat-dissipating cylinder is made of two-layer at least copper aluminium sheet lamination.
According to a better embodiment of the present utility model, the cross section of described annular metal heat-dissipating cylinder is circle, ellipse, rectangle, square, rhombus or triangle etc.
According to a better embodiment of the present utility model, described led chip directly is welded in described groove.
According to a better embodiment of the present utility model, described led chip is fixed in the described groove by a thermal conductive silicon glue-line or epoxy resin layer.
By above-mentioned to description of the present utility model as can be known, compared with prior art, in a kind of LED high efficiency and heat radiation heat-conducting mechanism of the present utility model, led chip is directly installed on the lower surface of annular metal heat-dissipating cylinder, the heat dissipation metal tube is the LED base plate for packaging, also be to connect outside cooling device, make heat that LED work the time sends can by the annular metal heat-dissipating cylinder just base plate for packaging promptly lead and shed, make the operating temperature of LED be controlled at more low temperature (65 ℃), and be applicable to higher operating temperature (reaching-30～85 ℃), efficiently solve the problem in service life of LED, and reached energy-efficient, produce the green light source that has truly, it is long to have a life-span, low power consumption and other advantages, alternative high-pressure mercury lamp, Metal halogen lamp, iodine-tungsten lamp, xenon flash lamps etc. are used for Tunnel Lamp, auto lamp, spacious lamp, flashlight, Projecting Lamp, flash lamp, on the products such as street lamp.
Description of drawings
Fig. 1 is an overall structure schematic diagram of the present utility model;
Fig. 2 is a part sectional structure schematic diagram of the present utility model.
The specific embodiment
Below the utility model will be further described by the specific embodiment.
See figures.1.and.2, a kind of LED high efficiency and heat radiation heat-conducting mechanism of the present utility model, comprise an annular metal heat-dissipating cylinder 10, the lower surface of this annular metal heat-dissipating cylinder 10 disperses to be provided with a plurality of grooves 20, by a thermal conductive silicon glue-line or epoxy resin layer 50 led chip 30 is installed in each groove 20, the centre of this annular metal heat-dissipating cylinder 10 is the double-deck line plate 40 of an annular.The series connection back is in parallel earlier for 30 of each led chips, is connected on the double-deck line plate 40 of centre of annular metal heat-dissipating cylinder 10 by two lead-in wires at last, and double-deck line plate 40 promptly is the driving circuit device of LED.
Annular metal heat-dissipating cylinder 10 is made of two-layer at least copper aluminium sheet lamination, and annular metal heat-dissipating cylinder 10 is the LED base plate for packaging, also is to connect outside cooling device so that LED is dispelled the heat.Led chip 30 is realized 360 ° of light-emitting areas of concentrating type LED ring-type, thereby is successfully developed W level, hundred W level LED solid state light emitters by series, parallel.
The utility model is when work, and the heat that led chip 30 sends directly distributes by annular metal heat-dissipating cylinder 10, and the temperature when making LED work reduces greatly, has improved the service life of LED, reaches energy-efficient purpose.
Above-mentioned only is a specific embodiment of the present utility model, but design concept of the present utility model is not limited thereto, and allly utilizes this design that the utility model is carried out the change of unsubstantiality, all should belong to the behavior of invading the utility model protection domain.
Claims (6)
1, a kind of LED high efficiency and heat radiation heat-conducting mechanism, it is characterized in that: it comprises a metal heat sink, this metal heat sink is provided with at least one groove, and a led chip is installed in each groove.
2, a kind of LED high efficiency and heat radiation heat-conducting mechanism as claimed in claim 1, it is characterized in that: described metal heat sink is the annular metal heat-dissipating cylinder, the lower surface of this annular metal heat-dissipating cylinder disperses to be provided with groove, and a led chip is installed in each groove.
3, a kind of LED high efficiency and heat radiation heat-conducting mechanism as claimed in claim 2, it is characterized in that: described annular metal heat-dissipating cylinder is made of two-layer at least copper aluminium sheet lamination.
4, a kind of LED high efficiency and heat radiation heat-conducting mechanism as claimed in claim 2 is characterized in that: the cross section of described annular metal heat-dissipating cylinder is circle, ellipse, rectangle, square, rhombus or triangle etc.
5, a kind of LED high efficiency and heat radiation heat-conducting mechanism as claimed in claim 1 or 2, it is characterized in that: described led chip directly is welded in described groove.
6, a kind of LED high efficiency and heat radiation heat-conducting mechanism as claimed in claim 1 or 2, it is characterized in that: described led chip is fixed in the described groove by a thermal conductive silicon glue-line or epoxy resin layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201383053U CN201416868Y (en) | 2009-05-07 | 2009-05-07 | A LED high efficiency heat-yielding and heat-conducting mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201383053U CN201416868Y (en) | 2009-05-07 | 2009-05-07 | A LED high efficiency heat-yielding and heat-conducting mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201416868Y true CN201416868Y (en) | 2010-03-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009201383053U Expired - Fee Related CN201416868Y (en) | 2009-05-07 | 2009-05-07 | A LED high efficiency heat-yielding and heat-conducting mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201416868Y (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102102819A (en) * | 2011-03-03 | 2011-06-22 | 东莞市远大光电科技有限公司 | LED illuminating device with high luminous efficiency |
| CN102102820A (en) * | 2011-03-03 | 2011-06-22 | 东莞市远大光电科技有限公司 | LED lighting device having excellent radiating function |
| CN102102821A (en) * | 2011-03-03 | 2011-06-22 | 东莞市远大光电科技有限公司 | LED (light emitting diode) illuminating device with good heat dissipation and high color rendering |
| CN102121613A (en) * | 2011-03-03 | 2011-07-13 | 东莞市远大光电科技有限公司 | LED (light emitting diode) illumination device with high lighting effect and high color rendering properties |
| CN103322535A (en) * | 2012-03-20 | 2013-09-25 | 金松山 | Groove type radiator for LED lamp |
| CN105042361A (en) * | 2015-06-24 | 2015-11-11 | 深圳市莱威光电子有限公司 | Wireless intelligent three-path mixed-light LED module |
-
2009
- 2009-05-07 CN CN2009201383053U patent/CN201416868Y/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102102819A (en) * | 2011-03-03 | 2011-06-22 | 东莞市远大光电科技有限公司 | LED illuminating device with high luminous efficiency |
| CN102102820A (en) * | 2011-03-03 | 2011-06-22 | 东莞市远大光电科技有限公司 | LED lighting device having excellent radiating function |
| CN102102821A (en) * | 2011-03-03 | 2011-06-22 | 东莞市远大光电科技有限公司 | LED (light emitting diode) illuminating device with good heat dissipation and high color rendering |
| CN102121613A (en) * | 2011-03-03 | 2011-07-13 | 东莞市远大光电科技有限公司 | LED (light emitting diode) illumination device with high lighting effect and high color rendering properties |
| CN103322535A (en) * | 2012-03-20 | 2013-09-25 | 金松山 | Groove type radiator for LED lamp |
| CN105042361A (en) * | 2015-06-24 | 2015-11-11 | 深圳市莱威光电子有限公司 | Wireless intelligent three-path mixed-light LED module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100303 Termination date: 20140507 |