CN201909274U - RGB (red, green and blue) three-colored LED (light-emitting diode) point light source - Google Patents
RGB (red, green and blue) three-colored LED (light-emitting diode) point light source Download PDFInfo
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- CN201909274U CN201909274U CN2010206817920U CN201020681792U CN201909274U CN 201909274 U CN201909274 U CN 201909274U CN 2010206817920 U CN2010206817920 U CN 2010206817920U CN 201020681792 U CN201020681792 U CN 201020681792U CN 201909274 U CN201909274 U CN 201909274U
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Abstract
An RGB three-colored LED point light source comprises a printed circuit board and at least one LED chip positioned on the printed circuit board, wherein the LED chips are positioned in a chip chamber, the printed circuit board comprises a heating panel arranged at a bottom layer, the heating panel is tightly connected with a heat conducting layer, an insulation layer is arranged at the upper part of the heat conducting layer, the LED chips are distributed on the insulation layer, and the LED chips are connected with a common anode pin and cathode pins. The heating panel is made of beryllium copper with high electrical conductivity, thermal conductivity, hardness, wearing resistance and creep deformation resistance, and very strong corrosion resistance, so as to completely and effectively protect the chips of the LED point light source, and greatly prolong the service life of the heating panel; with respect to the structure, the LED point light source adopts an ultrathin heat dissipation base plate structural design, and one heat conducting layer is additionally arranged and can timely conduct heat generated by an LED to the lower heating panel, so that the heat can be smoothly dissipated, the thermal resistance is small, the heat conduction is fast, and the occurrence of heat accumulation effect is avoided.
Description
Technical field
The utility model relates to and is used for view and decorative lighting light source module, relates in particular to high-power, the high brightness LED led light source module as lighting source, belongs to technical field of semiconductor illumination.
Background technology
The LED illumination is the new industry of semiconductor and the combination of traditional lighting industry, is to have one of high-tech industry of development prospect most.Semiconductor lighting has distinguishing features such as long-life, energy-conservation, environmental protection, rich color, microminiaturization as new and effective solid light source, to become the leap again after incandescent lamp, fluorescent lamp on the human illumination history, semiconductor lighting is causing the revolution of worldwide lighting source.It also will become the light source of new generation of conventional light source such as alternative conventional incandescent, fluorescent lamp and high-voltage gas discharging light.
LED will develop at lighting field, enters the market segment of special lighting, and strides forward to general lighting market, and key is the grade that its luminous efficiency, luminous flux will be increased to existing lighting source, promptly needs to develop great power LED.Because improving constantly of led chip input power had higher requirement to the encapsulation technology of these power-type LEDs.The power-type LED encapsulation technology mainly should satisfy following 2 requirements: the one, and encapsulating structure will have height and get optical efficiency; It two is that thermal resistance is low as far as possible, with photoelectric properties and the reliability of guaranteed output LED.The used epitaxial material of power-type LED adopts growth technology and the multi-quantum pit structure of MOCVD, though its internal quantum efficiency also need further to improve, the biggest obstacle that obtains high luminous flux be still chip to get optical efficiency low.The design of existing power-type LED has adopted the flip chip bonding new construction to improve the optical efficiency of getting of chip, improves the thermal characteristics of chip, and by increasing chip area, strengthens operating current and improve the photoelectric transformation efficiency of device, thereby obtain higher luminous flux.Except chip, the LED encapsulating products plays a part to form a connecting link in the development of whole industry chain.Industry should drop into bigger dynamics and research and develop, and having the encapsulation technology of autonomous property right, thereby catches up with the package level in the world.Having only the raising package level, the LED industry is run business big and strong, is China exploitation international market, participates in competition in the international market and expansion application product field and market and lays a solid foundation.In addition, have only the encapsulation industry is run business big and strong, the development of operation extension, chip industry before could promoting just can make the whole LED industrial chain obtain to develop biglyyer.About the intellectual property situation the semiconductor industry international division of labor and corresponding distribution of interests, want to improve the international competitiveness of China's field of semiconductor illumination, must independent intellectual property right be arranged in the high power field.
Summary of the invention
The purpose of this utility model provides the high-power RGB three-color LED spot light of a kind of rational in infrastructure, good heat dissipation effect, long service life.
For achieving the above object, the utility model is by the following technical solutions:
The utility model comprises printed circuit board (PCB) and is positioned at least one led chip on the printed circuit board (PCB), it is indoor that described led chip is positioned at chip, described printed circuit board (PCB) comprises the heat sink of bottom, heat sink closely is connected with heat-conducting layer, insulating barrier is set above described heat-conducting layer, and led chip distributes on the insulating barrier; And described led chip connects public anodal pin and negative pole pin.
Described heat sink and heat-conducting layer are flat board, and the two closely contacts.
The lower surface of described heat-conducting layer is provided with projection, and the upper surface of heat sink is provided with the groove that matches with projection.
Described heat sink is beallon plate or aluminium alloy plate.
Described heat-conducting layer is corronil plate or molybdenum-copper plate.
Described negative pole pin comprises three negative pole pins of red, green, blue.
Above the chip chamber, set out optical lens.
Adopt the utility model of technique scheme, have the following advantages.
(1) RGB three-color LED spot light is that led chip directly is encapsulated on the operplate printing circuit board that has heat sink, the packaged type uniqueness, good heat dissipation, corrosion-resistant, intensity is high, good toughness, safe waterproof, properties of product are more reliable, and dwindled volume, significantly reduced processing cost.
(2) heat sink adopt possess high conductance, thermal conductivity, high rigidity and wearability are arranged, high creep resistance and the superpower beallon of corrosion resistance, the chip of light source is played in all directions effective protection, prolonged its service life greatly.Structurally, adopt ultra-thin radiating bottom plate structural design and add one deck heat-conducting layer, this heat-conducting layer can in time be directed to the heat that LED produces on the heat sink of below, enables smooth dissipation, and thermal resistance is little, heat conduction is fast, guarantees the empty calory build-up effect.
(3) RGB three-color LED spot light adopts low-cost compact manufacturing technology and substrate heat dissipation technology, the luminescent wafer encapsulation of promptly adopting the ammeter face to install.Wafer package comprises substrate, substrate and lens.Substrate comprises the pair of metal substrate and is arranged at first heat-conducting layer between two metallic substrates.Second insulating barrier is contained on the metallic substrates securely, and a pair of circuit pattern is contained on second heat insulation layer securely to be used for installing luminescence chip, has high-heating radiation performance and outstanding thermal insulation and dependable performance.Described substrate can be by heat conduction but the material of electric insulation make, perhaps make by not only heat conduction but also the material that conducts electricity.Described substrate has the trace of the light emitting diode (LED) on the pad being installed in order to be connected to.
(4) RGB three-color LED spot light, color is various, and under the control of drive circuit, the light of three kinds of colors of RGB can make up at random, forms the abundant colors variation effect, is the best substitute of traditional neon light.
Description of drawings
Fig. 1 is a front view of the present utility model.
Fig. 2 is a vertical view of the present utility model.
Fig. 3 is a cutaway view of the present utility model.
The specific embodiment
As Fig. 1, Fig. 2, shown in Figure 3, the utility model comprises printed circuit board (PCB), is provided with locating hole 9 is installed on printed circuit board (PCB), can directly fix coming off in effectively preventing to use, problems such as dislocation in actual applications with screw.Be provided with at least one led chip 8 on printed circuit board (PCB), chip substrate 4 lining is below led chip 8, and led chip 8 is evenly distributed in the chip chamber 7, sets out optical lens 10 above chip chamber 7.Above-mentioned luminous lens 10 at first can play a protective effect to light source, secondly the lighting angle of light source can be diffused into more than 150 °.In addition, can also fill transparent resins in 7 inside, go between in order to astigmatism and protection led chip and spun gold in the chip chamber between luminous lens 10 and the led chip 8.
The utility model is for playing better heat radiating effect, and above-mentioned printed circuit board (PCB) comprises the heat sink 1 of bottom, and heat sink 1 closely is connected with heat-conducting layer 2, and insulating barrier 3 is set above heat-conducting layer 2, distribution led chip 8 on the insulating barrier 3.Wherein, be connected with high thermal conductive silicon fat between insulating barrier 3 and the heat-conducting layer 2, the main effect of heat-conducting layer is to conduct the heat that gives out in the course of the work with directing LED chip 8.Insulating barrier 3 and heat-conducting layer 2 are embedded in heat sink 1 the inside, and purpose and the benefit done like this are: better carry out the heat conduction, make handsome in appearance generous simultaneously.Heat sink 1 is compared to aluminium base base plate, has better conductance, thermal conductivity, high rigidity and wearability, high creep resistance and corrosion resistance, and the chip of light source is played in all directions effective protection, prolonged its service life greatly.
Textural, heat sink 1 and heat-conducting layer 2 are flat board, and the two closely contacts.In addition, for increasing heat transfer area, can be provided with projection at the lower surface of heat-conducting layer 2, the upper surface of heat sink 1 is provided with the groove that matches with projection.
Need to prove that in selection, heat sink 1 is advisable for beallon plate or aluminium alloy plate; Heat-conducting layer 2 is advisable for corronil plate or molybdenum-copper plate.
In addition, the utility model concentrates on three-color electric light source in the chip chamber 7, three led chips 8 are set in the chip chamber 7, three led chips 8 connect a public anodal pin 5, and three led chips 8 have independently negative pole pin 6 separately, and above-mentioned negative pole pin 6 comprises three negative pole pins of red, green, blue.In actual applications, control get up extremely convenient.Can arbitrarily adjust separately brightness and color by the operating current of configuration RGB three kinds of color chips,, thereby obtain various in riotous profusion colors through combination mutually.
In a word, the utility model be led chip directly on printed circuit board (PCB) and heat-radiating substrate packaging technology again with exemplary applications.High-power LED chip directly is encapsulated on the heat-radiating substrate, and size reduces, compact conformation, and integrated level height, and improved the integral heat sink effect has superpower energy-saving and environmental protection, easily control, advantage such as full-color, not fragile.
Claims (7)
1. RGB three-color LED spot light, it comprises printed circuit board (PCB) and is positioned at least one led chip (8) on the printed circuit board (PCB), described led chip (8) is positioned at chip chamber (7), it is characterized in that: described printed circuit board (PCB) comprises the heat sink (1) of bottom, heat sink (1) closely is connected with heat-conducting layer (2), in the top of described heat-conducting layer (2) insulating barrier (3) is set, insulating barrier (3) is gone up distribution led chip (8); And described led chip (8) connects public anodal pin (5) and negative pole pin (6).
2. RGB three-color LED spot light according to claim 1 is characterized in that: described heat sink (1) and heat-conducting layer (2) are flat board, and the two closely contacts.
3. RGB three-color LED spot light according to claim 1 is characterized in that: the lower surface of described heat-conducting layer (2) is provided with projection, and the upper surface of heat sink (1) is provided with the groove that matches with projection.
4. according to claim 2 or 3 described RGB three-color LED spot lights, it is characterized in that: described heat sink (1) is beallon plate or aluminium alloy plate.
5. according to claim 2 or 3 described RGB three-color LED spot lights, it is characterized in that: described heat-conducting layer (2) is corronil plate or molybdenum-copper plate.
6. RGB three-color LED spot light according to claim 1 is characterized in that: described negative pole pin (6) comprises three negative pole pins of red, green, blue.
7. RGB three-color LED spot light according to claim 1 is characterized in that: set out optical lens (10) in the top of chip chamber (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206817920U CN201909274U (en) | 2010-12-27 | 2010-12-27 | RGB (red, green and blue) three-colored LED (light-emitting diode) point light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206817920U CN201909274U (en) | 2010-12-27 | 2010-12-27 | RGB (red, green and blue) three-colored LED (light-emitting diode) point light source |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201909274U true CN201909274U (en) | 2011-07-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010206817920U Expired - Fee Related CN201909274U (en) | 2010-12-27 | 2010-12-27 | RGB (red, green and blue) three-colored LED (light-emitting diode) point light source |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201909274U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102903838A (en) * | 2012-07-10 | 2013-01-30 | 贵州大学 | Packaged LED light source with radiating structure and production method thereof |
| CN105351770A (en) * | 2015-12-15 | 2016-02-24 | 常熟市强盛冲压件有限公司 | LED lamp body having quick heat dissipating structure |
-
2010
- 2010-12-27 CN CN2010206817920U patent/CN201909274U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102903838A (en) * | 2012-07-10 | 2013-01-30 | 贵州大学 | Packaged LED light source with radiating structure and production method thereof |
| CN105351770A (en) * | 2015-12-15 | 2016-02-24 | 常熟市强盛冲压件有限公司 | LED lamp body having quick heat dissipating structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110727 Termination date: 20151227 |
|
| EXPY | Termination of patent right or utility model |