CN202056776U - Radiator structure of LED (Light Emitting Diode) lamp - Google Patents
Radiator structure of LED (Light Emitting Diode) lamp Download PDFInfo
- Publication number
- CN202056776U CN202056776U CN201120148310XU CN201120148310U CN202056776U CN 202056776 U CN202056776 U CN 202056776U CN 201120148310X U CN201120148310X U CN 201120148310XU CN 201120148310 U CN201120148310 U CN 201120148310U CN 202056776 U CN202056776 U CN 202056776U
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- circuit board
- substrate circuit
- led
- aluminum substrate
- radiator structure
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Abstract
The utility model relates to a radiator structure of an LED (Light Emitting Diode) lamp. The radiator structure comprises an aluminum substrate circuit board, wherein the upper end face of the aluminum substrate circuit board is provided with an LED lamp, and the lower end face of the aluminum substrate circuit board is provided with a plurality of L-shaped radiating fins which are arranged in extension direction of the long edge of the aluminum substrate circuit board; and the short edge of each L-shaped radiating fin is fixedly adhered to the lower end face of the aluminum substrate circuit board through an aluminum liquid adhesive. The heat produced by the LED lamp is quickly radiated by using the radiating fins, so that the light attenuation speed of an LED is reduced. Since the radiating fins are cut and stamped from a metal thin plate, and the cutting processing of an overall metal block is not required, the material consumption and the weight of a radiator are greatly reduced, and the production cost is reduced; and the radiating fins are connected with the aluminum substrate circuit board through the aluminum liquid adhesive, the radiator structure has the advantages of better heat transfer effect and improved radiating capacity compared with the conventional silica gel adhesion.
Description
Technical field
The utility model relates to a kind of LED light fixture, designs a kind of heat spreader structures of LED light fixture especially.
Background technology
It also is a kind of trend that the LED illuminating product replaces traditional energy-saving lamp with the performance of high-quality more, is called as the revolution for the third time of lighting field.It has the advantage of energy-saving and environmental protection, long service life.Present LED light fixture generally adopts led array formula structure, has produced thus that LED light fixture heat is concentrated, local temperature is too high, causes the light decay aggravation, thereby influence the normal use of LED, causes the reduction in service life.Present power type white light LED lamp can only be converted into luminous energy with about 15% electric energy, and remaining 85% energy is converted into heat energy.Along with the increase of LED power, quantity of heat production increases, and bad if heat dissipation problem solves, heat concentrates in the small-sized chip, makes that the chip internal temperature is more and more higher.The too high meeting of chip temperature brings a lot of problems, as quickening device aging, accelerates the speed of LED light decay, reduction of service life, even also can cause chip to burn, and how effectively to solve heat radiation, become the problem that presses for solution most that high-power LED lamp faces.
Number of patent application 200910135562.6 discloses a kind of heat dissipating method of LED radiator and has implemented the radiator of this method, its in LED substrate lower surface by the bonding cooling stand of silica gel, its by the metal derby cutting processing of monoblock after the back side form the radiating fin that some intervals are provided with.Though it distributes a difficult problem that has solved the high-powered LED lamp heat radiation with the heat of LED lamp fast by radiating fin, but because cooling stand is bonded on the substrate by silica gel, radiating effect is subjected to certain influence, and cooling stand is formed by the metal derby cutting of monoblock, easily cause the phenomenon that heat radiation is uneven during the substrate out-of-flatness, waste material during making, the cost height.
Summary of the invention
The technical problems to be solved in the utility model provides a kind of good heat dissipation effect, in light weight and LED lamp radiator structure that cost of manufacture is low.
For solving the problems of the technologies described above, the technical solution of the utility model is: a kind of LED lamp radiator structure, its innovative point is: comprise an aluminium substrate circuit board, establish the LED lamp in this aluminium substrate circuit board upper surface, the lower surface is provided with some L shaped radiating fins of arranging along the long limit of aluminium substrate circuit board bearing of trend, and the minor face of described each L shaped radiating fin is adhesively fixed by aluminium liquid binder and aluminium substrate circuit board lower surface.
Advantage of the present utility model is: utilize radiating fin fast the heat that the LED lamp produces to be dissipated, reduce LED light decay speed.Because radiating fin is stamped to form by the metal sheet cutting, need not bulk metal piece cutting processing, has alleviated the material consumption and the weight of radiator greatly, reduced production cost, and radiating fin can be adjusted its area of dissipation as required timely and conveniently.Radiating fin is connected by aluminium liquid binder with aluminium base circuit board, because aluminium liquid binder is mixed by a large amount of tiny metal dust and binder, carry out the heat conduction transmission by metal dust, it is bonding to compare traditional silica gel, heat transfer effect is better, caking property is better, tests to the temperature environment of 80 degree above freezing at subzero 10 degree, and radiating fin and aluminium base circuit board bonding are very firm.Because be connected with the aluminium base contact with single fin, to the no requirement (NR) of whole aluminium base flatness, thereby radiating efficiency is largely increased simultaneously, the radiator heat-dissipation better effects if is faster.
Description of drawings
Fig. 1 is the LED lamp radiator structural representation in the utility model.
Fig. 2 is the structural representation of anchor clamps in the utility model.
The specific embodiment
Fig. 1 shows LED lamp radiator structure of the present utility model, comprise an aluminium substrate circuit board 1, establish LED lamp 2 in this aluminium substrate circuit board 1 upper surface, the lower surface is provided with some L shaped radiating fins of arranging along aluminium substrate circuit board 1 long limit bearing of trend 3, and the minor face of each L shaped radiating fin 3 is adhesively fixed by aluminium liquid binder and aluminium substrate circuit board 1 lower surface.
Realize the method for above-mentioned LED lamp radiator structure, concrete making step is:
At first make radiating fin: require to calculate the area of dissipation of radiating fin according to heat radiation, metal sheet is cut into the metal flakelet of respective area after, become L shaped radiating fin by the bender pressing lap;
Make circuit board: aluminum-base printing circuit board is made up of circuit layer, heat conductive insulating layer and metal-based layer, and metal-based layer is the higher aluminium plane of thermal conductivity, and the centre is the heat conductive insulating layer, and the upper strata is a layer printed circuit board, forms an aluminium substrate circuit board;
Then radiating fin is bonded to the lower surface of circuit board by aluminium liquid binder: adopt the bonding of an anchor clamps auxiliary heat dissipation fin and circuit board, its structure is as shown in Figure 2: base 4 be just can chimeric circuit board the shaped as frame structure, base 4 evenly is arranged at intervals with the dividing plate 5 of vertical direction, and the spacing between the adjacent separator 5 is the bond length of L shaped radiating fin.Back of circuit board is placed in the shaped as frame base 4 up, after the minor face outer surface of radiating fin is coated aluminium liquid binder, insert between the dividing plate 5, under the guiding of dividing plate 5, vertically be bonded in the lower surface of aluminium substrate circuit board, aluminium liquid binder is mixed by a large amount of tiny metal dust and binder in this step, the existing at present related application as adhesive repeats no more here;
Take out the aluminium substrate circuit board that is bonded with radiating fin at last, the LED lamp is welded to the upper surface of aluminium substrate circuit board.
Claims (1)
1. LED lamp radiator structure, it is characterized in that: comprise an aluminium substrate circuit board, establish the LED lamp in this aluminium substrate circuit board upper surface, the lower surface is provided with some L shaped radiating fins of arranging along the long limit of aluminium substrate circuit board bearing of trend, and the minor face of described each L shaped radiating fin is adhesively fixed by aluminium liquid binder and aluminium substrate circuit board lower surface.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201120148310XU CN202056776U (en) | 2011-05-11 | 2011-05-11 | Radiator structure of LED (Light Emitting Diode) lamp |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201120148310XU CN202056776U (en) | 2011-05-11 | 2011-05-11 | Radiator structure of LED (Light Emitting Diode) lamp |
Publications (1)
Publication Number | Publication Date |
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CN202056776U true CN202056776U (en) | 2011-11-30 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201120148310XU Expired - Fee Related CN202056776U (en) | 2011-05-11 | 2011-05-11 | Radiator structure of LED (Light Emitting Diode) lamp |
Country Status (1)
Country | Link |
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CN (1) | CN202056776U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105423255A (en) * | 2015-12-21 | 2016-03-23 | 苏州佳亿达电器有限公司 | Efficient heat dissipation device for LED lamps |
CN105650495A (en) * | 2016-02-17 | 2016-06-08 | 苏州佳亿达电器有限公司 | LED lamp with low cost and high performance |
-
2011
- 2011-05-11 CN CN201120148310XU patent/CN202056776U/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105423255A (en) * | 2015-12-21 | 2016-03-23 | 苏州佳亿达电器有限公司 | Efficient heat dissipation device for LED lamps |
CN105650495A (en) * | 2016-02-17 | 2016-06-08 | 苏州佳亿达电器有限公司 | LED lamp with low cost and high performance |
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Legal Events
Date | Code | Title | Description |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111130 Termination date: 20180511 |
|
CF01 | Termination of patent right due to non-payment of annual fee |