CN101730455B - Heat-radiating device of electric component - Google Patents
Heat-radiating device of electric component Download PDFInfo
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- CN101730455B CN101730455B CN2009102278190A CN200910227819A CN101730455B CN 101730455 B CN101730455 B CN 101730455B CN 2009102278190 A CN2009102278190 A CN 2009102278190A CN 200910227819 A CN200910227819 A CN 200910227819A CN 101730455 B CN101730455 B CN 101730455B
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- electric component
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Abstract
The present invention belongs to the technical field of heat-radiating devices, in particular to a heat-radiating device of an electric component. The heat-radiating device is mainly characterized by comprising a heat-radiating substrate and a heat-radiating plate which are closely contacted with the electric component, wherein the heat-radiating plate comprises a plurality of heat-radiating channels which are vertical to the heat-radiating substrate and heat-radiating walls encircling to form the heat-radiating channel; the section of each heat-radiating channel is in a shape of regular hexagon; the section of the heat-radiating plate is a shape of honeycomb; and the heat-radiating walls are aluminum foil boards and a plurality of air holes are arranged on the aluminum foil boards vertically arranged on the heat-radiating channels; a plurality of gas channels interlinked with the heat-radiating channels are arranged on the heat-radiating substrate. The heat-radiating mode is changed from giving the priority to the radiation into giving the priority to convection assisted by the radiation, thus the thermal impedance of the heat-radiating channel is greatly reduced and air convection is more unobstructed; in addition, the heat-radiating plate the section of which is in a shape of honeycomb ensures that the heat-radiating area reaches the maximum. The heat-radiating device of an electric component provided by the present invention solves the problem that the service life of the traditional electronic component is short caused by ineffective temperature reduction.
Description
Technical field
The invention belongs to the heat abstractor technical field, relate in particular to a kind of heat-radiating device of electric component.
Background technology
The application of electronic devices and components is more and more wider, but the cooling electronic component problem is troubling the development of technology all the time.Mainly adopt heat radiation type for cooling electronic component at present, promptly directly heating panel is closely contacted with the high-power electronic component substrate, the heat that electronic devices and components produce distributes by the thermal radiation mode through heating panel, like this, cause the heat abstractor heaviness, the waste aluminium, and radiating effect is undesirable.
Especially for the semiconductor LED lighting source, the semiconductor LED lighting source has advantages such as life-span length, energy-saving and environmental protection, rich color, at present extremely people's favor.But for the fatal shortcoming of semiconductor LED lighting source is raising along with power, the heat energy that chip produces increases sharply, this chip reduces useful life at high temperature greatly, experiment shows, below 30 ℃, can reach 100,000 hours the useful life of semiconductor LED lighting source, and below 90, the semiconductor LED lighting source can reach 5000 hours useful life, and this also is the main cause that present semiconductor LED lighting source can not be applied.And for street lamp or home lighting LED lamp, the heat abstractor heaviness is not only wasted aluminium, increases its cost price, but also causes potential safety hazard, therefore is difficult to promote.
Summary of the invention
The technical problem of solution of the present invention just provide a kind of good heat dissipation effect, in light weight, save aluminium, easy to process, the heat-radiating device of electric component being convenient to promote.
The technical solution used in the present invention is: comprise the heat-radiating substrate and the fin that closely contact with electronic devices and components, described fin comprises several heat dissipation channels vertical with described heat-radiating substrate and surrounds the heat radiation wall composition of this heat dissipation channel, the cross section of described heat dissipation channel is a regular hexagon, the cross section of described fin is cellular, described heat radiation wall is the aluminium foil plate, be provided with a plurality of air-vents with the aluminium foil plate of described heat dissipation channel vertical direction, described heat-radiating substrate is provided with a plurality of gas passages that communicate with described heat dissipation channel.
Its additional technical feature is:
Described aluminium foil plate section thickness is less than 0.4 millimeter;
Described aluminium foil plate section thickness is less than 0.2 millimeter;
The section thickness of described aluminium foil plate is the 0.07-0.15 millimeter.
Compared with prior art provided by the present invention, have the following advantages: one, owing to comprise heat-radiating substrate and the fin that closely contacts with electronic devices and components, described fin comprises several heat dissipation channels vertical with described heat-radiating substrate and surrounds the heat radiation wall composition of this heat dissipation channel, the cross section of described heat dissipation channel is a regular hexagon, the cross section of described fin is cellular, described heat radiation wall is the aluminium foil plate, be provided with a plurality of air-vents with the aluminium foil plate of described heat dissipation channel vertical direction, described heat-radiating substrate is provided with a plurality of gas passages that communicate with described heat dissipation channel, make heat dissipation channel form cross-ventilation, radiating mode is that main to change convection current into be main by radiation, radiation is auxilliary, make the thermal impedance of heat dissipation channel reduce greatly, cross-ventilation is more unobstructed, and the employing cross section is cellular fin, make area of dissipation reach maximum, radiating effect improves greatly than the radiating effect of prior art and other heat dissipation channels, heat for the electronic devices and components generation, can lose rapidly, thereby reduced the temperature of electronic devices and components, prolonged the useful life of electronic devices and components; Its two because the section thickness of described heat radiation wall is the 0.07-0.15 millimeter, saved aluminium, reduced production cost, alleviated the weight of heat abstractor, improved radiating effect again, and processed convenient; Its three owing to be provided with a plurality of air-vents with the aluminium foil plate of described heat dissipation channel vertical direction, make with the same plane of described heat dissipation channel vertical direction in temperature almost equal, help scattering and disappearing of heat more; Its four because described heat-radiating substrate is provided with a plurality of gas passages that communicate with described heat dissipation channel, make heat dissipation channel form penetrating passage up and down, help the convection current of gas, help scattering and disappearing of heat.
Description of drawings
Fig. 1 is the structural representation of heat-radiating device of electric component of the present invention;
Fig. 2 is the cross-sectional view of fin;
Fig. 3 is the structural representation of heat-radiating substrate.
Embodiment
Be described in further details below in conjunction with the structure and the use principle of accompanying drawing heat-radiating device of electric component of the present invention.
As depicted in figs. 1 and 2, heat-radiating device of electric component of the present invention, comprise heat-radiating substrate 2 and fin 3, heat-radiating substrate 2 closely bonds together by heat-conducting glue with electronic devices and components 1, the heat radiation wall 32 that fin 3 comprises several heat dissipation channels vertical with heat-radiating substrate 2 31 and surrounds this heat dissipation channel 31 is formed, the cross section of heat dissipation channel 31 is a regular hexagon, the cross section of fin 3 is cellular, heat dissipation channel 31 forms cross-ventilation, radiating mode is that main to change convection current into be main by radiation, radiation is auxilliary, make the thermal impedance of heat dissipation channel reduce greatly, cross-ventilation is more unobstructed, and to adopt the cross section be cellular fin, makes area of dissipation reach maximum, and radiating effect improves greatly than the radiating effect of prior art and other heat dissipation channels, heat for the electronic devices and components generation, can lose rapidly, thereby reduce the temperature of electronic devices and components, prolong the useful life of electronic devices and components;
In order to alleviate the weight of heat-radiating device of electric component, increase area of dissipation, heat radiation wall 32 is made less than 0.4 millimeter aluminium foil plate for section thickness.Certainly, heat radiation wall 32 is made for section thickness is preferably less than 0.2 millimeter aluminium foil plate.Certainly, in order further to alleviate its weight, heat radiation wall 32 is made for section thickness is preferably less than the aluminium foil plate of 0.07-0.15 millimeter.
For make with the same plane of heat dissipation channel 31 vertical direction in temperature almost equal, help scattering and disappearing of heat more, be provided with a plurality of air-vents 33 with the aluminium foil plate of heat dissipation channel vertical direction.Like this, in the vertical plane of same and heat dissipation channel 31, air can form effective convection current, so better heat-radiation effect.
As shown in Figure 3, heat-radiating substrate 2 is provided with a plurality of gas passages 21 that communicate with heat dissipation channel 31, like this, makes heat dissipation channel 3 form penetrating passage up and down, helps the convection current of gas, helps scattering and disappearing of heat.
Certainly, heat-radiating device of electric component of the present invention not only is confined to above cooling mechanism, as long as adopt the heat-radiating device of electric component of said structure, all falls into the scope of heat-radiating device of electric component protection of the present invention.
Claims (4)
1. heat-radiating device of electric component, comprise the heat-radiating substrate and the fin that closely contact with electronic devices and components, it is characterized in that: described fin comprises several heat dissipation channels vertical with described heat-radiating substrate and surrounds the heat radiation wall composition of this heat dissipation channel, the cross section of described heat dissipation channel is a regular hexagon, the cross section of described fin is cellular, described heat radiation wall is the aluminium foil plate, be provided with a plurality of air-vents with the aluminium foil plate of described heat dissipation channel vertical direction, described heat-radiating substrate is provided with a plurality of gas passages that communicate with described heat dissipation channel.
2. heat-radiating device of electric component according to claim 1 is characterized in that: described aluminium foil plate section thickness is less than 0.4 millimeter.
3. heat-radiating device of electric component according to claim 2 is characterized in that: described aluminium foil plate section thickness is less than 0.2 millimeter.
4. heat-radiating device of electric component according to claim 3 is characterized in that: the section thickness of described aluminium foil plate is the 0.07-0.15 millimeter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009102278190A CN101730455B (en) | 2009-12-22 | 2009-12-22 | Heat-radiating device of electric component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009102278190A CN101730455B (en) | 2009-12-22 | 2009-12-22 | Heat-radiating device of electric component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101730455A CN101730455A (en) | 2010-06-09 |
| CN101730455B true CN101730455B (en) | 2011-09-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009102278190A Expired - Fee Related CN101730455B (en) | 2009-12-22 | 2009-12-22 | Heat-radiating device of electric component |
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| CN (1) | CN101730455B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103168198B (en) * | 2010-10-21 | 2016-04-06 | 皇家飞利浦电子股份有限公司 | For the low cost Mulifunctional radiator of LED array |
| CN102221189B (en) * | 2011-06-11 | 2014-04-02 | 东莞勤上光电股份有限公司 | Vertical convector radiator and vertical convector radiating down lamp |
| CN102853409A (en) * | 2012-08-23 | 2013-01-02 | 天津天星电子有限公司 | Honeycomb plate type high-power LED (Light Emitting Diode) radiator and radiating method |
| CN106402749A (en) * | 2016-12-01 | 2017-02-15 | 广东合新材料研究院有限公司 | High-power LED lamp with pulsating heat pipe type honeycomb radiator and radiating method of high-power LED lamp |
| CN113380283B (en) * | 2021-06-09 | 2022-08-02 | 西安交通大学 | M2 solid state disk heat dissipation subsides |
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2009
- 2009-12-22 CN CN2009102278190A patent/CN101730455B/en not_active Expired - Fee Related
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| CN101730455A (en) | 2010-06-09 |
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Owner name: XINGTAI GREEN TIME OPTOELECTRONIC TECHNOLOGY CO., Free format text: FORMER OWNER: ZHANG ZHIQIANG Effective date: 20120111 |
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Free format text: CORRECT: ADDRESS; FROM: 053000 HENGSHUI, HEBEI PROVINCE TO: 054000 XINGTAI, HEBEI PROVINCE |
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Effective date of registration: 20120111 Address after: 054000 No. 168, South Third Ring Road, Xingtai national photovoltaic industry base, Hebei Patentee after: Xingtai Ganai Optoelectronics Technology Co., Ltd. Address before: 053000, 235 century peace building, No. 402 Heping East Road, Hebei, Hengshui, 3 Patentee before: Zhang Zhiqiang |
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