CN102853409A - Honeycomb plate type high-power LED (Light Emitting Diode) radiator and radiating method - Google Patents
Honeycomb plate type high-power LED (Light Emitting Diode) radiator and radiating method Download PDFInfo
- Publication number
- CN102853409A CN102853409A CN2012103013201A CN201210301320A CN102853409A CN 102853409 A CN102853409 A CN 102853409A CN 2012103013201 A CN2012103013201 A CN 2012103013201A CN 201210301320 A CN201210301320 A CN 201210301320A CN 102853409 A CN102853409 A CN 102853409A
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- Prior art keywords
- radiating
- light source
- power led
- honeycomb plate
- radiator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000000034 method Methods 0.000 title claims abstract description 17
- 229910052751 metal Inorganic materials 0.000 claims abstract description 20
- 239000002184 metal Substances 0.000 claims abstract description 20
- 238000003475 lamination Methods 0.000 claims abstract description 8
- 239000000853 adhesive Substances 0.000 claims abstract description 6
- 230000001070 adhesive effect Effects 0.000 claims abstract description 6
- 230000005855 radiation Effects 0.000 claims description 10
- 238000005286 illumination Methods 0.000 claims description 7
- 238000009826 distribution Methods 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 4
- 238000005516 engineering process Methods 0.000 abstract description 3
- 230000010354 integration Effects 0.000 abstract 1
- 238000013021 overheating Methods 0.000 abstract 1
- 230000001413 cellular effect Effects 0.000 description 26
- 238000005452 bending Methods 0.000 description 13
- 238000003466 welding Methods 0.000 description 7
- 238000002955 isolation Methods 0.000 description 5
- 238000004080 punching Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 241000283973 Oryctolagus cuniculus Species 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000009429 distress Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000003562 lightweight material Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000003685 thermal hair damage Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/644—Heat extraction or cooling elements in intimate contact or integrated with parts of the device other than the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
The invention discloses a honeycomb plate type high-power LED (Light Emitting Diode) radiator and a radiating method. Holes are punched in a non-adhesive surface of a lamination of metal honeycomb plates to form radiating holes which are coaxial with light after the lamination is pulled apart; an electrode of an LED element is welded and attached to a bend of an adhesive end of the honeycomb plate, so that the radiating area is expanded; three-dimensional variation of the honeycomb plates is positioned by using a frame; the radiating is divided into natural radiating and power driven radiating, so that the temperature rise of the element is greatly reduced, and overheating damage and radiating cost produced by current element integration are avoided; a linear light source (straight line or curved line), a surface light source (flat surface and curved surface) and a body light source (planar body and curved body) manufactured by an integrated device implementing the patent technology have a good radiating effect and a diverse light distribution effect; the LED integrated device implementing the radiating method radiates naturally by using hot air flow power and can be industrially, standardly, serially and universally produced; and the radiator and the radiating method belong to the fields of electronic elements and LED light sources.
Description
Technical field
The invention discloses a kind of honeycombed sheet type high-power LED radiator and heat dissipating method, the heat dissipating method that specifically utilizes metal honeycomb plate as heat abstractor and realize dispelling the heat with the direction of illumination axis belongs to electronic component and led light source field.
Background technology
Present great power LED integrated heat dissipation all is on the element circuit board, distribution radiating ribs or utilize adopting heat pipes for heat transfer, integrated light source heat radiation weak effect causes the light source light decay to increase, and reduce service life, the thermal inertia of large scale of construction metal heat sink, need consuming can source heat-dissipating, and radiator fan mostly is the input high-temperature gas, therefore, the high-power integrated optical source of LED is utilized out of doors, is in for a long time depression and distress condition; The light source form of metal heat sink is with low uncertainty, and it is difficult that curved surface is made degree, and the three-dimensional light source that distributes is rare especially.Applied for patent of invention
Utilize metal honeycomb plate integratedHigh-power LED light source can not be realized and the coaxial heat radiation of light source irradiation direction.
Summary of the invention
A kind of honeycombed sheet type high-power LED radiator and heat dissipating method, with metal honeycomb plate in the punching of the non-adhesive surface of lamination, after forming lamination and pulling open with the coaxial heat radiation eyelet of illumination; Electrode of LED element and paster are welded in the bonding end bending of cellular board, enlarged area of dissipation, the cellular board three dimensional change adopts the framework location, be divided into natural heat dissipation and power drive heat radiation, greatly reduce the element temperature rise, avoided mistake cause thermal damage and the heat radiation cost of the integrated generation of present element, for non-luminous electronic component, parts that need heat radiation, used this technology radiating effect and more be better than cast aluminium and heat pipe-type.
1. break up hot hole at the metal honeycomb plate lamination; Adopt framework positioning honeycomb plate three dimensional change, comprise the heat radiation of coaxial light source direction of illumination and intersect the heat radiation of light source direction of illumination.
Break up hot hole at the non-adhesive surface of stack direction.
Description of drawings
Accompanying drawing 1 is that cellular board prolongs lamination straight line stretching planar light source radiating principle schematic diagram.
1 of Fig. 1 is low-power LED, the 2nd, and the bending of cellular board adhesion side, the 3rd, the cellular board honeycomb is adhesion side not, and the 4th, honeycomb eyelet, the 5th, the not adhesion side punching of cellular board honeycomb, the 6th, shape framework, the 7th, fan.
Accompanying drawing 2 is cylinder shot shape schematic diagrames that cellular board launches centered by single-ended.
2 of accompanying drawing 2 is the bendings of cellular board adhesion side, the 3rd, and the cellular board honeycomb is adhesion side not, and the 4th, honeycomb eyelet, the 5th, the not adhesion side punching of cellular board honeycomb.
Accompanying drawing 3 is cellular board lamination axial-rotation plane single face shot shape schematic diagrames.
2 of rabbit rabbit 3 is the bendings of cellular board adhesion side, the 3rd, and the cellular board honeycomb is adhesion side not, and the 4th, honeycomb eyelet, the 5th, the not adhesion side punching of cellular board honeycomb.
An electrode welding of low-power LED 1 is at the cellular board honeycomb not on the adhesion side bending end (metal honeycomb plate scatter end) 3; Honeycomb eyelet 4 and cellular board honeycomb not adhesion side punching 5 are ventilation and heat eyelet path; Shape framework 6 according to cellular board changes shape design moulding after encapsulating housing or directly supports fan 7. fans 7 be divided into unpowered fan (side packing air channel outside the shape framework), the electric drive fan that relies on thermal current to drive.
Implementation method
The material of integrating device: the cellular board that the metal forming that aluminum honeycomb panel or other thermal conductivity are high is made, at the large louvre of the non-adhesion area of stack direction (hereinafter to be referred as cellular board).
The selection of element: various low-power LED light sources, a termination electrode welding lead.
Integrated approach:
With the low-power LED element, an end of electrode and the welding of the bond end of substrate and metal forming.
Be included in the single-ended welded type of bond end and the two ends welded type of metal forming according to the cellular board welding manner.
The other end of electrode passes eyelet after adopting wire bonds, and wire is connected rear with insulating materials isolation coating.
Distance between each element adopts isolation bracing frame or framework location.
According to the distance of metal honeycomb plate eyelet and the dimension series design and selection of low-power LED element chip.
Linear light source:
Cellular board is sheared slivering according to stacking layer vertical direction.
The minimum widith of bar comprises the honeycomb eyelet of whole row more than two.
With the low-power LED element, the end bending edge welding of scattering of being combined with metal forming of electrode one end and paster backboard, another electrode passes eyelet after adopting wire bonds, and the insulating materials isolation coats after adopting wire to connect.
The curve light source:
Method 1: with cellular board according to stacking a layer vertical direction shearing curve bar.
Method 2: the different length of end is called for short in the end of above linear light source being sheared slivering.
Above two kinds of methods, illuminating source is illumination of curves behind the integrated small power LED element.
Planar light source:
Cellular board is cut into line pattern according to stacking a layer vertical direction.
At each bending edge distribution low-power LED element.
The integrated low-power LED light-emitting area of bending edge is the plane.
Curved surface light source:
Method 1: cellular board is cut into line pattern according to stacking a layer vertical direction, change the shape of honeycomb eyelet, form the bending edge curved surface and distribute, integrated low-power LED light-emitting area is curved surface.
Method 2: cellular board is cut into curvilinear figure according to stacking a layer vertical direction, and each bending edge is curve, and integrated low-power LED light-emitting area is curved surface.
Above four kinds metal honeycomb plate is one-sided bending and one-sided distribution low-power LED.
Light face body light source:
Cellular board is cut into curvilinear figure according to stacking a layer vertical direction.
Each bending edge of both sides low-power LED element that distributes.
Bending edge integrated low-power LED light-emitting area in both sides is the plane.
Change metal honeycomb plate eyelet shape, formation and modification colourful light face body light source.
The curved body light source:
According to two kinds of methods that curved surface distributes, change metal honeycomb plate eyelet shape, formation and modification colourful the curved body light source.
Relevant auxiliary equipment:
Change isolation bracing frame or the framework of necessity of various shapes, because metal honeycomb plate can not stand upright, can adopt various high temperature resistant, isolation bracing frame or frameworks that lightweight material is made various profiles.
Electrode in the eyelet and the insulation of eyelet wall.
Air channel draft direction intersects according to the ventilative direction of two kinds of eyelets.
The low-power LED electrode should be welded on the metal forming end adhesive bond position of scattering.
Metal honeycomb plate barrel hole size and area of dissipation according to the integrated power total amount of irradiation environment for use and low-power LED element, are selected the area of dissipation and the appearance and size that adapt to.
The principle that element distributes piecewise and a sheet distributes:
Integrated power is little, and the light source that the environment for use temperature is low adopts piecewise to distribute, for example: every welding electrode, distributed component.
Integrated power large (greater than 100w), the light source of environment for use temperature high (being higher than 38 ℃ is more than the subtropical zone), sheet distributes between employing, for example: interval a slice or several, welding electrode, distributed component.
Claims (2)
1. a honeycombed sheet type high-power LED radiator and heat dissipating method is characterized in that: break up hot hole at the metal honeycomb plate lamination; Adopt framework positioning honeycomb plate three dimensional change, comprise the heat radiation of coaxial light source direction of illumination and intersect the heat radiation of light source direction of illumination.
2. honeycombed sheet type high-power LED radiator according to claim 1 and heat dissipating method is characterized in that: break up hot hole at the non-adhesive surface of stack direction.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012103013201A CN102853409A (en) | 2012-08-23 | 2012-08-23 | Honeycomb plate type high-power LED (Light Emitting Diode) radiator and radiating method |
| PCT/CN2012/082811 WO2014029161A1 (en) | 2012-08-23 | 2012-10-12 | Honeycomb panel-type high-power led radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012103013201A CN102853409A (en) | 2012-08-23 | 2012-08-23 | Honeycomb plate type high-power LED (Light Emitting Diode) radiator and radiating method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102853409A true CN102853409A (en) | 2013-01-02 |
Family
ID=47400232
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012103013201A Pending CN102853409A (en) | 2012-08-23 | 2012-08-23 | Honeycomb plate type high-power LED (Light Emitting Diode) radiator and radiating method |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102853409A (en) |
| WO (1) | WO2014029161A1 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103517621A (en) * | 2013-09-09 | 2014-01-15 | 天津天星电子有限公司 | Hole cellular board radiator manufacturing method |
| WO2014029162A1 (en) * | 2012-08-19 | 2014-02-27 | 天津天星电子有限公司 | High-power led integrated device |
| WO2014029161A1 (en) * | 2012-08-23 | 2014-02-27 | 天津天星电子有限公司 | Honeycomb panel-type high-power led radiator |
| CN104654256A (en) * | 2014-06-03 | 2015-05-27 | 浙江斗山电子科技有限公司 | Honeycomb radiator and LED (light-emitting diode) bulb applying same |
| CN107957038A (en) * | 2017-11-02 | 2018-04-24 | 中山域晖光电科技有限公司 | It is a kind of can plane sprawl assembly LED lamp |
| CN113380283A (en) * | 2021-06-09 | 2021-09-10 | 西安交通大学 | M2 solid state disk heat dissipation subsides |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN200949803Y (en) * | 2006-08-15 | 2007-09-19 | 上海兴禄科技实业有限公司 | High power LED honeycomb heating radiator |
| CN201429055Y (en) * | 2009-07-14 | 2010-03-24 | 柯建锋 | Cooling device for LED lamp |
| KR20110062493A (en) * | 2009-12-03 | 2011-06-10 | 임채호 | Heat sink of light emitting diode lamp |
| CN101730455B (en) * | 2009-12-22 | 2011-09-28 | 张志强 | Heat-radiating device of electric component |
| CN102052610A (en) * | 2010-12-20 | 2011-05-11 | 江苏生日快乐光电科技有限公司 | High-power plant lamp |
| CN102853409A (en) * | 2012-08-23 | 2013-01-02 | 天津天星电子有限公司 | Honeycomb plate type high-power LED (Light Emitting Diode) radiator and radiating method |
-
2012
- 2012-08-23 CN CN2012103013201A patent/CN102853409A/en active Pending
- 2012-10-12 WO PCT/CN2012/082811 patent/WO2014029161A1/en active Application Filing
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014029162A1 (en) * | 2012-08-19 | 2014-02-27 | 天津天星电子有限公司 | High-power led integrated device |
| WO2014029161A1 (en) * | 2012-08-23 | 2014-02-27 | 天津天星电子有限公司 | Honeycomb panel-type high-power led radiator |
| CN103517621A (en) * | 2013-09-09 | 2014-01-15 | 天津天星电子有限公司 | Hole cellular board radiator manufacturing method |
| CN104654256A (en) * | 2014-06-03 | 2015-05-27 | 浙江斗山电子科技有限公司 | Honeycomb radiator and LED (light-emitting diode) bulb applying same |
| CN107957038A (en) * | 2017-11-02 | 2018-04-24 | 中山域晖光电科技有限公司 | It is a kind of can plane sprawl assembly LED lamp |
| CN113380283A (en) * | 2021-06-09 | 2021-09-10 | 西安交通大学 | M2 solid state disk heat dissipation subsides |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2014029161A1 (en) | 2014-02-27 |
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Legal Events
| Date | Code | Title | Description |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130102 |