CN103517621A - Hole cellular board radiator manufacturing method - Google Patents
Hole cellular board radiator manufacturing method Download PDFInfo
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- CN103517621A CN103517621A CN201310402921.6A CN201310402921A CN103517621A CN 103517621 A CN103517621 A CN 103517621A CN 201310402921 A CN201310402921 A CN 201310402921A CN 103517621 A CN103517621 A CN 103517621A
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- board
- hole
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- eyelet
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Abstract
The invention discloses a hole cellular board radiator manufacturing method. Tines are manufactured on a single side of a hole board made of rigid materials, the board top is manufactured into a groove bottom of a trapezoid-shaped groove, the board top is a solid board and is in layer-face contact location, a groove slope is the hole board top, the groove bottom is relatively stacked to form cellular holes, a bend which is in heat transmission connection with a heat source is manufactured on the opposite side of the tine side of the hole board, and cutting edges and tines are manufactured on the other two sides of the hole board made of the rigid materials. A single side of the heat source is in contact with the bend, and the heat dissipation tip ends are distributed on the other three single sides of the heat source. The hole cellular board radiator manufacturing method can be used for production in an industrialization, standardization, serialization and universalization mode, the hole cellular board manufactured through the method has wide application markets in the technical fields of heat transmission, heat dissipation and electrons.
Description
Technical field
The invention discloses eyelet cellular board manufacturing method of heat radiator, groove is domatic is eyelet face, and bottom land stacks relatively, thermal source and cellular board single edge contact, and the monolateral distribution heat radiation of another three side is most advanced and sophisticated, belongs to heat transfer and heat radiation and electronic technology field.
Background technology
The radiator being dispersed in all belongs to increase area of dissipation increases the heat sink material scale of construction simultaneously, radiating convection can not effectively connect at radiating end, the heat radiation of thermal source position is slow, at thermal source and heat-transfer area contact site, form heat accumulation, have no the application message report of eyelet cellular board manufacturing method of heat radiator and eyelet cellular board radiator.
Summary of the invention
Eyelet cellular board manufacturing method of heat radiator disclosed by the invention,
?aperture plate three side processing continuous or interrupted tip or the cutting edge of rigid material, utilize the most advanced and sophisticated heat source side heat that sheds fast that dispels the heat; The bottom land that plate face is processed into dovetail groove is real plate face and aspect contact location, increases heat radiation contact-making surface and eyelet honeycomb radiator intensity, improves radiating efficiency; Groove slope is aperture plate face, reduces radiating airflow resistance, quick heat radiating; Bottom land, with respect to stacking into honeycomb hole, reduces the heat sink material scale of construction, forms cyclonic air flow; Opposite side processing is done heat transfer connecting end surface with thermal source, increases heat sink material heat source-contacting surface, improves area of dissipation; Cutting edge is divided into plane cutting edge, curved surface cutting edge, improves quick heat radiating and heat transfer rate, can industrialization, standardization, seriation, generalization produce.
The present invention has following characteristics:
1
?eyelet cellular board manufacturing method of heat radiator, it is characterized in that: the eyelet of rigid material (13) plate three sides are processed continuously or interrupted most advanced and sophisticated (11) or cutting edge (1) and (7), the bottom land (12) that plate face is processed into dovetail groove is real plate face and aspect contact location, groove slope is eyelet (13) plate face, bottom land is with respect to stacking into honeycomb hole (14), opposite side processing is done heat transfer connecting end surface (15) with thermal source (9), and cutting edge is divided into plane cutting edge, curved surface cutting edge.
Accompanying drawing explanation
Accompanying drawing 1 is eyelet cellular board integrated structure schematic diagram.
Accompanying drawing 2 is eyelet cellular board radiator heat-dissipation principle schematic.
Accompanying drawing 1 is described as follows:
The eyelet of rigid material (13) plate three sides are processed continuously or interrupted most advanced and sophisticated (11) or cutting edge (1) and (7), the bottom land (12) that plate face is processed into dovetail groove is real plate face and aspect contact location, groove slope is eyelet (13) plate face, bottom land is with respect to stacking into honeycomb hole (14), and opposite side processing is done heat transfer connecting end surface (15) this Figure of description 1 with bending signal explanation with thermal source (9).
Accompanying drawing 2 is described as follows:
Accompanying drawing 2 is described as follows:
Cutting edge (1) and (7), most advanced and sophisticated slope (2), most advanced and sophisticated crest (3), most advanced and sophisticated trough (4), eyelet (5), bottom land (6), thermal interface (8), cooling heat source face (9), this Figure of description 2 is with plane cutting edge signal explanation, and curved surface cutting edge, is processed as wave-like in cutting edge side exactly.
Embodiment
The selection of material:
The copper coin that general thermal transmission coefficient is good, aluminium sheet, sheet alloy flitch are processed into aperture plate, also adopt current panel beating, machine-tooled method to be divided into the equidistantly aperture plate of distribution of real plate, eyelet, slabstone, perforation hole area is the more than 1/2 of slope area, eye diameter is less than the honeycomb length of side, and single hole distributes or many empty distributions all can.
The processing of dovetail groove:
Honeycomb is regular hexagon, take panel beating as example: plate stamping is processed into trapezoidal frid; By dovetail groove bottom surface machined grooves, in groove, be namely boss, bottom land is outside is that groove or plane adopt heat-conducting medium to do contact-making surface.
The manufacture of honeycomb:
Plate face or bar face bottom land are relative, stack successively, adopt slot wedge to be inserted in to locate between two relative grooves fastening, or adopt heat-conducting medium to do contact-making surface, and it is fastening that general adhesive is done contact.
The encapsulation of surrounding adopts rigid structure framework, according to lamination number and spacing and plate face thickness, rigid structure framework slot is set, for example: aluminium alloy door window frame.
Periphery tip or cutting edge protect, and place personnel's unexpected injury, adopt common aperture plate to make mask all around, and the face of going along with sb. to guard him is most advanced and sophisticated higher than top, go along with sb. to guard him face eye and are greater than and are divided into eyelet.
Concrete application example:
Computer CPU conducts heat and heat radiation: the thermal source that contacts shown in Fig. 2 is computer CPU radiating surface, can flash heat transfer and heat radiation, and top arranges radiator fan, and effect is better, has reduced the radiator scale of construction, increases the perforation of area of dissipation and radiating airflow.
LED light source conducts heat and heat radiation: the bending 15 shown in Fig. 1, distribution LED low-power light source, can flash heat transfer and heat radiation.
Claims (1)
1. eyelet cellular board manufacturing method of heat radiator, it is characterized in that: the one-sided processing pointed tooth of the eyelet of rigid material (13) plate (11), the bottom land (12) that plate face is processed into dovetail groove is real plate face and aspect contact location, groove slope is orifice plate face, bottom land is with respect to stacking into honeycomb hole (14), the processing of aperture plate pointed tooth side opposite side is done and is passed hot linked bending (15) with thermal source (9), the other both sides of aperture plate (1) of rigid material and (7) processing cutting edge, pointed tooth.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310402921.6A CN103517621A (en) | 2013-09-09 | 2013-09-09 | Hole cellular board radiator manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310402921.6A CN103517621A (en) | 2013-09-09 | 2013-09-09 | Hole cellular board radiator manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103517621A true CN103517621A (en) | 2014-01-15 |
Family
ID=49899356
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310402921.6A Pending CN103517621A (en) | 2013-09-09 | 2013-09-09 | Hole cellular board radiator manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103517621A (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101048055A (en) * | 2006-03-30 | 2007-10-03 | 通用电气公司 | Advanced heat sinks and thermal spreaders |
| CN101380832A (en) * | 2008-10-17 | 2009-03-11 | 苏州航通蜂窝科技有限公司 | High-strength light honeycomb core and manufacturing method thereof |
| CN101616575A (en) * | 2009-08-02 | 2009-12-30 | 陈磊 | Directional stream-guidance-type radiator |
| CN201636808U (en) * | 2010-01-26 | 2010-11-17 | 赵跃铭 | Ultra-light honeycomb heat radiator |
| CN202094162U (en) * | 2011-06-23 | 2011-12-28 | 上海精锐金属建筑系统有限公司 | Backboard heat radiation structure of solar cell panel |
| CN202420288U (en) * | 2011-12-16 | 2012-09-05 | 平湖市三久塑料有限公司 | Cooling fin for counter-flow cooling tower |
| CN102840785A (en) * | 2012-09-07 | 2012-12-26 | 浙江中博光电科技有限公司 | Temperature-uniforming plate, internal support thereof and methods for manufacturing same |
| CN102853409A (en) * | 2012-08-23 | 2013-01-02 | 天津天星电子有限公司 | Honeycomb plate type high-power LED (Light Emitting Diode) radiator and radiating method |
| CN203024113U (en) * | 2012-12-30 | 2013-06-26 | 杨世红 | Radiator for LED (Light Emitting Diode) lamp |
-
2013
- 2013-09-09 CN CN201310402921.6A patent/CN103517621A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101048055A (en) * | 2006-03-30 | 2007-10-03 | 通用电气公司 | Advanced heat sinks and thermal spreaders |
| CN101380832A (en) * | 2008-10-17 | 2009-03-11 | 苏州航通蜂窝科技有限公司 | High-strength light honeycomb core and manufacturing method thereof |
| CN101616575A (en) * | 2009-08-02 | 2009-12-30 | 陈磊 | Directional stream-guidance-type radiator |
| CN201636808U (en) * | 2010-01-26 | 2010-11-17 | 赵跃铭 | Ultra-light honeycomb heat radiator |
| CN202094162U (en) * | 2011-06-23 | 2011-12-28 | 上海精锐金属建筑系统有限公司 | Backboard heat radiation structure of solar cell panel |
| CN202420288U (en) * | 2011-12-16 | 2012-09-05 | 平湖市三久塑料有限公司 | Cooling fin for counter-flow cooling tower |
| CN102853409A (en) * | 2012-08-23 | 2013-01-02 | 天津天星电子有限公司 | Honeycomb plate type high-power LED (Light Emitting Diode) radiator and radiating method |
| CN102840785A (en) * | 2012-09-07 | 2012-12-26 | 浙江中博光电科技有限公司 | Temperature-uniforming plate, internal support thereof and methods for manufacturing same |
| CN203024113U (en) * | 2012-12-30 | 2013-06-26 | 杨世红 | Radiator for LED (Light Emitting Diode) lamp |
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| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140115 |