CN203466180U - Eyelet honeycomb plate electronic-chip heat radiator - Google Patents
Eyelet honeycomb plate electronic-chip heat radiator Download PDFInfo
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- CN203466180U CN203466180U CN201320553694.2U CN201320553694U CN203466180U CN 203466180 U CN203466180 U CN 203466180U CN 201320553694 U CN201320553694 U CN 201320553694U CN 203466180 U CN203466180 U CN 203466180U
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Abstract
The utility model discloses an eyelet honeycomb plate electronic-chip heat radiator. sharp teeth are machined on a single side of the eyelet plate made of a rigid material, plate faces are machined to be groove bottoms of trapezoid grooves, each groove bottom is a solid plate face and is positioned through layer face contact, groove slopes are hole plate faces, the groove bottoms are relatively stacked into honeycomb holes, a folding for heat transmission connection with a heat source is machined on an opposite side of each eyelet plate sharp-tooth side, cutting edges and sharp teeth are machined on the other two sides of the eyelet plate made of the rigid material, the heat source is in a single-edge contact relationship with each folding, and heat-radiation tips are distributed on the other three edge sides. Industrialization production, standardization production, serialization production and generalization production can be carried out; the heat radiator manufactured by utilizing the method is disposed on an electronic chip; and the heat radiator has the advantages of improved heat-transfer performance, improved heat-radiation performance and prolonged service life of the chip, and has a wide application market.
Description
Technical field
The utility model discloses eyelet cellular board electronic chip radiator, groove is domatic is eyelet face, and bottom land stacks relatively, thermal source and cellular board single edge contact, and the monolateral distribution heat radiation of another three side is most advanced and sophisticated, belongs to heat transfer and heat radiation and electronic technology field.
Background technology
Present electronic chip radiator all belongs to increase area of dissipation increases the heat sink material scale of construction simultaneously, radiating convection can not effectively connect at radiating end, the heat radiation of thermal source position is slow, at thermal source and heat-transfer area contact site, form heat accumulation, have no the application message report of eyelet cellular board electronic chip radiator.
Summary of the invention
The disclosed eyelet cellular board of the utility model electronic chip radiator, aperture plate three side processing continuous or interrupted tip or the cutting edge of rigid material, utilize the most advanced and sophisticated heat source side heat that sheds fast that dispels the heat; The bottom land that plate face is processed into dovetail groove is real plate face and aspect contact location, increases heat radiation contact-making surface and eyelet honeycomb radiator intensity, improves radiating efficiency; Groove slope is aperture plate face, reduces radiating airflow resistance, quick heat radiating; Bottom land, with respect to stacking into honeycomb hole, reduces the heat sink material scale of construction, forms cyclonic air flow; Opposite side processing is done electronic chip heat transfer connecting end surface with thermal source, increases heat sink material heat source-contacting surface, improves area of dissipation; Cutting edge is divided into plane cutting edge, curved surface cutting edge, improves quick heat radiating and heat transfer rate, can industrialization, standardization, seriation, generalization produce.
the utlity model has following characteristics:
The eyelet of 1 rigid material (13) plate three sides are processed continuously or interrupted most advanced and sophisticated (11) or cutting edge (1,7), the bottom land (12) that plate face is processed into dovetail groove is real plate face and aspect contact location, groove slope is eyelet (13) plate face, bottom land is with respect to stacking into honeycomb hole (14), opposite side processing is done electronic chip heat transfer connecting end surface (15) with thermal source (9), and cutting edge is divided into plane cutting edge, curved surface cutting edge.
Accompanying drawing explanation
Accompanying drawing 1 is eyelet cellular board integrated structure schematic diagram.
Accompanying drawing 2 is eyelet cellular board radiator heat-dissipation principle schematic.
Accompanying drawing 1 is described as follows:
The eyelet of rigid material (13) plate three sides are processed continuously or interrupted most advanced and sophisticated (11) or cutting edge (1,7), the bottom land (12) that plate face is processed into dovetail groove is real plate face and aspect contact location, groove slope is eyelet (13) plate face, bottom land is with respect to stacking into honeycomb hole (14), and opposite side processing is done electronic chip heat transfer connecting end surface (15) this Figure of description 1 with bending signal explanation with thermal source (9).
Accompanying drawing 2 is described as follows:
Accompanying drawing 2 is described as follows:
Cutting edge (1,7), most advanced and sophisticated slope (2), most advanced and sophisticated crest (3), most advanced and sophisticated trough (4), eyelet (5), bottom land (6), thermal interface (8), cooling heat source face (9), this Figure of description 2 is with plane cutting edge signal explanation, and curved surface cutting edge, is processed as wave-like in cutting edge side exactly.
Embodiment
The selection of material:
The copper coin that general thermal transmission coefficient is good, aluminium sheet, sheet alloy flitch are processed into aperture plate, also adopt current panel beating, machine-tooled method to be divided into the equidistantly aperture plate of distribution of real plate, eyelet, slabstone, perforation hole area is the more than 1/2 of slope area, eye diameter is less than the honeycomb length of side, and single hole distributes or many empty distributions all can.
The processing of dovetail groove:
Honeycomb is regular hexagon, take panel beating as example: plate stamping is processed into trapezoidal frid; By dovetail groove bottom surface machined grooves, in groove, be namely boss, bottom land is outside is that groove or plane adopt heat-conducting medium to do contact-making surface.
The manufacture of honeycomb:
Plate face or bar face bottom land are relative, stack successively, adopt slot wedge to be inserted in to locate between two relative grooves fastening, or adopt heat-conducting medium to do contact-making surface, and it is fastening that general adhesive is done contact.
The encapsulation of surrounding adopts rigid structure framework, according to lamination number and spacing and plate face thickness, rigid structure framework slot is set, for example: aluminium alloy door window frame.
Periphery tip or cutting edge protect, and place personnel's unexpected injury, adopt common aperture plate to make mask all around, and the face of going along with sb. to guard him is most advanced and sophisticated higher than top, go along with sb. to guard him face eye and are greater than and are divided into eyelet.
Concrete application example:
Computer CPU conducts heat and heat radiation: the thermal source that contacts shown in Fig. 2 is computer CPU radiating surface, can flash heat transfer and heat radiation, and top arranges radiator fan, and effect is better, has reduced the radiator scale of construction, increases the perforation of area of dissipation and radiating airflow.
Electronic chip conducts heat and heat radiation: the bending 15 shown in Fig. 1, be connected with electronic chip, and can flash heat transfer and heat radiation.
Claims (1)
1. eyelet cellular board electronic chip radiator, it is characterized in that: the eyelet of rigid material (13) plate three sides are processed continuously or interrupted most advanced and sophisticated (11) or cutting edge (1,7), the bottom land (12) that plate face is processed into dovetail groove is real plate face and aspect contact location, groove slope is eyelet (13) plate face, bottom land is with respect to stacking into honeycomb hole (14), and opposite side processing is done electronic chip heat transfer connecting end surface (15) with thermal source (9), and cutting edge is divided into plane cutting edge, curved surface cutting edge.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320553694.2U CN203466180U (en) | 2013-09-09 | 2013-09-09 | Eyelet honeycomb plate electronic-chip heat radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320553694.2U CN203466180U (en) | 2013-09-09 | 2013-09-09 | Eyelet honeycomb plate electronic-chip heat radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203466180U true CN203466180U (en) | 2014-03-05 |
Family
ID=50178525
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320553694.2U Expired - Fee Related CN203466180U (en) | 2013-09-09 | 2013-09-09 | Eyelet honeycomb plate electronic-chip heat radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203466180U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112635964A (en) * | 2020-12-11 | 2021-04-09 | 电子科技大学 | Slotted honeycomb wave-absorbing structure |
-
2013
- 2013-09-09 CN CN201320553694.2U patent/CN203466180U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112635964A (en) * | 2020-12-11 | 2021-04-09 | 电子科技大学 | Slotted honeycomb wave-absorbing structure |
| CN112635964B (en) * | 2020-12-11 | 2021-12-03 | 电子科技大学 | Slotted honeycomb wave-absorbing structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Technology Development Co., Ltd. Assignor: Tianjin Tianxing Electronics Co., Ltd. Contract record no.: 2014120000098 Denomination of utility model: Eyelet honeycomb plate electronic-chip heat radiator Granted publication date: 20140305 License type: Common License Record date: 20141212 |
|
| LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140305 Termination date: 20170909 |